CN102956579B - The fixed structure of heat abstractor - Google Patents
The fixed structure of heat abstractor Download PDFInfo
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- CN102956579B CN102956579B CN201110236701.1A CN201110236701A CN102956579B CN 102956579 B CN102956579 B CN 102956579B CN 201110236701 A CN201110236701 A CN 201110236701A CN 102956579 B CN102956579 B CN 102956579B
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- fixed structure
- heat abstractor
- aforementioned
- retaining element
- heat
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of fixed structure of heat abstractor, system comprises: a body, multiple retaining element, described body has a chamber, this chamber has one first side and one second side and multiple supporter and working fluid, described supporter connects first and second side aforementioned, and this body exterior is to arranging the recessed multiple connecting portion in supporter place by chamber; Described retaining element connects this connecting portion; When can guarantee that this heat abstractor arranges retaining element by this structure system, it still can keep the air-tightness of body interior chamber, and heat abstractor and other elements can be made to reach combine closely.
Description
Technical field
A kind of fixed structure of heat abstractor, espespecially a kind of fixed structure of heat abstractor, when it arranges fixed structure, obtain the body not destroying this heat abstractor, and then can prevent the chamber of this heat sink interior generation seepage from affecting the fixed structure of the heat abstractor of hot transfer efficiency.
Background technology
With existing electronic equipment gradually using the frivolous demand as bragging about, therefore each item all must reduce its size thereupon, but the thermal change that the size of electronic equipment reduces with and produces becomes the major obstacle of electronic equipment and system enhancement performance.The semiconductor dimensions no matter forming electronic component constantly reduces, and still requires constantly to increase performance.
When semiconductor dimensions reduces, result heat flux increases, heat flux increases institute and causes that the challenge that product cools to be exceeded be only all hot increases because the increase of heat flux cause can be overheated at different time and different length size, electronic failure or damage may be caused.
Temperature-uniforming plate is that the heat transfer in one face and face is in a big way applied, and it is different from the point-to-point heat exchange pattern of heat pipe, and is applicable to the comparatively narrow part in space and uses.
Temperature-uniforming plate has a heating surface and a cryosurface and a vacuum chamber and is filled with working fluid, in this vacuum chamber, there is multiple support column and capillary structure, described support column connects the heating surface of this temperature-uniforming plate and cryosurface and supports this vacuum chamber, temperature-uniforming plate system is sticked by this heating surface and thermal source, the cryosurface of this temperature-uniforming plate opposite side is then connected heat conduction with another heat abstractor, and this working fluid produces in heating surface place heat of adsorption amount the working fluid that evaporation converts gaseous state to, this gaseous working fluid produces condensation in this cryosurface place, be converted to liquid state, the working fluid of this liquid state is back to heating surface by the capillary structure of chamber interior, working fluid forms gas-liquid cycle heat conduction in this chamber.
Temperature-uniforming plate is combined with a substrate and is conducted the heat of the heater element on this substrate by temperature-uniforming plate by known system, known technology mainly lies in the position that temperature-uniforming plate avoids this chamber, namely the four coupling places of this temperature-uniforming plate respectively wear the copper post that has internal screw thread, the position system that substrate arranges copper post relative to this temperature-uniforming plate offers at least one hole, wear described copper post in the mode of screw lock again and this temperature-uniforming plate is fixed on this substrate by hole by a screw lock element simultaneously, but this fixed form is arranged at the four coupling places of this temperature-uniforming plate because of copper post, distant with this heater element, this temperature-uniforming plate is fixed afterwards and heater element cannot fit tightly, and then generation thermal chocking, for improving the aforementioned problem that cannot fit tightly, then direct for copper post correspondence is arranged at the adjacent place at the position that this temperature-uniforming plate and heater element are sticked by dealer, therefore the position that temperature-uniforming plate has chamber is directly run through in described copper post system, though tightness prevents thermal chocking from producing when can increase assembling, but the chamber of this temperature-uniforming plate loses air-tightness after running through destruction by described copper post, its chamber interior no longer has vacuum state, and destroy this chamber because copper post runs through, then the flow path of the working fluid of its inside may therefore interruptedly cause hot transfer efficiency to reduce, even seriously also leakage may be produced, and then make this temperature-uniforming plate lose heat biography effectiveness, therefore known technology has its own shortcomings:
1. easily produce thermal chocking;
2. hot transfer efficiency reduces.
Summary of the invention
For this reason, for solving the shortcoming of above-mentioned known technology, the main purpose of the present invention is provide a kind of fixed structure promoting the heat abstractor that combination tightness prevents thermal chocking from producing.
Secondary objective of the present invention, does not destroy heat abstractor body when being and providing one to arrange retaining element, and guarantees the fixed structure of the bubble-tight heat abstractor of Chamber vacuum.
For reaching above-mentioned object, system of the present invention provides a kind of fixed structure of heat abstractor, is comprise: a body, multiple retaining element;
Described body has a chamber, this chamber has one first side and one second side and multiple supporter and working fluid, and this first and second side has a capillary structure layer, described supporter connects first and second side aforementioned, described body exterior arranges the recessed multiple connecting portion in position of supporter relative to this chamber, and the corresponding aforementioned supporter of described connecting portion is arranged;
Described retaining element has a hole, and one end connects the connecting portion of aforementioned body.
Specifically, the invention provides. a kind of fixed structure of heat abstractor, comprises:
One body, there is a chamber, this chamber has one first side and one second side and multiple supporter and working fluid, and this first and second side has a capillary structure layer, described supporter connects first and second side aforementioned, and described body exterior arranges the recessed multiple connecting portion in described supporter place relative to this chamber;
Multiple retaining element, described retaining element has a hole, and one end connects the connecting portion of aforementioned body.
Preferably, the fixed structure of described heat abstractor, has internal thread in the hole of described retaining element.
Preferably, the fixed structure of described heat abstractor, described capillary structure layer is complete is attached to aforementioned cavity.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by welding processing.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by point discharge processing.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by ultrasonic waves welding.
Preferably, the fixed structure of described heat abstractor, described retaining element is combined with aforementioned body by machining.
Preferably, the fixed structure of described heat abstractor, described body is corresponding to be sticked with a substrate, this at least one heat affected zone of body projection also contacts with at least one thermal source on this substrate, the all sides of described thermal source are provided with multiple hole, described hole is corresponding with aforementioned retaining element, and described body this side, heat affected zone contrary connects a radiator.
Preferably, the fixed structure of described heat abstractor, also has a lock member and wears aforementioned hole and described body and substrate are fixed by aforementioned retaining element.
Preferably, the fixed structure of described heat abstractor, described at least one heat affected zone of body exterior projection, the adjacent described connecting portion in described heat affected zone.
Preferably, the fixed structure of described heat abstractor, described body also has one first plate body and one second plate body correspondence covers and jointly defines aforementioned cavity.
Not only can increase this heat abstractor by the fixed structure of the heat abstractor of the present invention avoids outside thermal chocking produces with the effect that fits tightly when heat-dissipating thing combines, more because the retaining element of the present invention and this body group establish the chamber not running through and destroy this body, therefore this chamber still possesses vacuum-tightness and internal process fluid does not produce leakage; Therefore the present invention has following advantages:
1. conjugation is good for thermal chocking;
2. do not produce leakage;
3. useful life is longer.
Accompanying drawing explanation
Fig. 1 is the first embodiment three-dimensional exploded view of the fixed structure of heat abstractor of the present invention;
Fig. 2 is the first embodiment three-dimensional combination figure of the fixed structure of heat abstractor of the present invention;
Fig. 3 is the first embodiment A-A cutaway view of the fixed structure of heat abstractor of the present invention;
Fig. 4 is the stereogram of the second embodiment of the fixed structure of the heat abstractor of the present invention;
Fig. 5 is the three-dimensional exploded view of the 3rd embodiment of the fixed structure of the heat abstractor of the present invention;
Fig. 6 is the three-dimensional combination figure of the 3rd embodiment of the fixed structure of the heat abstractor of the present invention;
Fig. 7 is the three-dimensional exploded view of the 4th embodiment of the fixed structure of the heat abstractor of the present invention;
Fig. 8 is the B-B cutaway view of the 4th embodiment of the fixed structure of the heat abstractor of the present invention.
[main element symbol description]
Body 1
First plate body 1a
Second plate body 1b
Chamber 11
First side 111
Second side 112
Supporter 113
Capillary structure layer 114
Connecting portion 115
Heat affected zone 116
Retaining element 2
Hole 21
Internal thread 22
Working fluid 3
Substrate 4
Thermal source 41
Hole 42
Lock member 5
Radiator 6
Embodiment
Characteristic on the above-mentioned purpose of the present invention and structure and fuction thereof, will be explained according to the preferred embodiment of institute's accompanying drawings.
Refer to Fig. 1, Fig. 2, Fig. 3, be the first embodiment stereo decomposing of the fixed structure of heat abstractor of the present invention and constitutional diagram and A-A cutaway view, as shown in the figure, the fixed structure of the heat abstractor of the present invention is comprise: a body 1, multiple retaining element 2;
Described body 1 has a chamber 11, this chamber 11 has one first side 111 and one second side 112 and multiple supporter 113 and working fluid 3, and this first and second side 111,112 has a capillary structure layer 114, described supporter 113 two ends connect first and second side 111,112 aforementioned respectively, outside this chamber 11 relatively of described body 1 arranges the recessed multiple connecting portion 115 in described supporter 113 place, and described capillary structure layer 114 is completely be attached to aforementioned cavity 11.
This retaining element 2 has a hole 21, and one end connects the connecting portion 115 of aforementioned body 1; In described hole 21, setting tool has internal thread 22.
Described retaining element 2 be by welding processing and point discharge processing and machining and ultrasonic waves welding wherein arbitrary and aforementioned body be combined, wherein machining can be punching press and bore a hole and Drilling operation wherein arbitrary but do not regard it as and be limited.
Refer to Fig. 4, it is the stereogram of the second embodiment of the fixed structure of the heat abstractor of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and not existing together of aforementioned first embodiment are at least one heat affected zone 116 of the outside projection of described body 1, the adjacent described connecting portion 115 in described heat affected zone 116.
Refer to Fig. 5, Fig. 6, be stereo decomposing and the constitutional diagram of the 3rd embodiment of the fixed structure of the heat abstractor of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together that to be that described body 1 is corresponding be sticked with a substrate 4, this at least one heat affected zone of body 1 projection 116 also contacts with at least one thermal source 41 on this substrate 4, described thermal source 41 weeks sides are provided with multiple hole 42, described hole 42 is corresponding with aforementioned retaining element 2, and wear aforementioned hole 42 by least one lock member 5 and described body 1 and substrate 4 are fixed by aforementioned retaining element 2.
One of aforementioned body 1 this heat affected zone 116 contrary side-line connects a radiator 6.
Refer to Fig. 7, Fig. 8, be stereo decomposing and the assembled sectional view of the 4th embodiment of the fixed structure of the heat abstractor of the present invention, as shown in the figure, the present embodiment part-structure system is identical with aforementioned first embodiment, therefore will repeat no more at this, only not existing together of the present embodiment and aforementioned first embodiment is that described body 1 also has that one first plate body 1a and one second plate body 1b is corresponding to be covered and jointly define aforementioned cavity 11.
Claims (11)
1. a fixed structure for heat abstractor, is characterized in that, comprises:
One body, there is a chamber, this chamber has one first side and one second side and multiple supporter and working fluid, and this first and second side has a capillary structure layer, described supporter connects first and second side aforementioned, and described body exterior arranges the recessed multiple connecting portion in described supporter place relative to this chamber;
Multiple retaining element, described retaining element has a hole, and one end connects the connecting portion of aforementioned body.
2. the fixed structure of heat abstractor as claimed in claim 1, is characterized in that having internal thread in the hole of described retaining element.
3. the fixed structure of heat abstractor as claimed in claim 1, it is characterized in that, described capillary structure layer is complete is attached to aforementioned cavity.
4. the fixed structure of heat abstractor as claimed in claim 1, it is characterized in that, described retaining element is combined with aforementioned body by welding processing.
5. the fixed structure of heat abstractor as claimed in claim 1, is characterized in that, described retaining element is combined with aforementioned body by point discharge processing.
6. the fixed structure of heat abstractor as claimed in claim 1, is characterized in that, described retaining element is combined with aforementioned body by ultrasonic waves welding.
7. the fixed structure of heat abstractor as claimed in claim 1, it is characterized in that, described retaining element is combined with aforementioned body by machining.
8. the fixed structure of heat abstractor as claimed in claim 1, it is characterized in that, described body is corresponding to be sticked with a substrate, this at least one heat affected zone of body projection also contacts with at least one thermal source on this substrate, the all sides of described thermal source are provided with multiple hole, described hole is corresponding with aforementioned retaining element, and described body this side, heat affected zone contrary connects a radiator.
9. the fixed structure of heat abstractor as claimed in claim 8, is characterized in that, also has a lock member and wears aforementioned hole and described body and substrate are fixed by aforementioned retaining element.
10. the fixed structure of heat abstractor as claimed in claim 1, is characterized in that, described at least one heat affected zone of body exterior projection, the adjacent described connecting portion in described heat affected zone.
The fixed structure of 11. heat abstractors as claimed in claim 1, is characterized in that, described body also has one first plate body and one second plate body correspondence covers and jointly defines aforementioned cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110236701.1A CN102956579B (en) | 2011-08-17 | 2011-08-17 | The fixed structure of heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110236701.1A CN102956579B (en) | 2011-08-17 | 2011-08-17 | The fixed structure of heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102956579A CN102956579A (en) | 2013-03-06 |
| CN102956579B true CN102956579B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110236701.1A Active CN102956579B (en) | 2011-08-17 | 2011-08-17 | The fixed structure of heat abstractor |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764311A (en) * | 2016-05-05 | 2016-07-13 | 重庆大学 | Heat dissipation device for chip |
| CN110769654B (en) * | 2019-10-30 | 2020-09-22 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method thereof and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101072490A (en) * | 2006-05-10 | 2007-11-14 | 英业达股份有限公司 | Support column with porous structure |
| CN201787842U (en) * | 2010-07-14 | 2011-04-06 | 夏邦杰 | Soaking plate |
| CN201839581U (en) * | 2010-10-28 | 2011-05-18 | 游明郎 | Equalizing thermal module |
| CN201926356U (en) * | 2010-12-21 | 2011-08-10 | 深圳市万景华科技有限公司 | Uniform-temperature plate |
| CN202217658U (en) * | 2011-08-17 | 2012-05-09 | 奇鋐科技股份有限公司 | Fixing structure of radiation device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5454149B2 (en) * | 2010-01-05 | 2014-03-26 | オンキヨー株式会社 | Heat sink mounting structure and heat sink mounting method |
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2011
- 2011-08-17 CN CN201110236701.1A patent/CN102956579B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101072490A (en) * | 2006-05-10 | 2007-11-14 | 英业达股份有限公司 | Support column with porous structure |
| CN201787842U (en) * | 2010-07-14 | 2011-04-06 | 夏邦杰 | Soaking plate |
| CN201839581U (en) * | 2010-10-28 | 2011-05-18 | 游明郎 | Equalizing thermal module |
| CN201926356U (en) * | 2010-12-21 | 2011-08-10 | 深圳市万景华科技有限公司 | Uniform-temperature plate |
| CN202217658U (en) * | 2011-08-17 | 2012-05-09 | 奇鋐科技股份有限公司 | Fixing structure of radiation device |
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| Publication number | Publication date |
|---|---|
| CN102956579A (en) | 2013-03-06 |
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