CN102917549A - Circuit board soldermask bridge processing method - Google Patents
Circuit board soldermask bridge processing method Download PDFInfo
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- CN102917549A CN102917549A CN2011102194031A CN201110219403A CN102917549A CN 102917549 A CN102917549 A CN 102917549A CN 2011102194031 A CN2011102194031 A CN 2011102194031A CN 201110219403 A CN201110219403 A CN 201110219403A CN 102917549 A CN102917549 A CN 102917549A
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Abstract
An embodiment of the invention relates to a circuit board soldermask bridge processing method. The method includes the steps: designing and making a shield on a base plate corresponding to a soldermask bridge; transferring a pattern of the base plate with the shield onto a screen printing plate, and performing local ink soldermask on a circuit board through the screen printing plate; subjecting the whole circuit board to ink soldermask; transferring the pattern on the base plate to the circuit board for exposure; and developing the soldermask ink at a welding copper position of the circuit board after exposure to form a soldermask bridge. The circuit board soldermask bridge processing method mainly solves the problems that quality of soldermask bridges processed according to existing soldermask bridge processing methods cannot be guaranteed, and manufacturing cost is high, and cost is saved while quality of the soldermask bridge of the circuit board is guaranteed.
Description
Technical field
The embodiment of the invention relates to a kind of processing method of circuit board resistance welding bridge, particularly a kind of processing method of heavy copper circuit board welding resistance bridge.
Background technology
Heavy copper circuit board is mainly used on the power module; power module is all towards the trend of the development such as light, thin; so it is more and more intensive that requirement is applied in the circuit board line of power module; spacing is more and more less; just often can use tiny welding resistance bridge on the circuit board; be commonly called as the green oil bridge, so-called welding resistance bridge refers to the insulation welding resistance printing ink between the surface label, and its Main Function is the effect of resistance tin in the welding process.The available circuit plate is in the flow process of welding resistance routine: ... welding resistance circuit board → the exposure of → welding resistance circuit board → again develop → ... twice welding resistance be welding resistance printing ink in whole plate printing on the circuit board all, the place of welding resistance bridge, printed welding resistance printing ink twice, the welding resistance ink thickness is blocked up, if use normal exposure energy, exposure can't shine the welding resistance printing ink of bottom, the welding resistance printing ink of bottom is unexposed, easy overdevelop in developing process, and the phenomenon of welding resistance bridge is fallen in generation; If the increasing exposure energy causes the unclean phenomenon of development easily, adopt this method, the difficult quality of welding resistance bridge is guaranteed; In addition, the welding resistance printing ink that the welding resistance bridge location is put has also caused the waste of welding resistance printing ink owing to repeat print, and cost is higher.
Summary of the invention
Embodiment of the invention technical problem to be solved is: a kind of processing method of circuit board resistance welding bridge is provided, to guarantee the quality of circuit board resistance welding bridge, can saves cost simultaneously.
For solving the problems of the technologies described above, the embodiment of the invention adopts following technical scheme: a kind of processing method of circuit board resistance welding bridge comprises the steps:
The design shelter: the Position Design of corresponding welding resistance bridge is made shelter on egative film;
Local welding resistance circuit board: the figure of egative film is transferred on the half tone, printed welding resistance printing ink by half tone at circuit board;
Whole plate resistance weldering circuit board: whole plate printing welding resistance printing ink on circuit board;
Exposure: the pattern displacement on the egative film is exposed to circuit board;
Develop: the welding resistance printing ink at place, soldering copper position on the circuit board after the described exposure-processed is developed to fall, generate the welding resistance bridge.
Further, in the described subsides shelter step, at first draw the position of blocking of shelter at egative film.
Further, in the described subsides shelter step, it is corresponding that each blocks the outline line of each welding resistance bridge of relevant position on outline line and the circuit board of position.
Further, in the described welding resistance egative film step, the outline line of shelter and the described outline line overlaid that blocks the position.
The beneficial effect of the embodiment of the invention is: first block an egative film of outline line line and design and produce shelter ready being carved with, the figure of egative film is transferred on the half tone, print welding resistance printing ink by half tone at circuit board, owing to be designed with shelter on the egative film, so that welding resistance printing ink is not printed at the corresponding place, position of blocking of circuit board, since this block the position with circuit board on welding resistance bridge location overlaid, after whole plate resistance weldering circuit board step, the welding resistance printing ink of circuit board has only printed once, printed the welding resistance bridge that forms for twice at the welding resistance bridge location compared to existing technology, in the present embodiment, the thickness of the welding resistance bridge of circuit board is moderate, behind exposure and developing procedure, has avoided overdevelop or has developed not pure land phenomenon, both guarantee the quality of circuit board resistance welding bridge, saved again cost.
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
Description of drawings
Fig. 1 is the method flow diagram of the embodiment of the invention.
Fig. 2 is the schematic diagram before the embodiment of the invention egative film welding resistance.
Fig. 3 is the schematic diagram of the local welding resistance circuit board of the embodiment of the invention.
Fig. 4 is the schematic diagram of the whole plate resistance weldering of embodiment of the invention circuit board.
Fig. 5 is the schematic diagram behind the embodiment of the invention circuit board exposure.
Embodiment
To shown in Figure 5, the embodiment of the invention provides a kind of processing method of circuit board resistance welding bridge such as Fig. 1.
Such as Fig. 1, the processing method of described circuit board resistance welding bridge comprises:
Design shelter: draw at egative film 1 in advance and block position 11 outline line, design and produce shelter 2 in the described position 11 of blocking, block outline line and the orientation overlaid of the welding resistance bridge location 31 of the outline line of position 11 and orientation and circuit board;
Local welding resistance circuit board: the figure of egative film 1 is transferred on the half tone, and at circuit board 3 printing welding resistance printing ink, without hindrance solder paste is black because the shelter 2 on the egative film 1 blocks for the welding resistance bridge location 31 on the circuit board 3 by half tone;
Whole plate resistance weldering circuit board: whole plate printing welding resistance printing ink on circuit board 3 comprises welding resistance bridge location 31 and soldering copper position 32;
Expose: the figure on the egative film 1 after the welding resistance is moved on on the circuit board 3 expose;
Develop: the welding resistance printing ink of soldering copper position 32 develops to fall on the circuit board 3 after will exposing, and generates welding resistance bridge 33.
Wherein, in pasting the shelter step, get egative film 1 ready, make its size identical with circuit board 3, so that the later stage uses; Described each to block the outline line of the welding resistance bridge location 31 of the welding resistance bridge 33 of relevant position on position 11 outline line and the circuit board 3 corresponding.
Such as Fig. 2, draw in advance on the egative film 1 and block position 11 for locating to shelter 2.
Such as Fig. 3, owing to be manufactured with shelter 2 on the egative film 1, the figure of egative film 1 is transferred on the half tone, print the welding resistance printing ink by half tone at circuit board 3, without hindrance solder paste is black because the shelter 2 on the egative film 1 blocks for welding resistance bridge location 31 on the circuit board 3, and the figure bend partly represents welding resistance printing ink.
Such as Fig. 4, after the welding resistance circuit board step, monoblock circuit board 3 all scribbles welding resistance printing ink, comprises welding resistance bridge location 31 and soldering copper position 32, and the figure bend partly represents welding resistance printing ink.
Such as Fig. 5, after step of exposure and the development step, because welding resistance printing ink has only been printed at welding resistance bridge 33 places of circuit board 3 one time, the thickness of welding resistance bridge 33 is moderate, and size and the precision of welding resistance bridge 31 are controlled easily, and the welding resistance printing ink at 32 places, soldering copper position is developed technique and removes, generate welding resistance bridge 33, black part is divided expression welding resistance bridge 33 among the figure, and white portion represents soldering copper position 32, and oblique line partly represents welding resistance printing ink.
In sum, the processing method of embodiment of the invention circuit board resistance welding bridge, avoided adopting in the existing technique twice welding resistance mode treatment circuit plate, cause the place of welding resistance bridge to print welding resistance printing ink twice, the welding resistance ink thickness is blocked up, if adopt normal exposure energy, exposure can't shine the welding resistance printing ink of bottom, the welding resistance printing ink of bottom is unexposed, causes easy overdevelop in developing process, produces the phenomenon of welding resistance bridge; If the increasing exposure energy causes the unclean phenomenon of development easily.The processing method of embodiment of the invention circuit board resistance welding bridge, owing to used shelter to carry out the welding resistance circuit board, the position of welding resistance bridge is only printed printing ink one time on the circuit board, has both effectively guaranteed the quality of welding resistance bridge, has saved again cost.
The above is the specific embodiment of the present invention; should be pointed out that the general expression technical staff for the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (4)
1. the processing method of a circuit board resistance welding bridge is characterized in that, comprises the steps:
The design shelter: the Position Design of corresponding welding resistance bridge is made shelter on egative film;
Local welding resistance circuit board: the figure of egative film is transferred on the half tone, printed welding resistance printing ink by half tone at circuit board;
Whole plate resistance weldering circuit board: whole plate printing welding resistance printing ink on circuit board;
Exposure: the pattern displacement on the egative film is exposed to circuit board;
Develop: the welding resistance printing ink at place, soldering copper position on the circuit board after the described exposure-processed is developed to fall, generate the welding resistance bridge.
2. the processing method of circuit board resistance welding bridge as claimed in claim 1 is characterized in that: in the described subsides shelter step, at first draw the position of blocking of shelter at egative film.
3. the processing method of circuit board resistance welding bridge as claimed in claim 1 is characterized in that: in the described subsides shelter step, the outline line of each welding resistance bridge of relevant position is corresponding on each outline line that blocks the position and the circuit board.
4. the processing method of circuit board resistance welding bridge as claimed in claim 1 is characterized in that: in the described welding resistance egative film step, and the outline line of shelter and the described outline line overlaid that blocks the position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219403.1A CN102917549B (en) | 2011-08-02 | 2011-08-02 | The processing method of circuit board soldermask bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110219403.1A CN102917549B (en) | 2011-08-02 | 2011-08-02 | The processing method of circuit board soldermask bridge |
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| Publication Number | Publication Date |
|---|---|
| CN102917549A true CN102917549A (en) | 2013-02-06 |
| CN102917549B CN102917549B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110219403.1A Active CN102917549B (en) | 2011-08-02 | 2011-08-02 | The processing method of circuit board soldermask bridge |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN104302110A (en) * | 2014-10-13 | 2015-01-21 | 广东依顿电子科技股份有限公司 | Method for producing keyboard circuit board |
| CN104742547A (en) * | 2015-04-03 | 2015-07-01 | 昆山万源通电子科技有限公司 | Two-ounce PCB board printing technology |
| CN107708322A (en) * | 2017-10-30 | 2018-02-16 | 大连崇达电路有限公司 | The restorative procedure of doing over again that a kind of welding resistance bridge comes off |
| CN108366495A (en) * | 2017-12-11 | 2018-08-03 | 信丰福昌发电子有限公司 | A kind of technique for improving the offset of IC bridge locations and falling off |
| CN110324982A (en) * | 2019-04-04 | 2019-10-11 | 惠州美锐电子科技有限公司 | A kind of PCB printing ink printing art method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060332A (en) * | 2001-08-10 | 2003-02-28 | Ibiden Co Ltd | Method of manufacturing wiring board |
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| JP2011119567A (en) * | 2009-12-07 | 2011-06-16 | Panasonic Corp | Method of manufacturing printed wiring board |
-
2011
- 2011-08-02 CN CN201110219403.1A patent/CN102917549B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060332A (en) * | 2001-08-10 | 2003-02-28 | Ibiden Co Ltd | Method of manufacturing wiring board |
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| JP2011119567A (en) * | 2009-12-07 | 2011-06-16 | Panasonic Corp | Method of manufacturing printed wiring board |
Non-Patent Citations (1)
| Title |
|---|
| 张逸新: "《特种承印材料印刷技术》", 1 September 2003 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN104302110A (en) * | 2014-10-13 | 2015-01-21 | 广东依顿电子科技股份有限公司 | Method for producing keyboard circuit board |
| CN104302110B (en) * | 2014-10-13 | 2017-07-04 | 广东依顿电子科技股份有限公司 | A kind of production method of keyboard pcb |
| CN104742547A (en) * | 2015-04-03 | 2015-07-01 | 昆山万源通电子科技有限公司 | Two-ounce PCB board printing technology |
| CN107708322A (en) * | 2017-10-30 | 2018-02-16 | 大连崇达电路有限公司 | The restorative procedure of doing over again that a kind of welding resistance bridge comes off |
| CN108366495A (en) * | 2017-12-11 | 2018-08-03 | 信丰福昌发电子有限公司 | A kind of technique for improving the offset of IC bridge locations and falling off |
| CN110324982A (en) * | 2019-04-04 | 2019-10-11 | 惠州美锐电子科技有限公司 | A kind of PCB printing ink printing art method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102917549B (en) | 2016-04-27 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |