CN110809363A - IC bonding pad - Google Patents
IC bonding pad Download PDFInfo
- Publication number
- CN110809363A CN110809363A CN201911063279.7A CN201911063279A CN110809363A CN 110809363 A CN110809363 A CN 110809363A CN 201911063279 A CN201911063279 A CN 201911063279A CN 110809363 A CN110809363 A CN 110809363A
- Authority
- CN
- China
- Prior art keywords
- solder mask
- bridge
- pad
- printing
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides an IC bonding pad, which comprises the following steps: manufacturing a solder mask film according to the typesetting of the large board and the edge of the large board and a preset alignment inspection pad in the large board, wherein the size of the alignment inspection pad on the solder mask film is preset with an allowable offset; performing solder mask printing for the first time according to the design of the solder mask film; performing solder mask inspection for the first time, inspecting whether solder mask oil is attached to the corresponding alignment inspection pad on the edge of the large board after exposure and development, if the alignment inspection pad on the solder mask oil exists, judging that the offset of the solder mask oil at this time exceeds the allowed offset, judging that the solder mask oil is unqualified, cleaning and reworking unqualified products, and if the alignment inspection pad on the edge of the large board does not have green oil, judging that the solder mask oil is qualified; performing second solder mask printing, wherein the second solder mask printing is local printing of an IC area; fourthly, performing second solder mask inspection; and the second solder mask inspection is to inspect whether the solder mask bridge is complete, if the solder mask bridge is completely reserved, the solder mask bridge is qualified, and if the solder mask bridge falls off, the solder mask bridge is unqualified.
Description
Technical Field
The invention relates to production and manufacture of a printed board containing an IC design, in particular to an IC bonding pad.
Background
Along with the gradual maturity of the printed circuit board technology, the competition of tangent circuit board production enterprises is more and more intense, so that the production profit of the printed circuit board is lower and lower, the circuit board production enterprises continuously improve and perfect the production technology, the rework rate and the defective rate of the circuit board in the production process are reduced, the production investment is saved, and the production cost is reduced. Meanwhile, with the development of the packaging technology, the packaging area is reduced, the functions are more and more powerful, the number of pins is more and more, and higher requirements are brought to the production technology and the production method of the circuit board.
The design of present printed wiring board, it has only 0.11mm and the pad width only has the design of 0.11mm to have appeared a lot of IC intervals, perhaps the design has between the IC walks the line, the interval has only 0.22 mm's design between the IC simultaneously, the production of this kind of printed wiring board has puzzled many enterprises, a large amount of short circuits after the product welding of production comes out, can't satisfy the demand of using, only use extreme accurate equipment to produce through strict production technology, the cost is increased, the production threshold has been improved, can't carry out high-efficient quick production when guaranteeing the quality.
Disclosure of Invention
The invention aims to solve the technical problem of providing an IC bonding pad solder mask short circuit prevention design, solves the problem of high-precision circuit board solder short circuit through a certain operation sequence and corresponding auxiliary tools, solves the trouble in production, particularly the production of batch orders,
in order to solve the technical problems, the invention adopts the following technical scheme: the IC bonding pad short circuit prevention design comprises the following steps:
firstly, manufacturing a solder mask film according to the typesetting of a large board, the edge of the large board and a preset alignment inspection pad in the large board, wherein the size of the alignment inspection pad on the solder mask film is preset with an allowable offset;
secondly, performing solder mask printing for the first time according to the design of the solder mask film;
step three, performing solder mask inspection for the first time, inspecting whether solder mask oil is attached to a corresponding alignment inspection pad on the edge of the large board after exposure and development, if the alignment inspection pad on the solder mask oil exists, judging that the offset of the solder mask oil at this time exceeds the allowed offset, judging that the large board is unqualified, cleaning and reworking unqualified products, and if the alignment inspection pad on the edge of the large board does not have green oil, judging that the large board is qualified;
step three, performing second solder mask printing, wherein the second solder mask printing is local printing of an IC area;
step four, performing second solder mask inspection; the second solder mask inspection is to inspect whether the solder mask bridge is complete, if the solder mask bridge is completely reserved, the solder mask bridge is qualified, and if the solder mask bridge falls off, the solder mask bridge is unqualified;
and fifthly, performing solder mask bridge printing on the unqualified product.
According to the design concept of the invention, the first solder mask printing is conventional printing, and when the design of the solder mask bridge cannot be ensured, the solder mask bridge is cut and reserved when a circuit needs to be manufactured.
According to the design concept of the invention, the second-time solder mask printing ensures the solder mask bridge design, and meanwhile, the IC position solder mask window is smaller than the window of the first-time solder mask and brush, but the solder mask ink cannot be applied to the bonding pad.
According to the design concept of the invention, the second solder resist printing is large-board printing or small-board printing after forming.
According to the design concept of the invention, the solder mask bridge is printed by printing solder mask oil between IC pads.
According to the design concept of the invention, the thickness of the ink of the first solder mask printing and the second solder mask printing is 8-15 um.
According to the design concept of the invention, the solder mask bridge printing is small plate printing.
Compared with the prior art, the invention has the following beneficial effects:
(1) the problem of because IC interval undersize, the short circuit is serious after the paster welding, unable batch production is solved.
(2) The production is not limited by equipment, the conventional machine equipment can be normally produced, the production efficiency is improved, the cost is reduced, and the mass production can be realized.
Drawings
FIG. 1 is a layout diagram of large panel layouts according to the present invention;
fig. 2A and 2B are solder mask window designs for small panels.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will further describe the present invention with reference to the accompanying drawings.
The utility model provides a short circuit design is prevented to IC pad 3 hinders welding, includes when typesetting, predetermines counterpoint inspection pad1 between the edge of big board and each platelet of big inboard, etches out counterpoint inspection pad1 when the circuit etching, hinders and welds the film manufacturing process, equally carries out windowing to counterpoint inspection pad1 and handles, counterpoint tolerance is reserved to counterpoint inspection pad 1's windowing, and the unilateral maximum allowable offset that exceeds of counterpoint inspection pad1 is unilateral promptly to counterpoint inspection pad1, and after stamp-pad, exposure, development, counterpoint inspection pad1 is then counterpoint to the solder mask oil, and counterpoint is inaccurate, or the film appears the problem, needs wash off reprint oil, exposure, development, or redraws film production.
In the first time of resistance welding printing manufacture, the resistance welding bridge 5 between ICs is manufactured, the resistance welding bridge 5 cannot be accurately manufactured, the printing can be separated, namely, the printing of the resistance welding bridge 5 is not reserved in the first time of resistance welding printing, the whole version of the resistance welding bridge 5 is immediately printed after the first time of resistance welding printing, and the effect of the first time of resistance welding printing reserved with the resistance welding bridge 5 is achieved.
And after the first solder resist printing, performing second solder resist printing, wherein the second printing is selective printing on the IC area, in order to effectively prevent deviation, the second solder resist printing process also selects to use the alignment check pad1 for alignment, and the solder resist window 2 of the second solder resist printing is smaller than the solder resist window 2 of the first solder resist printing and keeps the solder resist bridge 5. For the situation that the distance is too small to ensure that the ink does not go up the bonding pad, the size of the solder mask window 2 of the second solder mask printing is preferably the same as that of the solder mask window 2 at the same position for the first time.
In the second solder resist printing process, in order to ensure the printing quality, the second solder resist printing can be performed after the CNC is formed into a small plate.
The inspection is hindered for hindering solder bridge 5 inspection to the second time, looks over and hinders the reservation condition after 5 washing of solder bridge, to hindering solder bridge 5 and remain completely for qualified product, to hindering solder bridge 5 and remain incomplete, confirm whether need block solder bridge 5 printing according to the condition of incomplete, hinder solder bridge 5 printing for only printing incomplete solder bridge 5 part, for convenient production, preferably hinder the whole solder bridge 5 printing of carrying on of 5 incomplete of solder bridge.
The solder mask bridge 5 which can meet the alignment accuracy is preferably manufactured by screen printing and direct screen printing ink drying. Reducing ink waste and reducing process operations.
Referring to fig. 1, in the production design of the circuit board including the IC pad 3, the alignment inspection pad1 is disposed on the clamping edge of the large board, and the alignment inspection pad1 preferably has two to three types of structures, and for better inspection of the alignment effect, the pad and the solder resist opening window 2 having the same structure as the IC pad 3 in the board are also formed on the clamping edge.
In order to optimize production, corresponding alignment inspection pads 1 are added between small plates in the large plate, alignment pads of different types alternate with each other, so that first-time solder mask inspection is facilitated, selective inspection can be performed on the inner side and the clamping edge of the plate, and rapid finding out of film reasons or alignment deviation is facilitated. For example: in the first solder resist printing, the four corners of the large-board typesetting are integrally offset, namely film expansion and shrinkage; and if the small plates in the large plate typesetting cannot be aligned, the film typesetting is problematic, and the like.
