CN103911084B - Acrylate adhesive tape - Google Patents

Acrylate adhesive tape Download PDF

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Publication number
CN103911084B
CN103911084B CN201310751466.0A CN201310751466A CN103911084B CN 103911084 B CN103911084 B CN 103911084B CN 201310751466 A CN201310751466 A CN 201310751466A CN 103911084 B CN103911084 B CN 103911084B
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China
Prior art keywords
heat
adhesion coating
conducting glue
glue adhesion
pet film
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CN201310751466.0A
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Chinese (zh)
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CN103911084A (en
Inventor
金闯
梁豪
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Taicang Sidike New Material Science and Technology Co Ltd
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Suzhou Sidike New Material Science and Technology Co Ltd
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  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention discloses a kind of acrylate adhesive tape, comprising a thickness is 0.004mm ~ 0.025mmPET film, and this PET film upper surface plating has an aluminium foil layer, and PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, described heat-conducting glue adhesion coating toasts acquisition after being mixed by following parts by weight of component: acrylic ester adhesive 100, Graphite Powder 99, linking agent, toluene, ethyl acetate, butanone, coupling agent; The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10: 28: 5; Described Graphite Powder 99 diameter is 4.8 ~ 5 microns.The present invention substantially increases thermal conductivity in length and thickness direction, and greatly reduces the technological deficiency of the viscosity of adhesive linkage when overcoming long-time heat conduction, can keep the sticking strength with the contact strength of electron device for a long time.

Description

Acrylate adhesive tape
Technical field
The present invention relates to a kind of acrylate adhesive tape, belong to adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause volume reducing like this, function grow is large, directly causes the cooling requirements of electronic devices and components more and more higher.And the fan type radiating adopted in the past, because volume is large, the problems such as noise can be produced, gradually by market.And then create other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect also do not imagine in good, slowly, all finding new efficient heat sink material.Secondly, due to the diversity of electronic product, existing product often needs customization, thus difficulty is suitable for concrete use occasion and limits the popularization of its application; Therefore, a kind ofly for electronic product feature, there is high-performance acrylic acid ester gum band if designed, become the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
The object of the invention is to provide a kind of acrylate adhesive tape, this acrylate adhesive tape substantially increases thermal conductivity in length and thickness direction, and when overcoming long-time heat conduction, greatly reduce the technological deficiency of the viscosity of adhesive linkage, the sticking strength with the contact strength of electron device can be kept for a long time, achieve the stability of heat dispersion, thus improve the work-ing life of adhesive tape further.
For achieving the above object, the technical solution used in the present invention is: a kind of acrylate adhesive tape, comprising a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating toasts acquisition after being mixed by following parts by weight of component:
Acrylic ester adhesive 100,
Graphite Powder 99 85,
Linking agent 0.4,
Toluene 90,
Ethyl acetate 80,
Butanone 60,
Coupling agent 0.5;
Described linking agent from following general formula ( ) compound,
);
In formula, R 1, R 2, R 3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Fe or Al;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:28:5;
Described Graphite Powder 99 diameter is 4.8 ~ 5 microns.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, acrylate adhesive tape of the present invention, it substantially increases thermal conductivity in length and thickness direction, and when overcoming long-time heat conduction, greatly reduce the technological deficiency of the viscosity of low adhesive linkage, the sticking strength with the contact strength of electron device can be kept for a long time, achieve the stability of heat dispersion, thus improve the work-ing life of adhesive tape further.
Specific linking agent is added in the formula of 2, acrylate adhesive tape of the present invention, the technological deficiency of the viscosity of low adhesive linkage is greatly reduced when overcoming long-time heat conduction, the sticking strength with the contact strength of electron device can be kept for a long time, achieve the stability of heat dispersion, thus improve the work-ing life of adhesive tape further
3, the present invention adopts the component of three kinds of certain content as solvent, effectively prevent graphite granule agglomeration in the gluing system of subsequent technique acrylate, thus is conducive to length and thickness direction heat conduction synchronously improves;
4, the present invention is specific according to its formula, adopt diameter to be the graphite of 4.8 ~ 5 microns and Thickness Ratio to be the heat conduction pad pasting of PET film, heat-conducting glue adhesion coating and the aluminium foil layer that 10:28:5 superposes successively, taking into account existing pad pasting performance simultaneously, more be conducive to spread heat and the transmission of electron device, thus further avoid concentrating of adhesive tape amount of localized heat, improve the work-ing life of product.
Accompanying drawing explanation
Accompanying drawing 1 is acrylate adhesive tape structure schematic diagram of the present invention.
In above accompanying drawing: 1, PET film; 2, aluminium foil layer; 3, heat-conducting glue adhesion coating; 4, interleaving paper.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of acrylate adhesive tape, as shown in Figure 1, comprising a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating toasts acquisition after being mixed by following parts by weight of component:
Acrylic ester adhesive 100,
Graphite Powder 99 85,
Linking agent 0.4,
Toluene 90,
Ethyl acetate 80,
Butanone 60,
Coupling agent 0.5;
Described linking agent from following general formula ( ) compound,
);
In formula, R 1, R 2, R 3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Al;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:28:5;
Described Graphite Powder 99 diameter is 4.8 ~ 5 microns.
Implement a preparation method for above-mentioned heat conduction adhesive tape, comprise the following steps:
The first step, obtains dilution by 0.4 part of linking agent and 90 parts of toluene, 80 parts of ethyl acetate and 60 parts of butanone Homogeneous phase mixing, this linking agent be selected from following general formula ( ) compound,
);
In formula, R 1, R 2, R 3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Al;
Second step: 85 parts of Graphite Powder 99s are mixed with the first step dilution, and stir formation mixed solution 84 ~ 86 DEG C of conditions;
3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and through high speed agitator dispersion 2 ~ 10 hours, thus mix the gluing mixed solvent of formation heat conduction;
4th step: 0.5 part of coupling agent adds sizing agent, stirs 0.5-1 hour;
5th step: the gluing mixed solvent of heat conduction that the 3rd step obtains is coated the lower surface that upper surface has the PET film of aluminium foil layer;
6th step: baking is carried out to the gluing mixed solvent of heat conduction in the 4th step and forms heat-conducting glue adhesion coating;
7th step: by separated type material of fitting through another surface of the heat-conducting glue adhesion coating of overbaking in the 5th step;
8th step: rolling.
Above-mentioned M represents Al.
The whipping temp of above-mentioned second step is 85 DEG C.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.

Claims (1)

1. an acrylate adhesive tape, it is characterized in that: comprising a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating toasts acquisition after being mixed by following parts by weight of component:
Acrylic ester adhesive 100,
Graphite Powder 99 85,
Linking agent 0.4,
Toluene 90,
Ethyl acetate 80,
Butanone 60,
Coupling agent 0.5;
Described linking agent from following general formula ( ) compound,
);
In formula, R 1, R 2, R 3represent the residue after carbochain that carbonatoms is the ketone of 3 ~ 8 removing a hydrogen atom independently of one another, M represents Al;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4.8 ~ 5 microns.
CN201310751466.0A 2012-12-18 2012-12-18 Acrylate adhesive tape Active CN103911084B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310751466.0A CN103911084B (en) 2012-12-18 2012-12-18 Acrylate adhesive tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310751466.0A CN103911084B (en) 2012-12-18 2012-12-18 Acrylate adhesive tape
CN201210550169.5A CN103059758B (en) 2012-12-18 2012-12-18 Heat conducting adhesive tape for electronic device and preparation method thereof

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CN103911084B true CN103911084B (en) 2016-03-02

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CN201310751466.0A Active CN103911084B (en) 2012-12-18 2012-12-18 Acrylate adhesive tape
CN201310749012.XA Active CN103865417B (en) 2012-12-18 2012-12-18 The manufacturing process of acrylate sealing tape
CN201410357427.7A Active CN104152073B (en) 2012-12-18 2012-12-18 For the preparation method of electronic product pad pasting
CN201210550169.5A Active CN103059758B (en) 2012-12-18 2012-12-18 Heat conducting adhesive tape for electronic device and preparation method thereof
CN201410356814.9A Active CN104152071B (en) 2012-12-18 2012-12-18 For the preparation method of high viscosity adhesive tape
CN201310751336.7A Active CN103911083B (en) 2012-12-18 2012-12-18 Acrylate sealing tape

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CN201310749012.XA Active CN103865417B (en) 2012-12-18 2012-12-18 The manufacturing process of acrylate sealing tape
CN201410357427.7A Active CN104152073B (en) 2012-12-18 2012-12-18 For the preparation method of electronic product pad pasting
CN201210550169.5A Active CN103059758B (en) 2012-12-18 2012-12-18 Heat conducting adhesive tape for electronic device and preparation method thereof
CN201410356814.9A Active CN104152071B (en) 2012-12-18 2012-12-18 For the preparation method of high viscosity adhesive tape
CN201310751336.7A Active CN103911083B (en) 2012-12-18 2012-12-18 Acrylate sealing tape

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CN106304780B (en) * 2014-01-26 2019-01-01 斯迪克新型材料(江苏)有限公司 Manufacturing process for high thermal conductivity graphite film
WO2017113084A1 (en) * 2015-12-29 2017-07-06 江苏斯迪克新材料科技股份有限公司 Modified ultra-thin adhesive tape with high heat conductivity based on synthetic graphite
CN105585972B (en) * 2016-03-21 2018-12-11 林宝领 A kind of electronic device adhesive tape
CN110183997B (en) * 2019-06-11 2021-07-02 厦门市光博士光电有限公司 Manufacturing process of pressure-sensitive adhesive tape

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Publication number Publication date
CN103911083A (en) 2014-07-09
CN103911084A (en) 2014-07-09
CN104152071A (en) 2014-11-19
CN103865417B (en) 2016-04-27
CN104152073A (en) 2014-11-19
CN103911083B (en) 2016-03-02
CN104152071B (en) 2016-04-27
CN103059758A (en) 2013-04-24
CN103059758B (en) 2014-09-03
CN104152073B (en) 2016-01-13
CN103865417A (en) 2014-06-18

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Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6

Patentee after: Jiangsu Stick new materials Polytron Technologies Inc

Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No.

Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd.

CP03 Change of name, title or address
TR01 Transfer of patent right

Effective date of registration: 20170706

Address after: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No.

Patentee after: Taicang Stick new Mstar Technology Ltd

Address before: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6

Patentee before: Jiangsu Stick new materials Polytron Technologies Inc

TR01 Transfer of patent right