CN111482902A - Method for pressure adjustment of dresser in chemical mechanical polishing - Google Patents

Method for pressure adjustment of dresser in chemical mechanical polishing Download PDF

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Publication number
CN111482902A
CN111482902A CN202010290283.3A CN202010290283A CN111482902A CN 111482902 A CN111482902 A CN 111482902A CN 202010290283 A CN202010290283 A CN 202010290283A CN 111482902 A CN111482902 A CN 111482902A
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Prior art keywords
dresser
pressure
polishing pad
angle
pad
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CN202010290283.3A
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Chinese (zh)
Inventor
刘耀聪
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Changchun Changguang Yuanchen Microelectronic Technology Co ltd
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Changchun Changguang Yuanchen Microelectronic Technology Co ltd
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Priority to CN202010290283.3A priority Critical patent/CN111482902A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

The invention discloses a method for regulating pressure of a dresser in chemical mechanical polishing, which belongs to the field of processing and manufacturing of semiconductor chips.A pressure control is divided into two parts in the whole path of the motion of the dresser, the two parts are distinguished by the contact area of the dresser and a polishing pad, and when ① is completely contacted, the pressure applied by the dresser to the polishing pad is F1，F1A preset constant pressure, wherein when ② is not in full contact, the pressure applied by the dresser to the grinding pad is F2，F2The contact area of the dresser and the polishing pad is changed, so that all the areas of the polishing pad are subjected to the same dressing pressure. The dresser in the chemical mechanical polishing provided by the inventionThe pressure adjusting method can eliminate the phenomenon of edge effect that the edge of the grinding pad is consumed too fast, improve the thickness difference between the middle part and the edge part of the grinding pad and prolong the service life of the grinding pad.

