CN107801358B - The bypass structure of heat-sink unit - Google Patents
The bypass structure of heat-sink unit Download PDFInfo
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- CN107801358B CN107801358B CN201711098570.9A CN201711098570A CN107801358B CN 107801358 B CN107801358 B CN 107801358B CN 201711098570 A CN201711098570 A CN 201711098570A CN 107801358 B CN107801358 B CN 107801358B
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- plate body
- heat
- recess portion
- sink unit
- plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of bypass structure of heat-sink unit, includes: one first plate body, one second plate body；This first, the corresponding lid of two plate bodys, which closes, forms an airtight chamber surface equipped with a hydrophilic layer, and a capillary structure is provided in airtight chamber, and first plate body is to forming one first recess portion and one first hole and one second recess portion at second plate body, first recess portion engages capillary structure set on the third side of second plate body, support the capillary structure in one end of second recess portion, the capillary structure does not contact first recess portion, second plate body has one second hole corresponding with the first hole, the bypass structure of heat-sink unit can provide heat-sink unit and need still keep vacuum-tightness when running through through the invention.
Description
Technical field
The present invention relates to a kind of bypass structure of heat-sink unit, espespecially a kind of one kind that provides ensures heat-sink unit through rear interior
The bypass structure that portion's air-tight chamber possesses the heat-sink unit of vacuum tight is airtight through structure.
Background technique
Existing electronic equipment is improved with efficiency, wherein as processing signal and operation electronic component it is opposite also compared with
Preceding electronic component generates higher heat, and the general heat dissipation element being most often used includes the members such as heat pipe, radiator, temperature-uniforming plate
Part, and heat dissipation is further increased after the electronic component contact generated heat by direct participant, prevent electronic component temperature excessively high
And the facts such as burn.
Temperature-uniforming plate is the heat transfer application in a kind of larger range face and face, is different from the point-to-point heat transfer side of heat pipe
Formula, and be suitable for the more narrow place in space and use.
Temperature-uniforming plate is used in combination with a substrate and passes through the heat for the heater element that temperature-uniforming plate conducts on the substrate by existing system
Amount, the prior art mainly lies in the position that temperature-uniforming plate avoids the chamber, i.e., at the samming plate closing outside four couplings be respectively formed with and wear
Hole simultaneously wears a copper post with internal screw thread, and substrate opens up an at least hole with respect to the position system of temperature-uniforming plate setting copper post, then
Described these copper posts and hole are worn simultaneously in a manner of screw lock a screw lock element, and the temperature-uniforming plate is fixed on the substrate
On, but this fixed form is set at four couplings of the temperature-uniforming plate because of copper post, and farther out with heater element distance, the temperature-uniforming plate is solid
It can not be fitted closely after fixed with heater element, and then generate thermal chocking；To improve aforementioned the problem of can not fitting closely, then industry
The adjacent place at the position that copper post is directly correspondingly arranged in the temperature-uniforming plate by person and heater element is sticked, therefore these described copper post systems
Directly there is through temperature-uniforming plate the position of chamber, though tightness prevents thermal chocking from generating when can increase assembling, the temperature-uniforming plate
Chamber lost air-tightness after destroying by these described copper posts, chamber interior no longer has a vacuum state, and because
Copper post is through the chamber is destroyed, then the flow path of its internal working fluid is possible therefore interrupted, and hot transfer efficiency is caused to drop
It is low, or even leakage may also be seriously generated, and then enable the temperature-uniforming plate lose heat and pass effectiveness.
Above-mentioned existing temperature-uniforming plate is mainly only capable of being applicable in general existing thicker temperature-uniforming plate through structure, if using through structure
It can not then be applicable in the temperature-uniforming plate of superthin structure, because ultra-thin temperature-uniforming plate integral thickness is only (0.8mm or less), can not additionally be placed in
Support column, and if using copper post, the copper post very thin using dimensional thickness certainly will be needed, the positioning of merging copper post is too thin because of thickness
With difficulty, and the small processing of copper post size is not easy, and after existing temperature-uniforming plate upper plate punching, depressed area and lower plate are combined, in conjunction with
Capillary structure is not arranged for region, then the performance of temperature-uniforming plate heat biography is influenced, so the recessed portion upper cover side of the temperature-uniforming plate of thicker
Wall also must be provided with capillary structure, and the capillary structure of the capillary structure connection lower plate of the recessed portion side wall of temperature-uniforming plate upper plate is then whole
The existing thicker temperature-uniforming plate that body is seen and the temperature-uniforming plate that can not be suitable for being thinned.
In addition, also thering is dealer to carry out manufacturing ultrathin temperature-uniforming plate by etching mode, and enterprising in plate by etching and processing
Row is except material setting groove or support construction, and the processing because that need to carry out removing material, therefore plate thickness itself is then that must reserve enough
Thickness begin to carry out except material, furthermore, carry out being easy to produce the bad situation of structural strength except the position of material and occur, therefore pass through
The processing that the mode of etching carries out ultra-thin temperature-uniforming plate still has the problems such as missing.
Summary of the invention
In this way, solving existing run through it is a primary object of the present invention to provide a kind of to solve the disadvantage that the above-mentioned prior art
The bypass structure of the heat-sink unit of vacuum tight leakage missing is caused with air-tight chamber.
In order to achieve the above object, the present invention provides a kind of bypass structure of heat-sink unit, it is characterized in that comprising:
One first plate body has one first side, a second side, one first recess portion, one first hole and one second recess portion, should
First recess portion, the second recess portion are formed from second side to first side recess, which is set to first recessed portion simultaneously
Through first side, second side；
One second plate body has a third side, one the 4th side and one second hole, the third side and aforementioned first side pair
Conjunction should be covered, first plate body, the second plate body define an airtight chamber jointly, which runs through the third of second plate body
Side, the 4th side, and it is corresponding with first hole；
One hydrophilic layer, set on the first side surface of first plate body；
One capillary structure layer is set in the airtight chamber, and aforementioned second recess portion supports the capillary structure layer, the capillary knot
Structure layer does not contact first recess portion.
The bypass structure of the heat-sink unit, in which: the capillary structure layer is grid body or corpus fibrosum or other tools
There is the structural body of porous property.
The bypass structure of the heat-sink unit, in which: the material of the grid body is copper or aluminium or stainless steel or titanium
Matter.
The bypass structure of the heat-sink unit, in which: first plate body, the second plate body be copper or aluminium or stainless steel or
Titanium matter.
The bypass structure of the heat-sink unit, in which: first plate body has a lip and an interconnecting piece, the lip
Side is set to the periphery of first plate body, and the interconnecting piece both ends connect first recess portion and the lip, the interconnecting piece and this
One recess portion is recessed.
The bypass structure of the heat-sink unit, in which: there is a heat affected zone, the heat affected zone is convexly equipped in second plate
4th side of body.
The bypass structure of heat-sink unit through the invention can ensure that when radiator is carried out through the setting of structure still
The air-tightness of airtight chamber inside heat-sink unit can be possessed really, and this airtight structure that runs through is suitable for any samming
Plate, the second recess portion of the first plate body itself can be used as support and use, and replace the support copper post in existing temperature-uniforming plate to use, into one
Step, which can improve ultra-thin temperature-uniforming plate, can not be arranged support construction, and improve the existing ultrathin samming that groove is opened up by etching mode
The bad equal missing of structural strength produced by plate, while air-tightness can be kept simultaneously through structure in setting on ultrathin temperature-uniforming plate.
Detailed description of the invention
Fig. 1 is the first embodiment stereogram exploded view of the bypass structure of heat-sink unit of the present invention；
Fig. 2 is the first embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention；
Fig. 3 is the second embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention；
Fig. 4 is the 3rd embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention.
Description of symbols: the bypass structure 1 of heat-sink unit；First plate body 11；First side 111；Second side 112；First
Recess portion 113；First hole 114；Second recess portion 115；Second plate body 12；Third side 121；4th side 122；Second hole 123；The
Two recess portions 124；Airtight chamber 13；Hydrophilic layer 14；Capillary structure layer 15；Lip 16；Heat affected zone 17；Interconnecting piece 18；Heat source 2.
Specific embodiment
Fig. 1, Fig. 2 are please referred to, is that the airtight first embodiment stereo decomposing combination through structure of radiator of the present invention is cutd open
View, as shown, the bypass structure 1 of heat-sink unit of the present invention, includes: one first plate body 11, one second plate body 12；
First plate body 11 has one first side 111 and a second side 112 and one first recess portion 113 and one first hole
114 and one second recess portion 115, first and second recess portion 113,115 formed from the second side 112 to first side 111 recess,
First hole 114 is set to first recess portion 113 and runs through first and second side 111,112.
Second plate body 12 has a third side 121 and one the 4th side 122 and one second hole 123, the third side
121 lids corresponding with aforementioned first side 111 close, and first and second plate body 11,12 defines an airtight chamber 13 jointly, this second
Hole 123 runs through third and fourth side 121,122 of second plate body 12, and corresponding with first hole 114.
One hydrophilic layer 14 is set to 111 surface of the first side of first plate body 11.
One capillary structure layer 15 is set to the third side 121 of the second plate body 12 in the airtight chamber 13, and aforementioned second recessed
Portion supports 115 one end the capillary structure layer 15, and the capillary structure layer 15 does not contact first recess portion 113, the capillary structure
Layer 15 is that grid body or corpus fibrosum or structural body with porous property are any.
First plate body, 11 periphery and the 12 periphery junction of the second plate body have a lip 16, and the lip 16 and preceding
Stating the first recess portion 113 and 121 place of engaging of third side of second plate body 12 is in conjunction with diffusion bonding or the mode of welding, into
And closed aforementioned airtight chamber 13 keeps vacuum tight, and because first hole 114 and second hole 123 selection are set to
The position of aforementioned first recess portion 113 or lip 16 can enable the airtight chamber 13 not be damaged and possess vacuum-tightness.
First plate body 11 is a position used as condensation effect, and conduction can be combined with other heat-sink units
Heat increase condensation effect, second plate body 12 as heat absorption heated part effect using and can be with an at least heat source 2
Contact carries out heat transfer.
Referring to Fig. 3, be the second embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention, as shown,
The present embodiment part-structure technical characteristic is identical as aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment with it is aforementioned
The surface for being different in the capillary structure layer 15 of first embodiment has the hydrophilic layer 14,17 projection of a heat affected zone
In the 4th side 122 of second plate body 12, the heat affected zone 17 is as the position directly contacted with heat source 2, the heat affected zone
17 can be any for a thick copper sheet or a scale copper, is selected according to corresponding 2 height of heat source.
Referring to Fig. 4, be the 3rd embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention, as shown,
The present embodiment part-structure technical characteristic is identical as aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment with it is aforementioned
First embodiment is different in first plate body 11 with a lip 16 and an interconnecting piece 18, and the lip 16 is set to institute
State the periphery of the first plate body 11,18 both ends of interconnecting piece connect first recess portion 113 and the lip 16, the interconnecting piece 18 with should
The identical direction recess in the third side 121 of second plate body 12 of first recess portion 113, and aforementioned lip 16 and this is first recessed
Portion 113 is sealed with second plate body 12 by way of welding or diffusion bonding with 18 system of interconnecting piece and is engaged.
15 system of capillary structure layer described in aforementioned first, second and third embodiment is formed by etching groove or sintered copper powder,
The material of the grid body is that copper or aluminium or stainless steel or titanium matter are any, and first and second plate body 11,12 is copper or aluminium
Stainless steel or titanium matter it is any.
If the material of the grid body is copper or aluminium or stainless steel or titanium matter when selecting grid body as capillary structure layer
It is any, it can also be arranged certainly by the mashed up mode of laminated structure material.
Present invention is primarily aimed at provide a kind of heat-sink unit with vacuum tight chamber to set when run through
When setting screw lock element, has and run through and keeps vacuum-tightness runs through structure, and due to directly in the first and second plate body 11,12
Formation is run through and the structure (the first recess portion 113) engaged and (the second recess portion 115) with support effect, can not only realize super
Slim temperature-uniforming plate has support while keeping the structure of airtight effect when running through.
First and second recess portion 113,115 of first plate body 11 of this case does not limit to be formed with any form processing, can be
Pressure sludge ice or the impact style of embossed are formed, and pin processing can also be cut by machinery or non-traditional processing method is formed by structure
Body.
Claims (6)
1. a kind of bypass structure of heat-sink unit, it is characterized in that comprising:
One first plate body has one first side, a second side, one first recess portion, one first hole and one second recess portion, this first
Side and the second side are on first plate body towards two sides of opposite direction, first recess portion, the second recess portion by this second
Lateral first side recess is formed, which is set to first recessed portion and runs through first side, second side；
One second plate body, has a third side, one the 4th side and one second hole, and the third side and the 4th side are second plate
Towards two sides of opposite direction on body, third side lid corresponding with aforementioned first side is closed, first plate body, the second plate body
Define an airtight chamber jointly, second hole run through second plate body third side, the 4th side, and with first hole pair
It answers；
One hydrophilic layer, set on the first side surface of first plate body；
One capillary structure layer is set in the airtight chamber, and aforementioned second recess portion supports the capillary structure layer, the capillary structure layer
First recess portion is not contacted.
2. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: the capillary structure layer be grid body or
Corpus fibrosum or other structural bodies with porous property.
3. the bypass structure of heat-sink unit as claimed in claim 2, it is characterised in that: the material of the grid body is copper or aluminium
Or stainless steel or titanium matter.
4. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: first plate body, the second plate body are
Copper or aluminium or stainless steel or titanium matter.
5. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: first plate body have a lip and
One interconnecting piece, the lip are set to the periphery of part between the first side and second side of first plate body, the interconnecting piece two
End connects first recess portion and the lip, the interconnecting piece and first recess portion are recessed.
6. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that: have a heat affected zone, the heat affected zone
It is convexly equipped in the 4th side of second plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711098570.9A CN107801358B (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711098570.9A CN107801358B (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107801358A CN107801358A (en) | 2018-03-13 |
| CN107801358B true CN107801358B (en) | 2019-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711098570.9A Active CN107801358B (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882644B (en) * | 2018-07-25 | 2020-09-04 | 奇鋐科技股份有限公司 | Heat radiation unit |
| US11160197B2 (en) | 2018-08-05 | 2021-10-26 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
| CN111010858B (en) * | 2019-12-30 | 2021-11-16 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN113464871B (en) * | 2021-06-30 | 2023-08-15 | 江西新菲新材料有限公司 | Lamp film, preparation method thereof and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201904323U (en) * | 2010-11-17 | 2011-07-20 | 深圳东桥华瀚科技有限公司 | Heat homogenizing plate |
| CN106813525A (en) * | 2017-02-08 | 2017-06-09 | 锘威科技(深圳)有限公司 | A kind of flat-plate heat pipe structure and its manufacture method |
| CN207491438U (en) * | 2017-11-09 | 2018-06-12 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7808782B2 (en) * | 2007-03-14 | 2010-10-05 | Asia Vital Components Co., Ltd. | Support device for heat dissipation module |
-
2017
- 2017-11-09 CN CN201711098570.9A patent/CN107801358B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201904323U (en) * | 2010-11-17 | 2011-07-20 | 深圳东桥华瀚科技有限公司 | Heat homogenizing plate |
| CN106813525A (en) * | 2017-02-08 | 2017-06-09 | 锘威科技(深圳)有限公司 | A kind of flat-plate heat pipe structure and its manufacture method |
| CN207491438U (en) * | 2017-11-09 | 2018-06-12 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
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| Publication number | Publication date |
|---|---|
| CN107801358A (en) | 2018-03-13 |
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