CN103025118A - Radiating device and manufacturing method thereof - Google Patents
Radiating device and manufacturing method thereof Download PDFInfo
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- CN103025118A CN103025118A CN2011102822859A CN201110282285A CN103025118A CN 103025118 A CN103025118 A CN 103025118A CN 2011102822859 A CN2011102822859 A CN 2011102822859A CN 201110282285 A CN201110282285 A CN 201110282285A CN 103025118 A CN103025118 A CN 103025118A
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- heat abstractor
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- fixing hole
- internal thread
- hole
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Abstract
The invention discloses a radiating device and a manufacturing method thereof. The radiating device comprises a body and at least one fixing hole, wherein the body is provided with a first plate body and a second plate body which are correspondingly buckled to form a chamber; the chamber is provided with working fluid, a plurality of supporting posts and at least one capillary structure, wherein the fixing hole can be selectively formed in any one part of the supporting posts of the body and penetrates through the supporting posts. Through the radiating device, the air tightness of the inner chamber of the body can be ensured, and a temperature equalizing board can be tightly combined with other elements.
Description
Technical field
A kind of heat abstractor and manufacture method thereof, a kind of fixed structure of heat abstractor espespecially, when it arranges fixed structure, get and do not destroy the body of this heat abstractor, and then can prevent that the chamber of this heat sink interior from producing heat abstractor and the manufacture method thereof that seepage affects hot transfer efficiency.
Background technology
Gradually with frivolous demand as bragging about, so each item all must dwindle its size thereupon, but the size of electronic equipment is dwindled the major obstacle that the thermal change of following and producing becomes electronic equipment and system enhancement performance with existing electronic equipment.The semiconductor dimensions that no matter forms electronic component is constantly dwindled, and still requires constantly to increase performance.
Temperature-uniforming plate is that the heat conduction of a kind of in a big way face and face is used, and it is different from the point-to-point heat exchange pattern of heat pipe, and is applicable to the comparatively narrow part use in space.
Known system is combined with temperature-uniforming plate and a substrate and conduct by temperature-uniforming plate the heat of the heater element on this substrate, known technology mainly lies in the position that temperature-uniforming plate is avoided this chamber, namely four outer couplings of the closed place of this temperature-uniforming plate respectively are formed with and have worn and worn a copper post with internal screw thread, the position system that relative this temperature-uniforming plate of substrate arranges the copper post offers at least one hole, wear simultaneously described copper post by a screw lock element in the mode of screw lock again and hole is fixed in this temperature-uniforming plate on this substrate, but this fixed form is arranged at the four coupling places of this temperature-uniforming plate because of the copper post, distant with this heater element, this temperature-uniforming plate is fixed rear and heater element can't fit tightly, and then produces thermal chocking; For improving the aforementioned problem that can't fit tightly, then the dealer is arranged at the direct correspondence of copper post the adjacent place at the position that this temperature-uniforming plate and heater element be sticked, so described copper post is directly to run through the position that temperature-uniforming plate has chamber, though tightness prevents that thermal chocking from producing in the time of can increasing assembling, but the chamber of this temperature-uniforming plate loses air-tightness after being subjected to described copper post to run through destruction, its chamber interior no longer has vacuum state, and because running through, the copper post destroys this chamber, then the flow path of the working fluid of its inside may be therefore interrupted, cause hot transfer efficiency to reduce, even seriously also may produce leakage, and then make this temperature-uniforming plate lose heat biography effectiveness.
Moreover, see also Fig. 1 a, Fig. 1 b, U.S. Patent number 7066240 and 6302192 and 7,100,680 3 cases system disclose a kind of equalizing plate structure 5, one body 51 has first dull and stereotyped the 511 and second flat board 512 that is separated from each other, and be provided with an outer protuberance 513 in this body periphery,, this outer protuberance 513 forms a sealing chamber 514 in order to do being connected; One groove 5111 is positioned on the first flat board 511 and away from this outer protuberance 513, and is connected with this second flat board 512; One opening 52 penetrates groove 5111 and second flat board 512 of this first flat board 511, and this groove 5111 includes an outer annular surface 5112, and with the second flat board 512 on one of corresponding ring-shaped edge surface 5121 be connected so that this opening 52 independently isolates from outside this body 51; 53 extensions of one spacer portion are contacted with between the first flat board 511, the second flat board 512; One capillary fiber structure 54 is located at this sealing chamber 514, though this structure has supporting construction and has airtight effect by the design of groove 5111, but because making the cavity space of the inner steam-condensate circulating of this temperature-uniforming plate, arranging of groove greatly reduce, the relative contact area that is arranged so that temperature-uniforming plate and thermal source because of groove diminishes, so not only hot transfer efficiency reduces also greatly reduction of contact area.
So known have a following shortcoming:
1. easily produce thermal chocking;
2. area of dissipation reduction;
3. hot transfer efficiency reduces.
Summary of the invention
For this reason, for solving the shortcoming of above-mentioned known technology, the present invention system provides a kind of combination tightness that promotes to prevent the heat abstractor that thermal chocking produces.
Secondary objective of the present invention is that a kind of manufacture method that the combination tightness prevents the heat abstractor that thermal chocking produces that promotes is provided.
For reaching above-mentioned purpose, the present invention system provides a kind of heat abstractor, is to comprise: a body, at least one fixing hole; Described body has one first plate body and one second plate body correspondence covers formation one chamber, have one first side and one second side and working fluid and a plurality of support column in this chamber, this chamber surfaces is provided with at least one capillary structure, and described support column two ends connect respectively first and second side of aforementioned cavity; Described fixing hole system selects correspondence that aforementioned body is set to have wherein arbitrary position of support column, and this fixing hole runs through this first and second plate body and this support column simultaneously.
For reaching above-mentioned purpose, the present invention system provides a kind of manufacture method of heat abstractor, is to comprise the following step:
One first plate body and one second plate body are provided;
In one of this first and second plate body correspondence side at least one capillary structure and a plurality of support column are set;
Aforementioned first and second plate body correspondence covered to seal vacuumize and insert working fluid;
The wherein arbitrary position that is provided with support column in aforementioned first and second plate body correspondence arranges a fixing hole with machining.
The effect that the fits tightly when heat abstractor by the present invention and manufacture method thereof not only can increase this heat abstractor and treat the heat-dissipating thing combination is avoided outside thermal chocking produces, more because fixing hole and this body group of setting of the present invention are established the chamber that does not run through and destroy this body, the internal work fluid does not produce leakage so this chamber is still possessed vacuum-tightness; So the present invention has following advantages:
1. conjugation is good for thermal chocking;
2. do not produce leakage;
3. useful life is longer.
Description of drawings
Fig. 1 a is the uniform-temperature plate heat dissipating device cutaway view of known technology;
Fig. 1 b is the uniform-temperature plate heat dissipating device vertical view of known technology;
Fig. 2 is the first embodiment three-dimensional exploded view of heat abstractor of the present invention;
Fig. 3 is the first embodiment three-dimensional combination figure of heat abstractor of the present invention;
Fig. 4 is first embodiment A-A cutaway view of heat abstractor of the present invention;
Fig. 5 is the cutaway view of the second embodiment of the present invention's heat abstractor;
Fig. 6 is the cutaway view of the 3rd embodiment of the present invention's heat abstractor;
Fig. 7 is the stereogram of the 4th embodiment of the present invention's heat abstractor;
Fig. 8 is the stereogram of the 5th embodiment of the present invention's heat abstractor;
Fig. 9 is the stereogram of the 6th embodiment of the present invention's heat abstractor;
Figure 10 is the three-dimensional exploded view of the 7th embodiment of the present invention's heat abstractor;
Figure 11 is the three-dimensional combination figure of the 7th embodiment of the present invention's heat abstractor;
Figure 12 is the stereogram of the 8th embodiment of the present invention's heat abstractor;
Figure 13 is the three-dimensional exploded view of the 9th embodiment of the present invention's heat abstractor;
Figure 14 is the three-dimensional combination figure of the 9th embodiment of the present invention's heat abstractor;
Figure 15 is the manufacture method flow chart of steps of heat abstractor of the present invention.
[main element symbol description]
Heat abstractor 1
Fixing hole 111
The first plate body 112
The second plate body 113
The first side 1141
The second side 1142
Working fluid 115
Retaining element 118
Hole 1181
Internal thread 1182
Heat affected zone 119
Thermal source 21
Fixed leg 22
Lock member 4
Embodiment
Characteristic on the present invention's above-mentioned purpose and structure thereof and the function will be explained according to appended graphic preferred embodiment.
Seeing also Fig. 2, Fig. 3, Fig. 4, is the first embodiment stereo decomposing and combination and the A-A cutaway view of heat abstractor of the present invention, and described heat abstractor 1 is to comprise: a body 11 and at least one fixing hole 111;
Described body 11 has one first plate body 112 and one second plate body, 113 correspondences cover formation one chamber 114, have one first side 1141 and one second side 1142 and working fluid 115 and a plurality of support column 116 in this chamber 114, these chamber 114 surfaces are provided with at least one capillary structure 117, described support column 116 two ends connect respectively first and second side 1141,1142 of aforementioned cavity 114, and described capillary structure 117 is the agglomerated powder opisthosoma.
Described fixing hole 111 is to select correspondence that aforementioned body 11 is set to have wherein arbitrary position of support column 116, and this fixing hole 111 runs through this first and second plate body 112,113 and this support column 116 simultaneously.
The heat abstractor 1 of present embodiment is with temperature-uniforming plate as an illustration.
See also Fig. 5, it is the cutaway view of the second embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the first embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the first embodiment are also to have an internal thread 1111 in the described fixing hole 111.
See also Fig. 6, it is the cutaway view of the 3rd embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the first embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the first embodiment are that described capillary structure 117 is the grid body.
See also Fig. 7, be the cutaway view of the 4th embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the first embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the first embodiment are that described capillary structure 117 is groove.
See also Fig. 8, it is the stereogram of the 5th embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the first embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the first embodiment are that described heat abstractor 1 also has a retaining element 118, and these retaining element 118 1 ends are that correspondence wears aforementioned fixing hole 111, described retaining element 118 has a hole 1181, and this hole 1181 is provided with internal thread 1182.
See also Fig. 9, it is the stereogram of the 6th embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the first embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the first embodiment are that described body 11 outsides are convexly equipped with at least one heat affected zone 119, described heat affected zone 119 adjacent described fixing holes 111.
See also Figure 10, Figure 11, be stereo decomposing and the constitutional diagram of the 7th embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the first embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the first embodiment are that the corresponding and substrate 2 of described body 11 is sticked, this body 11 is convexly equipped with at least one heat affected zone 119, described body 11 opposite these heat affected zone 119 1 sides connect a radiator 3, the heat affected zone 119 of described body 11 contacts with at least one thermal source 21 on this substrate 2, thermal source 21 all sides of described substrate 2 are provided with a plurality of fixed legs 22, described fixed leg 22 has an internal thread 221, and corresponding with aforementioned fixing hole 111, wear simultaneously screw thread 221 within aforementioned fixing hole 111 and this fixed leg 22 by a lock member 4, make described body 11 be fixed on this substrate 2.
See also Figure 12, it is the stereogram of the 8th embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the 7th embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the 7th embodiment are that described fixing hole 111 also has an internal thread 1111, and described lock member 4 wears within the aforementioned fixing hole 111 screw thread 221 within the screw thread 1111 and this fixed leg 22 simultaneously, makes described body 11 be fixed on this substrate 2.
See also Figure 13, Figure 14, be stereo decomposing and the constitutional diagram of the 9th embodiment of the present invention's heat abstractor, as shown in the figure, present embodiment part-structure system is identical with aforementioned the 7th embodiment, so will repeat no more at this, only present embodiment and not existing together of aforementioned the 7th embodiment are that described body 11 also has at least one retaining element 118, these retaining element 118 1 ends are the fixing hole 111 that correspondence wears aforementioned body 11, described retaining element 118 has a hole 1181, this hole 1181 is provided with an internal thread 1182, wear simultaneously within the aforementioned hole 1181 screw thread 221 within the screw thread 1182 and this fixed leg 22 by a lock member 4, make described body 11 be fixed on this substrate 2.
Seeing also Figure 15, is the manufacture method flow chart of steps of heat abstractor of the present invention, consults in the lump Fig. 2～Fig. 9, and as shown in the figure, the manufacture method of heat abstractor of the present invention is to comprise the following step:
S1: one first plate body and one second plate body are provided;
System provides one first plate body 112 and one second plate body 113, described first and second plate body 112,113 is that the better material of heat transfer efficiency such as copper material and aluminium material and stainless steel and pottery are wherein arbitrary, present embodiment system is not limited but do not regard it as with copper material as an illustration.
S2: at least one capillary structure and a plurality of support column are set in one of this first and second plate body correspondence side;
In aforementioned first, two plate bodys 112, the mutual correspondence of 113 wishs one of covers side plane at least one deck capillary structure 117 and a plurality of support column 116 is set, described capillary structure 117 is that to may be selected to be agglomerated powder opisthosoma (as shown in Figure 4) and grid body (as shown in Figure 5) and groove (as shown in Figure 6) wherein arbitrary, in addition, described support column 116 is with the copper post of copper material as an illustration, be not limited but do not regard it as, also can be the aluminium post of aluminium material, and aforementioned capillary structure 117 and support column 116 are can be by diffusion bond and sintering and welding arbitrary mode and this first wherein, two plate bodys 112,113 combinations.
S3: aforementioned first and second plate body correspondence covered to seal vacuumize and insert working fluid;
After aforementioned first and second plate body 112,113 correspondences are covered with both by diffusion bond and the welding fixing heat abstractor 1 with chamber 114 that forms of arbitrary mode wherein, and simultaneously this chamber 114 is vacuumized and inserts the work such as working fluid 115, at last with this heat abstractor 1 integral sealing.
S4: the wherein arbitrary position that is provided with support column in aforementioned first and second plate body correspondence arranges a fixing hole with machining.
The work that the aforementioned heat abstractor 1 that carries out after the complete seal is offered fixing hole 111, the position system of described fixing hole 111 designs for the heat source position of the corresponding applying conduction of heat abstractor 1 wish heat, and the mode by machining is offered a hole 1181 in the position that the chamber 114 of this heat abstractor 1 is provided with support column 116 relatively, and runs through simultaneously body 11 and this support column 116 of this heat abstractor 1.
Described machining is punching press and lead plug and to mill pin wherein arbitrary, and present embodiment is with punching press as an illustration, is not limited but do not regard it as.
Claims (14)
1. a heat abstractor is characterized in that, comprises:
One body, have one first plate body and one second plate body correspondence and cover formation one chamber, have one first side and one second side and working fluid and a plurality of support column in this chamber, this chamber surfaces is provided with at least one capillary structure, and described support column two ends connect respectively first and second side of aforementioned cavity;
At least one fixing hole is selected correspondingly aforementioned body to be set to have wherein arbitrary position of support column, and this fixing hole runs through this first and second plate body and this support column simultaneously.
2. heat abstractor as claimed in claim 1 is characterized in that, described capillary structure is that agglomerated powder opisthosoma and grid body and groove are wherein arbitrary.
3. heat abstractor as claimed in claim 1 is characterized in that, also has a retaining element, and this retaining element one end correspondence wears aforementioned fixing hole, and described retaining element has a hole, and this hole is provided with internal thread.
4. heat abstractor as claimed in claim 1 is characterized in that, described body exterior is convexly equipped with at least one heat affected zone, the adjacent described fixing hole in described heat affected zone.
5. heat abstractor as claimed in claim 1 is characterized in that, described heat abstractor is temperature-uniforming plate.
6. heat abstractor as claimed in claim 1, it is characterized in that, described body is corresponding to be sticked with a substrate, this body is convexly equipped with at least one heat affected zone, opposite this heat affected zone one side of described body connects a radiator, the heat affected zone of described body contacts with at least one thermal source on this substrate, the thermal source week side of described substrate is provided with a plurality of fixed legs, described fixed leg has an internal thread, and corresponding with aforementioned fixing hole, wear simultaneously the internal thread of aforementioned fixing hole and this fixed leg by a lock member, make described body be fixed on this substrate.
7. the fixed structure of heat abstractor as claimed in claim 6, it is characterized in that, described body also has at least one retaining element, this retaining element one end correspondence wears the fixing hole of aforementioned body, described retaining element has a hole, this hole is provided with an internal thread, wears simultaneously the internal thread of aforementioned hole and the internal thread of this fixed leg by a lock member, makes described body be fixed on this substrate.
8. heat abstractor as claimed in claim 1 is characterized in that, described fixing hole also has an internal thread.
9. the fixed structure of heat abstractor as claimed in claim 6, it is characterized in that, described fixing hole also has an internal thread, and described lock member wears the internal thread of aforementioned fixing hole and the internal thread of this fixed leg simultaneously, makes described body be fixed on this substrate.
10. the manufacture method of a heat abstractor is characterized in that, comprises the following step:
One first plate body and one second plate body are provided;
In a side corresponding to this first and second plate body at least one capillary structure and a plurality of support column are set;
Aforementioned first and second plate body correspondence covered to seal vacuumize and insert working fluid;
The wherein arbitrary position that is provided with support column in aforementioned first and second plate body correspondence arranges a fixing hole with machining.
11. the manufacture method of heat abstractor as claimed in claim 10 is characterized in that, described capillary structure is that agglomerated powder opisthosoma and grid body and groove are wherein arbitrary.
12. the manufacture method of heat abstractor as claimed in claim 10 is characterized in that, also has a retaining element, this retaining element one end correspondence wears aforementioned fixing hole, and described retaining element has a hole, and this hole is provided with internal thread.
13. the manufacture method of heat abstractor as claimed in claim 10 is characterized in that, machining is punching press and lead plug and to mill pin wherein arbitrary.
14. the manufacture method of heat abstractor as claimed in claim 10 is characterized in that, aforementioned capillary structure and described support column by diffusion bond and sintering and welding wherein first and second plate body of arbitrary mode and this be combined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102822859A CN103025118A (en) | 2011-09-21 | 2011-09-21 | Radiating device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102822859A CN103025118A (en) | 2011-09-21 | 2011-09-21 | Radiating device and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN103025118A true CN103025118A (en) | 2013-04-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102822859A Pending CN103025118A (en) | 2011-09-21 | 2011-09-21 | Radiating device and manufacturing method thereof |
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| CN (1) | CN103025118A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN107295778A (en) * | 2016-04-11 | 2017-10-24 | 奇鋐科技股份有限公司 | Equalizing plate structure |
| CN107846819A (en) * | 2017-11-07 | 2018-03-27 | 奇鋐科技股份有限公司 | Heat abstractor is airtight to run through structure |
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
| CN110068236A (en) * | 2018-01-23 | 2019-07-30 | 讯凯国际股份有限公司 | Temperature-uniforming plate |
| US11092383B2 (en) | 2019-01-18 | 2021-08-17 | Asia Vital Components Co., Ltd. | Heat dissipation device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101567341A (en) * | 2008-04-23 | 2009-10-28 | 富准精密工业(深圳)有限公司 | Soaking plate heat dissipating device |
| CN201805671U (en) * | 2010-09-29 | 2011-04-20 | 游明郎 | Uniform temperature plate having capillary structure |
| CN201839581U (en) * | 2010-10-28 | 2011-05-18 | 游明郎 | Equalizing thermal module |
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2011
- 2011-09-21 CN CN2011102822859A patent/CN103025118A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567341A (en) * | 2008-04-23 | 2009-10-28 | 富准精密工业(深圳)有限公司 | Soaking plate heat dissipating device |
| CN201805671U (en) * | 2010-09-29 | 2011-04-20 | 游明郎 | Uniform temperature plate having capillary structure |
| CN201839581U (en) * | 2010-10-28 | 2011-05-18 | 游明郎 | Equalizing thermal module |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN105578840B (en) * | 2015-07-31 | 2018-06-15 | 宇龙计算机通信科技(深圳)有限公司 | A kind of mobile terminal |
| CN107295778A (en) * | 2016-04-11 | 2017-10-24 | 奇鋐科技股份有限公司 | Equalizing plate structure |
| CN107295778B (en) * | 2016-04-11 | 2023-03-24 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
| CN107846819A (en) * | 2017-11-07 | 2018-03-27 | 奇鋐科技股份有限公司 | Heat abstractor is airtight to run through structure |
| CN107846819B (en) * | 2017-11-07 | 2021-01-26 | 奇鋐科技股份有限公司 | Airtight penetrating structure of heat dissipation device |
| CN110068236A (en) * | 2018-01-23 | 2019-07-30 | 讯凯国际股份有限公司 | Temperature-uniforming plate |
| CN109883225A (en) * | 2019-01-03 | 2019-06-14 | 奇鋐科技股份有限公司 | Radiator |
| US11092383B2 (en) | 2019-01-18 | 2021-08-17 | Asia Vital Components Co., Ltd. | Heat dissipation device |
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Application publication date: 20130403 |