In the large-board typesetting printing, in order to ensure the existence of the solder resistance bridge 5, the solder resistance printing can be separated twice, the solder resistance printing and the solder resistance bridge 5 printing in full-page printing are respectively performed, and the sequence of the solder resistance printing and the solder resistance bridge 5 printing in full-page printing can be mutually adjusted. The connection of the connecting point of the stencil printing solder resist and the stencil printing solder resist bridge 5 exceeds the alignment tolerance, but the overlapping portion cannot exceed too much, and the overlapping portion is preferably 0.1 mm. And performing first solder mask inspection after the first solder mask printing is finished.
After the first solder resist inspection, a second solder resist printing is performed, which operates only on the IC area and the alignment inspection pad1 within the IC area, printing the periphery of the IC pad 3 and the solder resist bridge 5. In order to ensure the presence of the solder resist bridge 5, it is preferable to print separately, i.e., to print the periphery of the IC pad 3 and the solder resist bridge 5 separately in full-page.
In order to show the design scheme in more detail, refer to fig. 2A, the conventional IC solder mask is printed and manufactured, the solder mask window 2 of the IC pad 3 is larger than the pad, the distance between the solder mask windows 2 is small, the solder mask bridge 5 cannot be guaranteed, for the design of the wire between the IC pads 3, the distance between the solder mask window 2 and the wire is too small, the wire side leakage is easily caused, the short circuit between the pad and the circuit is formed due to the flowing of solder paste during the mounting, meanwhile, the solder mask window 2 is larger than the pad, the position of a formed substrate part is lower than that of the IC pad 3, the solder paste flows to the substrate due to high temperature during the mounting, the amount of the solder paste on the formed IC pad 3 is insufficient, and meanwhile, the packaging device is easy to deviate to form mounting deviation during the mounting, so.
Referring to fig. 2B, solder mask window 2 is smaller than IC pad 3, increasing the distance between solder mask windows 2, reducing the printing difficulty of solder mask bridge 5, preventing the flow of solder paste by the separation of solder mask bridge 5 between IC pads 3, reducing the possibility of side leakage and further improving the quality by setting wires between IC pads 3. In order to facilitate accurate alignment, an alignment check pad1 is provided in the area of the IC pad 3, and the printing accuracy is improved by reducing the printing area.
In the case where the pitch does not satisfy the minimum width for making the solder resist bridge 5, it is preferable that the solder resist bridge 5 allows partial mounting of the IC pad 3, and the solder resist bridges 5 for the first solder resist printing and the second solder resist printing have the same width, and it is preferable that the solder resist bridge 5 is printed separately, and a part of the ink on the IC pad 3 is washed away during the washing process after the exposure for printing the solder resist bridge 5.
Claims (7)
1. An IC pad employing an anti-short design, the anti-short design comprising the steps of:
firstly, manufacturing a solder mask film according to the typesetting of a large board, the edge of the large board and a preset alignment inspection pad in the large board, wherein the size of the alignment inspection pad on the solder mask film is preset with an allowable offset;
secondly, performing solder mask printing for the first time according to the design of the solder mask film;
step three, performing solder mask inspection for the first time, inspecting whether solder mask oil is attached to a corresponding alignment inspection pad on the edge of the large board after exposure and development, if the alignment inspection pad on the solder mask oil exists, judging that the offset of the solder mask oil at this time exceeds the allowed offset, judging that the large board is unqualified, cleaning and reworking unqualified products, and if the alignment inspection pad on the edge of the large board does not have green oil, judging that the large board is qualified;
step four, performing second solder mask printing, wherein the second solder mask printing is local printing of an IC area;
step five, performing second solder mask inspection; the second solder mask inspection is to inspect whether the solder mask bridge is complete, if the solder mask bridge is completely reserved, the solder mask bridge is qualified, and if the solder mask bridge falls off, the solder mask bridge is unqualified;
and step six, performing solder mask bridge printing on the unqualified product.
2. The IC pad of claim 1, wherein the first solder mask printing is a conventional printing, and cutting the pad when a circuit is required to make the solder bridge when the solder bridge design is not guaranteed preserves the solder bridge making.
3. The IC pad of claim 1 or 2, wherein the second solder mask printing ensures a solder bridge design while the IC site solder mask window is smaller than the first solder mask one brush window but solder mask ink cannot go to the pad.
4. The IC pad of claim 3, wherein the second solder mask print is a large-board print or a post-mold small-board print.
5. The IC pad of claim 3, wherein the solder bridge is printed as an inter-IC pad solder mask oil.
6. The IC pad of claim 1, wherein the first and second solder masks each have an ink thickness of 8-15 um.
7. The IC pad of claim 1 or 5, wherein the solder mask bridge printing is platelet printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911063279.7A CN110809363B (en) | 2018-12-27 | 2018-12-27 | IC bonding pad |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811607115.1A CN109511231B (en) | 2018-12-27 | 2018-12-27 | IC pad resistance welding short circuit prevention design |
| CN201911063279.7A CN110809363B (en) | 2018-12-27 | 2018-12-27 | IC bonding pad |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811607115.1A Division CN109511231B (en) | 2018-12-27 | 2018-12-27 | IC pad resistance welding short circuit prevention design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110809363A true CN110809363A (en) | 2020-02-18 |
| CN110809363B CN110809363B (en) | 2022-12-16 |
Family
ID=65755328
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811607115.1A Active CN109511231B (en) | 2018-12-27 | 2018-12-27 | IC pad resistance welding short circuit prevention design |
| CN201911063279.7A Active CN110809363B (en) | 2018-12-27 | 2018-12-27 | IC bonding pad |
| CN201911056149.0A Withdrawn CN110719704A (en) | 2018-12-27 | 2018-12-27 | IC bonding pad |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811607115.1A Active CN109511231B (en) | 2018-12-27 | 2018-12-27 | IC pad resistance welding short circuit prevention design |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911056149.0A Withdrawn CN110719704A (en) | 2018-12-27 | 2018-12-27 | IC bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN109511231B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913601B (en) * | 2019-11-18 | 2021-08-24 | 大连崇达电路有限公司 | Method for manufacturing solder mask translation film |
| CN111642079B (en) * | 2020-06-03 | 2021-12-21 | 瑞声精密制造科技(常州)有限公司 | Screen printing method and preparation method of flexible circuit board and flexible circuit board |
| CN114900976B (en) * | 2022-04-13 | 2024-03-01 | 深圳壹卡科技有限公司 | High-density circuit board alignment welding structure and production method |
| CN114900987B (en) * | 2022-04-13 | 2024-02-02 | 峻凌电子(合肥)有限公司 | High-density circuit board alignment welding structure and production method |
| CN114786364B (en) * | 2022-06-22 | 2022-08-23 | 广东科翔电子科技股份有限公司 | Mini-LED PCB tiny bonding pad solder mask deviation control method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN105592629A (en) * | 2014-10-24 | 2016-05-18 | 深圳崇达多层线路板有限公司 | Design method for pad soldering checking |
| CN107708322A (en) * | 2017-10-30 | 2018-02-16 | 大连崇达电路有限公司 | The restorative procedure of doing over again that a kind of welding resistance bridge comes off |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014030867A1 (en) * | 2012-08-23 | 2014-02-27 | Cho Hyoyoung | Method for forming solder resist of printed circuit board, and printed circuit board manufactured by said method |
| CN105208788B (en) * | 2015-08-11 | 2018-04-03 | 深圳崇达多层线路板有限公司 | It is a kind of to improve solder mask and the method for solder mask aligning accuracy |
-
2018
- 2018-12-27 CN CN201811607115.1A patent/CN109511231B/en active Active
- 2018-12-27 CN CN201911063279.7A patent/CN110809363B/en active Active
- 2018-12-27 CN CN201911056149.0A patent/CN110719704A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN105592629A (en) * | 2014-10-24 | 2016-05-18 | 深圳崇达多层线路板有限公司 | Design method for pad soldering checking |
| CN107708322A (en) * | 2017-10-30 | 2018-02-16 | 大连崇达电路有限公司 | The restorative procedure of doing over again that a kind of welding resistance bridge comes off |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109511231B (en) | 2019-12-27 |
| CN110719704A (en) | 2020-01-21 |
| CN109511231A (en) | 2019-03-22 |
| CN110809363B (en) | 2022-12-16 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20221130 Address after: 101, No. 8, Dongfeng Industrial Zone, Songgang Community, Songgang Street, Bao'an District, Shenzhen, Guangdong 518000 Applicant after: Shenzhen Zhongdian United Technology Co.,Ltd. Address before: No. 68, Chuangye Road, Longhutang, Xinbei District, Changzhou City, Jiangsu Province, 213000 Applicant before: Wu Xiaozai |
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