CN102636890A - Structure with adjustable parallelism - Google Patents
Structure with adjustable parallelism Download PDFInfo
- Publication number
- CN102636890A CN102636890A CN2012101034025A CN201210103402A CN102636890A CN 102636890 A CN102636890 A CN 102636890A CN 2012101034025 A CN2012101034025 A CN 2012101034025A CN 201210103402 A CN201210103402 A CN 201210103402A CN 102636890 A CN102636890 A CN 102636890A
- Authority
- CN
- China
- Prior art keywords
- parallelism
- depth
- steel ball
- djab600
- press head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electronic Switches (AREA)
Abstract
The invention relates to a structure with adjustable parallelism. The comprises an adjustment upper plate 1, an adjustment lower plate 2, a heat insulation fixed plate 3, a heat dissipation pillar 4, a synthesizing stone thermal baffle (2) 5, DJAB600-11-07 6, DJAB600-11-08 7, a synthesizing stone thermal baffle (1) 8, a steel ball 9, inner hexagonal chapiter screws 10 and 11. The invention provides a novel parallelism adjustable hot press head, and the structure overcomes the defects that the parallelism of the existing hot press head is not convenient to adjust, the stability of the parallelism is not good and the insulating ability is weak when high frequency pressing and pasting are performed; and meanwhile, the manufacture of the high precision hot press head is realized under general working accuracy condition, the processing cost is effectively reduced, the processing is convenient, the adjustment is rapid, and thus being contributed to improving whole rigidity of the press head and the productive speed of equipment.
Description
Technical field
The present invention relates to the adjustable structure of a kind of depth of parallelism; Be applicable in the LCDs manufacture process, with IC chip and the glass substrate that is distributed with small circuit, through the anisotropic conductive film plate; Press down in uniform temperature and load and to be connected together; Guaranteeing that circuit on IC chip and the glass substrate coincide deviation do not occur, and is suitable for the depth of parallelism between two bigger flat boards of regulating action area, the situation not high to accuracy requirement.
Technical background
The purpose of this invention is to provide a kind of depth of parallelism adjustable structure.It has overcome the existing thermal head depth of parallelism and has regulated inconvenience; Shortcomings such as depth of parallelism when high-frequency overlays, stability are bad; Realize the high precision hot press head manufacturing under the general machining precision condition simultaneously, can effectively reduce processing cost, easy to process; Assembling is quick, and helps to improve pressure head integral rigidity and device fabrication speed.
Summary of the invention
The technical solution that realizes the object of the invention is:
Thermal head depth of parallelism adjustment structure comprises: regulates upper plate 1, regulates lower plate 2, and heat insulation fixed head 3, thermal column 4, synthetic stone thermal insulation board (2) 5, DJAB600-11-07 6, DJAB600-11-08 7, synthetic stone thermal insulation board (1) 8, steel ball 9, interior hexagonal chapiter screw 10,11.Regulative mode is to be that single-point supports with steel ball 9, through hexagonal chapiter screw 10,11 in regulating, regulate 6 and 7 do simultaneously about, about finely tune the depth of parallelism of guaranteeing its pressure head and chip.
Structure of the present invention is comparatively simple, and handling ease realizes that the parts precision prescribed is low, effectively reduces cost.The thermal head overall volume is little simultaneously, and heat-insulating capability is strong, and integral rigidity is good, and the depth of parallelism is easy to adjust, realizes easily and the stable depth of parallelism that keeps pressure head and glass microscope carrier.
Description of drawings:
Accompanying drawing is an exploded perspective view of the present invention:
1-regulates upper plate, and 2-regulates lower plate, the heat insulation fixed head of 3-, 4-thermal column; 5-synthesizes stone thermal insulation board 2,6-DJAB600-11-07, and 7-DJAB600-11-08,8-synthesizes stone thermal insulation board 1; Hexagonal chapiter screw M6 in the 9-steel ball, 10-* 20, hexagonal chapiter screw M5 in the 11-* 20.
Embodiment:
Below in conjunction with accompanying drawing, specify embodiment of the present invention.
At first will synthesize stone thermal insulation board (1) 8, heat insulation fixed head 3, thermal column 4, synthetic stone thermal insulation board (2) 5, DJAB600-11-076, DJAB600-11-087 sequencing according to its installation; In conjunction with threaded hole corresponding on it installation that is connected; Guarantee mutual problems such as gap between the two in the installation process; Guarantee that its plane clearance in meeting the requirements, reduces the cumulative errors of its installation, then steel ball 9 is put on the concave spherical surface of regulating lower plate 2; Then put into and regulate upper plate 1 and the concave spherical surface coupling of regulating lower plate 2; Put into simultaneously hexagonal chapiter screw 11 earlier, combine to regulate upper plate 1 and be connected with the threaded hole of adjusting lower plate 2, the last hexagonal chapiter screw 10 of putting into again is screwed into the screw end face and rigidly connects the end face that contacts adjusting lower plate 2.Be that single-point supports (being similar to hinge connects) with steel ball 9 again; Through interior hexagonal chapiter screw 10 and 11 through tightening up and down or loosening; Set screw is adjusted and is regulated the upper plate 1 and the depth of parallelism of regulating lower plate 2 repeatedly; The circuit of circuit on the embodiment thermal head and IC chip is smooth identical indirectly, and the requirement that reaches regulation gets final product.
Claims (2)
1. a depth of parallelism adjustable structure comprises: regulate upper plate 1, regulate lower plate 2, heat insulation fixed head 3; Thermal column 4, synthetic stone thermal insulation board (2) 5, DJAB600-11-07 6; DJAB600-11-08 7, synthetic stone thermal insulation board (1) 8, steel ball 9; Interior hexagonal chapiter screw 10,11 is characterized in that with steel ball 9 being that single-point supports; Through tighten or loosen in hexagonal chapiter screw 10,11 adjust and regulate upper plate 1 and be rotated around the concave spherical surface that it cooperates with steel ball, regulate itself and the depth of parallelism of adjusting lower plate 2, the depth of parallelism of indirect regulation pressure head end face and circuit and IC chip smooth identical.
2. depth of parallelism adjustable structure according to claim 1; Be characterised in that: with steel ball 9 is that single-point supports; Through tighten or loosen in hexagonal chapiter screw 10,11 adjust and regulate upper plate 1 and be rotated adjusting around steel ball 9 spheres, regulate itself and the depth of parallelism of regulating lower plate 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101034025A CN102636890A (en) | 2012-04-11 | 2012-04-11 | Structure with adjustable parallelism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101034025A CN102636890A (en) | 2012-04-11 | 2012-04-11 | Structure with adjustable parallelism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102636890A true CN102636890A (en) | 2012-08-15 |
Family
ID=46621339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101034025A Pending CN102636890A (en) | 2012-04-11 | 2012-04-11 | Structure with adjustable parallelism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102636890A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576469A (en) * | 2013-10-14 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Levelness adjusting structure, lifting device and cavity |
| CN106466887A (en) * | 2015-08-20 | 2017-03-01 | 三星钻石工业株式会社 | Shearing device |
| CN106873198A (en) * | 2017-03-10 | 2017-06-20 | 深圳市诚亿自动化科技有限公司 | The accurate main pressure indenter device of thermostatic type |
| CN107785301A (en) * | 2016-08-24 | 2018-03-09 | 北京北方华创微电子装备有限公司 | Level(l)ing device, pressure ring assembly and semiconductor processing equipment |
| CN108361502A (en) * | 2018-04-20 | 2018-08-03 | 深圳市晶向科技有限公司 | The camera calibration apparatus and method of glass cutting machine |
| CN108612690A (en) * | 2018-04-28 | 2018-10-02 | 北京机械设备研究所 | A kind of combination bottom plate suitable for the installation of two-sided small size error transfer factor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030121616A1 (en) * | 1997-11-20 | 2003-07-03 | Shozo Minamitani | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components |
| TW200410822A (en) * | 2002-12-24 | 2004-07-01 | Ind Tech Res Inst | Hot embossing auto-leveling apparatus and method |
| CN201437284U (en) * | 2009-07-14 | 2010-04-14 | 深圳才纳半导体设备有限公司 | Electronic tag solidification pressure transmitting device |
| CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
-
2012
- 2012-04-11 CN CN2012101034025A patent/CN102636890A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030121616A1 (en) * | 1997-11-20 | 2003-07-03 | Shozo Minamitani | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components |
| TW200410822A (en) * | 2002-12-24 | 2004-07-01 | Ind Tech Res Inst | Hot embossing auto-leveling apparatus and method |
| CN201437284U (en) * | 2009-07-14 | 2010-04-14 | 深圳才纳半导体设备有限公司 | Electronic tag solidification pressure transmitting device |
| CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576469A (en) * | 2013-10-14 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Levelness adjusting structure, lifting device and cavity |
| CN106466887A (en) * | 2015-08-20 | 2017-03-01 | 三星钻石工业株式会社 | Shearing device |
| CN106466887B (en) * | 2015-08-20 | 2020-05-26 | 三星钻石工业株式会社 | Cutting device |
| CN107785301A (en) * | 2016-08-24 | 2018-03-09 | 北京北方华创微电子装备有限公司 | Level(l)ing device, pressure ring assembly and semiconductor processing equipment |
| CN106873198A (en) * | 2017-03-10 | 2017-06-20 | 深圳市诚亿自动化科技有限公司 | The accurate main pressure indenter device of thermostatic type |
| CN106873198B (en) * | 2017-03-10 | 2019-10-29 | 深圳市诚亿自动化科技有限公司 | The accurate main pressure indenter device of thermostatic type |
| CN108361502A (en) * | 2018-04-20 | 2018-08-03 | 深圳市晶向科技有限公司 | The camera calibration apparatus and method of glass cutting machine |
| CN108612690A (en) * | 2018-04-28 | 2018-10-02 | 北京机械设备研究所 | A kind of combination bottom plate suitable for the installation of two-sided small size error transfer factor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102636890A (en) | Structure with adjustable parallelism | |
| CN102167173B (en) | Adjusting module | |
| CN202649640U (en) | Structure having adjustable depth of parallelism | |
| US10168749B2 (en) | Cooling using adjustable thermal coupling | |
| CN202592893U (en) | Hot-pressing head with adjustable parallelism degree | |
| CN203470918U (en) | Tool rest mechanism used for fixing turning tool | |
| CN102632676A (en) | Hot pressing head with adjustable parallelism | |
| CN201998515U (en) | Adjusting module | |
| CN102192228A (en) | Fixed element and fixed device and electric device using fixed element | |
| CN204427134U (en) | Multi-function computer workstation | |
| TWM592638U (en) | Water-cooling head device fastening structure | |
| CN106298623A (en) | A kind of height-adjustable wafer support mechanism | |
| CN206135194U (en) | Laser device | |
| CN103769857B (en) | A kind of art and craft door level(l)ing device for semiconductor manufacturing equipment | |
| TW202121111A (en) | Water cooling head buckle structure | |
| CN104923450A (en) | Optical fiber array dispensing device | |
| CN206409481U (en) | Machine operation platform attachment means | |
| CN1153653C (en) | Regulator for plane parallel quasi-contact | |
| CN206883096U (en) | A kind of general clamping device for equipment welding | |
| TWI426337B (en) | Image lens adjustment structure | |
| CN105759977B (en) | Computer heat conduction device | |
| CN204464261U (en) | A kind of new structure of IGBT substrate | |
| CN2635361Y (en) | Gold stamping mould regulation fixing structure | |
| CN203003737U (en) | Adjusting device | |
| CN220097815U (en) | Adsorption component convenient to adjust |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |