CN106873198B - The accurate main pressure indenter device of thermostatic type - Google Patents
The accurate main pressure indenter device of thermostatic type Download PDFInfo
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- CN106873198B CN106873198B CN201710144197.XA CN201710144197A CN106873198B CN 106873198 B CN106873198 B CN 106873198B CN 201710144197 A CN201710144197 A CN 201710144197A CN 106873198 B CN106873198 B CN 106873198B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
The present invention provides a kind of main pressure indenter device of accurate thermostatic type, including pressure head mounting plate, the cylinder mounting base being installed on pressure head mounting plate, it is installed on the longitudinally disposed linear guides on pressure head mounting plate and along pressure head mounting plate, the mechanism for adjusting parallelism being installed on the sliding block of linear guides, low rubbing cylinder, spring connecting mechanism, double thermal insulation mechanism and heating pressure head mechanism, low rubbing cylinder is installed in cylinder mounting base, and low rubbing cylinder is drivingly connected the upside of mechanism for adjusting parallelism by spring connecting mechanism, heating pressure head mechanism is installed on the downside of mechanism for adjusting parallelism by double thermal insulation mechanism.The present invention provides a kind of main pressure indenter device of accurate thermostatic type, its radial clearance problem for not only solving floating junction, while by using double thermal insulation mechanism, effectively prevent the transmitting of the heat direction guiding rail of calandria, the precision that ensure that guide rail extends the service life of guide rail.
Description
Technical field
The present invention relates to the post-processing technology field of liquid crystal module more particularly to a kind of main pressure pressure head dresses of accurate thermostatic type
It sets.
Background technique
It is well known that needed by IC and FPC together with the connection of LCD in the last handling process of liquid crystal module, this
One process needs two processes to complete, precompressed (PRE-BONDIND) and main pressure (MAIN BONDIND).The main pressure heading machine of thermostatic type
Structure is used for the latter process.In prepressing procedures, IC or FPC is passed through into ACF (Anisotropic Conductive
Film, anisotropic conductive film) tentatively it is fitted on LCD, then, in main pressure process, the pressure head of constant temperature is applied on IC or FPC
Add constant pressure, the temperature of ACF will reach 180 DEG C, real by certain time (IC is usually 8 seconds, and FPC is usually 12 seconds)
The final fitting of existing IC or FPC.Although the process seems simply, but there are the high control of pressure accuracy and bonding
(BONDIND) required precision.Firstly, ACF particle explosion is uniform；Secondly, the route on BUMP and LCD on IC is corresponding
, spacing (PITCH) very little for IC, between route, it is desirable that completing the aligning accuracy after main pressure is ± 3 μ, on FPC
Route with the route of LCD be also it is corresponding, aligning accuracy is ± 10 μ, and quality (particle explosion uniformity and the bonding of product
Precision) mainly guaranteed by main pressure pressure heads mechanism.Therefore, the performance of pressure head structure directly determines bonding quality.Wherein, pressure head in
The depth of parallelism between IC or FPC support platform is to guarantee the premise of quality.
Main pressure pressure head is that the core institution of COG, FOG module device decides LCD whether pressure head structure is designed rationally
Or the quality and production efficiency of LCM product quality, the structure design of existing main pressure pressure head are broadly divided into four part-structures, the
A part is driving structure, mainly includes the parts such as cylinder, cylinder mounting base and floating junction, and second part is guiding knot
Structure, major part are linear guides, and Part III is that pressure head parallelism adjusts structure, for adjusting the depth of parallelism of pressure head and LCD,
Major part has X to adjustment part, Y-direction adjustment part, the parts such as connection sheet, and Part IV is that pressure head executes structure, and main zero
Part includes the parts such as radiating block, thermal insulation board, pressure head mounting base, heat block, pressure head.However, in actual operation, it has been found that
Existing main pressure pressure head haves the defects that in following design: 1, the connection of cylinder and pressure head uses the floating junction of SMC, which connects
Head radial clearance is big, and cylinder action is easy inclination in the pressure of pressure head, influences bonding accuracy；2, the parallelism adjusting mechanism of pressure head
It is unreasonable, the adjustment of the depth of parallelism is realized by the deformation of part, mechanism is unstable, needs often to adjust, and influences production effect
Rate；3, original pressure heads mechanism quality is excessive, and huge structure can not achieve small pressure output, is not able to satisfy small size IC or FPC
Bonding；4, the stability of parallelism adjusting mechanism is poor, and often variation, leads to deviation and particle explosion status not in process of production
Uniformly.
