TW201315359A - Heat dissipation device and a manufacturing method thereof - Google Patents
Heat dissipation device and a manufacturing method thereof Download PDFInfo
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一種散熱裝置及其製造方法，尤指一種散熱裝置的固定結構，其設置固定結構時，得不破壞該散熱裝置之本體，進而可防止該散熱裝置內部之腔室產生滲漏影響熱傳效率的散熱裝置及其製造方法。
A heat dissipating device and a manufacturing method thereof, in particular, a fixing structure of a heat dissipating device, which does not damage the body of the heat dissipating device when the fixing structure is disposed, thereby preventing leakage of the chamber inside the heat dissipating device and affecting heat transfer efficiency Heat sink and method of manufacturing the same.
隨現行電子設備逐漸以輕薄作為標榜之訴求，故各項元件皆須隨之縮小其尺寸，但電子設備之尺寸縮小伴隨而來產生的熱變成電子設備與系統改善性能的主要障礙。無論形成電子元件的半導體尺寸不斷地縮小，仍持續地要求增加性能。
均溫板係為一種較大範圍面與面之熱傳導應用，其有別於熱管之點對點的熱傳導方式，並適用於空間較為窄小之處使用。
習知係將均溫板與一基板結合使用並透過均溫板傳導該基板上之發熱元件之熱量，習知技術主要係於均溫板避開該腔室之部位，即該均溫板閉合處外之四耦各形成有穿孔並穿設一具有內螺牙之銅柱，基板相對該均溫板設置銅柱之位置係開設至少一孔洞，再透過一螺鎖元件以螺鎖之方式同時穿設該等銅柱及孔洞將該均溫板固定於該基板上，但此一固定方式因銅柱設置於該均溫板之四耦處，與該發熱元件距離較遠，該均溫板固定後與發熱元件無法緊密貼合，進而產生熱阻現象；為改善前述無法緊密貼合之問題，則業者將銅柱直接對應設置於該均溫板與發熱元件貼設之部位之鄰近處，故該等銅柱係直接貫穿均溫板具有腔室之部位，雖可增加組裝時緊密度防止熱阻現象產生，但該均溫板之腔室受該等銅柱貫穿破壞後失去氣密性，其腔室內部不再具有真空狀態，並且因銅柱貫穿破壞該腔室，則其內部之工作流體之流動路徑可能因此受阻礙，造成熱傳效率降低，甚至嚴重亦可能產生洩漏，進而令該均溫板失去熱傳效用。
再者，請參閱第1a、1b圖，美國專利號7066240及6302192及7100680三案係揭示一種均溫板結構5，一本體51具有相互分離之第一平板511與第二平板512，並於該本體周緣設有一外突出部513，俾使該外突出部513相連接而形成一封閉腔室514；一凹槽5111位於第一平板511上且遠離該外突出部513，並與該第二平板512相連接；一開口52穿透該第一平板511之凹槽5111及第二平板512，且該凹槽5111包含有一環狀外表面5112，並與第二平板512上之一相對應環狀邊緣表面5121相連接，使得該開口52獨立隔絕於該本體51外；一間隔部53延伸接觸於第一平板511、第二平板512之間；一毛細纖維結構54設於該封閉腔室514，雖此一結構藉由凹槽5111之設計而具有支撐結構及具有氣密之效果，但卻因凹槽之設置令該均溫板內部汽液循環之腔室空間大為縮減，相對的因凹槽之設置使得均溫板與熱源之接觸面積變小，故不僅熱傳效率降低接觸面積亦大為縮減。
故習知具有下列缺點：
1.易產生熱阻現象；
2.散熱面積縮減；
3.熱傳效率降低。
With the current gradual appeal of electronic devices, all components must be reduced in size, but the heat generated by the shrinking of electronic devices has become a major obstacle to the improvement of performance of electronic devices and systems. Regardless of the ever-shrinking size of semiconductors forming electronic components, there is a continuing demand for increased performance.
The uniform temperature plate is a kind of heat transfer application with a wide range of surface and surface, which is different from the point-to-point heat conduction mode of the heat pipe, and is suitable for use in a narrow space.
Conventionally, a temperature equalizing plate is used in combination with a substrate and the heat of the heating element on the substrate is transmitted through the temperature equalizing plate. The prior art is mainly applied to the portion of the temperature equalizing plate that avoids the chamber, that is, the temperature equalizing plate is closed. Each of the four couplings is formed with a perforation and a copper post having an internal thread, and the substrate is provided with at least one hole relative to the position of the copper plate provided by the temperature equalizing plate, and is simultaneously screwed through a screw locking component The copper plate and the hole are bored to fix the temperature equalizing plate on the substrate, but the fixing manner is because the copper column is disposed at the four couplings of the temperature equalizing plate, and the heating element is far away from the heating element. After the fixing, the heat-generating component cannot be closely adhered to each other, thereby generating a thermal resistance phenomenon; in order to improve the problem that the above-mentioned inseparable, the copper column is directly disposed adjacent to the portion where the temperature-regulating plate and the heat-generating component are attached, Therefore, the copper pillars directly penetrate the portion of the uniform temperature plate having the chamber, and although the tightness during assembly can be increased to prevent the occurrence of thermal resistance, the chamber of the uniform temperature plate loses airtightness after being broken by the copper columns. , the interior of the chamber no longer has a vacuum And damage due to the copper posts throughout the chamber, its internal flow path of the working fluid may therefore be impeded, resulting in reduced heat transfer efficiency, even seriously it may also leak, and thus enabling the loss of vapor chamber heat transfer effectiveness.
Furthermore, please refer to Figures 1a and 1b. U.S. Patent Nos. 7,066,240 and 6,302,192 and 7,100,680 disclose a temperature equalizing plate structure 5, a body 51 having a first plate 511 and a second plate 512 separated from each other, and An outer protrusion 513 is disposed on the periphery of the body, so that the outer protrusion 513 is connected to form a closed cavity 514; a groove 5111 is located on the first plate 511 and away from the outer protrusion 513, and the second plate 512 is connected; an opening 52 penetrates the groove 5111 of the first plate 511 and the second plate 512, and the groove 5111 includes an annular outer surface 5112 and is annularly corresponding to one of the second plates 512. The edge surface 5121 is connected to the outside of the body 51; a spacer 53 extends between the first plate 511 and the second plate 512; a capillary structure 54 is disposed in the closed chamber 514. Although the structure has a support structure and an airtight effect by the design of the groove 5111, the chamber space of the vapor-liquid circulation inside the temperature equalizing plate is greatly reduced due to the arrangement of the groove, and the opposite is concave. The setting of the groove makes the contact surface of the temperature equalizing plate and the heat source It becomes smaller, so that not only reduce the contact area of the heat transfer efficiency is also greatly reduced.
Therefore, the conventional drawbacks have the following disadvantages:
1. It is easy to generate thermal resistance phenomenon;
2. The heat dissipation area is reduced;
3. The heat transfer efficiency is reduced.
爰此，為解決上述習知技術之缺點，本發明係提供一種可提升組合緊密度防止熱阻現象產生的散熱裝置。
本發明次要目的係提供一種可提升組合緊密度防止熱阻現象產生的散熱裝置之製造方法。
為達上述之目的，本發明係提供一種散熱裝置，係包含：一本體、至少一固定孔；所述本體具有一第一板體及一第二板體對應蓋合形成一腔室，該腔室內具有一第一側及一第二側及工作流體及複數支撐柱，該腔室表面設有至少一毛細結構，該等支撐柱兩端分別連接前述腔室第一、二側；所述固定孔係選擇對應設置前述本體具有支撐柱其中任一之部位，該固定孔同時貫穿該第一、二板體及該支撐柱。
為達上述之目的，本發明係提供一種散熱裝置之製造方法，係包含下列步驟：
提供一第一板體及一第二板體；
於該第一、二板體對應之一側設置至少一毛細結構及複數支撐柱；
將前述第一、二板體對應蓋合進行密封抽真空及填入工作流體；
於前述第一、二板體對應設置有支撐柱的其中任一部位以機械加工設置一固定孔。
透過本發明之散熱裝置及其製造方法不僅可增加該散熱裝置與待散熱物組合時之緊密貼合效果避免熱阻現象產生外，更因為本發明設置之固定孔與該本體組設未貫穿及破壞該本體之腔室，故該腔室仍保有真空氣密性而內部工作流體不產生洩漏；故本發明具有下列優點：
1.結合度佳無熱阻現象；
2.不產生洩漏；
3. 使用壽命較長。
Accordingly, in order to solve the above-mentioned shortcomings of the prior art, the present invention provides a heat dissipating device which can improve the tightness of the combination and prevent the occurrence of thermal resistance.
