CN103029035B - Polishing pad and loss detecting method during polishing by using same - Google Patents
Polishing pad and loss detecting method during polishing by using same Download PDFInfo
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- CN103029035B CN103029035B CN201210493978.7A CN201210493978A CN103029035B CN 103029035 B CN103029035 B CN 103029035B CN 201210493978 A CN201210493978 A CN 201210493978A CN 103029035 B CN103029035 B CN 103029035B
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Abstract
The invention relates to the field of semiconductor manufacture, and in particular relates to a polishing pad and a loss detecting method during polishing by using the same. According to the invention, a plurality of detection inclined holes are preset in the polishing pad provided with a polishing groove, when the loss of the polishing pad is needed to be detected in a polishing process, through measuring the distance between one detection inclined hole in the polishing pad subjected to the polishing process and the groove and using a preset numerical value and a formula aiming at the groove, the abrasion condition of the polishing pad in the detection inclined hole is figured out, and same process steps are continuously carried out on other detection inclined holes, therefore, the abrasion condition of all the surface of the polishing pad in the polishing process can be detected in real time, and further the purpose of fully utilizing the polishing pad is achieved so that the cost of the polishing process is lowered.
Description
Technical field
The present invention relates to field of semiconductor manufacture, loss detection method when particularly relating to a kind of grinding pad and utilize this grinding pad to grind.
Background technology
In wafer manufactures, along with the upgrading of process technique, the reducing of wire and grid size, the requirement of photoetching (Lithography) technology to the planarization (Non-uniformity) of crystal column surface is more and more higher, cmp (Chemical Mechanical Polishing is called for short CMP) technique is widely used; CMP be one by chemical reaction process and the coefficient technique of mechanical grinding process, in process of lapping, certain pressure is applied at wafer rear by grinding head, wafer frontside is caused to be close to grinding pad, and simultaneous grinding head drives wafer and the equidirectional rotation of grinding pad, mechanical friction is produced to make wafer frontside and grinding pad, by lapping liquid, wafer is ground simultaneously, namely by the machinery of series of complex and the film of chemical action removal crystal column surface, thus the object of wafer planarization is reached.
Fig. 1 is the top view of traditional grinding pad in background technology of the present invention; As shown in Figure 1, in order to increase the frictional force of wafer and grinding pad in prior art, and improve the distributing homogeneity of lapping liquid simultaneously, grinding pad 1 arranges the groove 2 of multiple concentrically circle distribution; When carrying out grinding technics, due to the mechanical friction between wafer and grinding pad 1, the material on the surface of grinding pad 1 is inevitably lossy, and along with the increase of milling time, loss also increases, and the degree of depth of the groove 2 on grinding pad 1 can shoal gradually.
Fig. 2 is that in background technology of the present invention, traditional grinding pad is at the grinding pad thickness schematic diagram close to diverse location during its physical life, and transverse axis represents the distance (unit be inch) of grinding pad from its center, and the longitudinal axis represents the thickness (unit is mils) of grinding pad; Due to when carrying out grinding technics, the diverse location effect of wafer and the pressure of grinding pad are uneven, and there is relative to grinding pad the motion of rotating and sliding, cause during grinding wafer technique and different losses is produced to the diverse location of grinding pad, along with the increase of process time, the many region of loss can the thinner thickness in the few region of specific loss; As shown in Figure 2, when grinding pad is close to its service life, grinding pad thickness near its distance grinding pad centre distance is all at about 70mils, and the thickness of grinding pad fringe region (distance center point is more than or equal to the region of 15inch) is at more than 75mils, even can reach 80mils, namely the thickness of the zone line of grinding pad obviously compared with fringe region is much thin.
Fig. 3 is the relation schematic diagram between the coefficient of friction of grinding pad in background technology of the present invention and milling time, and transverse axis represents milling time (unit is H), and the longitudinal axis represents coefficient of friction; Known, the grinding pad degree of wear can have a strong impact on grinding rate, and namely along with the increase of the grinding pad degree of wear, the coefficient of friction of grinding pad presents the trend of reduction; As shown in Figure 3, after grinding technics proceeds to 2 hours (H), grinding coefficient sharply drops to less than 0.85 from 0.95, and the reduction of grinding coefficient can cause the decline of grinding rate, and then increases the grinding technics time.
Relation schematic diagram in Fig. 4 background technology of the present invention between the grinding rate of grinding pad and milling time, transverse axis represents milling time (pad age), and unit is H, and the longitudinal axis represents grinding rate (removal rate), and unit is A/min; As shown in Figure 4, along with the increase grinding rate of milling time also presents downward trend, especially after milling time is more than or equal to 2 hours, grinding rate is also dropping near 5200A/min from close to 5400A/min sharply.
Because grinding rate, grinding pad coefficient of friction are identical variation tendency with milling time, are all reductions sharply along with the increase of milling time, therefore the loss of grinding pad are monitored timely and effectively just very necessary.
Under prior art conditions, mainly define in such a way the service life of grinding pad: the milling time 1. defining grinding pad; 2. the wafer number of applied abrasive pad grinding is defined; 3. to define 1. and 2. simultaneously, and be defined as service life with first comer.But, above-mentioned monitoring mode has certain limitation, when carrying out grinding technics to different wafers, because its film quality of wafer of different product and the difference of grinding pressure can cause the loss different to grinding pad, therefore under identical milling time, loss can be very different, equally, under the prerequisite of identical grinding crystal wafer number, if grinding is the wafer of different product, its loss to grinding pad can be different; Namely when current grinding pad monitoring method carries out grinding technics for different wafer on same grinding pad, the abrasion condition of grinding pad can not be detected in real time, and then cause grinding pad not to be fully utilized, increase production cost.
Summary of the invention
For above-mentioned Problems existing, present invention is disclosed a kind of grinding pad, mainly by arranging multiple detection inclined hole for the technique detecting grinding pad loss situation at each position in grinding technics in real time on grinding pad.
The object of the invention is to be achieved through the following technical solutions:
A kind of grinding pad, described grinding pad is provided with grinding groove, wherein, described grinding is paid somebody's debt and expected repayment later and is provided with multiple detection inclined hole.
Above-mentioned grinding pad, wherein, described detection inclined hole is the blind hole extending to its inside from the upper surface of described grinding pad.
Above-mentioned grinding pad, wherein, the distance between the described groove that the openend of described detection inclined hole is adjacent is 1-20mm.
Above-mentioned grinding pad, wherein, the angle on described detection inclined hole and described grinding pad surface is 20 °-80 °.
Above-mentioned grinding pad, wherein, the number of described detection inclined hole is 3-50.
Above-mentioned grinding pad, wherein, does not contact between described detection inclined hole with described grinding groove.
Above-mentioned grinding pad, wherein, described detection inclined hole is less than the degree of depth of described grinding groove perpendicular to the degree of depth on described grinding pad surface, and is greater than the degree of depth that when described grinding pad arrives service life, grinding groove is preset.
Above-mentioned grinding pad, wherein, the diameter of the openend of described detection inclined hole is less than the diameter of described grinding groove.
Above-mentioned grinding pad, wherein, multiple described detection inclined hole is arranged on described grinding falls uniformly.
Grinding pad is carried out to a method for loss detection, is applied in grinding technics, comprise the grinding pad described in above-mentioned any one, comprise the following steps:
When carrying out needing in grinding technics to carry out loss detection to grinding pad, measure the upper surface of described detection inclined hole apart from the distance x1 between a grinding groove;
According to wearing calculation formula
△ h is this detection inclined hole place grinding pad wear-thickness, X is that the openend of this detection inclined hole that grinding pad is preset is apart from the distance between this grinding groove, θ is angle between this detection inclined hole and surface of grinding pad, and x1 is that the openend of this detection inclined hole after grinding pad grinding technics is apart from the distance between this grinding groove.
In sum, a kind of grinding pad of the present invention and loss detection method when utilizing this grinding pad to grind, by presetting multiple detection inclined hole on the grinding pad being provided with grinding groove, when carrying out needing in grinding technics to detect grinding pad loss, grinding pad after carrying out grinding technics by measurement detects the distance between inclined hole and groove, and preset numerical value and formula for the utilization of this groove, calculate the abrasion condition of this grinding pad at this detection inclined hole place, and continue to carry out identical processing step to other each detection inclined hole, with the abrasion condition of whole position, this grinding pad of detection surface in grinding technics that can be real-time, and then reach the object making full use of this grinding pad, to reduce grinding technics cost.
Accompanying drawing explanation
Fig. 1 is the top view of traditional grinding pad in background technology of the present invention;
Fig. 2 is that in background technology of the present invention, traditional grinding pad is at the grinding pad thickness schematic diagram close to diverse location during its physical life, and transverse axis represents the distance (unit be inch) of grinding pad from its center, and the longitudinal axis represents the thickness (unit is mils) of grinding pad;
Fig. 3 is the relation schematic diagram between the coefficient of friction of grinding pad in background technology of the present invention and milling time, and transverse axis represents milling time (unit is H), and the longitudinal axis represents coefficient of friction;
Relation schematic diagram in Fig. 4 background technology of the present invention between the grinding rate of grinding pad and milling time, transverse axis represents milling time (pad age), and unit is H, and the longitudinal axis represents grinding rate (removal rate), and unit is A/min;
Fig. 5 is the structural representation that grinding pad of the present invention is preset;
Fig. 6 is the structural representation after carrying out grinding technics in grinding pad of the present invention.
detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is further described:
Fig. 5 is the structural representation that grinding pad of the present invention is preset, and Fig. 6 is the structural representation after carrying out grinding technics in grinding pad of the present invention; As shown in Figure 5, a kind of grinding pad 1 of the present invention, be mainly used in wafer planarization metallization processes as chemical mechanical milling tech (Chemical Mechanical Polishing, be called for short CMP) etc., this grinding pad 1 is provided with multiple grinding groove 2, and relatively more conventional is that the plurality of grinding groove 2 is set to multiple concentric circles; Multiple detection inclined hole 3 is also offered between upper multiple grinding grooves 2 of this grinding pad 1, for when this grinding pad 1 carries out grinding technics, the loss situation of real-time measurement grinding pad surface each several part.
Further, 3-50 is detected inclined hole 3 and is arranged on grinding pad 1 uniformly, so that carry out real-time detection when grinding technics to each several part on the surface of grinding pad 1, the number of preferred detection inclined hole 3 can be set to 3, 15, 25, 35, 40 or 50, and the plurality of detection inclined hole 3 is the blind hole extending to its inside from the upper surface of grinding pad 1, and the surface plane of grinding pad 1 is the angle theta between 20 °-80 °, such could measurement comparatively is accurately being carried out before and after grinding technics, detect inclined hole 3 relative to the distance change between same grinding groove 2, angle theta preferably 20 °, 40 °, 60 ° or 80 °, wherein, the scope of the distance X between the grinding groove 2 that the openend of each detection inclined hole 3 is adjacent between 1-20mm, to prevent the detection inclined hole 3 that arranges and the break-through of grinding groove 2, value preferably 1mm, 10mm or 20mm of X.
Preferably, each detection inclined hole 3 is less than perpendicular to the degree of depth d on the surface of grinding pad 1 degree of depth D grinding groove 2, and d is greater than the degree of depth L that when grinding pad 1 arrives service life, grinding groove 2 is preset, i.e. D > d > L, to prevent the detection inclined hole 3 arranged from penetrating grinding pad 1, can prevent again to detect inclined hole 3 simultaneously and lose efficacy before grinding pad 1 arrives physical life.
Further, the diameter r of the openend of each detection inclined hole 3 is all less than the diameter R of grinding groove 2, and the grinding effect in order to prevent the detection inclined hole 3 arranged from affecting grinding pad 2, all can not break-through between arbitrary detection inclined hole 3 and arbitrary grinding groove 3.
As seen in figs. 5-6, present invention also offers a kind of method utilizing above-mentioned grinding pad this grinding pad to be carried out to real-time loss detection in grinding technics:
First, as shown in Figure 5, utilize grinding pad 1 carry out grinding technics as CMP etc. before, each detection inclined hole 3 on this grinding pad 1 is recorded relative to the distance x of the grinding groove 2 apart from its minimum distance, and the value of the angle theta between this detection inclined hole 3 and grinding pad 1 top surface plane is also recorded simultaneously; Wherein, the angle Y that above-mentioned detection inclined hole 3 and the grinding groove 2 corresponding with it are formed when grinding pad 1 inside extends between 10 °-70 °, and θ and Y addition and be 90 °.
Secondly, as shown in Figure 6, after grinding pad 1 carries out grinding technics, when needing the grinding pad 1 after to wearing and tearing to carry out loss detection, measure the distance x1 between each detection inclined hole 3 and the grinding groove 2 corresponding with it.
Finally, formula trigonometric function formula is utilized
calculating the wear-thickness of each detection inclined hole 3 place grinding pad 1, because X, x1 and θ are all known, so by calculating the value that can obtain this detection inclined hole place grinding pad wear-thickness △ h, and then determining the grinding pad wear-thickness at this detection inclined hole place; Wherein, △ h is this detection inclined hole place grinding pad wear-thickness, X is that the openend of this detection inclined hole that grinding pad is preset is apart from the distance between this grinding groove, θ is angle between this detection inclined hole and surface of grinding pad, and x1 is that the openend of this detection inclined hole after grinding pad grinding technics is apart from the distance between this grinding groove.
Wherein, above-mentioned formula
derivation be:
①
②
1. and 2. △ h=h-h1=can be obtained by formula
;
Wherein, h is that the grinding groove that this detect aperture place is corresponding with it before grinding technics extends the degree of depth of infall to grinding pad surface to grinding pad inside, h is that the grinding groove that this detect aperture place is corresponding with it after grinding technics extends the degree of depth of infall to grinding pad surface to grinding pad inside, △ h is this detection inclined hole place grinding pad wear-thickness, X is that the openend of this detection inclined hole that grinding pad is preset is apart from the distance between this grinding groove, θ is angle between this detection inclined hole and surface of grinding pad, x1 is that the openend of this detection inclined hole after grinding pad grinding technics is apart from the distance between this grinding groove.
In sum, owing to have employed technique scheme, loss detection method when the embodiment of the present invention proposes a kind of grinding pad and utilizes this grinding pad to grind, by presetting multiple detection inclined hole on the grinding pad being provided with grinding groove, when carrying out needing in grinding technics to detect grinding pad loss, grinding pad after carrying out grinding technics by measurement detects the distance between inclined hole and groove, and preset numerical value and formula for the utilization of this groove, calculate the abrasion condition of this grinding pad at this detection inclined hole place, and continue to carry out identical processing step to other each detection inclined hole, with the abrasion condition of whole position, this grinding pad of detection surface in grinding technics that can be real-time, and then reach the object making full use of this grinding pad, to reduce grinding technics cost.
By illustrating and accompanying drawing, giving the exemplary embodiments of the ad hoc structure of detailed description of the invention, based on the present invention's spirit, also can do other conversion.Although foregoing invention proposes existing preferred embodiment, but these contents are not as limitation.
For a person skilled in the art, after reading above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should regard the whole change and correction of containing true intention of the present invention and scope as.In Claims scope, the scope of any and all equivalences and content, all should think and still belong to the intent and scope of the invention.
Claims (9)
1. a grinding pad, described grinding pad is provided with grinding groove, it is characterized in that, described grinding is paid somebody's debt and expected repayment later and is provided with multiple detection inclined hole;
Wherein, the diameter of the openend of described detection inclined hole is less than the diameter of described grinding groove.
2. grinding pad according to claim 1, is characterized in that, described detection inclined hole is the blind hole extending to its inside from the upper surface of described grinding pad.
3. grinding pad according to claim 1, is characterized in that, the distance between the described groove that the openend of described detection inclined hole is adjacent is 1-20mm.
4. grinding pad according to claim 1, is characterized in that, the angle on described detection inclined hole and described grinding pad surface is 20 °-80 °.
5. grinding pad according to claim 1, is characterized in that, the number of described detection inclined hole is 3-50.
6. grinding pad according to claim 1, is characterized in that, does not contact between described detection inclined hole with described grinding groove.
7. grinding pad according to claim 1, is characterized in that, described detection inclined hole is less than the degree of depth of described grinding groove perpendicular to the degree of depth on described grinding pad surface, and is greater than the degree of depth that when described grinding pad arrives service life, grinding groove is preset.
8. grinding pad according to claim 1, is characterized in that, multiple described detection inclined hole is arranged on described grinding pad uniformly.
9. grinding pad is carried out to a method for loss detection, is applied in grinding technics, comprise the grinding pad in claim 1-8 described in any one, it is characterized in that, comprise the following steps:
When carrying out needing in grinding technics to carry out loss detection to grinding pad, measure the upper surface of described detection inclined hole apart from the distance x1 between a grinding groove;
According to wearing calculation formula △ h=(X-x1) tan θ, △ h is this detection inclined hole place grinding pad wear-thickness, X is that the openend of this detection inclined hole that grinding pad is preset is apart from the distance between this grinding groove, x1 be the openend of this detection inclined hole after grinding pad grinding technics apart from the distance between this grinding groove, θ is angle between this detection inclined hole and surface of grinding pad.
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| JP6776166B2 (en) * | 2017-03-29 | 2020-10-28 | 株式会社日立産機システム | Method for detecting wear of wire rope grooves in electric hoisting machine and electric hoisting machine |
| US11260495B2 (en) * | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
| CN109590893B (en) * | 2019-01-04 | 2021-01-26 | 京东方科技集团股份有限公司 | Grinding method using grinding system and grinding system |
| CN114700869A (en) * | 2022-04-14 | 2022-07-05 | 上海华力集成电路制造有限公司 | System for judging wear degree and service life of polishing pad and use method |
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| JPS6257225A (en) * | 1985-09-06 | 1987-03-12 | Sumitomo Electric Ind Ltd | Method for measuring thickness of silicon wafer |
| US6616513B1 (en) * | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
| DE60308946T2 (en) * | 2002-06-03 | 2007-05-10 | Jsr Corp. | Polishing pad and method of making a polishing pad |
| CN1260783C (en) * | 2002-09-04 | 2006-06-21 | 南亚科技股份有限公司 | Grinding mat capable of showing abradability automatically and its manufacturing method |
| CN100488724C (en) * | 2006-11-10 | 2009-05-20 | 上海华虹Nec电子有限公司 | Method for effectively controlling useful time of grinding pad |
| CN102567597A (en) * | 2010-12-08 | 2012-07-11 | 无锡华润上华科技有限公司 | Method for computing service life of CMP (chemical mechanical polish) pad |
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