CN101693817A - Superconductivity copper foil tape - Google Patents
Superconductivity copper foil tape Download PDFInfo
- Publication number
- CN101693817A CN101693817A CN200910192875A CN200910192875A CN101693817A CN 101693817 A CN101693817 A CN 101693817A CN 200910192875 A CN200910192875 A CN 200910192875A CN 200910192875 A CN200910192875 A CN 200910192875A CN 101693817 A CN101693817 A CN 101693817A
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- Prior art keywords
- copper foil
- superconductivity
- foil tape
- tape according
- plated
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- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The invention provides a superconductivity copper foil tape, which has good ultra-high conductivity and direct welding capacity, is applied to key parts of ultra-precision electrical and electronic components, and is not easily oxidized. The superconductivity copper foil tape is characterized in that a conductive self-adhesive layer is attached on the upper surface of anti-sticking silicone-coating oil paper, and tin-plated copper foil is attached on the upper surface of the conductive self-adhesive layer. The copper foil tape which is coated with a conducive adhesive with ultra-low resistance leads the copper foil to be convenient to be bended and crimped, has ultra-high conductivity and direct welding capacity, is not easily cracked, and is suitable for electronic components and punching type processing.
Description
Technical field
The present invention relates to a kind of adhesive tape, relate in particular to a kind of supraconductivity adhesive tape that is applicable to the welding operation of electric machine industry and electronic industry.
Background technology
In the prior art, the adhesive tape kind of various uses is more, is used for electronic product and makes also having much of field.At present, superconductivity copper foil tape is applicable to the welding operation of electric machine industry and electronic industry, as industry such as photoelectricity, LCD TV, junctor, computer, mobile phones, all ultra-high conductivity and can directly weld function are applied to the key part of Ultraprecise electric organic electronic; Belong to the supraconductivity adhesive tape, be fit to the purposes of needs high conductivity.This class adhesive tape needs all chemical resistant propertiess, is difficult for oxidation, characteristics, the above characteristic extreme difference of adhesive tape that can be traditional, necessity that haves much room for improvement such as can reach not fragility, do not chap.
Summary of the invention
Problem at the prior art existence, technical problem to be solved by this invention is that a kind of superconductivity copper foil tape will be provided, its all good ultra-high conductivity and can directly weld function is applied on the key part of Ultraprecise electric organic electronic, and is difficult for oxidation.
For reaching above-mentioned purpose, superconductivity copper foil tape of the present invention is achieved by following technical proposals:
A kind of superconductivity copper foil tape, the anti-glutinous surperficial additional conductive non-drying glue layer on the silicone oil paper that is coated with, the additional zinc-plated Copper Foil in surface on the conduction non-drying glue layer.
Further, described anti-sticking is coated with the thick 0.15～0.39mm of silicone oil paper, acrylic oiliness colloid bed thickness 0.02～0.06mm, and zinc-plated copper thickness 0.03～0.05mm, superconductivity copper foil tape total thickness are 0.2～0.5mm;
Further, the base material of described zinc-plated Copper Foil is selected Copper Foil, its Copper Foil be chosen as calendering copper, its zinc-plated amount is at every tinsel total thickness 4%;
Further, the acrylic oiliness colloid layer of conduction non-drying glue layer, its composition quality per-cent:
Main body oiliness acrylic non-setting adhesive (100g) 91～96.5%
(0.6g～2g) 1.5～5% for conducting powder
Dispersion agent (0.4～0.8g) 1～2%
Bridging agent (0.4～0.8g) 1～2%.
Main body acrylic non-setting adhesive structure, its moiety mass percent:
Main monomer (MAIN MONOMER) 50～98%
Upgrading monomer (MODIFYING MONOMER) 10～40%
Bridge formation official energy machine monomer (MONOMER WZTH FUNCTIONALGROUP) 0.5～20%;
Above-mentioned bridging agent and bridge formation mode:
Functional group's bridging agent kind co-reactive group
-OH -CONH
2-CH-CH-COOH -CH2-OH
Thiamines acid-CH2-OR
-CaH
6N
2O
2 -NCO
PLOY?ISO?CYANATE
(cyanuric acid salt)
-COOH -CONH
2-CH-CH-COOH -CH2-OR
Thiamines acid-CH2-OH
-CaH
6N
2O
2 -NCO
(cyanuric acid salt)
-polyhedral metal
Metal peroxides
Metal-salt
METEL(Al，Fe，Zr，Ti)ACETYL?ACETONATE；
The conducting medium of above-mentioned conducting powder, its conducting particles is:
Particle structure particle shape particle diameter
Spherical 18 μ-50 of pure nickel (100%) μ
Or
Nickel (60～95%)
Graphite (5～40%) dihedral sheet 17 μ～165 μ
(nickel bag graphite).
Fibrous 8 μ of nickel (67%)～140 μ
Graphite (33%)
Or
Granulated glass sphere
Silver-plated (Ag4～16%) spherical 8 μ～140 μ.
This copper foil tape that scribbles the conductive adhesive with super-low resistance of the present invention, Copper Foil are convenient to bending and are curled, and all ultra-high conductivity and can directly weld function are applied to the key part of Ultraprecise electric organic electronic, are difficult for oxidation.The copper foil tape of good conductivity, the electroconductibility of its base material is a very crucial technology, and the selection of Copper Foil of the present invention is based on calendering copper, and electrolytic copper should not use.Because can obtain splendidly after the calendering copper tempered processing around song, be difficult for be full of cracks, be fit to electronic component, stamp processing characteristics.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
For further understanding feature of the present invention, technique means and the specific purposes that reached, function, the present invention is described in further detail below in conjunction with accompanying drawing and embodiment.
Dependency structure of the present invention mainly comprises with lower member: anti-glutinous silicone oil paper 1, conduction non-drying glue layer 2, the zinc-plated Copper Foil 3 of being coated with.
Superconductivity copper foil tape of the present invention, the anti-glutinous surperficial additional conductive non-drying glue layer 2 on the silicone oil paper 1 that is coated with, the additional zinc-plated Copper Foil 3 in surface on the conduction non-drying glue layer 2.Anti-sticking is coated with silicone oil paper 1 thick 0.15～0.39mm, acrylic oiliness colloid layer 2 thick 0.02～0.06mm, and zinc-plated Copper Foil 3 thickness 0.03～0.05mm, described superconductivity copper foil tape total thickness is 0.2～0.5mm.
The selection of base material: the copper foil tape of good conductivity basically, the electroconductibility of its base material is a very crucial technology.The selection of its Copper Foil is based on calendering copper, and electrolytic copper should not use.Because can obtain splendidly after the calendering copper tempered processing around song, be difficult for be full of cracks, be fit to electronic component, stamp processing characteristics.It produces international common-use size has: 18m, 23m, 35m, among the 70m and its zinc-plated amount at every tinsel total thickness 4%.Be main.The selection of eleetrotinplate Copper Foil, as: can meet the requirements more than the glue spread 28.3g/sm of thickness, tempering situation, tin.
The acrylic oiliness colloid layer of conduction non-drying glue layer 2, its composition quality per-cent:
Main body 40% oiliness acrylic non-setting adhesive 91～96.5%
(bridge formation Guan Nengji must be arranged)
(0.6g～2g) 1.5～5% for conducting powder
Dispersion agent (0.4～0.8g) 1～2%
Bridging agent (0.4～0.8g) 1～2%
Main body acrylic non-setting adhesive structure
It forms main monomer (MAIN MONOMER) 50～98%
Upgrading monomer (MODIFYING MONOMER) 10～40%
The bridge formation official can machine monomer (MONOMER WZTH FUNCTIONAL
GROUP)0.5～20％
Bridging agent: (and bridge formation mode)
Functional group's bridging agent kind co-reactive group
-OH -CONH
2-CH-CH-COOH -CH2-OH
Thiamines acid-CH2-OR
-CaH
6N
2O
2 -NCO
PLOY?ISO?CYANATE
(cyanuric acid salt)
-COOH -CONH
2-CH-CH-COOH -CH2-OR
Thiamines acid-CH2-OH
-CaH
6N
2O
2 -NCO
(cyanuric acid salt)
-polyhedral metal
Metal peroxides
Metal-salt
METEL(Al，Fe，Zr，Ti)ACETYL?ACETONATE
Conducting powder (conducting medium):
Can be used at present conducting electricity in the Pressure sensitive adhesive tape field, in order to require to reach excellent electric conductivity, got rid of the epoch of aluminium powder, the new electro-conductive material that replaces is a main flow with nickel, silver, gold, wherein in cost structure all based on nickel and silver, the gold fail to be accepted because of cost is too high.
Its conducting particles:, be described as follows because of different field has different selectivity:
Particle structure particle shape particle diameter
Spherical 18 μ of pure nickel (100%)～50 μ
Or adopt following material:
Nickel (60～95%)
Graphite (5～40%) dihedral sheet 17 μ～165 μ
(nickel bag graphite)
Or adopt following material:
Fibrous 8 μ of nickel (67%)～140 μ
Graphite (33%)
Or adopt following material:
Granulated glass sphere
Silver-plated (Ag4～16%) spherical 8 μ～140 μ
So conductive tape is the most often used with pure nickel and silvered glass beads, wherein the specification that is used most with the granulated glass sphere of silver (Ag) content more than 12% again.
Dispersion agent:
Select liquid, solvent-free dispersion agent, itself having has moistening, dispersive effect to metal-powder.
Superconduction viscose (acrylic oiliness colloid):
1. the control of acrylic viscose molecular weight (its molecular weight can influence its conductivity)
2. conducting particles:
A. the selection 20u～75u of particle diameter is to equal particle diameter;
B. conducting material can be selected following element: proof gold, fine silver, pure nickel, gypsum; The shared per-cent of its blending ratio be very have quite key;
C. its metallic carrier may be spherical (as acrylic glass)
The adhesive-layer coating thickness of adhesive tape of the present invention own is different according to requiring, should be between 30～50 μ at most according to its coating of general normal specifications, and its volume impedance (Volume Reciotance) should be less than 0.003 Ω/cm
2
The present invention fully optimizes the technology of gluing: 1. the dispersion technology of colloid and metallics; 2. coating is done the design of difference according to different thickness and stickiness; 3. how to prevent that its metal conductive particles from precipitating in operation, so the interpolation of its dispersion agent, antisettling agent and selection just have its necessity.
Claims (9)
1. a superconductivity copper foil tape is characterized in that: the anti-glutinous surperficial additional conductive non-drying glue layer (2) on the silicone oil paper (1) that is coated with, the additional zinc-plated Copper Foil (3) in surface on the conduction non-drying glue layer (2).
2. superconductivity copper foil tape according to claim 1, it is characterized in that: the described anti-glutinous thick 0.15～0.39mm of silicone oil paper (1) that is coated with, thick 0.02～the 0.06mm of acrylic oiliness colloid layer (2), zinc-plated Copper Foil (3) thickness 0.03～0.05mm, described superconductivity copper foil tape total thickness is 0.2～0.5mm.
3. superconductivity copper foil tape according to claim 1 is characterized in that: the base material of described zinc-plated Copper Foil (3) is selected Copper Foil, its Copper Foil be chosen as calendering copper, its zinc-plated amount is at every tinsel total thickness 4%.
4. superconductivity copper foil tape according to claim 1 is characterized in that: the acrylic oiliness colloid layer of described conduction non-drying glue layer (2), and its composition quality per-cent:
Main body oiliness acrylic non-setting adhesive 91～96.5%
Conducting powder 1.5～5%
Dispersion agent 1～2%
Bridging agent 1～2%.
5. superconductivity copper foil tape according to claim 4 is characterized in that: described main body acrylic non-setting adhesive structure, and its moiety mass percent:
Main monomer 50～98%
Upgrading monomer 10～40%
The bridge formation official can machine monomer 0.5～20%.
6. superconductivity copper foil tape according to claim 4 is characterized in that: described bridging agent and bridge formation mode are:
Functional group's bridging agent kind co-reactive group
-OH -CONH
2-CH-CH-COOH -CH2-OH
Thiamines acid-CH2-OR
-CaH
6N
2O
2 -NCO
PLOY?ISO?CYANATE
Cyanuric acid salt
7. superconductivity copper foil tape according to claim 4 is characterized in that: described bridging agent and bridge formation mode are:
Functional group's bridging agent kind co-reactive group
-COOH -CONH
2-CH-CH-COOH -CH2-OR
Thiamines acid-CH2-OH
-CaH
6N
2O
2 -NCO
Cyanuric acid salt
-polyhedral metal
Metal peroxides
Metal-salt.
8. superconductivity copper foil tape according to claim 4 is characterized in that: the conducting medium of described conducting powder, and its conducting particles is:
Particle structure particle shape particle diameter
Spherical 18 μ of pure nickel～50 μ
Or nickel
Graphite dihedral sheet 17 μ～165 μ.
9. superconductivity copper foil tape according to claim 4 is characterized in that: the conducting medium of described conducting powder, and its conducting particles is:
Particle structure particle shape particle diameter
Fibrous 8 μ of nickel～140 μ
Graphite
Or
Granulated glass sphere
Silver-plated spherical 8 μ～140 μ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910192875A CN101693817A (en) | 2009-09-30 | 2009-09-30 | Superconductivity copper foil tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910192875A CN101693817A (en) | 2009-09-30 | 2009-09-30 | Superconductivity copper foil tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101693817A true CN101693817A (en) | 2010-04-14 |
Family
ID=42092819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910192875A Pending CN101693817A (en) | 2009-09-30 | 2009-09-30 | Superconductivity copper foil tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101693817A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102399513A (en) * | 2011-11-18 | 2012-04-04 | 常熟市富邦胶带有限责任公司 | Conductive cloth tape |
| CN103484031A (en) * | 2013-09-29 | 2014-01-01 | 苏州华周胶带有限公司 | Conductive tape |
| CN104059556A (en) * | 2012-12-18 | 2014-09-24 | 苏州斯迪克新材料科技股份有限公司 | Film for electronic components |
| CN104059555A (en) * | 2012-12-18 | 2014-09-24 | 苏州斯迪克新材料科技股份有限公司 | Manufacturing process of antistatic pressure-sensitive adhesive tape |
| CN104059557A (en) * | 2012-12-18 | 2014-09-24 | 苏州斯迪克新材料科技股份有限公司 | High-viscosity heat-resistant film |
| CN104073183A (en) * | 2012-12-18 | 2014-10-01 | 苏州斯迪克新材料科技股份有限公司 | Manufacturing technology of membrane adhered to electronic component |
| CN104152073A (en) * | 2012-12-18 | 2014-11-19 | 苏州斯迪克新材料科技股份有限公司 | Preparation method for electronic product membrane |
| CN108598209A (en) * | 2017-12-29 | 2018-09-28 | 南京日托光伏科技股份有限公司 | Restorative procedure after a kind of conductive core plate breakage of MWT photovoltaic solars component |
| CN110996641A (en) * | 2019-12-27 | 2020-04-10 | 惠州Tcl移动通信有限公司 | Conductive foam |
-
2009
- 2009-09-30 CN CN200910192875A patent/CN101693817A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102399513A (en) * | 2011-11-18 | 2012-04-04 | 常熟市富邦胶带有限责任公司 | Conductive cloth tape |
| CN104152073A (en) * | 2012-12-18 | 2014-11-19 | 苏州斯迪克新材料科技股份有限公司 | Preparation method for electronic product membrane |
| CN104059556A (en) * | 2012-12-18 | 2014-09-24 | 苏州斯迪克新材料科技股份有限公司 | Film for electronic components |
| CN104059555A (en) * | 2012-12-18 | 2014-09-24 | 苏州斯迪克新材料科技股份有限公司 | Manufacturing process of antistatic pressure-sensitive adhesive tape |
| CN104059557A (en) * | 2012-12-18 | 2014-09-24 | 苏州斯迪克新材料科技股份有限公司 | High-viscosity heat-resistant film |
| CN104073183A (en) * | 2012-12-18 | 2014-10-01 | 苏州斯迪克新材料科技股份有限公司 | Manufacturing technology of membrane adhered to electronic component |
| CN104152073B (en) * | 2012-12-18 | 2016-01-13 | 苏州斯迪克新材料科技股份有限公司 | For the preparation method of electronic product pad pasting |
| CN104073183B (en) * | 2012-12-18 | 2016-06-15 | 苏州斯迪克新材料科技股份有限公司 | Manufacturing process for the adhesive tape of electronic devices and components |
| CN104059557B (en) * | 2012-12-18 | 2016-06-15 | 苏州斯迪克新材料科技股份有限公司 | Anti-static self-adhesive strip |
| CN104059555B (en) * | 2012-12-18 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | The manufacturing process of anti-static self-adhesive strip |
| CN103484031A (en) * | 2013-09-29 | 2014-01-01 | 苏州华周胶带有限公司 | Conductive tape |
| CN108598209A (en) * | 2017-12-29 | 2018-09-28 | 南京日托光伏科技股份有限公司 | Restorative procedure after a kind of conductive core plate breakage of MWT photovoltaic solars component |
| CN110996641A (en) * | 2019-12-27 | 2020-04-10 | 惠州Tcl移动通信有限公司 | Conductive foam |
| WO2021128554A1 (en) * | 2019-12-27 | 2021-07-01 | 惠州Tcl移动通信有限公司 | Conductive foam |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20100414 |