A secondary object of the present invention is to provide a method of manufacturing a heat sink that can improve the tightness of the combination and prevent the occurrence of thermal resistance.
In order to achieve the above object, the present invention provides a heat dissipating device, comprising: a body and at least one fixing hole; the body has a first plate body and a second plate body correspondingly closed to form a cavity, the cavity The chamber has a first side and a second side, and a working fluid and a plurality of support columns. The surface of the chamber is provided with at least one capillary structure, and the two ends of the support columns are respectively connected to the first and second sides of the chamber; The hole system is selected to correspond to the position that the body has any one of the support columns, and the fixing hole penetrates the first and second plates and the support column at the same time.
To achieve the above object, the present invention provides a method of manufacturing a heat sink comprising the following steps:
Providing a first plate body and a second plate body;
Providing at least one capillary structure and a plurality of support columns on one side of the first and second plates;
The first and second plates are correspondingly closed for sealing and vacuuming and filling the working fluid;
A fixing hole is mechanically disposed in any one of the first and second plates corresponding to the support column.
The heat dissipating device and the manufacturing method thereof of the present invention can not only increase the close fitting effect of the heat dissipating device when combined with the heat dissipating material, but also prevent the thermal resistance phenomenon from occurring, and further, because the fixing hole and the body assembly provided by the present invention are not penetrated and The chamber of the body is destroyed, so that the chamber still retains vacuum airtightness and the internal working fluid does not leak; therefore, the present invention has the following advantages:
1. Good combination of no thermal resistance phenomenon;
2. No leakage;
3. Long service life.
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。
請參閱第2、3、4圖，係為本發明散熱裝置之第一實施例立體分解及組合及A-A剖視圖，所述散熱裝置1，係包含：一本體11及至少一固定孔111；
所述本體11具有一第一板體112及一第二板體113對應蓋合形成一腔室114，該腔室114內具有一第一側1141及一第二側1142及工作流體115及複數支撐柱116，該腔室114表面設有至少一毛細結構117，該等支撐柱116兩端分別連接前述腔室114之第一、二側1141、1142，所述毛細結構117係為燒結粉末體。
所述固定孔111係選擇對應設置前述本體11具有支撐柱116其中任一之部位，該固定孔111同時貫穿該第一、二板體112、113及該支撐柱116。
本實施例之散熱裝置1係以均溫板作為說明。
請參閱第5圖，係為本發明之散熱裝置之第二實施例之立體圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述固定孔111內更具有一內螺紋1111。
請參閱第6圖，係為本發明之散熱裝置之第三實施例之剖視圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述毛細結構117係為網格體。
請參閱第7圖，係為本發明之散熱裝置之第四實施例之剖視圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述毛細結構117係為溝槽。
請參閱第8圖，係為本發明之散熱裝置之第五實施例之立體圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述散熱裝置1更具有一固定元件118，該固定元件118一端係對應穿設前述固定孔111，所述固定元件118具有一孔洞1181，該孔洞1181設有內螺紋1182。
請參閱第9圖，係為本發明之散熱裝置之第六實施例之立體圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述所述本體11外部凸設至少一受熱區119，所述受熱區119相鄰該等固定孔111。
請參閱第10、11圖，係為本發明之散熱裝置之第七實施例之立體分解及組合圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述本體11對應與一基板2貼設，該本體11凸設至少一受熱區119，所述本體11相反該受熱區119一側連接一散熱器3，所述本體11之受熱區119與該基板2上之至少一熱源21接觸，所述基板2之熱源21周側設有複數固定柱22，該等固定柱22具有一內螺紋221，並與前述固定孔111相對應，透過一鎖固元件4同時穿設前述固定孔111及該固定柱22之內螺紋221，令所述本體11得以固定於該基板2上。
請參閱第12圖，係為本發明之散熱裝置之第八實施例之立體分解圖，如圖所示，本實施例部分結構係與前述第七實施例相同，故在此將不再贅述，惟本實施例與前述第七實施例之不同處係為所述固定孔111更具有一內螺紋1111，所述鎖固元件4同時穿設前述固定孔111之內螺紋1111及該固定柱22之內螺紋221，令所述本體11得以固定於該基板2上。
請參閱第13、14圖，係為本發明之散熱裝置之第九實施例之立體分解及組合圖，如圖所示，本實施例部分結構係與前述第七實施例相同，故在此將不再贅述，惟本實施例與前述第七實施例之不同處係為所述本體11更具有至少一固定元件118，該固定元件118一端係對應穿設前述本體11之固定孔111，所述固定元件118具有一孔洞1181，該孔洞1181設有一內螺紋1182，透過一鎖固元件4同時穿設前述孔洞1181之內螺紋1182及該固定柱22之內螺紋221，令所述本體11得以固定於該基板2上。
請參閱第15圖，係為本發明散熱裝置之製造方法步驟流程圖，一併參閱2～9圖，如圖所示，本發明散熱裝置之製造方法，係包含下列步驟：
S1：提供一第一板體及一第二板體；
係提供一第一板體112及一第二板體113，所述第一、二板體112、113係為導熱效率較佳之材質如銅材質及鋁材質及不銹鋼及陶瓷其中任一，本實施例係以銅材質作為說明，但並不引以為限。
S2：於該第一、二板體對應之一側設置至少一毛細結構及複數支撐柱；
於前述第一、二板體112、113欲相互對應蓋合之一側平面設置至少一層毛細結構117及複數支撐柱116，所述毛細結構117係可選擇為燒結粉末體（如第4圖所示）及網格體（如第6圖所示）及溝槽（如第7圖所示）其中任一，另外，所述支撐柱116係以銅材質之銅柱作為說明，但並不引以為限，亦可為鋁材質之鋁柱，並前述毛細結構117及支撐柱116係可透過擴散接合及燒結及焊接其中任一方式與該第一、二板體112、113結合。
S3：將前述第一、二板體對應蓋合進行密封抽真空及填入工作流體；
將前述第一、二板體112、113對應蓋合後將兩者透過擴散接合及焊接其中任一方式固定形成一具有腔室114之散熱裝置1，並同時對該腔室114進行抽真空及填入工作流體115等工作，最後將該散熱裝置1整體密封。
S4：於前述第一、二板體對應設置有支撐柱的其中任一部位以機械加工設置一固定孔。
將前述進行完整密封後之散熱裝置1進行開設固定孔111之工作，所述固定孔111之位置係針對散熱裝置1欲相對應貼合傳導熱量之熱源位置作設計，並且透過機械加工之方式於該散熱裝置1之腔室114相對設有支撐柱116之位置開設一孔洞1181，並同時貫穿該散熱裝置1之本體11及該支撐柱116。
所述機械加工係為沖壓及鑽銷及銑銷其中任一，本實施例係以沖壓作為說明，但並不引以為限。
The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
2, 3, 4, is a perspective view of a first embodiment of the heat sink of the present invention, and a cross-sectional view of the AA, the heat sink 1 includes a body 11 and at least one fixing hole 111;
The body 11 has a first plate body 112 and a second plate body 113 correspondingly closed to form a chamber 114. The chamber 114 has a first side 1141 and a second side 1142 and a working fluid 115 and a plurality of The support column 116 is provided with at least one capillary structure 117 on the surface of the chamber 114. The two ends of the support column 116 are respectively connected to the first and second sides 1141 and 1142 of the chamber 114. The capillary structure 117 is a sintered powder body. .
The fixing hole 111 is configured to correspondingly provide a portion of the body 11 having any one of the supporting columns 116. The fixing hole 111 penetrates the first and second plates 112 and 113 and the supporting column 116 at the same time.
The heat sink 1 of the present embodiment is described by a temperature equalizing plate.
Referring to FIG. 5, it is a perspective view of a second embodiment of the heat sink of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing first embodiment is that the fixing hole 111 has an internal thread 1111.
Please refer to FIG. 6 , which is a cross-sectional view of a third embodiment of the heat sink of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be further described herein. The difference between the embodiment and the first embodiment described above is that the capillary structure 117 is a mesh body.
FIG. 7 is a cross-sectional view showing a fourth embodiment of the heat sink of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the first embodiment described above is that the capillary structure 117 is a groove.
FIG. 8 is a perspective view of a fifth embodiment of the heat sink of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing first embodiment is that the heat dissipating device 1 further has a fixing component 118. The fixing component 118 has a fixing hole 111 corresponding to one end thereof, and the fixing component 118 has a hole 1181. The hole 1181 is provided with an internal thread 1182.
FIG. 9 is a perspective view of a sixth embodiment of the heat sink of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing first embodiment is that at least one heated area 119 is protruded from the outside of the body 11 , and the heated area 119 is adjacent to the fixing holes 111 .
10 and 11 are perspective exploded and combined views of a seventh embodiment of the heat sink of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore It is not described here, but the difference between the embodiment and the first embodiment is that the body 11 is correspondingly disposed with a substrate 2, and the body 11 protrudes from at least one heated area 119, and the body 11 is opposite to the heated area. A heat sink 3 is connected to one side of the 119, and the heat receiving area 119 of the body 11 is in contact with at least one heat source 21 on the substrate 2. The heat source 21 of the substrate 2 is provided with a plurality of fixing columns 22 on the circumferential side of the heat source 21, and the fixing columns 22 The body 11 has an internal thread 221 and is fixed to the substrate 2 through a fixing hole 111 and an internal thread 221 of the fixing post 22 through a locking component 4 . .
Referring to FIG. 12, it is an exploded perspective view of the eighth embodiment of the heat sink of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the seventh embodiment, and therefore will not be described again. The difference between the embodiment and the foregoing seventh embodiment is that the fixing hole 111 further has an internal thread 1111. The locking element 4 simultaneously penetrates the internal thread 1111 of the fixing hole 111 and the fixing post 22 The internal thread 221 allows the body 11 to be fixed to the substrate 2.
13 and FIG. 14 are perspective exploded and combined views of a ninth embodiment of the heat sink of the present invention. As shown in the figure, the partial structure of the present embodiment is the same as that of the seventh embodiment described above, and thus It is not described here, but the difference between the embodiment and the foregoing seventh embodiment is that the body 11 further has at least one fixing component 118, and one end of the fixing component 118 corresponds to the fixing hole 111 of the body 11 . The fixing member 118 has a hole 1181. The hole 1181 is provided with an internal thread 1182. The locking member 4 is inserted through the internal thread 1182 of the hole 1181 and the internal thread 221 of the fixing post 22 to fix the body 11. On the substrate 2.
Please refer to FIG. 15 , which is a flow chart of the manufacturing method of the heat dissipating device of the present invention. Referring to FIG. 2 to FIG. 9 , as shown in the figure, the manufacturing method of the heat dissipating device of the present invention comprises the following steps:
S1: providing a first plate body and a second plate body;
Providing a first plate body 112 and a second plate body 113, wherein the first and second plate bodies 112 and 113 are materials having better heat conduction efficiency, such as copper material and aluminum material, and stainless steel and ceramics. The example is made of copper, but it is not limited.
S2: providing at least one capillary structure and a plurality of support columns on one side of the first and second plates;
The first and second plates 112 and 113 are provided with at least one capillary structure 117 and a plurality of support columns 116 corresponding to one side plane of the cover. The capillary structure 117 can be selected as a sintered powder body (as shown in FIG. 4). And the grid body (as shown in FIG. 6) and the groove (as shown in FIG. 7), and the support column 116 is described by a copper pillar of copper, but is not cited. For example, the aluminum column of aluminum may be used, and the capillary structure 117 and the support post 116 may be combined with the first and second plates 112 and 113 by any of diffusion bonding, sintering and soldering.
S3: sealing the first and second plates to seal and vacuum and fill the working fluid;
The first and second plates 112 and 113 are correspondingly closed, and then the two are fixed by diffusion bonding and welding to form a heat dissipating device 1 having a chamber 114, and at the same time, the chamber 114 is evacuated and The work fluid 115 and the like are filled in, and finally the heat sink 1 is integrally sealed.
S4: mechanically processing a fixing hole in any one of the first and second plates corresponding to the support column.
The heat-dissipating device 1 after the complete sealing is performed to open the fixing hole 111. The position of the fixing hole 111 is designed for the position of the heat source of the heat-dissipating device 1 corresponding to the heat-conducting heat, and is processed by mechanical processing. The cavity 114 of the heat dissipating device 1 defines a hole 1181 at a position opposite to the support column 116, and simultaneously penetrates the body 11 of the heat dissipating device 1 and the support column 116.
The machining is performed by stamping, drilling, and milling. The present embodiment is illustrated by stamping, but is not limited thereto.
1．．．散熱裝置1. . . Heat sink
11．．．本體11. . . Ontology
111．．．固定孔111. . . Fixed hole
1111．．．內螺紋1111. . . internal thread
112．．．第一板體112. . . First plate
113．．．第二板體113. . . Second plate
114．．．腔室114. . . Chamber
1141．．．第一側1141. . . First side
1142．．．第二側1142. . . Second side
115．．．工作流體115. . . Working fluid
116．．．支撐柱116. . . Support column
117．．．毛細結構117. . . Capillary structure
118．．．固定元件118. . . Fixed component
1181．．．孔洞1181. . . Hole
1182．．．內螺紋1182. . . internal thread
119．．．受熱區119. . . Heated area
2．．．基板2. . . Substrate
21．．．熱源twenty one. . . Heat source
22．．．固定柱twenty two. . . Fixed column
221．．．內螺紋221. . . internal thread
3．．．散熱器3. . . heat sink
4．．．鎖固元件4. . . Locking element
第1a圖係為習知技術之均溫板散熱裝置剖視圖；
第1b圖係為習知技術之均溫板散熱裝置俯視圖；
第2圖係為本發明散熱裝置之第一實施例立體分解圖；
第3圖係為本發明散熱裝置之第一實施例立體組合圖；
第4圖係為本發明散熱裝置之第一實施例A-A剖視圖；
第5圖係為本發明之散熱裝置之第二實施例之立體圖；
第6圖係為本發明之散熱裝置之第三實施例之剖視圖；
第7圖係為本發明之散熱裝置之第四實施例之剖視圖；
第8圖係為本發明之散熱裝置之第五實施例之立體圖；
第9圖係為本發明之散熱裝置之第六實施例之立體圖；
第10圖係為本發明之散熱裝置之第七實施例之立體分解圖；
第11圖係為本發明之散熱裝置之第七實施例之立體組合圖；
第12圖係為本發明之散熱裝置之第八實施例之立體分解圖；
第13圖係為本發明之散熱裝置之第九實施例之立體分解圖；
第14圖係為本發明之散熱裝置之第九實施例之立體組合圖；
第15圖係為本發明散熱裝置之製造方法步驟流程圖。
Figure 1a is a cross-sectional view of a uniform temperature plate heat sink of the prior art;
Figure 1b is a top view of a uniform temperature plate heat sink of the prior art;
Figure 2 is a perspective exploded view of the first embodiment of the heat sink of the present invention;
Figure 3 is a perspective assembled view of the first embodiment of the heat sink of the present invention;
Figure 4 is a cross-sectional view of the first embodiment AA of the heat sink of the present invention;
Figure 5 is a perspective view of a second embodiment of the heat sink of the present invention;
Figure 6 is a cross-sectional view showing a third embodiment of the heat sink of the present invention;
Figure 7 is a cross-sectional view showing a fourth embodiment of the heat sink of the present invention;
Figure 8 is a perspective view of a fifth embodiment of the heat sink of the present invention;
Figure 9 is a perspective view of a sixth embodiment of the heat sink of the present invention;
Figure 10 is a perspective exploded view of a seventh embodiment of the heat sink of the present invention;
Figure 11 is a perspective assembled view of a seventh embodiment of the heat sink of the present invention;
Figure 12 is an exploded perspective view showing an eighth embodiment of the heat sink of the present invention;
Figure 13 is a perspective exploded view of a ninth embodiment of the heat sink of the present invention;
Figure 14 is a perspective assembled view of a ninth embodiment of the heat sink of the present invention;
Figure 15 is a flow chart showing the steps of the manufacturing method of the heat sink of the present invention.
