CN102244985A - Processing method of surface-mounted pads on thick copper circuit board - Google Patents
Processing method of surface-mounted pads on thick copper circuit board Download PDFInfo
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- CN102244985A CN102244985A CN2011101010223A CN201110101022A CN102244985A CN 102244985 A CN102244985 A CN 102244985A CN 2011101010223 A CN2011101010223 A CN 2011101010223A CN 201110101022 A CN201110101022 A CN 201110101022A CN 102244985 A CN102244985 A CN 102244985A
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Abstract
The invention discloses a processing method of surface-mounted pads on a thick copper circuit board. The processing method comprises the following steps: S01. patterning an external layer for the first time; 2. etching the external layer for the first time; 3. patterning the external layer for the second time; 4. etching the external layer for the second time; and 5. manufacturing a solder mask bridge among the surface-mounted pads by a fractional solder resisting method. The processing method has the beneficial effects that the surface-mounted pads are manufactured by a partitioned etching method, which strengthens size control of the surface-mounted pads and meets the design requirements; and the solder mask bridge among the surface-mounted pads are manufactured by utilizing the fractional solder resisting method so that the solder mask bridge and the circuit board are firmly connected together and are not easily separated from each other.
Description
Technical field
The present invention relates to the thick copper circuit board manufacture field, relate in particular to the processing method that paste on a kind of thick copper circuit board surface.
Background technology
Thick copper circuit board: the thick printed wiring board of copper more than or equal to 3OZ;
OZ: the abbreviation of symbol ounce, Chinese are called " ounce ", are unit of measurement made in Great Britain, 1 ounce=28.35 grams, in wiring board, the 1OZ meaning is that the weight of average Copper Foil is 28.35g on 1 square feet the area, represents the average thickness of Copper Foil with the weight of unit are.
Paste on the surface: be used for the pad that mounts with components and parts on the wiring board, because the top that paste on the surface is to need contact with components and parts conducting parts, in order to guarantee to conduct electricity the integrality that power or signal transmit, the size that the line top is pasted on the surface is controlled by strictness;
10mil/10mil pastes on the surface: be meant that the width that paste on the surface is 10mil, spacing also is 10mil.
Thick copper coin is used in powerful power module field, and the market demand is increasing.And along with the increase of the power of components and parts, the thick requirement of the copper of thick copper coin is also more and more higher.But because the size of many components and parts is fixing, so also relative fixed of its size that surface on wiring board of using is pasted.Conventional processing method is: → outer graphics → outer etching → silk-screen welding resistance → contraposition/exposure → development → welding resistance curing →, the wiring board state of each flow process correspondence as shown in Figure 1, according to conventional processing method processing, size is pasted on the surface can only control to 7mil usually, does not reach its tolerance; Thereby cause mounting area and cause underpower or the not enough defective of signal inadequately, cause great product defects.Paste on surface for 10mil/10mil, and the surface needs to make the welding resistance bridge between pasting, and on the thick copper circuit board more than the 4OZ, paste on the surface of adopting conventional processing method can't process this 10mil/10mil; In addition, the undersized welding resistance bridge of processing is also very difficult between the surface subsides of thick copper coin, because the printing ink of silk-screen is thick, the bottom exposure of printing ink is incomplete, and the welding resistance bridge just is very easy to peel off, and then causes product to occur connecting the tin short risk easily.
On October 13rd, 2010, disclosed application number was that 200910029762.3 Chinese invention patent application relates to a kind of thick copper circuit board and circuit etching and solder-resisting manufacturing methods, be partially submerged in the contacted heat conductive insulating layer in contact-making surface with the contacted thick copper circuit layer of each heat conductive insulating layer in the wiring board, the making of this structure is produced thick copper circuit layer by respectively etched mode being carried out on the two sides of super thick Copper Foil, solves the circuit etching problem of super thick Copper Foil; The prepreg that adopts high resin content is as the heat conductive insulating layer, and the heat conductive insulating layer segment behind the lamination is packed in the circuit gap of thick copper circuit layer.This method is directly carried out etching to Copper Foil and is pressed in the wiring board substrate again, and difficulty of processing is bigger.
Summary of the invention
The technical problem that the present invention mainly solves provides the processing method that paste on a kind of thick copper circuit board surface, realizes the processing that paste on the surperficial thick 5OZ of processing, especially copper, the 10mil/10mil surface of pasting of thick copper circuit board.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of thick copper circuit board processing method that paste on the surface is provided, and described thick copper circuit board comprises surperficial pinup picture shape zone and line pattern zone, and described processing method comprises step:
S01: outer graphics for the first time: cover line pattern zone and surperficial pinup picture shape zone with dry film, after overexposure, development, expose the Copper Foil part that the line pattern zone need etch away;
S02: outer etching for the first time: etching is carried out in the line pattern zone, the Copper Foil that exposes among the step S01 is etched away, form the circuit and first etching region;
S03: outer graphics for the second time: cover the circuit pack and the unprocessed surperficial pinup picture shape zone in manufactured line pattern zone with dry film, through overexposure, develop after the exposing surface pinup picture shape zone Copper Foil part that need etch away;
S04: outer etching for the second time: etching was carried out in his-and-hers watches Face Map shape zone, the Copper Foil that exposes among the step S03 is etched away, cross the Copper Foil that stays after the etching and form the surface subsides, zone between paste on adjacent two surfaces becomes second etching region, and the zone except that the surface subsides and second etching region is the 3rd etching region.
Wherein, after step S04, also comprise the step of welding resistance bridge between making the surface pastes further, the step of welding resistance bridge comprised between pasted on described making surface:
S201: silk-screen welding resistance for the first time: at the PCB surface ink for screen printing, the control ink thickness is at 30 μ m～40 μ m;
S202: the exposure of contraposition for the first time: wiring board first etching region, second etching region and the 3rd etching region are exposed;
S203: develop for the first time: wiring board is put into developer solution develop;
S204: welding resistance is solidified for the first time;
S205: silk-screen welding resistance for the second time: at the PCB surface ink for screen printing;
S206: the exposure of contraposition for the second time: wiring board first etching region and the 3rd etching region are exposed;
S207: second development: wiring board is put into developer solution develop;
S208: welding resistance is solidified for the second time.
Wherein, among the step S03, the partial width specific surface that subsides zone, surface covers is sticked and counts the big 7mil of width.
Wherein, among the step S04, etching factor is 4.0～5.0.
Wherein, among the step S04, etching solution spray pressure is 3.2Kgf/cm
2～3.8Kgf/cm
2
Wherein, among the step S04, etching solution spray pressure is 3.5Kgf/cm
2
Wherein, among the step S203, developing time is 80～100s.
Wherein, among the step S201, silk-screen mesh number is 51T/CM
2, ink viscosity is 80PaS.
Wherein, among the step S205, silk-screen mesh number is 43T/CM
2, ink viscosity is 150PaS.
Wherein, among the step S02, etching factor is 3.0～3.5, and etching solution spray pressure is 2Kgf/cm
2
The invention has the beneficial effects as follows: an etching forming circuit that is different from prior art pastes with the surface and makes that surface subsides size is less, cause mounting the not enough and not enough defective of underpower or signal of area, processing method of the present invention adopts the subregion etching, his-and-hers watches Face Map shape zone and other graphics fields are carried out etching respectively, because etching and processing was carried out in his-and-hers watches Face Map shape zone separately, be beneficial to process control to this key area processing, can accurately control the dimensional accuracy in the course of processing, increase the size between surface subsides size and the surface subsides, satisfy the design size requirement, electronic devices and components mount area and increase, mount reliably, can effectively guarantee electric property.
Further, the present invention also comprises the step of making welding resistance bridge between the subsides of surface, be different from silk-screen welding resistance in the prior art, because the exposure of the thick bottom of printing ink not exclusively causes the welding resistance bridge to come off easily, the present invention adopt the method for substep silk-screen welding resistance make the surface paste between the welding resistance bridge, focus on forming the welding resistance bridge of surface between pasting for the first time during silk-screen, because control printing ink is at less thickness, can fully expose in the printing ink bottom, the welding resistance bridge that develops after solidifying is not easy to peel off the reliability height.
Adopt processing method of the present invention, in actual production, successfully realized the processing that paste on the thick copper circuit board surface, the batch machining of 3mil welding resistance bridge between paste on subsides of the thick 5OZ of especially outer copper, 10mil/mil surface and surface.
Description of drawings
Fig. 1 is the wiring board view of each flow process correspondence of prior art processing method;
Fig. 2 is the process chart of processing method of the present invention;
Fig. 3 is the PCB surface pinup picture shape zone state schematic diagram of each flow process correspondence of processing method of the present invention.
Embodiment
By describing technology contents of the present invention, structural feature in detail, being realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed, and following embodiment is with the thick copper coin of 5OZ, 10mil/mil pastes on the surface and is the example explanation, certainly, the wiring board that the processing aspect is not limited to the specification of lifting is pasted on described thick copper circuit board surface, in its processing that also can be applicable to paste as thick copper circuit boards such as 3OZ, 4OZ, 6OZ surface.
See also Fig. 2 and Fig. 3, the invention provides the processing method that paste on a kind of thick copper circuit board surface, the thick copper circuit board surface comprises surperficial pinup picture shape zone and line pattern zone, and the technological process of processing method is:
S01: outer graphics for the first time: cover line pattern zone and surperficial pinup picture shape zone 1 with dry film 2, through exposing, exposing the Copper Foil part that the line pattern zone need etch away after the development.In this step to before the circuit board to explosure; need to make corresponding exposure egative film; this exposure egative film hides the Copper Foil part that need etch away in the line pattern zone when making the wiring board exposure dry film is not exposed; and the dry film in all the other zones, line pattern zone and surperficial pinup picture shape zone is exposed; after the development; not dissolved away by the dry film of exposure area, expose Copper Foil, and other regional dry films left behind the effect of Copper Foil being played protection through behind the exposure imaging.
S02: outer etching for the first time: etching is carried out in the line pattern zone, and the Copper Foil that will expose etches away, and forms the circuit and first etching region; In this step, spray wiring board with etching solution, the etched liquid of the Copper Foil that exposes etches away, and the residual Copper Foil that the dry film zone arranged can not etched away by etched liquid by the dry film protection on the wiring board.In one embodiment, the control outer etched etching factor first time is 3.0～3.5; Etching solution spray pressure is controlled to be 1.8Kgf/cm
2～2.2Kgf/cm
2, specifically be chosen as 2.0Kgf/cm
2
S03: outer graphics for the second time: cover the circuit pack and the unprocessed surperficial pinup picture shape zone 1 in manufactured line pattern zone, the Copper Foil part that exposing surface pinup picture shape zone need etch away after exposure, development with dry film 2.In this step; S03 is similar with step; before the circuit board to explosure; need to make corresponding exposure egative film; the Copper Foil part that surface pinup picture shape zone need etch away when this exposure egative film made the wiring board exposure or not; and make other regional exposures in line pattern zone and surperficial pinup picture shape zone; after the development; the dry film in the zone of this pinup picture shape zone, surface unexposed portion is dissolved away; expose Copper Foil, and other regional dry films left behind the effect of Copper Foil being played protection through behind the exposure imaging.
S04: outer etching for the second time: etching was carried out in his-and-hers watches Face Map shape zone, the Copper Foil that will expose in pinup picture shape zone, exposure imaging rear surface etches away, thereby forms second etching region 12, the 3rd etching region 13 except that 11 and second etching region 12 is pasted on the surface between surface subsides 11, the surface subsides; In this step, the etching solution of the high spray of employing pressure carries out repeatedly etching to the Copper Foil that exposes, and crosses the Copper Foil that stays after the etching and forms surface subsides 11.In one embodiment, the control etching factor is between 4.0～5.0; In one embodiment, etching solution spray pressure is 3.2Kgf/cm
2～3.8Kgf/cm
2In a specific embodiment, etching solution spray pressure is controlled to be 3.5Kgf/cm
2
In the present invention, other graphics field subregions beyond his-and-hers watches Face Map shape zone and the surperficial pinup picture shape zone carry out etching, and his-and-hers watches Face Map shape zone carried out etching, reach the dimensional requirement that control surface pastes width 10mil and surface subsides spacing 10mil.In one embodiment, the compensation that 7mil is strengthened in his-and-hers watches Face Map shape zone among the step S03, the surface that dry film is covered is pasted the zone and is pasted specified requirement zone greater than the surface, and size is pasted on the final surface that forms of assurance can be less than designing requirement.
Further, the present invention also is included in the step of making the welding resistance bridge between the subsides of surface after step S04, and its technological process is:
S201: silk-screen welding resistance for the first time: at PCB surface ink for screen printing 3, control printing ink 3 thickness are at 30 μ m～40 μ m; Because ink thickness is less, can fully expose in the printing ink bottom.In one embodiment, the silk screen mesh number that uses of this step is 51T/CM
2, ink viscosity is 80PaS.
S202: the exposure of contraposition for the first time: expose after will expose egative film and the wiring board contraposition, and described exposure egative film correspondence table Face Map shape zone is provided with the welding resistance bridge, the surface is pasted lip-deep printing ink and is not exposed, and remainder (the corresponding part of welding resistance bridge that comprises surperficial pinup picture shape zone and the egative film that exposes) is fully exposed.Because control printing ink 3 thickness are at 30 μ m～40 μ m among the step S201, thereby the printing ink of welding resistance pars basilaris pontis can both fully be exposed, and welding resistance bridge thickness is also little, overcome in the prior art welding resistance pars basilaris pontis and failed that abundant exposure is easily peeled off and larger-size defective.
S203: develop for the first time: wiring board is put into developer solution develop, making the surface paste lip-deep printing ink is developed, and the printing ink of the welding resistance bridge corresponding region of line pattern zone, surperficial pinup picture shape zone and exposure egative film is owing to fully exposed, can not be developed, form welding resistance bridge 31 at second etching region 12.In one embodiment, for reaching reasonable development effect, the control developing time is 80s～100s, can guarantee that welding resistance bridge 31 does not drop.
S204: welding resistance is solidified for the first time: solidify the rapid middle welding resistance bridge 31 that forms of previous step.
S205: silk-screen welding resistance for the second time: ink for screen printing in the circuit board guarantees that the thickness of printing ink meets design requirement.In one embodiment, this step adopts 43T/CM
2The twine printing ink, ink viscosity is controlled to be 150PaS.
S206: the exposure of contraposition for the second time: guarantee the surface paste 11 and welding resistance bridge 31 places be not exposed, the remainder exposure, thus all the other zones and the line pattern zone of guaranteeing surperficial pinup picture shape zone fully exposed, can reach requirement to guarantee final solder mask thickness.
S207: second development: wiring board put in the developer solution develop, the printing ink that is exposed on the wiring board is developed.
S208: welding resistance is solidified for the second time: the solder mask 41 that step S11 forms on the curing circuit plate.
Among the present invention, make the welding resistance bridge between the surface subsides 11 earlier, for the first time ink thickness is less during silk-screen, in exposure process, the printing ink of bottom can fully be exposed, and after developing and solidifying, the welding resistance bridge of formation is more firm, be difficult for coming off, between paste on the surface, formed reliable welding resistance bridge like this from wiring board.
An etching forming circuit that is different from prior art pastes with the surface and makes that surface subsides size is less, cause mounting the not enough and not enough defective of underpower or signal of area, processing method of the present invention adopts the subregion etching, his-and-hers watches Face Map shape zone and other graphics fields are carried out etching respectively, because etching and processing was carried out in his-and-hers watches Face Map shape zone separately, be beneficial to process control to this key area processing, can accurately control the dimensional accuracy in the course of processing, increase the size between surface subsides size and the surface subsides, satisfy the design size requirement, electronic devices and components mount area and increase, and mount reliably, can effectively guarantee electric property.
Further, the present invention also comprises the step of making welding resistance bridge between the subsides of surface, be different from silk-screen welding resistance in the prior art, because printing ink thick bottom exposure not exclusively causes the welding resistance bridge to come off easily and welding resistance bridge size is big, the present invention adopts the method for substep silk-screen welding resistance to make welding resistance bridge between the subsides of surface, focus on for the first time forming the welding resistance bridge of surface between pasting during silk-screen, because control printing ink is at less thickness, can fully expose in the printing ink bottom, welding resistance bridge after develop solidifying be not easy to peel off and size little, the reliability height.Adopt processing method of the present invention, in actual production, successfully realized the batch machining of 3mil welding resistance bridge between subsides of the thick 5OZ of outer copper, 10mil/mil surface and the surface subsides.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. the processing method that paste on the thick copper circuit board surface is characterized in that, described thick copper circuit board comprises surperficial pinup picture shape zone and line pattern zone, and described processing method comprises step:
S01: outer graphics for the first time: cover line pattern zone and surperficial pinup picture shape zone with dry film, after overexposure, development, expose the Copper Foil part that the line pattern zone need etch away;
S02: outer etching for the first time: etching is carried out in the line pattern zone, the Copper Foil that exposes among the step S01 is etched away, form the circuit and first etching region;
S03: outer graphics for the second time: cover the circuit pack and the unprocessed surperficial pinup picture shape zone in manufactured line pattern zone with dry film, through overexposure, develop after the exposing surface pinup picture shape zone Copper Foil part that need etch away;
S04: outer etching for the second time: etching was carried out in his-and-hers watches Face Map shape zone, the Copper Foil that exposes among the step S03 is etched away, cross the Copper Foil that stays after the etching and form the surface subsides, zone between paste on adjacent two surfaces becomes second etching region, and the zone except that the surface subsides and second etching region is the 3rd etching region.
2. the processing method that paste on thick copper circuit board according to claim 1 surface is characterized in that: after step S04, also comprise the step of welding resistance bridge between making the surface pastes further, the step of welding resistance bridge comprised between pasted on described making surface:
S201: silk-screen welding resistance for the first time: at the PCB surface ink for screen printing, the control ink thickness is at 30 μ m～40 μ m;
S202: the exposure of contraposition for the first time: wiring board first etching region, second etching region and the 3rd etching region are exposed;
S203: develop for the first time: wiring board is put into developer solution develop;
S204: welding resistance is solidified for the first time;
S205: silk-screen welding resistance for the second time: at the PCB surface ink for screen printing;
S206: the exposure of contraposition for the second time: wiring board first etching region and the 3rd etching region are exposed;
S207: second development: wiring board is put into developer solution develop;
S208: welding resistance is solidified for the second time.
3. the surperficial processing method of pasting of thick copper circuit board according to claim 1 is characterized in that: among the step S03, the partial width specific surface that subsides zone, surface covers is sticked and counts the big 7mil of width.
4. the processing method that paste on thick copper circuit board according to claim 2 surface, it is characterized in that: among the step S04, etching factor is 4.0～5.0.
5. the processing method that paste on thick copper circuit board according to claim 3 surface is characterized in that: among the step S04, etching solution spray pressure is 3.2Kgf/cm
2～3.8Kgf/cm
2
6. the processing method that paste on thick copper circuit board according to claim 4 surface is characterized in that: among the step S04, etching solution spray pressure is 3.5Kgf/cm
2
7. according to the processing method of each described thick copper circuit board surface subsides of claim 1-6, it is characterized in that: among the step S203, developing time is 80～100s.
8. the processing method that paste on thick copper circuit board according to claim 7 surface, it is characterized in that: among the step S201, silk-screen mesh number is 51T/CM
2, ink viscosity is 80PaS.
9. the processing method that paste on thick copper circuit board according to claim 8 surface, it is characterized in that: among the step S205, silk-screen mesh number is 43T/CM
2, ink viscosity is 150PaS.
10. the processing method that paste on thick copper circuit board according to claim 9 surface, it is characterized in that: among the step S02, etching factor is 3.0～3.5, etching solution spray pressure is 2Kgf/cm
2
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Cited By (12)
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| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN105228363A (en) * | 2015-08-28 | 2016-01-06 | 江门崇达电路技术有限公司 | A kind of manufacture method of solder mask |
| CN105323974A (en) * | 2015-10-29 | 2016-02-10 | 深圳市五株科技股份有限公司 | Manufacture method of thick copper plate solder mask |
| CN105530762A (en) * | 2014-09-29 | 2016-04-27 | 深南电路有限公司 | Resistance welding processing method and circuit board |
| CN106793500A (en) * | 2016-11-15 | 2017-05-31 | 智恩电子(大亚湾)有限公司 | A kind of wiring board text printout method |
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| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN103354702B (en) * | 2013-07-26 | 2016-05-25 | 东莞生益电子有限公司 | The circuit board that microwave circuit board manufacturing method and the method make |
| CN105530762B (en) * | 2014-09-29 | 2018-08-07 | 深南电路有限公司 | Resistance welding processing method and circuit board |
| CN105530762A (en) * | 2014-09-29 | 2016-04-27 | 深南电路有限公司 | Resistance welding processing method and circuit board |
| CN105228363A (en) * | 2015-08-28 | 2016-01-06 | 江门崇达电路技术有限公司 | A kind of manufacture method of solder mask |
| CN105323974A (en) * | 2015-10-29 | 2016-02-10 | 深圳市五株科技股份有限公司 | Manufacture method of thick copper plate solder mask |
| CN106793500A (en) * | 2016-11-15 | 2017-05-31 | 智恩电子(大亚湾)有限公司 | A kind of wiring board text printout method |
| CN106852033A (en) * | 2017-04-06 | 2017-06-13 | 昆山苏杭电路板有限公司 | High precision part very high current printed circuit board processing method |
| CN107708322A (en) * | 2017-10-30 | 2018-02-16 | 大连崇达电路有限公司 | The restorative procedure of doing over again that a kind of welding resistance bridge comes off |
| CN107708322B (en) * | 2017-10-30 | 2021-06-15 | 大连崇达电路有限公司 | Rework repairing method for solder resisting bridge falling |
| CN109618504A (en) * | 2019-01-31 | 2019-04-12 | 厦门弘信电子科技股份有限公司 | A kind of the jigsaw structure and production method of single sided board |
| CN109618504B (en) * | 2019-01-31 | 2023-12-19 | 厦门弘信电子科技集团股份有限公司 | Jointed board structure of single-sided board and manufacturing method |
| CN112469204A (en) * | 2019-09-06 | 2021-03-09 | 庆鼎精密电子（淮安）有限公司 | Circuit board and method for manufacturing the same |
| CN111935907A (en) * | 2020-06-24 | 2020-11-13 | 惠州市金百泽电路科技有限公司 | Circuit board processing method for reducing galvanic effect |
| WO2021258509A1 (en) * | 2020-06-24 | 2021-12-30 | 惠州市金百泽电路科技有限公司 | Circuit board processing method for decreasing galvanic effect |
| CN114466516A (en) * | 2022-01-27 | 2022-05-10 | 盐城维信电子有限公司 | Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board |
| CN114466516B (en) * | 2022-01-27 | 2024-03-12 | 盐城维信电子有限公司 | Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board |
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| CN102244985B (en) | 2013-06-12 |
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