CN103857187B - A kind of circuit board and the remaining glue processing method of circuit board - Google Patents
A kind of circuit board and the remaining glue processing method of circuit board Download PDFInfo
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- CN103857187B CN103857187B CN201210524240.2A CN201210524240A CN103857187B CN 103857187 B CN103857187 B CN 103857187B CN 201210524240 A CN201210524240 A CN 201210524240A CN 103857187 B CN103857187 B CN 103857187B
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- circuit board
- copper
- remaining glue
- processing method
- board
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Abstract
The present invention is applied to the making of circuit board, there is provided a kind of remaining glue processing method of circuit board is it is intended to solve the problems, such as to remove remaining glue and ensure circuit board outward appearance using evening brush board out present in prior art.The remaining glue processing method of described circuit board comprises the following steps：Prepare the daughter board of mixed compression circuit board；Prepare the motherboard of mixed compression circuit board；Prepare the central layer of mixed compression circuit board；And outer layer is processed as carrying out lamination process successively, one side microetch subtracts that process for copper processes, evens brush board PROCESS FOR TREATMENT out, bore process is processed, electroplating technology is processed and outer graphics shifting process is processed.Present invention also offers the circuit board that a kind of remaining glue processing method of employing foregoing circuit plate is formed.The method reaches required value by evening brush board out and unifying batch de except the copper thickness that remaining glue ensures circuit board, and ensures circuit board well-tended appearance and obtain good reliability, you can with the defect avoiding manual removing glue to produce, can realize the batch machining of removing glue again.
Description
Technical field
The invention belongs to the remaining glue processing method of art of printed circuit boards, more particularly, to a kind of circuit board and circuit board, should
Circuit board is partial hybrid circuit board.
Background technology
Partial hybrid circuit board is widely used to the manufacture field of various circuit boards, for example, locally adopt high frequency or
, to realize the function of high-frequency signal and to save material cost simultaneously, locally embedding high level daughter board is to save integrated circuit for high-speed material
The level of plate.However, the processing technique of these circuit boards all has a problem that, that is, after pressing, between daughter board and motherboard, leave one
Fixed remaining glue needs to be removed.Due to usually there will be difference in height between daughter board and motherboard, this leads to remaining glue often to lodge in phase
To shorter place, and the ground kelly-up glue with difference in height accumulates more, is evened out brush board and cannot be removed these using conventional
Remaining glue, excessively shovel brush can lead to the copper thickness degree on the panel of circuit board inadequate, and more than manual removal, glue is difficult to ensure that electricity
Road plate outward appearance and cost of idleness and time.
Content of the invention
The purpose of the embodiment of the present invention is to provide a kind of remaining glue processing method of circuit board, especially for partial hybrid
Circuit board is it is intended to solve to remove remaining glue and ensure circuit board outward appearance and reliability using evening brush board out present in prior art
Sex chromosome mosaicism.
The embodiment of the present invention is achieved in that a kind of remaining glue processing method of circuit board, and the method comprises the following steps：
Prepare the daughter board of mixed compression circuit board；Prepare the motherboard of mixed compression circuit board；Prepare the central layer of mixed compression circuit board；And, outer layer is processed
For carrying out lamination process successively, one side microetch subtract process for copper process, even out brush board PROCESS FOR TREATMENT, bore process process, electricity
Depositing process is processed and outer graphics shifting process is processed.
Preferably, described daughter board selects copper-clad plate, and the copper thickness of described copper-clad plate is more than required value.
Preferably, described motherboard selects common FR4 copper-clad plate, and the copper thickness of described common FR4 copper-clad plate is more than and requires
Value.
Preferably, described central layer selects common FR4 copper-clad plate, the copper thickness of described common FR4 copper-clad plate and required value
Equal.
Preferably it is characterised in that described lamination process is described daughter board to be embedded in described motherboard, by institute
State daughter board to be fixed in described motherboard.
Preferably, described one side microetch subtracts process for copper processing method, is remaining to containing after described lamination process
The circuit board of glue carries out microetch and processes to subtract copper, allows the described remaining glue of accumulation to reveal.
Preferably, described brush board technique processing method of evening out is to the remaining glue lodging between described daughter board and described motherboard
Carry out unifying to remove.
Present invention also offers a kind of circuit board, this circuit board is to be formed using the remaining glue processing method of foregoing circuit plate
's.
After the laminated PROCESS FOR TREATMENT of circuit board that the present invention provides, process for copper processing method is subtracted using one side microetch, with right
Described laminated after circuit board carry out microetch and process and subtract copper, allow the remaining glue lodging between described daughter board and described motherboard to show
Expose.So, no matter described remaining glue lodges between mother baby plate Anywhere, all can be utilized and even brush board PROCESS FOR TREATMENT out and enter
Row is unified to be removed.
The remaining glue processing method that the present invention provides selects special material copper-clad plate during preparing daughter board and this covers copper
The copper thickness of plate is more than required value, and selects common FR4 copper-clad plate and this copper-clad plate during preparing described motherboard
Copper thickness also greater than required value, using the method for the invention remove more than glue simple and efficient, and can unify batch de except described
Remaining glue, and can make circuit board copper thickness reach required value, ensure the well-tended appearance of circuit board and obtain good can
By property.
Brief description
Fig. 1 is the remaining glue process method step flow chart of circuit board provided in an embodiment of the present invention.
Fig. 2 is the schematic flow sheet of step 11 provided in an embodiment of the present invention.
Fig. 3 is the schematic flow sheet of step 12 provided in an embodiment of the present invention.
Fig. 4 is the schematic flow sheet of step 13 provided in an embodiment of the present invention.
Fig. 5 is the schematic diagram of circuit board after laminated PROCESS FOR TREATMENT provided in an embodiment of the present invention.
Fig. 6 is the schematic diagram subtracting circuit board after process for copper is processed through one side microetch provided in an embodiment of the present invention.
Fig. 7 is that even out brush board, boring, plating and outer graphics in step 14 provided in an embodiment of the present invention shift work
The schematic diagram that skill is processed.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with drawings and Examples, right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only in order to explain the present invention, and
It is not used in the restriction present invention.
Refer to Fig. 1, the remaining glue processing method of circuit board provided in an embodiment of the present invention, comprise the following steps：
Prepare the daughter board of mixed compression circuit board；
Prepare the motherboard of mixed compression circuit board；
Prepare the central layer of mixed compression circuit board；
Outer layer is processed as carrying out lamination process successively, one side microetch subtract process for copper process, even out brush board PROCESS FOR TREATMENT,
Bore process is processed, electroplating technology is processed and outer graphics shifting process is processed.
In the present embodiment, described circuit board is partial hybrid circuit board.
Refer to Fig. 2, in one particular embodiment of the present invention, prepare mixed compression circuit board daughter board 10 step be according to
Secondary carry out technology for blanking process（As Fig. 2（a）Shown）, inner figure shifting process process（As Fig. 2（b）Shown）, outer layer groove milling
With brown PROCESS FOR TREATMENT（As Fig. 2（c）Shown）.
In the present embodiment, described daughter board 10 is multi-layer sheet.
Copper thickness A oz is unit value, and that is, every square chi of area one side covers the copper layer thickness that Copper Foil weight is A oz.
Specifically, in technology for blanking processing procedure, according to the requirement of copper base（Required value is A oz）Copper is covered in selection
As daughter board 10, this copper-clad plate is special material copper-clad plate to plate, and on base material 12, the thickness of covered Copper Foil 14 is more than required value,
I.e. the first face in this base material 12 covers Copper Foil 14, and the thickness of this covered Copper Foil in the first face 14 is A oz+0.5oz, the second face
Cover Copper Foil 16, the thickness of this covered Copper Foil in the second face 16 is A oz.Described special material copper-clad plate can be that fragrant amide is fine
Dimension nonwoven fabric base copper-clad plate or synthetic fibers base copper-clad plate, to realize the specific function of local material structure production, for example, high
Frequency signal, saves the usage amount of high frequency material.
It is by the circuit negative of the second layer on described daughter board 10 that inner figure shifting process is processed（The film）On circuit diagram
Shape is transferred on Copper Foil 16 surface of daughter board 10, and carries out pre-treatment, pad pasting, exposure, development successively, etches and move back film.
Pre-treatment step is to remove the oxide of all, spot on copper coin surface, requires surface microroughness, to increase simultaneously
Big dry film and the contact area of substrate surface, can adopt mechanical cleaning process, for example, abrasive brush roll-type brush plate machine or pumice
Brush board, or chemical cleaning method, for example, oil removing, microetch or pickling.Copper coin surface after pre-treatment whether clean utilization water
Film rupture experimental technique is tested, will pre-treatment copper coin surface, soak through flowing water and be disposed vertically, in whole plate face
Continuous moisture film should at least keep 15 seconds not rupturing.
During pad pasting, first polyethylene protective film is peeled from dry film, then under heating pressurized conditions, dry film photoresist is glued
Film is in copper-clad plate.Copper-clad plate after pad pasting must stop more than 15 minutes, within 24 hours.If the time of staying is not, dry film
Middle added adhesion promoter is not had an effect completely with copper and is cohered loosely, causes film pine；If the time of staying is too
Long, then can cause that overresponse attachment Dipeptiven is strong and the problems such as the stripping that develops is difficult.
Exposure-processed, that is, under ultraviolet light, light trigger absorbs luminous energy and resolves into free radical, and free radical causes light again
Polymerized monomer carries out polymerization crosslinking reaction, forms the build macromolecular structure insoluble in weak solution.List is carried out to described copper-clad plate
Face graphic making, that is, to Copper Foil 16（Thickness is the one side of A oz）Carry out graphic making, and to Copper Foil 14（Thickness is A oz+
The one side of 0.5oz）Carry out protection process.Exposure imaging inspection is done using Ristor17 or SST21 level exposure guide rule, when determining exposure
Between, this part is prior art, not enumeration herein.
Development, that is, pass through the effect of liquid medicine sodium carbonate, after the dry film of unexposed portion is dissolved and rinses, stay photosensitive
Part.
Etching, is to fall unexposed dew copper part copper facet etch.
Move back film, be the sodium hydroxide by higher concentration（NaOH）The film of protection circuit copper face is removed, described NaOH
Concentration be 1-4%.
The above development, etch and move back film and belong to prior art, herein not enumeration.
Outer layer groove milling PROCESS FOR TREATMENT, by the target setting, in the uniform location milling pipe position groove of the outer layer of described copper-clad plate,
Row's plate pipe position for lower operation uses.According to the actual requirements milling handling process, the length of described daughter board 10 are carried out to described daughter board 10
Little 4-6 mil more monolateral than the size of described motherboard with width（mil）.
Brown PROCESS FOR TREATMENT, it is therefore an objective to be roughened described copper-clad plate surface, increases bonded area and increases surface adhesion.
Described comprehensive metallization processes are processed to be realized using general prior art, herein not enumeration.
Refer to Fig. 3, in one particular embodiment of the present invention, prepare mixed compression circuit board motherboard 20 step be according to
Secondary carry out technology for blanking process（As Fig. 3（a）Shown）, inner figure shifting process process（As Fig. 3（b）Shown）, outer layer groove milling
With brown PROCESS FOR TREATMENT（As Fig. 3（c）Shown）.This step is essentially identical with the step preparing described daughter board 10, both differences
It is to prepare the requirement according to copper base during motherboard 20 in technology for blanking processing procedure（Required value is A oz）Common FR4 is selected to cover
As motherboard 20, the thickness in the covered Copper Foil 24 of base material 22 is more than described required value to copper coin, that is, in the first face of this base material 22
Cover Copper Foil 24, the thickness of this covered Copper Foil in the first face 24 is A oz+0.5oz, and the second face covers Copper Foil 26, this second face institute
The thickness covering Copper Foil 26 is A oz, and, it is also to carry out one side figure to described copper-clad plate that the inner figure of this step is processed
Make, that is, to Copper Foil 26（Thickness is the one side of A oz）Carry out graphic making, and to Copper Foil 24（Thickness is the one of A oz+0.5oz
Face）Carry out protection process.
Refer to Fig. 4, in one particular embodiment of the present invention, prepare mixed compression circuit board central layer 30 step be according to
Secondary carry out technology for blanking process（As Fig. 4（a）Shown）, inner figure shifting process process（As Fig. 4（b）Shown）, brown technique
Process（As Fig. 4（c）Shown）.This step is essentially identical with the step preparing described daughter board 10, and difference is, technology for blanking is processed
During, prepare during described central layer 30, to select logical Copper Foil 34,36 thickness to be the common FR4 copper-clad plate of A oz, described central layer 30
Copper Foil 34,36 thickness are equal with required value；It is to carry out two-sided making to described copper-clad plate that described inner figure shifting process is processed
Figure；This step does not need to carry out outer layer groove milling PROCESS FOR TREATMENT.
Refer to Fig. 5, the outer layer processing method in the embodiment of the present invention, is the improvement on the basis of conventional method.The party
The lamination process of method is that described daughter board 10 is embedded in described motherboard 20, after pressing, described daughter board 10 is fixed on institute
State in motherboard 20.Certain remaining glue 40 can be accumulated it will usually situations below occurs between the daughter board 10 after pressing and motherboard 20：The
One, described daughter board 10 is higher than described motherboard 20, and described daughter board 10 and described motherboard 20 contain remaining glue 40, described motherboard respectively
Remaining glue 40 on 20 is substantially more, and, the recess being formed between described daughter board 10 and described motherboard 20 also can accumulate remaining glue
40, such as Fig. 5（a）Shown；Second, described daughter board 10 is flushed with described motherboard 20, and the remaining glue 40 of generation is few, such as Fig. 5（b）Shown；
3rd, described daughter board 10 is less than described motherboard 20, and described daughter board 10 and described motherboard 20 contain remaining glue 40, described son respectively
Remaining glue 40 on plate 10 is substantially more, and, the recess being formed between described daughter board 10 and described motherboard 20 also can accumulate remaining
Glue 40, such as Fig. 5（c）Shown.
Refer to Fig. 6, the embodiment of the present invention subtracts process for copper processing method using one side microetch, at through described laminating technology
Circuit board after reason carries out microetch and processes to subtract copper 0.5oz, allows the remaining glue 40 of accumulation to reveal.Fig. 6（a）For described daughter board 10
Higher than described motherboard 20, subtract after process for copper process through one side microetch, remaining glue 40 is revealed in outside described circuit board；Fig. 6（b）For institute
State daughter board 10 to flush with described motherboard 20, subtract after process for copper process through one side microetch, remaining glue 40 is revealed in outside described circuit board；
Fig. 6（c）It is less than described motherboard 20 for described daughter board 10, subtract after process for copper process through one side microetch, remaining glue 40 is revealed in described electricity
Outside the plate of road.
Refer to Fig. 7（a）, using the remaining glue 40 evened out between brush board technique processing method removal daughter board 10 and motherboard 20,
The remaining glue 40 lodging in described daughter board 10, described motherboard 20 or described recess is carried out unify to remove.The present invention is due to adopting
Subtract process for copper processing method with one side microetch, the remaining glue 40 of above-mentioned three kinds of situations can be purged in the lump, need not be directed to
Different situations individual processing.In addition, the present invention due to selecting Copper Foil 14,24 thick when described daughter board 10 and described motherboard 20 make
Spend the copper-clad plate bigger than required value, can be easy to remove remaining glue 40 after brush board through evening out, and the Copper Foil on final copper-clad plate surface
14th, 24 thickness also can meet requirement.
Refer to Fig. 7（b）, bore process is processed, and is to carry out boring process to the circuit board after laminated, described to make
The passage 50 of circuit board ectonexine interconnection, and make the passage 50 of described daughter board 10 and the internal layer interconnection of described motherboard 20.
Refer to Fig. 7（c）, electroplating technology is processed, and the passage 50 being formed in described bore process processing procedure is carried out gold
Genusization, is coated with layer of metal layer 60 in described passage 50 inwall and described circuit board outer surface, realizes ectonexine, daughter board 10
Circuit interconnection and motherboard 20 between.
Refer to Fig. 7（d）, outer graphics shifting process is processed, and is that the outer layer to the circuit board after laminated carries out figure
Transfer, by the graphic making of outer layer to the outer layer of circuit board.This processing method shifts work with the inner figure of described daughter board 10
Skill processing method is similar, successively using pre-treatment, pad pasting, exposure, development, etch and move back film, the exposure of this processing method is right
Circuit board after lamination carries out two-sided making figure.
Copper Foil 14 thickness of the present invention selection special material copper-clad plate and this copper-clad plate during preparing daughter board 10 is big
Copper Foil 24 thickness of common FR4 copper-clad plate and this copper-clad plate is selected during required value, and the described motherboard 20 of preparation
More than required value, after laminated PROCESS FOR TREATMENT, process for copper processing method is subtracted using one side microetch, with to described laminated after electricity
Road plate carries out microetch and processes and subtract copper, allows the remaining glue 40 lodging between described daughter board 10 and described motherboard 20 to reveal.This
Sample, no matter described remaining glue 40 lodges between daughter board 10 and motherboard 20 Anywhere, all can be utilized and evens brush board PROCESS FOR TREATMENT out
Carry out unifying removing, using the method for the invention remove more than glue 40 simple and efficient, and batch de can remove described remaining glue 40.Pass through
The thick design of precompensation copper, then microetch removes the copper thickness having been compensated for again, and the Copper Foil 14 of circuit board, 24 thickness can be made to reach will
Evaluation.And, the remaining glue processing method of the present invention also ensures that the well-tended appearance of circuit board and obtains good reliability, that is,
The defect that manual removing glue can be avoided to produce, can realize the batch machining of removing glue again.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (7)
1. a kind of remaining glue processing method of circuit board is it is characterised in that the method comprises the following steps：
Prepare the daughter board of mixed compression circuit board；
Prepare the motherboard of mixed compression circuit board；
Prepare the central layer of mixed compression circuit board；And
Outer layer is processed, and described outer layer is processed as carrying out lamination process successively, one side microetch subtracts process for copper and processes, evens brush board out
PROCESS FOR TREATMENT, bore process are processed, electroplating technology is processed and outer graphics shifting process is processed；Wherein, described one side microetch
Subtract process for copper processing method, be the circuit board containing remaining glue after described lamination process to be carried out with microetch process to subtract
Copper, allows the described remaining glue of accumulation to reveal.
2. the remaining glue processing method of circuit board as claimed in claim 1 is it is characterised in that described daughter board selects copper-clad plate, institute
The copper thickness stating copper-clad plate is more than required value.
3. the remaining glue processing method of circuit board as claimed in claim 1 is it is characterised in that described motherboard selects common FR4 to cover
Copper coin, the copper thickness of described common FR4 copper-clad plate is more than required value.
4. the remaining glue processing method of circuit board as claimed in claim 1 is it is characterised in that described central layer selects common FR4 to cover
Copper coin, the copper thickness of described common FR4 copper-clad plate is equal with required value.
5. the remaining glue processing method of the circuit board as described in Claims 1-4 any one is it is characterised in that described lamination work
It is that described daughter board is embedded in described motherboard that skill is processed.
6. the remaining glue processing method of circuit board as claimed in claim 5 is it is characterised in that described even brush board PROCESS FOR TREATMENT side out
Method is the remaining glue lodging between described daughter board and described motherboard to be carried out unify to remove.
7. the circuit board that in a kind of employing claim 1 to 6, the remaining glue processing method of the circuit board described in any one is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210524240.2A CN103857187B (en) | 2012-12-07 | 2012-12-07 | A kind of circuit board and the remaining glue processing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210524240.2A CN103857187B (en) | 2012-12-07 | 2012-12-07 | A kind of circuit board and the remaining glue processing method of circuit board |
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| CN103857187A CN103857187A (en) | 2014-06-11 |
| CN103857187B true CN103857187B (en) | 2017-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210524240.2A Active CN103857187B (en) | 2012-12-07 | 2012-12-07 | A kind of circuit board and the remaining glue processing method of circuit board |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282969B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of PCB production method and PCB for realizing internal layer connection |
| CN108430174B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101074408A (en) * | 2006-05-18 | 2007-11-21 | 施汉忠 | Chemical method for cleaning circuit-board surface |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI399147B (en) * | 2009-09-16 | 2013-06-11 | Unimicron Technology Corp | Fabrication method of circuit board |
-
2012
- 2012-12-07 CN CN201210524240.2A patent/CN103857187B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101074408A (en) * | 2006-05-18 | 2007-11-21 | 施汉忠 | Chemical method for cleaning circuit-board surface |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |