CN207491438U - The bypass structure of heat-sink unit - Google Patents
The bypass structure of heat-sink unit Download PDFInfo
- Publication number
- CN207491438U CN207491438U CN201721488944.3U CN201721488944U CN207491438U CN 207491438 U CN207491438 U CN 207491438U CN 201721488944 U CN201721488944 U CN 201721488944U CN 207491438 U CN207491438 U CN 207491438U
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- China
- Prior art keywords
- plate body
- heat
- recess portion
- sink unit
- hole
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Abstract
The utility model provides a kind of bypass structure of heat-sink unit, comprising：One first plate body, one second plate body；This first, two plate bodys correspond to lid and close one airtight chamber surface of formation equipped with a hydrophilic layer, and a capillary structure is provided in airtight chamber, and first plate body is to forming one first recess portion and one first hole and one second recess portion at second plate body, first recess portion engages capillary structure set on the third side of second plate body, support the capillary structure in one end of second recess portion, the capillary structure does not contact first recess portion, second plate body is corresponding with the first hole with one second hole, can be provided when heat-sink unit is needed and run through by the bypass structure of the utility model heat-sink unit can still keep vacuum-tightness.
Description
Technical field
The utility model is related to a kind of bypass structure of heat-sink unit, espespecially a kind of offer one kind ensures that heat-sink unit runs through
The bypass structure of heat-sink unit that internal air-tight chamber possesses vacuum tight afterwards is airtight through structure.
Background technology
Existing electronic equipment is improved with efficiency, wherein as processing signal and operation electronic component it is opposite also compared with
Preceding electronic component generates higher heat, and the general heat dissipation element being most often used includes the members such as heat pipe, radiator, temperature-uniforming plate
Part, and heat dissipation is further increased after the electronic component contact generated heat by direct participant, prevent electronic component temperature excessively high
And the facts such as burn.
Temperature-uniforming plate is the heat transfer application in a kind of wide range face and face, is different from the point-to-point heat transfer side of heat pipe
Formula, and used suitable for the more narrow place in space.
Existing is the heat for temperature-uniforming plate being used in combination and being passed through with a substrate heater element that temperature-uniforming plate is conducted on the substrate
Amount, the prior art mainly lies in the position that temperature-uniforming plate avoids the chamber, i.e., at the samming plate closing outside four couplings be respectively formed with and wear
Hole simultaneously wears a copper post with internal screw thread, and substrate opens up an at least hole with respect to the position system of temperature-uniforming plate setting copper post, then
These described copper posts in a manner of screw lock are worn a screw lock element simultaneously and the temperature-uniforming plate is fixed on the substrate by hole
On, but this fixed form is set at four couplings of the temperature-uniforming plate because of copper post, and distant with the heater element, which consolidates
It can not be fitted closely with heater element after fixed, and then generate thermal chocking；To improve aforementioned the problem of can not fitting closely, then industry
Copper post is directly correspondingly arranged in the adjacent place at position that the temperature-uniforming plate and heater element are sticked by person, therefore these described copper post systems
Directly there is the position of chamber through temperature-uniforming plate, though tight ness rating prevents thermal chocking from generating when can increase assembling, the temperature-uniforming plate
Chamber lost air-tightness after destroying by these described copper posts, chamber interior no longer has a vacuum state, and because
Copper post is through the chamber is destroyed, then the flow path of its internal working fluid is possible therefore interrupted, and hot transfer efficiency is caused to drop
It is low or even may also seriously generate leakage, and then the temperature-uniforming plate is enabled to lose heat and passes effectiveness.
Above-mentioned existing temperature-uniforming plate is mainly only capable of being applicable in general existing thicker temperature-uniforming plate through structure through structure, if using
It can not then be applicable in the temperature-uniforming plate of superthin structure, because ultra-thin temperature-uniforming plate integral thickness is only (below 0.8mm), can not additionally be placed in
Support column, and if using copper post, certainly will need using the very thin copper post of dimensional thickness, merging copper post is positioned because thickness is too thin
With difficulty, and the small processing of copper post size is not easy, and after existing temperature-uniforming plate upper plate punching, depressed area and lower plate combine, with reference to
Region does not set capillary structure, then the performance of temperature-uniforming plate heat biography is influenced, so the recessed portion upper cover side of the temperature-uniforming plate of thicker
Wall also must be provided with capillary structure, and the capillary structure of the capillary structure connection lower plate of the recessed portion side wall of temperature-uniforming plate upper plate is then whole
The existing thicker temperature-uniforming plate that body is seen can not simultaneously be suitable for the temperature-uniforming plate of slimming.
In addition, also there is dealer to carry out manufacturing ultrathin temperature-uniforming plate, and enterprising in plank by etching and processing by etching mode
Row sets groove or support construction except material, and because that need to carry out except the processing of material, therefore sheet metal thickness itself is then that must reserve enough
Thickness begin to carry out except material, furthermore, carry out easily generating that structural strength is bad to be happened except the position of material, therefore pass through
The processing that the mode of etching carries out ultra-thin temperature-uniforming plate still has the problems such as missing.
Utility model content
In this way, to solve the disadvantage that the above-mentioned prior art, it is existing to be to provide a kind of solution for the main purpose of the utility model
Through the bypass structure for the heat-sink unit that vacuum tight leakage missing is caused with air-tight chamber.
In order to achieve the above object, the utility model provides a kind of bypass structure of heat-sink unit, it is characterized in that comprising：
One first plate body has one first side, a second side, one first recess portion, one first hole and one second recess portion, should
First recess portion, the second recess portion are formed by second lateral first side recess, which is set on first recess portion and passes through
Wear the first side, the second side；
One second plate body has a third side, one the 4th side and one second hole, the third side and aforementioned first side pair
Conjunction should be covered, first plate body, the second plate body define an airtight chamber jointly, which runs through the third of second plate body
Side, the 4th side, and it is corresponding with first hole；
One hydrophilic layer, set on the first side surface of first plate body；
One capillary structure layer, in the airtight chamber, aforementioned second recess portion supports the capillary structure layer, the capillary knot
Structure layer does not contact first recess portion.
The bypass structure of the heat-sink unit, wherein：The capillary structure layer is grid body or corpus fibrosum or other tools
There is the structure of porous property.
The bypass structure of the heat-sink unit, wherein：The material of the grid body is copper or aluminium or stainless steel or titanium
Matter.
The bypass structure of the heat-sink unit, wherein：First plate body, the second plate body be copper or aluminium or stainless steel or
Titanium matter.
The bypass structure of the heat-sink unit, wherein：First plate body has a lip and a connecting portion, the lip
Side is set on the periphery of first plate body, and the connecting portion both ends connect first recess portion and the lip, the connecting portion with this
One recess portion is recessed.
The bypass structure of the heat-sink unit, wherein：With a heat affected zone, the heat affected zone is convexly equipped in second plate
4th side of body.
It can ensure that by the bypass structure of the heat-sink unit of the utility model when radiator carries out the setting through structure
When can still possess the air-tightness of airtight chamber inside heat-sink unit really, and this it is airtight through structure be suitable for it is any
Warm plate, the second recess portion of the first plate body itself can be used as support and use, and the support copper post in existing temperature-uniforming plate is replaced to use, into
One step, which can improve ultra-thin temperature-uniforming plate, can not set support construction and the existing ultrathin type for opening up groove by etching mode of improvement equal
Structural strength produced by warm plate is bad to wait missing, while can keep airtight simultaneously through structure in setting on ultrathin temperature-uniforming plate
Property.
Description of the drawings
Fig. 1 is the first embodiment three-dimensional exploded view of the bypass structure of the utility model heat-sink unit；
Fig. 2 is the first embodiment assembled sectional view of the bypass structure of the utility model heat-sink unit；
Fig. 3 is the second embodiment assembled sectional view of the bypass structure of the utility model heat-sink unit；
Fig. 4 is the 3rd embodiment assembled sectional view of the bypass structure of the utility model heat-sink unit.
Reference sign：The bypass structure 1 of heat-sink unit；First plate body 11；First side 111；The second side 112；First
Recess portion 113；First hole 114；Second recess portion 115；Second plate body 12；Third side 121；4th side 122；Second hole 123；The
Two recess portions 124；Airtight chamber 13；Hydrophilic layer 14；Capillary structure layer 15；Lip 16；Heat affected zone 17；Connecting portion 18；Heat source 2.
Specific embodiment
It please refers to Fig.1, Fig. 2, is the airtight first embodiment stereo decomposing group through structure of the utility model radiator
Sectional view is closed, as shown in the figure, the bypass structure 1 of the utility model heat-sink unit, comprising：One first plate body 11, one second plate body
12；
First plate body 11 has one first side 111 and a second side 112 and one first recess portion 113 and one first hole
114 and one second recess portion 115, which is recessed from the second side 112 to first side 111 is formed,
First hole 114 is set on first recess portion 113 and through first and second side 111,112.
Second plate body 12 has a third side 121 and one the 4th side 122 and one second hole 123, the third side
121 lids corresponding with aforementioned first side 111 close, and first and second plate body 11,12 defines an airtight chamber 13 jointly, this second
Hole 123 runs through third and fourth side 121,122 of second plate body 12, and corresponding with first hole 114.
One hydrophilic layer 14 is set on 111 surface of the first side of first plate body 11.
One capillary structure layer 15 is set on the third side 121 of the second plate body 12 in the airtight chamber 13, and aforementioned second recessed
Portion supports 115 one end the capillary structure layer 15, and the capillary structure layer 15 does not contact first recess portion 113, the capillary structure
Layer 15 is grid body or corpus fibrosum or the structure any of which with porous property.
First plate body, 11 periphery and the 12 periphery junction of the second plate body have a lip 16, and the lip 16 and preceding
The first recess portion 113 is stated to be combined with system of 121 place of engaging of the third side mode that diffusion is engaged or welded thoroughly of second plate body 12, into
And closed aforementioned airtight chamber 13 keeps vacuum tight, and because first hole 114 and second hole 123 selection are set to
The position of aforementioned first recess portion 113 or lip 16 can enable the airtight chamber 13 not be damaged and possess vacuum-tightness.
First plate body 11 is a position used as condensation effect, and conduction can be combined with other heat-sink units
Heat increases the effect of condensation, and second plate body 12 simultaneously can be with an at least heat source 2 as the use of heat absorption heated part effect
Contact carries out heat transfer.
Referring to Fig. 3, it is the second embodiment assembled sectional view of the bypass structure of the utility model heat-sink unit, as schemed institute
Show, the present embodiment part-structure technical characteristic is identical with aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment with
The difference of aforementioned first embodiment is in has the hydrophilic layer 14, a heat affected zone 17 in the surface of the capillary structure layer 15
Be convexly equipped in the 4th side 122 of second plate body 12, the heat affected zone 17 as the position directly contacted with heat source 2, it is described by
Hot-zone 17 can be a thick copper sheet or a scale copper any of which, be selected according to corresponding 2 height of heat source.
Referring to Fig. 4, it is the 3rd embodiment assembled sectional view of the bypass structure of the utility model heat-sink unit, as schemed institute
Show, the present embodiment part-structure technical characteristic is identical with aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment with
The difference of aforementioned first embodiment is in has a lip 16 and a connecting portion 18, the lip 16 in first plate body 11
Set on the periphery of first plate body 11,18 both ends of connecting portion connect first recess portion 113 and the lip 16, the connecting portion
18 it is identical with first recess portion 113 be in the third side 121 of second plate body 12 direction recess, and aforementioned lip 16 and should
First recess portion 113 is sealed with second plate body 12 by way of welding or spreading engagement with 18 system of connecting portion and engaged.
15 system of capillary structure layer described in aforementioned first, second and third embodiment is formed by etching groove or sintered copper powder,
The material of the grid body is copper or aluminium or stainless steel or titanium matter any of which, and first and second plate body 11,12 is copper or aluminium
Or stainless steel or titanium matter any of which.
If the material of the grid body is copper or aluminium or stainless steel or titanium matter when selecting grid body as capillary structure layer
Any of which can also be set certainly by the mashed up mode of laminated structure material.
The utility model main purpose is that providing a kind of heat-sink unit with vacuum tight chamber ought be passed through
It wears when putting screw lock element, has what is run through and keeps vacuum-tightness to run through structure, and due to directly in first and second plate body
11st, 12 the structure (the first recess portion 113) for running through and engaging and (the second recess portion 115) with support effect are formed, not only may be used
The ultrathin temperature-uniforming plate of realization has support keeps airtight effect structure when running through simultaneously.
First and second recess portion 113,115 of first plate body 11 of this case does not limit to be formed with any form processing, can be
Pressure sludge ice or the impact style of embossed are formed, and also can cut the structure that pin is processed or non-traditional processing method is formed by machinery
Body.
Claims (6)
1. a kind of bypass structure of heat-sink unit, it is characterized in that comprising：
One first plate body has one first side, a second side, one first recess portion, one first hole and one second recess portion, this first
Recess portion, the second recess portion are formed by second lateral first side recess, which is set on first recess portion and runs through and be somebody's turn to do
First side, the second side；
One second plate body has a third side, one the 4th side and one second hole, third side lid corresponding with aforementioned first side
It closes, first plate body, the second plate body define an airtight chamber jointly, and second hole is through the third side of second plate body, the
Four sides, and it is corresponding with first hole；
One hydrophilic layer, set on the first side surface of first plate body；
One capillary structure layer, in the airtight chamber, aforementioned second recess portion supports the capillary structure layer, the capillary structure layer
First recess portion is not contacted.
2. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that：The capillary structure layer be grid body or
Corpus fibrosum or other structures with porous property.
3. the bypass structure of heat-sink unit as claimed in claim 2, it is characterised in that：The material of the grid body is copper or aluminium
Or stainless steel or titanium matter.
4. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that：First plate body, the second plate body are
Copper or aluminium or stainless steel or titanium matter.
5. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that：First plate body have a lip and
One connecting portion, the lip are set on the periphery of first plate body, and the connecting portion both ends connect first recess portion and the lip,
The connecting portion and first recess portion are recessed.
6. the bypass structure of heat-sink unit as described in claim 1, it is characterised in that：With a heat affected zone, the heat affected zone
It is convexly equipped in the 4th side of second plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721488944.3U CN207491438U (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721488944.3U CN207491438U (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491438U true CN207491438U (en) | 2018-06-12 |
Family
ID=62476357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721488944.3U Expired - Fee Related CN207491438U (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801358A (en) * | 2017-11-09 | 2018-03-13 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
-
2017
- 2017-11-09 CN CN201721488944.3U patent/CN207491438U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801358A (en) * | 2017-11-09 | 2018-03-13 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
| CN107801358B (en) * | 2017-11-09 | 2019-09-06 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180612 Termination date: 20201109 |