Summary of the invention
The purpose of the present invention is to provide a kind of accurate main pressure indenter devices of thermostatic type, not only solve floating junction
Radial clearance problem effectively prevent the transmitting of the heat direction guiding rail of calandria while by using double thermal insulation mechanism,
The precision that ensure that guide rail extends the service life of guide rail.
The present invention is implemented as follows:
A kind of main pressure indenter device of accurate thermostatic type, including pressure head mounting plate, is installed on the pressure head mounting plate
Cylinder mounting base is installed on the pressure head mounting plate and along the longitudinally disposed linear guides of the pressure head mounting plate, installation
In on the sliding block of the linear guides mechanism for adjusting parallelism, low rubbing cylinder, spring connecting mechanism, double thermal insulation mechanism with
And heating pressure head mechanism, the low rubbing cylinder are installed in the cylinder mounting base, and the low rubbing cylinder is described in
Spring connecting mechanism is drivingly connected the upside of the mechanism for adjusting parallelism, and the heating pressure head mechanism passes through the double thermal insulation
Mechanism is installed on the downside of the mechanism for adjusting parallelism.
As the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the mechanism for adjusting parallelism includes guide rail installation
To adjustment plate and Y-direction adjustment plate, the guide rail mounting plate is installed on the sliding block of the linear guides by plate, X, and the X is to tune
The downside of whole plate is made by X cooperating and being flexibly connected on the downside of the guide rail mounting plate to axle sleeve to pin shaft and X
The X is rotated to centered on pin shaft relative to the guide rail mounting plate to adjustment plate by the X, the X is to the upper of adjustment plate
X is provided between side and the upside of the guide rail mounting plate to adjustment structure and X to resetting structure, under the Y-direction adjustment plate
Side by the mutual cooperation of Y-direction pin shaft and Y-direction axle sleeve and the X to being flexibly connected on the downside of adjustment plate so that the Y-direction
Adjustment plate is rotated relative to the X to adjustment plate centered on the Y-direction pin shaft,
The upside of the Y-direction adjustment plate and the X are multiple with Y-direction to Y-direction adjustment structure is provided between the upside of adjustment plate
Bit architecture.
As the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the X includes being installed on the X to adjustment structure
The first screw top plate in adjustment plate and the X being installed on the guide rail mounting plate are to adjusting screw, and the X is to adjusting spiral shell
One end of nail abuts connection with the first screw top plate, and the Y-direction adjustment structure includes being installed in the Y-direction adjustment plate
It second screw top plate and is installed on Y-direction of the X in adjustment plate and adjusts screw, the Y-direction adjusts one end and the institute of screw
It states the second screw top plate and abuts connection.
As the improvement of the main pressure indenter device of above-mentioned accurate thermostatic type, the X to resetting structure include X to resetting bullet
Spring, the first X being set on the guide rail mounting plate to spring card slot and be set to twoth X of the X in adjustment plate to
Spring card slot, the first X be correspondingly arranged to spring card slot and the 2nd X to spring card slot collectively form accommodate the X to
First spring action space of reset spring；The Y-direction resetting structure includes Y-direction reset spring, is set to the X to adjustment plate
On the first Y-direction spring card slot and the second Y-direction spring card slot for being set in the Y-direction adjustment plate, the first Y-direction spring
Card slot and the second Y-direction spring card slot, which are correspondingly arranged, collectively forms the second spring for accommodating Y-direction reset spring effect sky
Between.
As the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the spring connecting mechanism includes two spring cores
Axis, two spring brackets and two compressed springs are equipped with cylinder connector, two spring on the piston rod of the low rubbing cylinder
Bracket is separately mounted in the left and right sides plane of the cylinder connector, and one end of each central spindle of the spring sequentially passes through respectively
It is screwed into the screw hole of the Y-direction adjustment plate after one compressed spring and a spring bracket, each central spindle of the spring
The other end is disposed with washer and two nuts so that the both ends of each compressed spring respectively with the corresponding washer and
The corresponding spring bracket abuts connection, so that the low rubbing cylinder is drivingly connected by the spring connecting mechanism
The upside of the mechanism for adjusting parallelism.
As the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the double thermal insulation mechanism includes first heat-insulated
Block, heat-insulated transfer block and the second heat insulation, the heating pressure head mechanism include heating component and are fixed on the heating component
On pressure head, be disposed between the downside and the heating component of the Y-direction adjustment plate first heat insulation, it is described every
Hot transfer block and second heat insulation.
As the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the heating component includes calandria and installation
In several heating tubes on the calandria.
As the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the mechanism for adjusting parallelism is aluminum alloy junction
Structure.
The beneficial effects of the present invention are: the main pressure indenter device of accurate thermostatic type provided by the invention, low rubbing cylinder
The upside of mechanism for adjusting parallelism is drivingly connected by spring connecting mechanism, it is existing to replace by using spring connecting mechanism
Floating junction, it can be ensured that the output pressure of low rubbing cylinder acts perpendicularly to the surface IC or FPC, and then solves the prior art
It is middle to be attached and existing radial clearance problem using floating junction.Meanwhile heating pressure head mechanism passes through double thermal insulation machine
Structure is fixed on the downside of mechanism for adjusting parallelism, effectively to prevent the heat direction guiding rail of calandria by double thermal insulation mechanism
Transmitting, ensure that the precision of guide rail, extend the service life of guide rail.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is a kind of overall structure diagram of preferred embodiment of the accurate main pressure indenter device of thermostatic type of the invention.
Fig. 2 is the fractionation structural representation of the mechanism for adjusting parallelism of the accurate main pressure indenter device of thermostatic type shown in Fig. 1.
Fig. 3 is the local fractionation structural representation one of the accurate main pressure indenter device of thermostatic type shown in Fig. 1.
Fig. 4 is the local fractionation structural representation two of the accurate main pressure indenter device of thermostatic type shown in Fig. 1.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, the present embodiment provides a kind of accurate main pressure indenter device 1 of thermostatic type, the accurate main pressure of thermostatic type
Indenter device 1 includes pressure head mounting plate 11, the cylinder mounting base 12 being installed on pressure head mounting plate 11, is installed on pressure head mounting plate
Depth of parallelism tune on 11 and on the longitudinally disposed linear guides 13 of pressure head mounting plate 11, the sliding block for being installed on linear guides 13
Save mechanism 14, low rubbing cylinder 15, spring connecting mechanism 16, double thermal insulation mechanism 17 and heating pressure head mechanism 18, low friction
Cylinder 15 is installed in cylinder mounting base 12, and low rubbing cylinder 15 is drivingly connected the depth of parallelism by spring connecting mechanism 16 and adjusts
The upside of mechanism 14, heating pressure head mechanism 18 are installed on the downside of mechanism for adjusting parallelism 14 by double thermal insulation mechanism 17.
In the present embodiment, as shown in Figures 1 and 2, mechanism for adjusting parallelism 14 includes guide rail mounting plate 141, X to adjustment
Plate 142 and Y-direction adjustment plate 143, guide rail mounting plate 141 are installed on the sliding block of linear guides 13, and X is under adjustment plate 142
(there is peace in side (having mounting hole) to pin shaft 1441 and X to the downside of the mutual cooperation of axle sleeve 1442 and guide rail mounting plate 141 by X
Dress hole) it is flexibly connected, so that X is rotated to centered on pin shaft 1441 relative to guide rail mounting plate 141 to adjustment plate 142 by X,
Specifically, X is installed on guide rail mounting plate 141 to pin shaft 1441 by pin shaft fixing screws 1443, and outside puts on X to axle sleeve
1442, X cooperate to the outer diameter and X of axle sleeve 1442 to the hole of the downside of adjustment plate 142, in this way, side energy of the X to adjustment plate 142
Enough by X to pin shaft 1441 and X to axle sleeve 1442 cooperate to be X to swing relative to guide rail mounting plate 141.X is to tune
X is provided between the upside of whole plate 142 and the upside of guide rail mounting plate 141 to adjustment structure and X to resetting structure, wherein X to
Adjustment structure includes the first screw top plate 1451 being installed on X in adjustment plate 142 and is installed on guide rail mounting plate 141
X abuts connection with the first screw top plate 1451 to the one end for adjusting screw 1452 to screw 1452, X is adjusted, and X is to resetting structure packet
X is included to reset spring 1461, the first X being set on guide rail mounting plate 141 to spring card slot 1462 and is set to X to adjustment
To spring card slot (not shown), the first X is correspondingly arranged the 2nd X on plate 142 to spring card slot 1462 and the 2nd X to spring card slot
It collectively forms and accommodates first spring action space of the X to reset spring 1461, when work, when turning X clockwise to adjusting
When screw 1452, which can withstand the first screw top plate 1451 and X is swung to adjustment plate 142 clockwise (with X to pin
Centered on axis 1441).When counterclockwise turning X to when adjusting screw 1452, effect due to from X to reset spring 1461, X to
Adjustment plate 142 can counterclockwise be swung (by X to centered on pin shaft 1441).Since Y-direction adjustment plate 143 is mounted in X to tune
In whole plate 141, therefore, Y-direction adjustment plate 143 follows X to move (X-direction) together to adjustment plate 141.
Likewise, as shown in Figures 1 and 2, the downside (having mounting hole) of Y-direction adjustment plate 143 passes through Y-direction pin shaft 1471 and Y
Mutual cooperation to axle sleeve 1472 is flexibly connected with X to the downside (having mounting hole) of adjustment plate 142, so that Y-direction adjustment plate
143 are rotated relative to X to adjustment plate 142 centered on Y-direction pin shaft 1471, and specifically, Y-direction pin shaft 1471 passes through the fixed spiral shell of pin shaft
Nail 1473 is installed on X in adjustment plate 142, and outside puts on Y-direction axle sleeve 1472, the outer diameter and Y-direction adjustment plate of Y-direction axle sleeve 1472
The hole of 143 downside cooperates, in this way, the downside of Y-direction adjustment plate 143 can pass through the phase of Y-direction pin shaft 1471 and Y-direction axle sleeve 1472
Mutually cooperation is to do Y-direction swing to adjustment plate 142 relative to X.The upside of Y-direction adjustment plate 143 and X to the upside of adjustment plate 142 it
Between be provided with Y-direction adjustment structure and Y-direction resetting structure, wherein Y-direction adjustment structure includes be installed in Y-direction adjustment plate 143
It two screw top plates 1481 and is installed on Y-direction of the X in adjustment plate 142 and adjusts screw 1482, Y-direction adjusts one end of screw 1482
Connection is abutted with the second screw top plate 1481.Y-direction resetting structure includes Y-direction reset spring 1491, is set to X to adjustment plate 142
On the first Y-direction spring card slot (not shown) and the second Y-direction spring card slot 1493 for being set in Y-direction adjustment plate 143, first
Y-direction spring card slot and the second Y-direction spring card slot 1493 are correspondingly arranged the second spring work that common structure accommodates Y-direction reset spring 1491
Use space.When work, when turning Y-direction adjusting screw 1482 clockwise, which heads on the second spiral shell in Y-direction adjustment plate 143
Screw top plate 1481, so that Y-direction adjustment plate 143, which is done, counterclockwise swings (centered on Y-direction pin shaft 1471).When counterclockwise
When turning Y-direction adjusting screw 1482, compressed Y-direction reset spring 1491 pushes Y-direction adjustment plate 143 to do and swings clockwise
(centered on Y-direction pin shaft 1471).As it can be seen that in the mechanism for adjusting parallelism 14 of this accurate main pressure indenter device 1 of thermostatic type,
Which employs new adjustment principle, delicate structure and it is easily adjusted, it is highly stable for the holding of the depth of parallelism.Moreover, this is parallel
Degree adjustment mechanism 14 is aluminium alloy structure, so that the weight of this accurate main pressure indenter device 1 of thermostatic type mitigates significantly, is realized
Small pressure 0.5KG's stablizes output, is able to satisfy the demand of all products.
As shown in Figures 1 and 3, spring connecting mechanism 16 includes two central spindle of the spring 161, two spring brackets 162 and two pressures
Contracting spring 163 is equipped with cylinder connector 151 on the piston rod of low rubbing cylinder 15, and two spring brackets 162 are separately mounted to cylinder
In the left and right sides plane of connector 151, one end of each central spindle of the spring 161 sequentially passes through a compressed spring 163 and a bullet respectively
It is screwed into after dumb iron 162 in the screw hole of Y-direction adjustment plate 143, the other end of each central spindle of the spring 161 is disposed with washer 164
And two nuts 165, so that the both ends of each compressed spring 163 are supported with corresponding washer 164 and corresponding spring bracket 162 respectively
It connects in succession, so that low rubbing cylinder 15 is drivingly connected the upside of mechanism for adjusting parallelism 14 by spring connecting mechanism 16.
The main pressure indenter device 1 of the accurate thermostatic type of sheet in the present embodiment, cylinder connector 151 are installed on the piston rod of low rubbing cylinder 15
On, the plane above Y-direction adjustment plate 143 is withstood on arc-shaped head below, and the central spindle of the spring 161 in compressed spring 163 is pacified
In Y-direction adjustment plate 143, spring bracket 162 is fixed on cylinder connector 151, can by the high and low position of adjusting nut 165
To adjust the amount of force between cylinder connector 151 and Y-direction adjustment plate 143, Y-direction adjustment plate 143 is not made during the work time not
As for being detached from cylinder connector 151 because of gravity.Due to realizing point contact, guarantee that pressure head hangs down in the IC pressure applied and IC
Directly, stress is best, ensure that bonding (BONDING) precision of pressure head.
As shown in Fig. 1 and Fig. 4, double thermal insulation mechanism 17 includes the first heat insulation 171, heat-insulated transfer block 172 and second
Heat insulation 173, heating pressure head mechanism 18 include heating component 181 and the pressure head 182 being fixed in heating component 181, Y-direction adjustment
It is heat-insulated that the first heat insulation 171, heat-insulated transfer block 172 and second are disposed between the downside and heating component 181 of plate 143
Block 173.Heating component 181 includes calandria 1811 and several heating tubes 1812 being installed on calandria 1811.Specifically,
Several heating tubes 1812 are installed on calandria 1811, and pressure head 182 is fixed on heating by four cup head screws by a block pressur plate
On body 1811, heating pressure head mechanism 18 is collectively constituted.Four cup head screws 191 pass through heat-insulated transfer block 172, the from above
Two thermal insulation boards 173 are connected with calandria 1811 so that heat-insulated transfer block 172, the second thermal insulation board 173 and heating pressure head mechanism 18 at
For an entirety.Wherein, a heat insulating washer 192 and a metal coating washer 193 are respectively filled on each glass of head screw 191,
The purpose of metal coating washer 193 is that head of screw damages heat insulating washer 192 by pressure in order to prevent.Four cup head screws 194 are from following
Heat-insulated transfer block 172, the first thermal insulation board 171 is up passed through to be connected with Y-direction adjustment plate 143, it is so far, heating pressure head mechanism 18, double
Layer heat-shield mechanism 17 and Y-direction adjustment plate 143 are connected to an entirety, likewise, respectively filling one on each glass of head screw 194
Heat insulating washer 195 and a metal coating washer 196.By the way that the first heat insulation is respectively set in the two sides of heat-insulated transfer block 172
171 and second thermal insulation board 173, realize double thermal insulation.Also, in heat-insulated transfer block 172, there is the cooling cycle shaped
Channel is communicated with subsequent connector, is realized that pneumatic circulating is cooling, is further prevented the heat of calandria 1811 to linear guides
13 conduction, ensure that the kinematic accuracy of pressure head, extend the service life of linear guides.
As shown in Figures 1 to 4, it need to be followed the steps below when this accurate main pressure indenter device 1 of thermostatic type works:
Step 1: adjustment pressure head is pressing against the depth of parallelism of platform with LCD.Specifically, it is being pressed against in LCD and is placing pressure-sensitive on platform
Paper, and decline pressure head 182, it is pressed on pressure-sensitive paper, the time less than 0.3 second, i.e., rises pressure head 182.According to the face of pressure-sensitive paper
Color change situation, for turn X to screw 1451 and Y-direction adjusting screw 1471 is adjusted, pressure head 182 and LCD is pressing against platform can phase respectively
Tend to be parallel with answering, pressed against in LCD place pressure-sensitive paper on platform again, pressure head 182 is declined, observes the color of pressure-sensitive paper again
Variation, according to color change situation, is according to the method described above again adjusted the depth of parallelism of pressure head.Until the color of pressure-sensitive paper
Within the scope of pressure head after uniformity, the Y-direction for locking X from X to adjustment plate 142 to fastening screw 1421 and Y-direction adjustment plate 143 is tight
Gu screw 1431.
Step 2: magnitude of back pressure is adjusted.Specifically, it in order to accurately control the pressure that pressure head 182 acts on IC, needs
Gas sources different to the two sides supply pressure of low rubbing cylinder 15 simultaneously controls the effect of pressure head 182 using the pressure difference of the two
In the power on IC, the enterprising outlet pressure of low rubbing cylinder 15 is referred to as main pressure, the lower inlet pressure quilt of low rubbing cylinder 15
Referred to as back pressure, the effect of back pressure are the gravity for offsetting the motion parts of this accurate main pressure indenter device 1 of thermostatic type.When adjusting,
First main pressure is adjusted and arrives zero pressure, then, the gradually precise pressure regulating valve of turn back pressure, with pushing this accurate thermostatic type down on hand
It is main pressure indenter device 1 motion parts, enable pressure head 182 rest on any position in stroke range and also it is static not
It is dynamic, at this point, pressure head 182 cannot decline automatically because of gravity, it is just needed back-pressure at this time.Since the present invention is closed using aluminium
Golden structure manufactures the motion parts (i.e. mechanism for adjusting parallelism 14) of this accurate main pressure indenter device 1 of thermostatic type, mitigates significantly
The weight of the motion parts of this accurate main pressure indenter device 1 of thermostatic type, and using low rubbing cylinder 15 carry out drive ram 182
Lifting, therefore pressure head 182 is enabled to work under smaller pressure.
Step 3: pressure head 182 is heated up, until reaching the setting temperature of pressure head 182, (displays temperature of temp controlled meter about exists
300℃)。
Step 4: operational process.When LCD reaches working position, low rubbing cylinder 15 can decline under program, pass through
Spring connecting mechanism 16, pressure head 182 decline together along linear guides 13, until 182 working face of pressure head fall within LCD IC or
On FPC, and continue to keep the constant pressure of a period of time, IC is kept for the time of constant pressure be generally 8 seconds, and FPC is kept for the time one of constant pressure
As be 12 seconds.Then pressure head 182 rises the bonding (BONDING) for completing IC or FPC on LCD.
The main pressure indenter device of accurate thermostatic type provided in this embodiment, low rubbing cylinder are driven by spring connecting mechanism
The upside of dynamic connection mechanism for adjusting parallelism, to replace existing floating junction by using spring connecting mechanism, it can be ensured that
The output pressure of low rubbing cylinder acts perpendicularly to the surface IC or FPC, so solve in the prior art using floating junction into
Row connects and existing radial clearance problem.Meanwhile heating pressure head mechanism is fixed on depth of parallelism tune by double thermal insulation mechanism
The downside of mechanism is saved, effectively to prevent the transmitting of the heat direction guiding rail of calandria by double thermal insulation mechanism, ensure that and lead
The precision of rail extends the service life of guide rail.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of main pressure indenter device of accurate thermostatic type, which is characterized in that including pressure head mounting plate, be installed on the pressure head peace
Cylinder mounting base in loading board is installed on the pressure head mounting plate and linearly leads along the longitudinally disposed of the pressure head mounting plate
Rail, the mechanism for adjusting parallelism being installed on the sliding block of the linear guides, low rubbing cylinder, spring connecting mechanism, it is double-deck every
Heat engine structure and heating pressure head mechanism；The low rubbing cylinder is installed in the cylinder mounting base, and the low rubbing cylinder
The upside of the mechanism for adjusting parallelism is drivingly connected by the spring connecting mechanism, the heating pressure head mechanism passes through described
Double thermal insulation mechanism is installed on the downside of the mechanism for adjusting parallelism；The mechanism for adjusting parallelism includes guide rail mounting plate, X
To adjustment plate and Y-direction adjustment plate, the guide rail mounting plate is installed on the sliding block of the linear guides, and the X is to adjustment plate
Mutual cooperation of the downside by X to pin shaft and X to axle sleeve and be flexibly connected on the downside of the guide rail mounting plate so that institute
State X and rotated to centered on pin shaft relative to the guide rail mounting plate to adjustment plate by the X, upside from the X to adjustment plate with
X is provided between the upside of the guide rail mounting plate to adjustment structure and X to resetting structure, the downside of the Y-direction adjustment plate is logical
The mutual cooperation of Y-direction pin shaft and Y-direction axle sleeve and the X are crossed to being flexibly connected on the downside of adjustment plate, so that Y-direction adjustment
Plate is rotated relative to the X to adjustment plate centered on the Y-direction pin shaft, and the upside of the Y-direction adjustment plate and the X are to adjustment
Y-direction adjustment structure and Y-direction resetting structure are provided between the upside of plate.
2. the accurate main pressure indenter device of thermostatic type as described in claim 1, which is characterized in that the X is to adjustment structure packet
Include the first screw top plate being installed on the X in adjustment plate and the X being installed on the guide rail mounting plate to adjust screw,
The X abuts connection with the first screw top plate to the one end for adjusting screw, and the Y-direction adjustment structure is described including being installed on
It the second screw top plate in Y-direction adjustment plate and is installed on Y-direction of the X in adjustment plate and adjusts screw, the Y-direction adjusts spiral shell
One end of nail abuts connection with the second screw top plate.
3. the accurate main pressure indenter device of thermostatic type as described in claim 1, which is characterized in that the X is to resetting structure packet
X is included to reset spring, the first X being set on the guide rail mounting plate to spring card slot and is set to the X to adjustment plate
On the 2nd X to spring card slot, the first X is correspondingly arranged with the 2nd X to spring card slot to spring card slot to be collectively formed
Accommodate first spring action space of the X to reset spring；The Y-direction resetting structure includes Y-direction reset spring, is set to institute
The the second Y-direction spring card slot stating first Y-direction spring card slot of the X in adjustment plate and being set in the Y-direction adjustment plate, it is described
First Y-direction spring card slot and the second Y-direction spring card slot, which are correspondingly arranged to collectively form, accommodates the second of the Y-direction reset spring
Spring action space.
4. the accurate main pressure indenter device of thermostatic type as described in claim 1, which is characterized in that the spring connecting mechanism packet
Two central spindle of the spring, two spring brackets and two compressed springs are included, cylinder connector is installed on the piston rod of the low rubbing cylinder,
Two spring bracket is separately mounted in the left and right sides plane of the cylinder connector, one end point of each central spindle of the spring
It is screwed into the screw hole of the Y-direction adjustment plate after not sequentially passing through a compressed spring and a spring bracket, it is each described
The other end of central spindle of the spring is disposed with washer and two nuts so that the both ends of each compressed spring respectively with it is corresponding
The washer and the corresponding spring bracket abut connection, so that the low rubbing cylinder connects machine by the spring
Structure is drivingly connected the upside of the mechanism for adjusting parallelism.
5. the accurate main pressure indenter device of thermostatic type as described in claim 1, which is characterized in that double thermal insulation mechanism packet
Include the first heat insulation, heat-insulated transfer block and the second heat insulation, the heating pressure head mechanism includes heating component and is fixed on institute
State the pressure head in heating component, be disposed between the downside and the heating component of the Y-direction adjustment plate described first every
Heat block, the heat-insulated transfer block and second heat insulation.
6. the accurate main pressure indenter device of thermostatic type as claimed in claim 5, which is characterized in that the heating component includes adding
Hot body and several heating tubes being installed on the calandria.
7. the main pressure indenter device of accurate thermostatic type as described in claim 1-6 is any, which is characterized in that the depth of parallelism tune
Section mechanism is aluminium alloy structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710144197.XA CN106873198B (en) | 2017-03-10 | 2017-03-10 | The accurate main pressure indenter device of thermostatic type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107561742A (en) * | 2017-09-28 | 2018-01-09 | 苏州富强加能精机有限公司 | With this pressure device of the LCDs of fender strainer |
| CN107942551A (en) * | 2017-12-23 | 2018-04-20 | 苏州富强科技有限公司 | Adaptive pressure head micro-adjusting mechanism for liquid crystal display pressing device |
| CN107884965B (en) * | 2017-12-23 | 2023-07-04 | 苏州富强科技有限公司 | Three-dimensional pressure head fine adjustment mechanism for liquid crystal display screen pressing device |
| CN112213871A (en) * | 2019-07-11 | 2021-01-12 | 东莞市华慧智能装备有限公司 | Automatic parallel pressure head on mobile phone display screen binding equipment |
| CN111679465B (en) * | 2020-06-10 | 2023-08-29 | 深圳汉和智造有限公司 | False pressing device |
| CN113329563B (en) * | 2021-04-30 | 2022-10-25 | 东莞联鹏智能装备有限公司 | Bonding head, bonding device and forming method of cooling channel |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101478075A (en) * | 2009-02-03 | 2009-07-08 | 北京德鑫泉科技发展有限公司 | Temperature and pressure processing apparatus with high verticality |
| CN201352285Y (en) * | 2009-02-16 | 2009-11-25 | 太原风华信息装备股份有限公司 | Main pressing mechanism for bonding process of liquid crystal display module |
| CN201427409Y (en) * | 2009-05-06 | 2010-03-24 | 王顺波 | Novel stepless pressure adjusting hot-pressing plate |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| CN102632676A (en) * | 2012-03-23 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Hot pressing head with adjustable parallelism |
| CN202486455U (en) * | 2012-01-18 | 2012-10-10 | 苏州光宝康电子有限公司 | Full-automatic chip on glass (COG) bonding machine preloading pressure head unit |
| CN202502321U (en) * | 2012-02-06 | 2012-10-24 | 苏州光宝康电子有限公司 | Anisotropic conductive film pressure head flatness adjusting device |
| CN202764333U (en) * | 2012-08-08 | 2013-03-06 | 吴江市博众精工科技有限公司 | Preheating module |
| CN203205388U (en) * | 2013-03-22 | 2013-09-18 | 华中科技大学 | Hot pressing apparatus for anisotropy conductive adhesive in flip-chip bonding device |
| KR20130137267A (en) * | 2012-06-07 | 2013-12-17 | 주식회사 에이에스티젯텍 | Main bonding apparatus for flexible display panel |
| CN203930262U (en) * | 2014-05-16 | 2014-11-05 | 深圳市深科达智能装备股份有限公司 | Be applied to absorption and the integrated pressure head of hot pressing that automatic nation determines machine |
| CN203982029U (en) * | 2014-07-22 | 2014-12-03 | 东莞市力生机械设备有限公司 | Intelligence LCM module assembly machine |
| CN203982024U (en) * | 2014-07-22 | 2014-12-03 | 东莞市力生机械设备有限公司 | LCM module assembly machine pre-pressing governor motion |
| CN205326331U (en) * | 2016-01-22 | 2016-06-22 | 平湖星天阳服饰科技有限公司 | Hot press |
-
2017
- 2017-03-10 CN CN201710144197.XA patent/CN106873198B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101478075A (en) * | 2009-02-03 | 2009-07-08 | 北京德鑫泉科技发展有限公司 | Temperature and pressure processing apparatus with high verticality |
| CN201352285Y (en) * | 2009-02-16 | 2009-11-25 | 太原风华信息装备股份有限公司 | Main pressing mechanism for bonding process of liquid crystal display module |
| CN201427409Y (en) * | 2009-05-06 | 2010-03-24 | 王顺波 | Novel stepless pressure adjusting hot-pressing plate |
| CN202486455U (en) * | 2012-01-18 | 2012-10-10 | 苏州光宝康电子有限公司 | Full-automatic chip on glass (COG) bonding machine preloading pressure head unit |
| CN202502321U (en) * | 2012-02-06 | 2012-10-24 | 苏州光宝康电子有限公司 | Anisotropic conductive film pressure head flatness adjusting device |
| CN102632676A (en) * | 2012-03-23 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Hot pressing head with adjustable parallelism |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| KR20130137267A (en) * | 2012-06-07 | 2013-12-17 | 주식회사 에이에스티젯텍 | Main bonding apparatus for flexible display panel |
| CN202764333U (en) * | 2012-08-08 | 2013-03-06 | 吴江市博众精工科技有限公司 | Preheating module |
| CN203205388U (en) * | 2013-03-22 | 2013-09-18 | 华中科技大学 | Hot pressing apparatus for anisotropy conductive adhesive in flip-chip bonding device |
| CN203930262U (en) * | 2014-05-16 | 2014-11-05 | 深圳市深科达智能装备股份有限公司 | Be applied to absorption and the integrated pressure head of hot pressing that automatic nation determines machine |
| CN203982029U (en) * | 2014-07-22 | 2014-12-03 | 东莞市力生机械设备有限公司 | Intelligence LCM module assembly machine |
| CN203982024U (en) * | 2014-07-22 | 2014-12-03 | 东莞市力生机械设备有限公司 | LCM module assembly machine pre-pressing governor motion |
| CN205326331U (en) * | 2016-01-22 | 2016-06-22 | 平湖星天阳服饰科技有限公司 | Hot press |
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| CN106873198A (en) | 2017-06-20 |
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