1．．．散熱裝置1. . . Heat sink
11．．．本體11. . . Ontology
111．．．固定孔111. . . Fixed hole
112．．．第一板體112. . . First plate
113．．．第二板體113. . . Second plate
114．．．腔室114. . . Chamber
1141．．．第一側1141. . . First side
1142．．．第二側1142. . . Second side
115．．．工作流體115. . . Working fluid
116．．．支撐柱116. . . Support column
117．．．毛細結構117. . . Capillary structure
Claims (14)
一本體，具有一第一板體及一第二板體對應蓋合形成一腔室，該腔室內具有一第一側及一第二側及工作流體及複數支撐柱，該腔室表面設有至少一毛細結構，該等支撐柱兩端分別連接前述腔室第一、二側；
至少一固定孔，係選擇對應設置前述本體具有支撐柱其中任一之部位，該固定孔同時貫穿該第一、二板體及該支撐柱。A heat sink comprising:
a body having a first plate body and a second plate body correspondingly closed to form a chamber, the chamber having a first side and a second side and a working fluid and a plurality of support columns, the chamber surface being provided At least one capillary structure, the two ends of the support columns are respectively connected to the first and second sides of the chamber;
The at least one fixing hole is configured to correspondingly set the body to have any one of the supporting columns, and the fixing hole penetrates the first and second plates and the supporting column at the same time.
提供一第一板體及一第二板體；
於該第一、二板體對應之一側設置至少一毛細結構及複數支撐柱；
將前述第一、二板體對應蓋合進行密封抽真空及填入工作流體；
於前述第一、二板體對應設置有支撐柱的其中任一部位以機械加工設置一固定孔。A method of manufacturing a heat sink includes the following steps:
Providing a first plate body and a second plate body;
Providing at least one capillary structure and a plurality of support columns on one side of the first and second plates;
The first and second plates are correspondingly closed for sealing and vacuuming and filling the working fluid;
A fixing hole is mechanically disposed in any one of the first and second plates corresponding to the support column.
The method of manufacturing a heat sink according to claim 10, wherein the capillary structure and the support columns are bonded to the first and second plates by any one of diffusion bonding, sintering, and soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100134012A TWI538610B (en) | 2011-09-21 | 2011-09-21 | Heat dissipation device and a manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100134012A TWI538610B (en) | 2011-09-21 | 2011-09-21 | Heat dissipation device and a manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201315359A true TW201315359A (en) | 2013-04-01 |
| TWI538610B TWI538610B (en) | 2016-06-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100134012A TWI538610B (en) | 2011-09-21 | 2011-09-21 | Heat dissipation device and a manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI538610B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105889795A (en) * | 2014-10-23 | 2016-08-24 | 迈萪科技股份有限公司 | Light source module |
| CN107295778A (en) * | 2016-04-11 | 2017-10-24 | 奇鋐科技股份有限公司 | Equalizing plate structure |
| TWI729325B (en) * | 2018-11-26 | 2021-06-01 | 奇鋐科技股份有限公司 | Heat dissipation unit |
-
2011
- 2011-09-21 TW TW100134012A patent/TWI538610B/en active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105889795A (en) * | 2014-10-23 | 2016-08-24 | 迈萪科技股份有限公司 | Light source module |
| CN107295778A (en) * | 2016-04-11 | 2017-10-24 | 奇鋐科技股份有限公司 | Equalizing plate structure |
| CN107295778B (en) * | 2016-04-11 | 2023-03-24 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
| TWI729325B (en) * | 2018-11-26 | 2021-06-01 | 奇鋐科技股份有限公司 | Heat dissipation unit |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI538610B (en) | 2016-06-11 |
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