CN103857187A - Circuit board and surplus-glue processing method thereof - Google Patents
Circuit board and surplus-glue processing method thereof Download PDFInfo
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- CN103857187A CN103857187A CN201210524240.2A CN201210524240A CN103857187A CN 103857187 A CN103857187 A CN 103857187A CN 201210524240 A CN201210524240 A CN 201210524240A CN 103857187 A CN103857187 A CN 103857187A
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- circuit board
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Abstract
The invention provides a surplus-glue processing method of a circuit board, wherein the method is suitable for manufacturing a circuit board, and aims to solve the problems that by means of leveling and board brushing in the prior art, surplus glue cannot be removed, and the appearances of circuit boards cannot be guaranteed. The surplus-glue processing method of the circuit board comprises the following steps that a daughter board of a mixed-voltage circuit board is prepared; a mother board of the mixed-voltage circuit board is prepared; a core board of the mixed-voltage circuit board is prepared; as for outer processing, laminating technique processing, single-face microetching copper reduction technique processing, leveling and board brushing technique processing, drilling technique processing, electroplating technique processing and outer pattern transfer technique processing are conducted in sequence. The invention further provides the circuit board formed in the surplus-glue processing method of the circuit board. According to the method, the surplus glue is removed in batches by means of leveling and board brushing, so that it is guaranteed that the thickness of copper of the circuit board reaches a required value; besides, it is guaranteed that the appearance of the circuit board is undamaged, good reliability is obtained, the defects produced by manual glue removing can be overcome, and batch processing of glue removing can be achieved.
Description
Technical field
The invention belongs to art of printed circuit boards, relate in particular to the remaining glue processing method of a kind of circuit board and circuit board, this circuit board is local mixed compression circuit board.
Background technology
Local mixed compression circuit board has been widely used in the manufacture field of various circuit boards, and for example, local high frequency or the high speed material of adopting is to realize the function of high-frequency signal and to save material cost simultaneously, and the high-rise daughter board of locally embedding is to save the level of integrated circuit plate.But the processing technology of these circuit boards all exists a problem, after pressing, between daughter board and motherboard, leaving certain remaining glue need to be removed.Owing to conventionally can there being difference in height between daughter board and motherboard; this causes remaining glue often to lodge in relatively short place; and the ground kelly-up glue with difference in height accumulates more; adopt and conventional even brush board out and cannot remove these remaining glue; excessively shovel brush can cause the copper thickness degree on the panel of circuit board inadequate, and removes remaining glue and be difficult to ensure circuit board outward appearance and cost of idleness and time by hand.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of remaining glue processing method of circuit board, particularly for local mixed compression circuit board, is intended to solve the employing existing in prior art and evens brush board out and cannot remove remaining glue and ensure circuit board outward appearance and integrity problem.
The embodiment of the present invention is achieved in that a kind of remaining glue processing method of circuit board, and the method comprises the following steps: the daughter board of preparing mixed compression circuit board; Prepare the motherboard of mixed compression circuit board; Prepare the central layer of mixed compression circuit board; And, skin be treated to carry out successively that lamination process, one side microetch subtract process for copper processing, even brush board PROCESS FOR TREATMENT out, bore process processing, electroplating technology process and the processing of outer graphics shifting process.
Preferably, described daughter board is selected copper-clad plate, and the copper thickness of described copper-clad plate is greater than required value.
Preferably, described motherboard is selected common FR4 copper-clad plate, and the copper thickness of described common FR4 copper-clad plate is greater than required value.
Preferably, described central layer is selected common FR4 copper-clad plate, and the copper thickness of described common FR4 copper-clad plate equates with required value.
Preferably, it is characterized in that, described lamination process is that described daughter board is embedded in described motherboard, so that described daughter board is fixed in described motherboard.
Preferably, described one side microetch subtracts process for copper processing method, is that circuit board to accumulate the glue of having a surplus after described lamination process carries out microetch processing and reveals to subtract copper, to allow the described remaining glue accumulating.
Preferably, the remaining glue of evening brush board technique processing method described in out and being lodging between described daughter board and described motherboard is unified to remove.
The present invention also provides a kind of circuit board, and this circuit board is to adopt the remaining glue processing method of foregoing circuit plate to form.
Circuit board provided by the invention, after lamination process, adopts one side microetch to subtract process for copper processing method, reveals with the remaining glue that described circuit board after lamination carried out microetch processing and subtracts copper, allow lodging between described daughter board and described motherboard.Like this, no matter described remaining glue lodges between mother baby plate Anywhere, all can utilize and even brush board PROCESS FOR TREATMENT out and unify to remove.
Remaining glue processing method provided by the invention selects the copper thickness of special material copper-clad plate and this copper-clad plate to be greater than required value in the process of preparing daughter board, and prepare to select the copper thickness of common FR4 copper-clad plate and this copper-clad plate to be also greater than required value in the process of described motherboard, adopt the method for the invention to remove remaining glue simple and efficient, and can unify batch de except described remaining glue, and can make the copper thickness of circuit board reach required value, ensure the well-tended appearance of circuit board and obtain good reliability.
Brief description of the drawings
Fig. 1 is the remaining glue process method step flow chart of the circuit board that provides of the embodiment of the present invention.
Fig. 2 is the schematic flow sheet of the step 11 that provides of the embodiment of the present invention.
Fig. 3 is the schematic flow sheet of the step 12 that provides of the embodiment of the present invention.
Fig. 4 is the schematic flow sheet of the step 13 that provides of the embodiment of the present invention.
Fig. 5 is the schematic diagram of circuit board after lamination process that the embodiment of the present invention provides.
Fig. 6 is the schematic diagram of circuit board after one side microetch subtracts process for copper and processes that the embodiment of the present invention provides.
Fig. 7 is the schematic diagram of evening brush board, boring, plating and the processing of outer graphics shifting process out in the step 14 that provides of the embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Please refer to Fig. 1, the remaining glue processing method of the circuit board that the embodiment of the present invention provides, comprises the following steps:
Prepare the daughter board of mixed compression circuit board;
Prepare the motherboard of mixed compression circuit board;
Prepare the central layer of mixed compression circuit board;
Skin be treated to carry out successively that lamination process, one side microetch subtract process for copper processing, even brush board PROCESS FOR TREATMENT out, bore process processing, electroplating technology process and the processing of outer graphics shifting process.
In the present embodiment, described circuit board is local mixed compression circuit board.
Please refer to Fig. 2, in a specific embodiment of the present invention, the step of the daughter board 10 of preparation mixed compression circuit board is for carrying out successively technology for blanking processing (as shown in Figure 2 (a) shows), inner figure shifting process processing (as shown in Fig. 2 (b)), outer groove milling and brown PROCESS FOR TREATMENT (as shown in Figure 2 (c)).
In the present embodiment, described daughter board 10 is multi-layer sheet.
Copper thickness A oz is unit value, and every square chi of area one side covering Copper Foil weight is the copper layer thickness of A oz.
Particularly, in technology for blanking processing procedure, select copper-clad plate as daughter board 10 according to the requirement of copper base (required value is A oz), this copper-clad plate is special material copper-clad plate, on base material 12, the thickness of the Copper Foil that covers 14 is greater than required value, covers Copper Foil 14 at the first surface of this base material 12, and the thickness of Copper Foil that this first surface covers 14 is A oz+0.5oz, second covers Copper Foil 16, and the thickness of this second Copper Foil that covers 16 is A oz.Described special material copper-clad plate can be the copper-clad plate of aramid fiber nonwoven fabric base or the copper-clad plate of synthetic fibers base, the specific function of producing to realize local material structure, for example, high-frequency signal, the use amount of saving high frequency material.
The processing of inner figure shifting process is that the circuitous pattern on the circuit negative (film) of the second layer on described daughter board 10 is transferred on Copper Foil 16 surfaces of daughter board 10, and carries out successively pre-treatment, pad pasting, exposure, development, etching and move back film.
Pre-treatment step is oxide, the spot of removing on copper coin surface all, require surface microscopic coarse simultaneously, to increase the contact area of dry film and substrate surface, can adopt mechanical cleaning method, for example, abrasive brush roll-type brush plate machine or ground pumice brush board, or chemical cleaning method, for example, oil removing, microetch or pickling.Whether clean utilization water break experimental technique is tested on premenstrual copper coin after treatment surface, by the copper coin surface of pre-treatment, soaks and vertical placement through flowing water, and the continuous moisture film on whole plate face should at least keep do not break for 15 seconds.
When pad pasting, first peel polyethylene protective film from dry film, then under heating pressurized conditions by dry film photoresist mucous membrane in copper-clad plate.Copper-clad plate after pad pasting must stop more than 15 minutes, in 24 hours.If the time of staying is inadequate, the adhesion promoter adding in dry film coheres not firm less than not having an effect completely with copper, cause film pine; If the time of staying is too of a specified duration, can cause overreact adhesive force too by force and the problems such as development stripping difficulty.
Exposure-processed,, under UV-irradiation, light trigger absorbs luminous energy and resolves into free radical, and free radical causes photo polymerization monomer again and carries out polymerization crosslinking reaction, forms the build macromolecular structure that is insoluble to weak solution.Described copper-clad plate is carried out to one side graphic making, is the one side of A oz to Copper Foil 16(thickness) carry out graphic making, and be the one side of A oz+0.5oz to Copper Foil 14(thickness) carry out conservation treatment.Adopt Ristor17 or SST21 level exposure guide rule to do exposure imaging inspection, determine the time for exposure, this part is prior art, herein enumeration not.
Develop, by the effect of liquid medicine sodium carbonate, after the dry film of unexposed portion is dissolved and rinsing, leave the part of sensitization.
Etching is that unexposed dew copper part copper facet etch is fallen.
Moving back film, is that the NaOH (NaOH) by higher concentration removes the film of protection circuit copper face, and the concentration of described NaOH is 1-4%.
The above development, etching and move back film and belong to prior art, herein enumeration not.
Outer groove milling PROCESS FOR TREATMENT, by the target of setting, at the outer field unified position milling pipe position of described copper-clad plate groove, for row's plate pipe position of lower operation is used.According to the actual requirements described daughter board 10 is carried out to milling treatment process, the length of described daughter board 10 and the wide monolateral little 4-6 mil of size (mil) than described motherboard.
Brown PROCESS FOR TREATMENT, object is copper-clad plate surface described in alligatoring, increases bonded area and increases surface conjunction power.Described comprehensive metallization processes is processed and is adopted general existing techniques in realizing, herein enumeration not.
Please refer to Fig. 3, in a specific embodiment of the present invention, the step of the motherboard 20 of preparation mixed compression circuit board is for carrying out successively technology for blanking processing (as shown in Fig. 3 (a)), inner figure shifting process processing (as shown in Figure 3 (b)), outer groove milling and brown PROCESS FOR TREATMENT (as shown in Figure 3 (c)).This step is basic identical with the step of preparing described daughter board 10, when being to prepare motherboard 20 in technology for blanking processing procedure, both differences select common FR4 copper-clad plate as motherboard 20 according to the requirement of copper base (required value is A oz), thickness in base material 22 Copper Foil that covers 24 is greater than described required value, cover Copper Foil 24 at the first surface of this base material 22, the thickness of Copper Foil that this first surface covers 24 is A oz+0.5oz, second covers Copper Foil 26, the thickness of this second Copper Foil that covers 26 is A oz, and, it is also that described copper-clad plate is carried out to one side graphic making that the inner figure of this step is processed, be the one side of A oz to Copper Foil 26(thickness) carry out graphic making, and be the one side of A oz+0.5oz to Copper Foil 24(thickness) carry out conservation treatment.
Please refer to Fig. 4, in a specific embodiment of the present invention, the step of the central layer 30 of preparation mixed compression circuit board is for carrying out successively technology for blanking processing (as shown in Figure 4 (a)), inner figure shifting process processing (as shown in Figure 4 (b)), brown PROCESS FOR TREATMENT (as shown in Figure 4 (c)).This step is basic identical with the step of preparing described daughter board 10, difference is, in technology for blanking processing procedure, while preparing described central layer 30, selecting logical Copper Foil 34,36 thickness is the common FR4 copper-clad plate of A oz, and Copper Foil 34,36 thickness of described central layer 30 equate with required value; The processing of described inner figure shifting process is that described copper-clad plate is carried out to two-sided making figure; This step does not need to carry out outer groove milling PROCESS FOR TREATMENT.
Please refer to Fig. 5, the outer processing method in the embodiment of the present invention, is the improvement on conventional method basis.The lamination process of the method is that described daughter board 10 is embedded in described motherboard 20, after pressing, described daughter board 10 is fixed in described motherboard 20.Between the daughter board 10 after pressing and motherboard 20, can accumulate certain remaining glue 40, conventionally there will be following situation: first, described daughter board 10 is higher than described motherboard 20, on described daughter board 10 and described motherboard 20, accumulate respectively the glue 40 of having a surplus, remaining glue 40 on described motherboard 20 is obviously more, and the recess forming between described daughter board 10 and described motherboard 20 also can accumulate remaining glue 40, as shown in Fig. 5 (a); The second, described daughter board 10 flushes with described motherboard 20, and the remaining glue 40 of generation is few, as shown in Fig. 5 (b); The 3rd, described daughter board 10, lower than described motherboard 20, accumulates respectively the glue 40 of having a surplus on described daughter board 10 and described motherboard 20, remaining glue 40 on described daughter board 10 is obviously more, and the recess forming between described daughter board 10 and described motherboard 20 also can accumulate remaining glue 40, as shown in Fig. 5 (c).
Please refer to Fig. 6, the embodiment of the present invention adopts one side microetch to subtract process for copper processing method, the circuit board after described lamination process is carried out to microetch processing and reveal to subtract copper 0.5oz, to allow the remaining glue 40 accumulating.Fig. 6 (a) be described daughter board 10 higher than described motherboard 20, through one side microetch subtract process for copper process after, remaining glue 40 is revealed in described circuit board outside; Fig. 6 (b) flushes with described motherboard 20 for described daughter board 10, and after one side microetch subtracts process for copper processing, remaining glue 40 is revealed in described circuit board outside; Fig. 6 (c) be described daughter board 10 lower than described motherboard 20, through one side microetch subtract process for copper process after, remaining glue 40 is revealed in described circuit board outside.
Please refer to Fig. 7 (a), adopt the remaining glue 40 of evening out between brush board technique processing method removal daughter board 10 and motherboard 20, unify to remove to lodging in the remaining glue 40 of described daughter board 10, described motherboard 20 or described recess.The present invention, owing to having adopted one side microetch to subtract process for copper processing method, can remove in the lump to the remaining glue 40 of above-mentioned three kinds of situations, need not process separately for different situations.In addition, the present invention is owing to selecting the large copper-clad plate of Copper Foil 14,24 Thickness Ratio required value in the time that described daughter board 10 and described motherboard 20 are made, after evening brush board out, can be easy to remove remaining glue 40, and Copper Foil 14,24 thickness on final copper-clad plate surface also can meet the demands.
Please refer to Fig. 7 (b), bore process processing, is to the processing of holing of the circuit board after lamination, to make the interconnected passage 50 of described circuit board ectonexine, and makes the interconnected passage 50 of described daughter board 10 and the internal layer of described motherboard 20.
Please refer to Fig. 7 (c), electroplating technology processing, the passage 50 forming in described bore process processing procedure is metallized,, at described passage 50 inwalls and described circuit board outer surface coating layer of metal layer 60, realize the interconnect between ectonexine, daughter board 10 and motherboard 20.
Please refer to Fig. 7 (d), the processing of outer graphics shifting process, is that the skin of the circuit board after lamination is carried out to figure transfer, by outer field graphic making to the skin of circuit board.This processing method is similar to the inner figure shifting process processing method of described daughter board 10, adopts successively pre-treatment, pad pasting, exposure, development, etching and moves back film, and the exposure of this processing method is that the circuit board after lamination is carried out to two-sided making figure.
The present invention selects Copper Foil 14 thickness of special material copper-clad plate and this copper-clad plate to be greater than required value in the process of preparing daughter board 10, and prepare to select Copper Foil 24 thickness of common FR4 copper-clad plate and this copper-clad plate to be also greater than required value in the process of described motherboard 20, after lamination process, adopt one side microetch to subtract process for copper processing method, reveal with the remaining glue 40 that described circuit board after lamination carried out microetch processing and subtracts copper, allow lodging between described daughter board 10 and described motherboard 20.Like this, no matter described remaining glue 40 lodges between daughter board 10 and motherboard 20 Anywhere, all can utilize and even brush board PROCESS FOR TREATMENT out and unify to remove, adopt the method for the invention to remove remaining glue 40 simple and efficient, and can batch de except described remaining glue 40.By the thick design of precompensation copper, and then microetch to remove the copper having compensated thick, can make Copper Foil 14,24 thickness of circuit board reach required value.And remaining glue processing method of the present invention can also ensure the well-tended appearance of circuit board and obtain good reliability, can avoid manually removing the defect that glue produces, and can realize again the batch machining except glue.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. a remaining glue processing method for circuit board, is characterized in that, the method comprises the following steps:
Prepare the daughter board of mixed compression circuit board;
Prepare the motherboard of mixed compression circuit board;
Prepare the central layer of mixed compression circuit board; And
Outer processing, described skin be treated to carry out successively that lamination process, one side microetch subtract process for copper processing, even brush board PROCESS FOR TREATMENT out, bore process processing, electroplating technology process and the processing of outer graphics shifting process.
2. the remaining glue processing method of circuit board as claimed in claim 1, is characterized in that, described daughter board is selected copper-clad plate, and the copper thickness of described copper-clad plate is greater than required value.
3. the remaining glue processing method of circuit board as claimed in claim 1, is characterized in that, described motherboard is selected common FR4 copper-clad plate, and the copper thickness of described common FR4 copper-clad plate is greater than required value.
4. the remaining glue processing method of circuit board as claimed in claim 1, is characterized in that, described central layer is selected common FR4 copper-clad plate, and the copper thickness of described common FR4 copper-clad plate equates with required value.
5. the remaining glue processing method of the circuit board as described in claim 1 to 4 any one, is characterized in that, described lamination process is that described daughter board is embedded in described motherboard.
6. the remaining glue processing method of circuit board as claimed in claim 5, it is characterized in that, described one side microetch subtracts process for copper processing method, is that circuit board to accumulate the glue of having a surplus after described lamination process carries out microetch processing and reveals to subtract copper, to allow the described remaining glue accumulating.
7. the remaining glue processing method of circuit board as claimed in claim 6, is characterized in that, described in to even brush board technique processing method out be to unify to remove to lodging in remaining glue between described daughter board and described motherboard.
8. one kind adopts the circuit board that in claim 1 to 7, the remaining glue processing method of the circuit board described in any one forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210524240.2A CN103857187B (en) | 2012-12-07 | 2012-12-07 | A kind of circuit board and the remaining glue processing method of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210524240.2A CN103857187B (en) | 2012-12-07 | 2012-12-07 | A kind of circuit board and the remaining glue processing method of circuit board |
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| CN103857187A true CN103857187A (en) | 2014-06-11 |
| CN103857187B CN103857187B (en) | 2017-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210524240.2A Active CN103857187B (en) | 2012-12-07 | 2012-12-07 | A kind of circuit board and the remaining glue processing method of circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282969A (en) * | 2018-03-26 | 2018-07-13 | 生益电子股份有限公司 | A kind of PCB production methods and PCB for realizing internal layer connection |
| CN108430174A (en) * | 2018-03-26 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
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| CN101074408A (en) * | 2006-05-18 | 2007-11-21 | 施汉忠 | Chemical method for cleaning circuit-board surface |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| JP2011066372A (en) * | 2009-09-16 | 2011-03-31 | Kinko Denshi Kofun Yugenkoshi | Circuit board manufacturing method |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
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2012
- 2012-12-07 CN CN201210524240.2A patent/CN103857187B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101074408A (en) * | 2006-05-18 | 2007-11-21 | 施汉忠 | Chemical method for cleaning circuit-board surface |
| JP2011066372A (en) * | 2009-09-16 | 2011-03-31 | Kinko Denshi Kofun Yugenkoshi | Circuit board manufacturing method |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282969A (en) * | 2018-03-26 | 2018-07-13 | 生益电子股份有限公司 | A kind of PCB production methods and PCB for realizing internal layer connection |
| CN108430174A (en) * | 2018-03-26 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN108430174B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN108282969B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of PCB production method and PCB for realizing internal layer connection |
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| Publication number | Publication date |
|---|---|
| CN103857187B (en) | 2017-03-08 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |