CN103200777A - Manufacture method of thick copper plate fine solder resist bridge - Google Patents
Manufacture method of thick copper plate fine solder resist bridge Download PDFInfo
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- CN103200777A CN103200777A CN2013101400702A CN201310140070A CN103200777A CN 103200777 A CN103200777 A CN 103200777A CN 2013101400702 A CN2013101400702 A CN 2013101400702A CN 201310140070 A CN201310140070 A CN 201310140070A CN 103200777 A CN103200777 A CN 103200777A
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Abstract
The invention discloses a manufacture method of a thick copper plate fine solder resist bridge. The manufacture method comprises the following steps of: baffling printing ink at the position of a fine solder resist bridge by a mesh plate with oil baffle points when first oil printing is carried out, wherein the thickness of the printing ink of a thick copper plate line can be guaranteed only by printing the printing ink at the other positions; and carrying out second printing by a normal blank mesh plate. After the method is used, under the condition that the thickness of the printing ink of the thick copper plate line is guaranteed, the thickness of the printing ink at the fine solder resist bridge is reduced, and the thickness condition of the manufactured fine solder resist bridge can be met; the conventional double-alignment, exposure and development technology is changed into one-time-alignment, exposure and development technology after the whole craft process is used; and the printing oil at the edge within an oil baffle region inwards leaks due to the liquidity of the printing ink after the first printing, so that the stepped drop can be avoided in the process of secondary silk screen, and the thick copper plate fine solder resist bridge is attractive in appearance. The stepped apparent defect caused by the double times of exposure and development can be avoided.
Description
Technical field
The present invention relates to the PCB manufacture technology field, relate in particular to the manufacture method of the meticulous welding resistance bridge of a kind of thick copper coin.
Background technology
Thick copper coin (〉=be the ink thickness that guarantees on the circuit when 2OZ) making welding resistance, the normal mode of twice printing or repeatedly printing that adopts is made, but printing back since substrate location printing ink can be thicker (generally with the thick phase of copper at once 〉=70um), when making tiny green oil bridge, owing to there is the relation of lateral erosion, the quality abnormal of green oil bridge usually occurs falling, seriously perplex this industry and produce this series products in batches.
At present generally take the mode of twice contraposition of twice printing, exposure and development to make at this type plate wiring board producer: method 1, in the first impression and contraposition exposure imaging, the green oil bridge to be made, during the exposure of contraposition for the second time windowed out in green oil bridge zone; Method 2, in exposure for the first time little green oil bridge location is put and to be in the light and to develop to fall, normally make the green oil bridge second time during welding resistance again.The mode of twice contraposition of this two kinds of twice printings is put ink thickness and is made meticulous green oil bridge by reducing little green oil bridge location, but this mode make efficiency lower (twice of conventional welding resistance) and produce product and develop bigger with the drop of second development for the first time at green oil bridge regional location, have significantly ladder effect, have a strong impact on product appearance.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide the manufacture method of the meticulous welding resistance bridge of a kind of thick copper coin, be intended to solve the meticulous green oil bridge of present making inefficiency, product appearance is not good, the problem that yields is low.
Technical scheme of the present invention is as follows:
The manufacture method of the meticulous welding resistance bridge of a kind of thick copper coin wherein, may further comprise the steps:
A, use band retaining oil drop web plate to carry out the first impression to thick copper coin line layer, described band retaining oil drop web plate is used for that meticulous welding resistance bridge location to be processed is put and does not cover printing ink;
B, thick copper coin is carried out the second impression, whole plate ink for screen printing;
After C, process contraposition, exposure, the development, put processing and fabricating welding resistance printing ink bridge at described meticulous welding resistance bridge location to be processed.
The manufacture method of the meticulous welding resistance bridge of described thick copper coin wherein, also comprises pre-roasting process for the first time between described steps A and the B: the described first time in advance roasting process for the thick copper coin of printing-ink under 75 ℃ of temperature conditions prebake conditions 10 minutes with cured printing ink.
The manufacture method of the meticulous welding resistance bridge of described thick copper coin wherein, comprises pre-roasting process for the second time between described step B and the C, in advance roasting process will be for putting in order thick copper coin behind plate ink for screen printing prebake conditions 40 minutes under 75 ℃ of temperature conditions the described second time.
The manufacture method of the meticulous welding resistance bridge of described thick copper coin, wherein, described band retaining oil drop web plate is to adopt the sensitization slurry to be coated on the blank web plate, then by using film exposure imaging, the sensitization slurry that is exposed the zone is retained on the web plate, stops meticulous welding resistance bridge zone printing ink when being used for printing.
The manufacture method of the meticulous welding resistance bridge of described thick copper coin, wherein, the retaining oil drop border of described band retaining oil drop web plate is than the meticulous welding resistance bridge wide 0.5mm in zone boundary.
The manufacture method of the meticulous welding resistance bridge of described thick copper coin, wherein, described welding resistance printing ink bridge width≤4mil.
Beneficial effect: the manufacture method that the invention provides the meticulous welding resistance bridge of a kind of thick copper coin, by use band retaining oil drop web plate during ink printing in the first time, meticulous welding resistance bridge location is put printing ink block, only need other position printing ink of printing, guarantee thick copper coin circuit ink thickness.Use conventional blank web plate to carry out the second impression afterwards.The method can be under the situation that guarantees thick copper coin circuit ink thickness, and it is less to make meticulous welding resistance bridge location put ink thickness, satisfies the thickness condition of producing meticulous welding resistance bridge, and avoiding simultaneously double exposing and developing produces the open defect of ladder.
Description of drawings
Fig. 1 is the meticulous welding resistance bridge of the thick copper coin manufacture method flow chart of one embodiment of the invention.
Fig. 2 is that the meticulous welding resistance bridge of golden finger uses band retaining oil drop screen printing inked areas schematic diagram on the thick copper coin of one embodiment of the invention.
Embodiment
The invention provides the manufacture method of the meticulous welding resistance bridge of a kind of thick copper coin, clearer, clear and definite for making purpose of the present invention, technical scheme and effect, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
The manufacture method of the meticulous welding resistance bridge of a kind of thick copper coin of the present invention, in order to processing the thick copper coin of thickness 〉=2OZ, and the welding resistance printing ink bridge width≤4mil of institute's processing and fabricating.Less than the welding resistance bridge of 4mil often because the lateral erosion during printing-ink causes processing quality to descend, and this method can be avoided the appearance of this problem, the method that this law invention is adopted may further comprise the steps: use band retaining oil drop web plate to carry out the first impression to thick copper coin line layer, the position printing ink of meticulous welding resistance bridge is blocked, make meticulous welding resistance bridge location to be processed put and do not cover printing ink, guarantee the up to standard and uniformity of other position ink thickness of thick copper coin line layer.Described band retaining oil drop web plate is to adopt the sensitization slurry to be coated on the blank half tone, by using film exposure imaging, the sensitization slurry that is exposed the zone is retained on the half tone then, stops the purpose of green oil bridge zone printing ink when realizing printing.Preferably, the retaining oil drop border of described band retaining oil drop web plate is than the meticulous welding resistance bridge wide 0.5mm in zone boundary.Can satisfy the processing needs of meticulous welding resistance bridge like this, can guarantee that also meticulous welding resistance bridge zone can access the covering fully of printing ink, improve machining accuracy and the quality of follow-up welding resistance bridge, avoid because the problems such as quality abnormal that the printing ink seal is inclined to one side and lateral erosion causes that deviations causes.It is roasting in advance after the first impression the thick copper coin of printing-ink to be carried out the first time, and prebake conditions 10 minutes is with cured printing ink under 75 ℃ of temperature conditions.Use conventional blank web plate that thick copper coin is carried out the second impression, whole plate ink for screen printing afterwards, thick copper coin is carried out in advance roasting process second time, to put in order thick copper coin behind plate ink for screen printing prebake conditions 40 minutes under 75 ℃ of temperature conditions.After carrying out contraposition, exposure, development at last, put processing and fabricating welding resistance printing ink bridge at described meticulous welding resistance bridge location to be processed.
As shown in Figure 2, utilize the present invention to process golden finger 300 on the thick copper coin 100,300 needs of golden finger are made meticulous welding resistance printing ink bridge, make flow process as shown in Figure 1, S1, at first thick copper coin after the etching is carried out the welding resistance pre-treatment, use the welding resistance pre-processing device to remove thick copper coin 100 line layer surface oxidations and dirty.S2, use special facture band retaining oil drop web plate carry out first impression printing ink, in the course of processing, golden finger need be made the position of welding resistance printing ink bridge and block, soon 200 indicated empty frame zones are blocked among Fig. 2, make this zone 200 not cover printing ink, all the other positions cover green oil.S3, with the thick copper coin of printing-ink under 75 ℃ of temperature conditions prebake conditions 10 minutes with cured printing ink.S4, the conventional blank web plate of use carry out the second impression, and whole plate is carried out ink for screen printing.S5, thick copper coin 100 is carried out the pre-roasting process second time, thick copper coin behind whole plate ink for screen printing prebake conditions 40 minutes under 75 ℃ of temperature conditions.S6, treat to carry out contraposition, exposure, development behind the ink solidification after, because golden finger 300 meticulous welding resistance printing ink bridge locations are put printing ink and have only been printed once, its thickness is compared to thinner on every side, satisfy the thickness condition of the meticulous welding resistance bridge of processing golden finger, method for producing can carry out S7 routinely, realizes the processing and fabricating of meticulous printing ink bridge.
The present invention puts printing ink with meticulous welding resistance bridge location and blocks by use band retaining oil drop web plate during ink printing in the first time, only needs other position printing ink of printing, guarantees thick copper coin circuit ink thickness.Use conventional blank web plate to carry out the second impression afterwards.The method can be under the situation that guarantees thick copper coin circuit ink thickness, it is less to make meticulous welding resistance bridge location put ink thickness, satisfy the thickness condition of producing meticulous welding resistance bridge, whole technical process is modified to contraposition, exposure and a development with traditional twice contraposition, exposure and development, also reach the purpose of making welding resistance printing ink bridge when significantly promoting processing and fabricating efficient, simultaneously owing to utilize the flowability of printing ink after the first impression, the edge printing ink in retaining oil zone can ooze inward, can not produce step therein, appearance looks elegant in the second time during silk-screen.Avoided double exposure and developed producing the open defect of ladder.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, for those of ordinary skills, can be improved according to the above description or conversion that all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (6)
1. the manufacture method of the meticulous welding resistance bridge of thick copper coin is characterized in that, may further comprise the steps:
A, use band retaining oil drop web plate to carry out the first impression to thick copper coin line layer, described band retaining oil drop web plate is used for that meticulous welding resistance bridge location to be processed is put and does not cover printing ink;
B, thick copper coin is carried out the second impression, whole plate ink for screen printing;
After C, process contraposition, exposure, the development, put processing and fabricating welding resistance printing ink bridge at described meticulous welding resistance bridge location to be processed.
2. the manufacture method of the meticulous welding resistance bridge of thick copper coin according to claim 1, it is characterized in that, also comprise pre-roasting process for the first time between described steps A and the B: the described first time in advance roasting process for the thick copper coin of printing-ink under 75 ℃ of temperature conditions prebake conditions 10 minutes with cured printing ink.
3. the manufacture method of the meticulous welding resistance bridge of thick copper coin according to claim 1, it is characterized in that, comprise pre-roasting process for the second time between described step B and the C, in advance roasting process will be for putting in order thick copper coin behind plate ink for screen printing prebake conditions 40 minutes under 75 ℃ of temperature conditions the described second time.
4. the manufacture method of the meticulous welding resistance bridge of thick copper coin according to claim 1, it is characterized in that, described band retaining oil drop web plate is to adopt the sensitization slurry to be coated on the blank web plate, then by using film exposure imaging, the sensitization slurry that is exposed the zone is retained on the web plate, stops meticulous welding resistance bridge zone printing ink when being used for printing.
5. the manufacture method of the meticulous welding resistance bridge of thick copper coin according to claim 4 is characterized in that, the retaining oil drop border of described band retaining oil drop web plate is than the meticulous welding resistance bridge wide 0.5mm in zone boundary.
6. the manufacture method of the meticulous welding resistance bridge of thick copper coin according to claim 1 is characterized in that, described welding resistance printing ink bridge width≤4mil.
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| CN2013101400702A CN103200777A (en) | 2013-04-22 | 2013-04-22 | Manufacture method of thick copper plate fine solder resist bridge |
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| CN2013101400702A CN103200777A (en) | 2013-04-22 | 2013-04-22 | Manufacture method of thick copper plate fine solder resist bridge |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687336A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Corrosion-resistant printed wiring board and manufacturing method thereof |
| CN104742547A (en) * | 2015-04-03 | 2015-07-01 | 昆山万源通电子科技有限公司 | Two-ounce PCB board printing technology |
| CN105208788A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Method for improving aligning precision of solder masks |
| CN105530770A (en) * | 2015-12-30 | 2016-04-27 | 东莞生益电子有限公司 | Manufacturing method of PCB |
| CN105578759A (en) * | 2015-12-30 | 2016-05-11 | 东莞生益电子有限公司 | PCB manufacturing method |
| CN107027245A (en) * | 2017-05-02 | 2017-08-08 | 江门崇达电路技术有限公司 | A kind of preparation method of welding resistance bridge |
| CN107613656A (en) * | 2017-08-31 | 2018-01-19 | 景旺电子科技(龙川)有限公司 | It is a kind of to improve the bad method of anti-welding thick exposed copper |
| CN109511231A (en) * | 2018-12-27 | 2019-03-22 | 深圳市确保电子有限公司 | A kind of anti-short circuit design of IC pad welding resistance |
| CN109605968A (en) * | 2018-11-02 | 2019-04-12 | 成都银河动力有限公司 | A kind of technique improving aluminum piston graphite silk-screen printing coating layer thickness |
| CN110324982A (en) * | 2019-04-04 | 2019-10-11 | 惠州美锐电子科技有限公司 | A kind of PCB printing ink printing art method |
| CN111031704A (en) * | 2019-12-06 | 2020-04-17 | 沪士电子股份有限公司 | Method for adding solder resisting bridge between narrow and small IC pads on thick copper PCB |
| CN112721482A (en) * | 2020-12-17 | 2021-04-30 | 江西弘信柔性电子科技有限公司 | Printing process for improving thickness uniformity of solder resist ink |
| CN112976853A (en) * | 2021-03-17 | 2021-06-18 | 上达电子（深圳）股份有限公司 | Method for improving ink precision by twice printing |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687336B (en) * | 2013-12-11 | 2016-08-17 | 广州兴森快捷电路科技有限公司 | Corrosion resistant printed wiring board and preparation method thereof |
| CN103687336A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Corrosion-resistant printed wiring board and manufacturing method thereof |
| CN104742547A (en) * | 2015-04-03 | 2015-07-01 | 昆山万源通电子科技有限公司 | Two-ounce PCB board printing technology |
| CN105208788A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Method for improving aligning precision of solder masks |
| CN105208788B (en) * | 2015-08-11 | 2018-04-03 | 深圳崇达多层线路板有限公司 | It is a kind of to improve solder mask and the method for solder mask aligning accuracy |
| CN105578759A (en) * | 2015-12-30 | 2016-05-11 | 东莞生益电子有限公司 | PCB manufacturing method |
| CN105530770A (en) * | 2015-12-30 | 2016-04-27 | 东莞生益电子有限公司 | Manufacturing method of PCB |
| CN107027245A (en) * | 2017-05-02 | 2017-08-08 | 江门崇达电路技术有限公司 | A kind of preparation method of welding resistance bridge |
| CN107027245B (en) * | 2017-05-02 | 2019-04-02 | 江门崇达电路技术有限公司 | A kind of production method of welding resistance bridge |
| CN107613656B (en) * | 2017-08-31 | 2020-08-11 | 景旺电子科技(龙川)有限公司 | Method for improving poor exposure of metal-based thick copper plate |
| CN107613656A (en) * | 2017-08-31 | 2018-01-19 | 景旺电子科技(龙川)有限公司 | It is a kind of to improve the bad method of anti-welding thick exposed copper |
| CN109605968A (en) * | 2018-11-02 | 2019-04-12 | 成都银河动力有限公司 | A kind of technique improving aluminum piston graphite silk-screen printing coating layer thickness |
| CN109511231A (en) * | 2018-12-27 | 2019-03-22 | 深圳市确保电子有限公司 | A kind of anti-short circuit design of IC pad welding resistance |
| CN110809363A (en) * | 2018-12-27 | 2020-02-18 | 吴小再 | IC bonding pad |
| CN110809363B (en) * | 2018-12-27 | 2022-12-16 | 深圳市中电联科技有限公司 | IC bonding pad |
| CN110324982A (en) * | 2019-04-04 | 2019-10-11 | 惠州美锐电子科技有限公司 | A kind of PCB printing ink printing art method |
| CN111031704A (en) * | 2019-12-06 | 2020-04-17 | 沪士电子股份有限公司 | Method for adding solder resisting bridge between narrow and small IC pads on thick copper PCB |
| CN112721482A (en) * | 2020-12-17 | 2021-04-30 | 江西弘信柔性电子科技有限公司 | Printing process for improving thickness uniformity of solder resist ink |
| CN112976853A (en) * | 2021-03-17 | 2021-06-18 | 上达电子（深圳）股份有限公司 | Method for improving ink precision by twice printing |
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Address after: 518102, Shenzhen, Guangdong province Baoan District West Township iron Gang reservoir No. 166 Applicant after: Shenzhen Kinwong Electronic Co., Ltd. Address before: 518102, Shenzhen, Guangdong province Baoan District West Township iron Gang reservoir No. 166 Applicant before: Kinwong Electronic (Shenzhen) Co., Ltd. |
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