CN1260783C - Grinding mat capable of showing abradability automatically and its manufacturing method - Google Patents
Grinding mat capable of showing abradability automatically and its manufacturing method Download PDFInfo
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- CN1260783C CN1260783C CN02131996.0A CN02131996A CN1260783C CN 1260783 C CN1260783 C CN 1260783C CN 02131996 A CN02131996 A CN 02131996A CN 1260783 C CN1260783 C CN 1260783C
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- grinding pad
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- depth
- index aperture
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Abstract
The present invention relates to a grinding pad which can automatically display abrasion degrees and comprises a grinding basal plate provided with a reference face, at least one first marking hole arranged in a first set distance below the grinding face, at least one second marking hole arranged in a second set distance below the grinding face, and at least one third marking hole arranged in a third set distance below the grinding face, wherein the first marking hole, the second marking hole and the third marking hole extend from the grinding face to the direction of the reference face, the third set distance is larger than the second set distance, and the second set distance is larger than the first set distance.
Description
Technical field
The invention relates to a kind of grinding pad and manufacture method, particularly relevant for a kind of grinding pad and manufacture method thereof that can show extent of deterioration automatically.
Background technology
In recent years, along with the increase of semiconductor device integrated level and density, the device with membrane structure is more and more many, so that need a technology of the lip-deep film surface of planarization membrane structure exactly.
Wherein a kind of technology of planarization wafer is cmp (chemical mechanicalpolish).In this technology, can be pressed towards a grinding pad that is bonded on the rotation platform by the wafer of a carrier fixing, grinding pad is when providing the chemical grinding solvent, in order to the surface of grinding wafers.
Because, the extent of deterioration of grinding pad is for the grinding efficiency of whole cmp processing procedure, very big influence is arranged, for example, when the extent of deterioration of grinding pad greater than one both quantitatively the time, to the grinding effect of wafer, will be lower than this both quantitatively the time not as extent of deterioration, therefore the thickness inequality that can cause wafer to be removed.
Yet, in the known method, measure the effective ways of grinding pad extent of deterioration, all be destructive, for example by cutting one on the grinding pad, and use electron microscope to come amount thickness, or use contact the grinding pad surface across the height footage number (straightedge) on the grinding pad, in order to measure thickness.Therefore, in known method of measurement, can destroy grinding pad or cause the grinding pad surface unclean.
Summary of the invention
In view of this, the primary technical problem that the present invention will solve provides a grinding pad that can show extent of deterioration certainly, makes the processing procedure personnel need not measure and can learn whether grinding pad has needed to change, so as to by the grinding efficiency that improves the whole CMP processing procedure.
According to above-mentioned purpose, the invention provides a kind of grinding pad of automatic demonstration wear intensity, comprise that one grinds substrate, has an abradant surface, one datum level, at least one first index aperture, be arranged at this abradant surface below one first set distance, at least one second index aperture, be arranged at this abradant surface below one second set distance, and at least one the 3rd index aperture, be arranged at this abradant surface below one the 3rd set distance, wherein this first, second and third index aperture, extend toward this abradant surface direction by this datum level, and the 3rd both set a distance greater than this second both set a distance, and this second both set a distance greater than this first both set a distance.
According to above-mentioned purpose, the present invention also provides a kind of manufacture method that can show the grinding pad of extent of deterioration automatically, and comprising provides one to grind substrate, has an abradant surface, a back side and one first set color; And on the back side of this grinding substrate, formation have the one first set degree of depth at least one first index aperture, have at least one second index aperture of the one second set degree of depth, and at least one the 3rd index aperture with one the 3rd set degree of depth, wherein this first set degree of depth is greater than this second set degree of depth, this second both depthkeeping greater than the 3rd set degree of depth.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Fig. 1 a-Fig. 1 b represents the schematic flow sheet of manufacture method of the present invention.
Fig. 2 a, Fig. 3 a, Fig. 4 a, Fig. 5 a represent the generalized section of the grinding pad of automatic demonstration wear intensity of the present invention.
The top view of this grinding pad among Fig. 2 b, Fig. 3 b, Fig. 4 b, Fig. 5 b difference presentation graphs 2a, Fig. 3 a, Fig. 4 a, Fig. 5 a.
Embodiment
As shown in Fig. 1 a-Fig. 1 b, be the schematic flow sheet of the manufacture method of the grinding pad that can show extent of deterioration automatically of the present invention.
At first, as shown in Fig. 1 a, provide one to grind substrate 100, have an abradant surface SF1 and a back side SF2.
In general, grinding substrate is made of polyurethane (poly-peace carbamate) material usually, above-mentioned polyurethane material is after being formed a cylinder earlier, is cut into a plurality of grinding substrates with a set thickness T s again, and the set thickness T s that wherein grinds substrate is approximately several millimeters.
Then, use laser light or mechanical system to burrow in the back side of this grinding substrate 100 SF2, form respectively and have at least one first index aperture V1 of one first set depth d 1, at least one second index aperture V2 with one second set depth d 2, and at least one the 3rd index aperture V3 with one the 3rd set depth d 3, wherein this first set depth d 1 is greater than this second set depth d 2, and this second set depth d 2 is greater than the 3rd set depth d 3, shown in Fig. 1 b.
For instance, the first set depth d 1 of these first index aperture V1 is about 0.6mm-0.7mm, and these first index aperture V1 is arranged in one first set pattern.The second set depth d 2 of these second index aperture V2 is about 0.4mm-0.5mm, and these second index aperture V2 is arranged in one second set pattern.And the 3rd set depth d 3 of this grade in an imperial examination three index aperture V3 is about 0.2mm-0.3mm, and this grade in an imperial examination three index aperture V3 are arranged in one the 3rd set pattern.In this example, this first, second, third set pattern is three concentric circless, but not in order to limit the present invention.
Then, please refer to Fig. 2 a-Fig. 5 a and Fig. 2 b-Fig. 5 b, Fig. 2 a-Fig. 5 a is the generalized section of the grinding pad 10 of expression automatic demonstration wear intensity of the present invention.Fig. 2 b-Fig. 5 b is the top view of this grinding pad 10 among difference presentation graphs 2a-Fig. 5 a.
Shown in Fig. 2 a, the grinding pad 10 of extent of deterioration that can show automatically of the present invention comprises that one grinds substrate 100, has an abradant surface SF1, one datum level SF2, at least one first index aperture V1, be arranged at both set a distance T1 places, this abradant surface SF1 below one first, at least one second index aperture V2, be arranged at both set a distance T2 places, this abradant surface SF1 below one second, and at least one the 3rd index aperture V3, be arranged at both set a distance T3 places, this abradant surface SF1 below one the 3rd, wherein this first, second and third index aperture V1, V2 and V3, all extend toward this datum level SF2 direction by this abradant surface SF1, and the 3rd both set a distance T3 greater than this second both set a distance T2, and this second both set a distance T2 greater than this first both set a distance T1, in this illustrative examples, above-mentioned first, second, the 3rd both set a distance be to be respectively 0.3mm, 0.5mm, 0.7mm, but not in order to limit the present invention.
Extent of deterioration when grinding pad 10 of the present invention, not greater than this first both during set a distance T1, these first, second and third index aperture V1, V2, the one first, second and third set pattern that V3 was arranged in respectively can not come across the abradant surface SF1 of this grinding pad 10, as shown in Fig. 2 b.
As shown in Fig. 3 a, when the extent of deterioration of grinding pad 10 of the present invention, greater than this first both during set a distance T1, the one first set pattern that is arranged in of these first index aperture then can come across the abradant surface SF1 of this grinding pad 10, as shown in Fig. 3 b.
Then, as Fig. 4 a, when the extent of deterioration of grinding pad 10 of the present invention, greater than this second both during set a distance T2, first and second set pattern that then these first and second index aperture were arranged in can come across the abradant surface SF1 of this grinding pad 10, as shown in Fig. 4 b.
Then, as shown in Fig. 5 a, extent of deterioration when grinding pad 10 of the present invention, greater than this first both during set a distance T3, the one first, second and third set pattern that is arranged in of these first, second and third index aperture then, can come across the abradant surface SF1 of this grinding pad 100, as shown in Fig. 5 b.
In present embodiment, first, second and third set pattern is respectively the circle of three different-diameters.So, when the extent of deterioration of grinding pad greater than first both during set a distance T1, on the abradant surface of grinding pad, can demonstrate a circle (the first set pattern) that becomes by the hole arrangement plane.And, when the extent of deterioration of grinding pad greater than second both during set a distance, on the abradant surface of grinding pad, can demonstrate two figures (first, second set pattern) that become by the hole arrangement plane.In addition, when the extent of deterioration of grinding pad greater than the 3rd both during set a distance T3, on the abradant surface of grinding pad, can demonstrate three and arrange the circles (first, second, third set pattern) that form by hole.So the grinding pad 10 that can show extent of deterioration automatically of the present invention can demonstrate different patterns when different extent of deterioration.
Therefore, the figure that the processing procedure personnel show on can the abradant surface according to grinding pad is differentiated the extent of deterioration of grinding pad, and is learnt whether need to change grinding pad, so as to by the grinding efficiency that improves the whole CMP processing procedure.Simultaneously, the present invention can not look like known method of measurement, needs to destroy grinding pad or can cause grinding pad contaminated.
Though the present invention with preferred embodiment openly as above; right its is not in order to restriction the present invention, any those who familiarize themselves with the technology, without departing from the spirit and scope of the present invention; change and retouching when doing, so protection scope of the present invention is as the criterion when the content that look claims.
Claims (14)
1. manufacture method that can show the grinding pad of extent of deterioration automatically comprises:
Provide one to grind substrate, have an abradant surface and a back side; And
Grind on the back side of substrate at this, formation have the one first set degree of depth at least one first index aperture, have at least one second index aperture of the one second set degree of depth, and at least one the 3rd index aperture with one the 3rd set degree of depth, wherein this first set degree of depth is greater than this second set degree of depth, and this second set degree of depth is greater than the 3rd set degree of depth.
2. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 1 is characterized in that described first, second and the 3rd index aperture, is to use laser light to form.
3. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 1 is characterized in that described first, second and the 3rd index aperture, is to use mechanical system to form.
4. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 2 is characterized in that described first, second and third index aperture is arranged in one first set pattern, one second set pattern and one the 3rd set pattern respectively.
5. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 4 is characterized in that described first, second, third set pattern is three concentric circless.
6. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 1 is characterized in that the described first set degree of depth is 0.6mm-0.7mm.
7. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 1 is characterized in that the described second set degree of depth is 0.4mm-0.5mm.
8. the manufacture method that can show the grinding pad of extent of deterioration automatically as claimed in claim 1 is characterized in that the described the 3rd set degree of depth is 0.2mm-0.3mm.
9. grinding pad that automatically shows wear intensity comprises:
One grinds substrate, have an abradant surface, a datum level, at least one first index aperture, be arranged at this abradant surface below one first set distance, at least one second index aperture, be arranged at this abradant surface below one second set distance, and at least one the 3rd index aperture, be arranged at this abradant surface below one the 3rd set distance, this first, second and third index aperture wherein, extend toward this abradant surface direction by this datum level, and the 3rd both set a distance greater than this second both set a distance, and this second both set a distance greater than this first both set a distance.
10. the grinding pad of automatic demonstration wear intensity as claimed in claim 9, it is characterized in that described first both set a distance be 0.2mm-0.3mm.
11. the grinding pad of automatic demonstration wear intensity as claimed in claim 9, it is characterized in that described second both set a distance be 0.4mm-0.5mm.
12. the grinding pad of automatic demonstration wear intensity as claimed in claim 9, it is characterized in that the described the 3rd both set a distance be 0.6mm-0.7mm.
13. the grinding pad of automatic demonstration wear intensity as claimed in claim 9 is characterized in that described first, second and third index aperture is to be arranged in one first set pattern, one second set pattern and one the 3rd set pattern respectively.
14. the grinding pad of automatic demonstration wear intensity as claimed in claim 13 is characterized in that described first, second, third set pattern is three concentric circless.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02131996.0A CN1260783C (en) | 2002-09-04 | 2002-09-04 | Grinding mat capable of showing abradability automatically and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02131996.0A CN1260783C (en) | 2002-09-04 | 2002-09-04 | Grinding mat capable of showing abradability automatically and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1480991A CN1480991A (en) | 2004-03-10 |
| CN1260783C true CN1260783C (en) | 2006-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02131996.0A Expired - Lifetime CN1260783C (en) | 2002-09-04 | 2002-09-04 | Grinding mat capable of showing abradability automatically and its manufacturing method |
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| Country | Link |
|---|---|
| CN (1) | CN1260783C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112008001866T5 (en) * | 2007-07-27 | 2010-07-22 | Saint-Gobain Abrasifs | Automatic detection of characteristics of abrasive products during use |
| CN103029035B (en) * | 2012-11-28 | 2015-02-11 | 上海华力微电子有限公司 | Polishing pad and loss detecting method during polishing by using same |
| CN103100969A (en) * | 2013-02-27 | 2013-05-15 | 上海华力微电子有限公司 | Polishing pad for chemical machinery polishing |
| CN106853610B (en) | 2015-12-08 | 2019-11-01 | 中芯国际集成电路制造(北京)有限公司 | Polishing pad and its monitoring method and monitoring system |
-
2002
- 2002-09-04 CN CN02131996.0A patent/CN1260783C/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| CN1480991A (en) | 2004-03-10 |
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Granted publication date: 20060621 |