Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, intelligence
Energy mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries increasingly lighting, and volume is more and more less, function from strength to strength,
So cause integrated level more and more higher.So causing volume reducing, function becomes powerful, directly results in the heat radiation of electronic devices and components
Require more and more higher.The fan type radiating used before and, owing to volume is big, can produce the problems such as noise, gradually be washed in a pan by market
Eliminate.And then create other heat sink material, and such as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive,
Radiating effect the most do not imagine in good, slowly, all finding new efficient heat sink material.Secondly as electronic product
Multiformity, existing product generally requires customization, thus difficult be suitable for concrete use occasion and limit its popularization applied;
Therefore, a kind of for electronic product feature, there is high-performance Heat dissipation adhesive tape if designed, becoming those of ordinary skill in the art
The direction made great efforts.
Summary of the invention
It is an object of the present invention to provide the preparation method of a kind of heat radiation type acrylate adhesive tape, this preparation method is in length and thickness
Degree direction substantially increases heat conductivity, and is substantially reduced the technological deficiency of the viscosity of adhesive linkage, energy when overcoming long-time heat conduction
Keep the sticking strength of contact strength with electronic device for a long time, it is achieved that the stability of heat dispersion, thus carry further
The service life of high adhesive tape.
For reaching above-mentioned purpose, the technical solution used in the present invention is: the preparation side of a kind of heat radiation type acrylate adhesive tape
Method, is 0.004mm ~ 0.025mmPET thin film including a thickness, and this PET film upper surface is plated with an aluminium foil layer, under PET film
Surface-coated has heat-conducting glue adhesion coating, a release paper to be covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating is by following
Technique obtains:
The first step, by 0.1 ~ 0.2 part of cross-linking agent and 70 ~ 150 parts of toluene, 50 ~ 150 parts of ethyl acetate and 50 ~ 70 parts of butanone
Uniformly mixing obtains dilution, this cross-linking agent selected from below general formula () compound,
();
In formula, R1、R2、R3Represent independently of one another after removing a hydrogen atom in the carbochain of the ketone that carbon number is 3 ~ 8
Residue, M represents Fe or Al;
Second step: 100 parts of graphite powders are mixed homogeneously with first step dilution, and formed mixed 84 ~ 86 DEG C of condition stirrings
Close liquid;
3rd step: 100 parts of acrylate adhesives are mixed with the mixed liquor of second step, and through high speed agitator disperse 2 ~
10 hours, thus mix homogeneously forms the gluing mixed solvent of heat conduction;
4th step: 0.1 ~ 1 part of coupling agent adds adhesive, stirs 0.5-1 hour;
5th step: the gluing mixed solvent of heat conduction that the 3rd step obtains is coated upper surface there is the PET film of aluminium foil layer
Lower surface;
6th step: the gluing mixed solvent of heat conduction in the 4th step is carried out baking and forms heat-conducting glue adhesion coating;
7th step: by the 5th step through overbaking another surface of heat-conducting glue adhesion coating fit separated type material;
8th step: rolling;
The thickness of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is than for 10:28:5;
A diameter of 4.8 ~ 5 microns of described graphite powder.
In technique scheme, further improved plan is as follows:
In such scheme, the whipping temp of described second step is 85 DEG C.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1, the preparation method of heat radiation type acrylate adhesive tape of the present invention, it substantially increases heat conduction in length and thickness direction
Property, and when overcoming long-time heat conduction, it is substantially reduced the technological deficiency of the viscosity of low adhesive linkage, can keep for a long time and electronics device
The sticking strength of the contact strength of part, it is achieved that the stability of heat dispersion, thus improve the service life of adhesive tape further.
2, the formula of the preparation method of heat radiation type acrylate adhesive tape of the present invention adds specific cross-linking agent, overcome length
It is substantially reduced the technological deficiency of the viscosity of low adhesive linkage during time heat conduction, contact strength with electronic device can be kept for a long time
Sticking strength, it is achieved that the stability of heat dispersion, thus improve the service life of adhesive tape further
3, the present invention uses the component of three kinds of certain content as solvent, effectively prevent graphite granule at subsequent technique third
Olefin(e) acid ester gum glues agglomeration in system, thus beneficially length and thickness direction heat conduction synchronize to improve;
4, the present invention is specific according to its formula, uses the graphite of a diameter of 4.8 ~ 5 microns and thickness ratio for 10:28:5 successively
The heat conduction pad pasting of the PET film of superposition, heat-conducting glue adhesion coating and aluminium foil layer, is taking into account existing pad pasting performance simultaneously, is being more beneficial for electricity
The heat dispersion of sub-device and transmission, thus further avoid the concentration of adhesive tape amount of localized heat, improve the use longevity of product
Life.
Embodiment: the preparation method of a kind of heat radiation type acrylate adhesive tape, including a thickness be 0.004mm ~
0.025mmPET thin film, this PET film upper surface is plated with an aluminium foil layer, and PET film lower surface is coated with heat-conducting glue adhesion coating, and one
Release paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating is obtained by following technique:
The first step, by 0.1 ~ 0.2 part of cross-linking agent and 70 ~ 150 parts of toluene, 50 ~ 150 parts of ethyl acetate and 50 ~ 70 parts of butanone
Uniformly mixing obtains dilution, this cross-linking agent selected from below general formula () compound,
();
In formula, R1、R2、R3Represent independently of one another after removing a hydrogen atom in the carbochain of the ketone that carbon number is 3 ~ 8
Residue, M represents Fe or Al;
Second step: 100 parts of graphite powders are mixed homogeneously with first step dilution, and formed mixed 84 ~ 86 DEG C of condition stirrings
Close liquid;
3rd step: 100 parts of acrylate adhesives are mixed with the mixed liquor of second step, and through high speed agitator disperse 2 ~
10 hours, thus mix homogeneously forms the gluing mixed solvent of heat conduction;
4th step: 0.1 ~ 1 part of coupling agent adds adhesive, stirs 0.5-1 hour;
5th step: the gluing mixed solvent of heat conduction that the 3rd step obtains is coated upper surface there is the PET film of aluminium foil layer
Lower surface;
6th step: the gluing mixed solvent of heat conduction in the 4th step is carried out baking and forms heat-conducting glue adhesion coating;
7th step: by the 5th step through overbaking another surface of heat-conducting glue adhesion coating fit separated type material;
8th step: rolling;
The thickness of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is than for 10:28:5;
A diameter of 4.8 ~ 5 microns of described graphite powder.
The whipping temp of above-mentioned second step is 85 DEG C.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention
The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.