Description

Method for pressure adjustment of dresser in chemical mechanical polishing
Technical Field
The invention relates to a method for regulating the pressure of a dresser in chemical mechanical polishing, belonging to the field of processing and manufacturing of semiconductor chips.
Background
In the field of semiconductor chip processing and manufacturing, as the process technology is upgraded, the requirement of the photolithography technology on the flatness of the wafer surface is higher and higher. The combination of chemical etching and mechanical polishing is currently the only technique that can achieve global planarization of a surface. In the process of chemical mechanical polishing, a wafer is in close contact with a polishing pad and certain pressure is applied to the wafer to perform relative motion, the roughness change and the integral appearance change of the polishing pad have great influence on the polishing rate and the flatness in the process, and in order to ensure that the mechanical removal rate of the wafer is stable and constant, the polishing pad is continuously polished by a dresser, so that the polishing pad achieves required roughness and is stable in a certain range.
As the chemical mechanical polishing is performed, the polishing pad usually has "edge effect", i.e. the edge portion of the polishing pad is consumed more than the middle portion of the polishing pad. The reason is that when the dresser moves to the edge of the polishing pad, the pressure applied by the dresser is not changed, but the force bearing areas of the polishing pad and the dresser are reduced, so that the pressure applied to the polishing pad is increased, the consumption of the polishing pad is increased, and the thickness of the middle part and the edge part of the polishing pad is different after a long time. The polishing pad as a consumable product affects the manufacturing cost and the mechanical polishing manufacturing process of the silicon wafer, so that the effect of realizing the global planarization of the wafer is affected.
Disclosure of Invention
The present invention is directed to a method for pressure adjustment of a dresser in chemical mechanical polishing.
The technical scheme adopted by the invention for realizing the purpose is as follows: a method for pressure adjustment of a dresser in chemical mechanical polishing is characterized in that the method is realized based on a dresser, a dresser pressure monitoring system, a dresser angle detecting system and a controller, wherein the dresser is used for dressing the surface of a polishing pad; the dresser pressure monitoring system is used for monitoring the pressure applied by the dresser to the grinding pad and transmitting the pressure data monitored by the dresser to the controller; the dresser angle detection system is used for monitoring a dresser movement angle, the dresser movement angle is an included angle formed by connecting a dresser rotation central point with a dresser central point and a grinding disc central point respectively, and angle data monitored by the dresser movement angle is transmitted to the controller; the controller is used for receiving pressure data and angle data sent to the dresser pressure monitoring system and the dresser angle detecting system, and sending a control instruction for dressing the grinding pad according to the set pressure to the dresser according to the pressure data and the angle data;
the specific pressure adjusting method comprises the following steps: and the dresser carries out real-time dynamic adjustment dressing on the grinding pad according to the control instruction so as to enable all the areas of the grinding pad to be subjected to the same dressing pressure.
Wherein, in the whole moving path of the dresser, when the dresser is completely contacted with the grinding pad, the pressure applied by the dresser to the grinding pad is F1(ii) a When the dresser is not in complete contact with the polishing pad, the pressure exerted by the dresser on the polishing pad is F2In which F is1To set the parameters, F2Obtained by the following method:
X2＝K2+L2-2KLcos∠C
r2＝R2+X2-2RXcos∠A
R2＝r2+X2-2rXcos∠B
Figure BDA0002450133340000021
Figure BDA0002450133340000022
wherein K is the distance between the center point of the polishing pad and the center point of the dresser, L is the distance between the center point of the dresser and the center point of the dresser, R is the radius of the polishing pad, R is the radius of the dresser, and F is the distance between the center point of the polishing pad and the center point of the dresser1All of the above are known constant quantities as equipment target parameters; s1The dresser area, i.e., the area of the dresser in full contact with the polishing pad; s2∠ A is the connecting angle between the center of the polishing pad and the center of the dresser and the intersection point of the dresser and the polishing pad, and ∠ B is the connecting angle between the center of the dresser and the center of the polishing pad and the intersection point of the dresser and the polishing padA connecting line included angle of an intersection point of the grinding pad and the dresser, ∠ C is an included angle formed by connecting a rotating central point of the dresser with a central point of the dresser and a central point of the grinding disc respectively, ∠ C is obtained by real-time monitoring of a dresser angle detection system, and X is a distance between the center of the grinding pad and the center of the dresser;
Figure BDA0002450133340000031
wherein
Figure BDA0002450133340000032
According to ∠ C size and preset F1Adjusting the pressure F applied by the dresser to the polishing pad in real time2So that the pressure of the dresser to the grinding disc is constant.
Through the design scheme, the invention can bring the following beneficial effects: the method for regulating the pressure of the dresser in the chemical mechanical polishing can eliminate the phenomenon of edge effect of over-quick edge consumption of the polishing pad, improve the thickness difference between the middle part and the edge part of the polishing pad and prolong the service life of the polishing pad.
Drawings
FIG. 1 illustrates a path of a dresser across a polishing pad;
FIG. 2 is a schematic diagram of a pressure distribution of a dresser to a polishing pad before modification;
FIG. 3 is a schematic diagram of the pressure distribution of the dresser to the polishing pad in different regions after modification;
FIG. 4 is an enlarged view of a portion of the dresser as it travels to the edge of the polishing pad.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below in connection with preferred embodiments. As will be appreciated by those skilled in the art. The following detailed description is to be construed as illustrative and not restrictive, and various changes may be made in the following parameters by a user without departing from the spirit and scope of the invention as set forth in the appended claims. Well-known methods and procedures have not been described in detail so as not to obscure the present invention.
Fig. 1 shows a path of a dresser traveling on a polishing pad; FIG. 2 shows a schematic of the pressure distribution of a dresser to a polishing pad before dressing, F1Setting parameters for constancy; FIG. 3 shows the pressure distribution of different zones of the dresser on the polishing pad after modification by a method of dresser pressure regulation in chemical mechanical polishing, F1Setting parameters for constancy; f2As the contact area of the polishing pad and the dresser changes.
A method for pressure adjustment of a dresser in chemical mechanical polishing is realized based on a dresser, a dresser pressure monitoring system, a dresser angle detecting system and a controller, wherein the dresser is used for dressing the surface of a polishing pad; the dresser pressure monitoring system is used for monitoring the pressure applied by the dresser to the grinding pad and transmitting the pressure data monitored by the dresser to the controller; the dresser angle detection system is used for monitoring a dresser movement angle, the dresser movement angle is an included angle formed by connecting a dresser rotation central point with a dresser central point and a grinding disc central point respectively, and angle data monitored by the dresser movement angle is transmitted to the controller; the controller is used for receiving pressure data and angle data sent to the dresser pressure monitoring system and the dresser angle detecting system, and sending a control instruction for dressing the grinding pad according to the set pressure to the dresser according to the pressure data and the angle data;
the method comprises the following steps: and the dresser carries out real-time dynamic adjustment dressing on the grinding pad according to the control instruction so as to enable all the areas of the grinding pad to be subjected to the same dressing pressure.
As shown in fig. 4, the pressure control is divided into two parts in the whole path of the motion of the dresser, and the contact area between the dresser and the polishing pad is used for distinguishing, ① is completely contacted, the pressure exerted by the dresser on the polishing pad is F1，F1A preset constant pressure, wherein when ② is not in full contact, the pressure applied by the dresser to the grinding pad is F2，F2Follow-up dresser and polishing padChange in contact area, F2Obtained by the following method:
X2＝K2+L2-2KLcos∠C
r2＝R2+X2-2RXcos∠A
R2＝r2+X2-2rXcos∠B
Figure BDA0002450133340000041
Figure BDA0002450133340000042
wherein K is the distance between the center point of the polishing pad and the center point of the dresser, L is the distance between the center point of the dresser and the center point of the dresser, R is the radius of the polishing pad, R is the radius of the dresser, and F is the distance between the center point of the polishing pad and the center point of the dresser1All of the above are known constant quantities as equipment target parameters; s1The dresser area, i.e., the area of the dresser in full contact with the polishing pad; s2∠ A (angle A) is the connecting line angle between the center of the grinding pad and the intersection of the center of the dresser and the grinding pad, ∠ B (angle B) is the connecting line angle between the center of the dresser and the intersection of the grinding pad and the dresser, ∠ C (angle C) is the angle formed by the connecting line between the center of the rotation of the dresser and the center of the grinding disc, which is a constant obtained by real-time monitoring of a dresser angle detection system, and X is the distance between the center of the grinding pad and the center of the dresser, so that the intermediate quantity is calculated;
Figure BDA0002450133340000051
wherein
Figure BDA0002450133340000052
According to ∠ C (i.e. angle C) size and F1Setting, real-time adjusting the pressure F applied by the dresser to the grinding pad2So that the pressure of the dresser to the grinding disc is constant.

Claims (2)

1. A method for pressure adjustment of a dresser in chemical mechanical polishing is characterized in that the method is realized based on a dresser, a dresser pressure monitoring system, a dresser angle detecting system and a controller, wherein the dresser is used for dressing the surface of a polishing pad; the dresser pressure monitoring system is used for monitoring the pressure applied by the dresser to the grinding pad and transmitting the pressure data monitored by the dresser to the controller; the dresser angle detection system is used for monitoring a dresser movement angle, the dresser movement angle is an included angle formed by connecting a dresser rotation central point with a dresser central point and a grinding disc central point respectively, and angle data monitored by the dresser movement angle is transmitted to the controller; the controller is used for receiving pressure data and angle data sent to the dresser pressure monitoring system and the dresser angle detecting system, and sending a control instruction for dressing the grinding pad according to the set pressure to the dresser according to the pressure data and the angle data;
the specific pressure adjusting method comprises the following steps: and the dresser carries out real-time dynamic adjustment dressing on the grinding pad according to the control instruction so as to enable all the areas of the grinding pad to be subjected to the same dressing pressure.
2. The method of claim 1, wherein the method further comprises: the pressure applied by the dresser to the polishing pad is F when the dresser is completely contacted with the polishing pad in the whole moving path of the dresser1(ii) a When the dresser is not in complete contact with the polishing pad, the pressure exerted by the dresser on the polishing pad is F2In which F is1To set the parameters, F2Obtained by the following method:
X2＝K2+L2-2KLcos∠C
r2＝R2+X2-2RXcos∠A
R2＝r2+X2-2rXcos∠B
Figure FDA0002450133330000011
Figure FDA0002450133330000012
wherein K is the distance between the center point of the polishing pad and the center point of the dresser, L is the distance between the center point of the dresser and the center point of the dresser, R is the radius of the polishing pad, R is the radius of the dresser, and F is the distance between the center point of the polishing pad and the center point of the dresser1All of the above are known constant quantities as equipment target parameters; s1The dresser area, i.e., the area of the dresser in full contact with the polishing pad; s2∠ A is the connecting line angle between the center of the grinding pad and the center of the dresser, the intersection point of the dresser and the grinding pad, ∠ B is the connecting line angle between the center of the dresser and the center of the grinding pad, the intersection point of the grinding pad and the dresser, ∠ C is the angle formed by the connecting line between the rotation center point of the dresser and the center point of the grinding disc, ∠ C is obtained by real-time monitoring of a dresser angle detection system, and X is the distance between the center of the grinding pad and the center of the dresser;
Figure FDA0002450133330000021
wherein
Figure FDA0002450133330000022
According to ∠ C size and preset F1Adjusting the pressure F applied by the dresser to the polishing pad in real time2So that the pressure of the dresser to the grinding disc is constant.
CN202010290283.3A 2020-04-14 2020-04-14 Method for pressure adjustment of dresser in chemical mechanical polishing Pending CN111482902A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112497022A (en) * 2020-11-28 2021-03-16 厦门理工学院 Polishing auxiliary supporting device for edge effect control

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000237947A (en) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd Dresser
CN102725828A (en) * 2010-03-31 2012-10-10 应用材料公司 Side pad design for edge pedestal
CN103659605A (en) * 2012-08-28 2014-03-26 株式会社荏原制作所 Method of monitoring a dressing process and polishing apparatus
CN104002239A (en) * 2013-02-22 2014-08-27 株式会社荏原制作所 Method of acquiring sliding distance distribution of grinding wheel dresser on grinding component, method of acquiring sliding vector distribution and grinding apparatus
CN104858784A (en) * 2014-02-26 2015-08-26 盛美半导体设备（上海）有限公司 Polishing pad trimming method
CN105729307A (en) * 2014-12-26 2016-07-06 株式会社荏原制作所 Polishing apparatus and controlling the same
CN105856060A (en) * 2015-01-20 2016-08-17 中芯国际集成电路制造(上海)有限公司 Adjustment method for outer shape of ground component
CN110722457A (en) * 2018-07-17 2020-01-24 中芯国际集成电路制造(上海)有限公司 Polishing pad dressing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000237947A (en) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd Dresser
CN102725828A (en) * 2010-03-31 2012-10-10 应用材料公司 Side pad design for edge pedestal
CN103659605A (en) * 2012-08-28 2014-03-26 株式会社荏原制作所 Method of monitoring a dressing process and polishing apparatus
CN104002239A (en) * 2013-02-22 2014-08-27 株式会社荏原制作所 Method of acquiring sliding distance distribution of grinding wheel dresser on grinding component, method of acquiring sliding vector distribution and grinding apparatus
CN104858784A (en) * 2014-02-26 2015-08-26 盛美半导体设备（上海）有限公司 Polishing pad trimming method
CN105729307A (en) * 2014-12-26 2016-07-06 株式会社荏原制作所 Polishing apparatus and controlling the same
CN105856060A (en) * 2015-01-20 2016-08-17 中芯国际集成电路制造(上海)有限公司 Adjustment method for outer shape of ground component
CN110722457A (en) * 2018-07-17 2020-01-24 中芯国际集成电路制造(上海)有限公司 Polishing pad dressing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112497022A (en) * 2020-11-28 2021-03-16 厦门理工学院 Polishing auxiliary supporting device for edge effect control
CN112497022B (en) * 2020-11-28 2022-05-17 厦门理工学院 Polishing auxiliary supporting device for edge effect control

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Application publication date: 20200804