CN106466887A - Shearing device - Google Patents
Shearing device Download PDFInfo
- Publication number
- CN106466887A CN106466887A CN201610270643.7A CN201610270643A CN106466887A CN 106466887 A CN106466887 A CN 106466887A CN 201610270643 A CN201610270643 A CN 201610270643A CN 106466887 A CN106466887 A CN 106466887A
- Authority
- CN
- China
- Prior art keywords
- cut
- substrate
- shearing device
- pressing plate
- out bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/20—Cutting beds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2628—Means for adjusting the position of the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
The present invention provides a kind of shearing device, and described shearing device has the cut-out bar of the top crest line not using backing plate etc. just can simply adjust pressing sword and the depth of parallelism of substrate surface.Described shearing device (A) includes：Workbench (1), mounting substrate (W)；And cut-out bar (10), configuration in the top of workbench (1), cuts off bar (10) and has being arranged as linear multiple pressing plate (14), and be provided with gap between each pressing plate (14).
Description
Technical field
The present invention relates to the shearing device split by the substrate that the fragile materials such as glass, pottery, semiconductor wafer are constituted.The present invention be more particularly directed to the cut-out bar of shearing device, described shearing device passes through the face defining the substrate of score line (grooving) opposition side from this score line in previously operation to be pressed to make substrate bend, thus splitting substrate along score line.
Background technology
Following method for example disclosed in patent documentation 1, patent documentation 2 known in the state of the art：Using break bar (also referred to as scribe wheel), laser beam etc. in brittle substrate (below, surface referred to as " substrate ") forms the score line of mutually orthogonal X-direction and Y-direction, this score line of tailing edge apply external force to be cut off, thus substrate is divided into cell substrate.
Fig. 5 is the axonometric chart being roughly shown with the general shearing device of prior art cutting off bar.
Shearing device 21 has the workbench 22 of the level of substrate W loading and being maintained as processing object.Workbench 22 can rotate in the horizontal plane, and can move in the Y direction.It is provided with crossbeam (transverse frame) 23 horizontally extending in the X direction above workbench 22, the cut-out bar 24 of the tabular extending with being provided with parallel with this crossbeam 23 (X-direction) in this crossbeam 23, this cut-out bar 24 can be lifted via the lifting shaft 27 that cylinder 25 is driven.
When with this shearing device 21 cut-out substrate W, any one such as score line S1 of score line S1, S2 is made along the X direction, to clip the buffer board 26 being made up of elastomeric material and substrate W is placed on workbench 22 first.Now, load substrate W in the way of score line S1 is located at lower face side.Then, the position of readiness making the top from substrate W for the cut-out bar 24 declines towards score line S1, presses substrate W so as to slight curvature is V-shaped on buffer board 26 with the pressing sword 24a of its lower end, so that the crackle of score line S1 is stretched and cut off substrate W.Additionally, after the cut-out of whole score line S1 terminates, making workbench 22 carry out 90 degree of rotations, cut off score line S2 successively with cut-out bar 24 as described above.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Unexamined Patent Publication 2014-080336 publication；
Patent documentation 2：Japanese Unexamined Patent Publication 2002-187098 publication.
Invention problem to be solved
Generally, in the segmentation being carried out using cut-out bar, the bending change of substrate when cut-out bar is big to the intrusion of substrate greatly, or is cracked to the extension of unexpected direction in segmentation end face generation breakage due to segmentation side end face contact each other etc. sometimes.Additionally, on the contrary when intrusion hour it may appear that producing the faults such as not divided part it is therefore desirable to guarantee to cut off the suitable intrusion of bar because bending is not enough.And then in addition it is also necessary to make the top crest line of the pressing sword of cut-out bar stand facing each other with respect to substrate-parallel, and throughout the uniformly applied pressing force of score line total length.
But, because the cut-out bar of prior art is to be formed by a long material, so sometimes because cut-out bar main body, comprise its installation portion, workbench, its drive mechanism each component small error, lead to press the depth of parallelism knifeedge deviation of top crest line and the substrate surface of sword.Particularly when cutting off to large-scale substrate, the size due to cutting off bar is elongated further, so the deviation being accompanied by this depth of parallelism also can become big.
When the depth of parallelism produces deviation it is impossible to equably be pressed it is impossible to ideally cut off with suitable pressing force throughout score line total length.Then, as shown in Figure 6 thin backing plate (pad) 28 is inserted into the downside of the low part of substrate W in prior art and adjusts the depth of parallelism, but this operation bothers and takes very much.
Content of the invention
Therefore, in view of above-mentioned prior art problem, present invention aim at providing a kind of shearing device, described shearing device has the cut-out bar of the top crest line not using backing plate etc. just can simply adjust pressing sword and the depth of parallelism of substrate surface.
For solving the scheme of problem
In order to achieve the above object, present invention employs following technological means.That is, the shearing device of the present invention adopts following structure：A kind of shearing device, the brittle substrate being formed with score line is cut off along described score line, described shearing device includes：Workbench, has the mounting surface loading described brittle substrate；And cut-out bar, above described workbench, described cut-out bar is constituted by being arranged as linear multiple pressing plate, is provided with gap between adjacent each pressing plate for configuration.
Following structure can be adopted in the present invention as stated above：Each described pressing plate has the parallelism adjusting mechanism of the depth of parallelism for adjusting the surface that described pressing plate is with respect to described brittle substrate.
Invention effect
According to the present invention, do not use the backing plate of prior art, be adjusted by the upper-lower position of the pressing plate to each pressing unit, rotation attitude, it becomes possible to accurately and easily revise pressing sword with respect to the depth of parallelism of substrate surface, can accurately cutting off substrate.Further, since constituting cut-out bar using by the aggregation that multiple pressing units are constituted, so having the quantity increasing and decreasing pressing unit by the size coordinating substrate, thus the effect of the cut-out bar of effectively optimal length can be formed.
Following structure can be adopted in the present invention：Described parallelism adjusting mechanism is formed by pivot and fixing screws, and described pivot carries out pivot suspension in the way of rotatably mounted with respect to described support plate to described pressing plate, and described fixing screws lock to rotation.
Thereby, it is possible to compactly being formed and being easily adjusted operating.
Brief description
Fig. 1 is the integrally-built axonometric chart of the outline of the shearing device illustrating the present invention.
Fig. 2 is the amplification stereogram of the cut-out bar in Fig. 1.
Fig. 3 is the amplification front elevation of the pressing cell mesh illustrating the cut-out bar in Fig. 1.
Fig. 4 is the line B-B sectional view in Fig. 3.
Fig. 5 is the axonometric chart of the schematic configuration of shearing device of cut-out bar being shown with prior art.
Fig. 6 is the explanatory diagram with the guiding mechanism of the depth of parallelism of substrate surface for the cut-out bar illustrating prior art.
Specific embodiment
Hereinafter, illustrated based on the details implementing the shearing device to the present invention for the accompanying drawing.Fig. 1 is the integrally-built axonometric chart of the outline of the shearing device illustrating the present invention, and Fig. 2～4 are the figures illustrating the details of cut-out bar shown in Fig. 1.
As shown in Figure 1, the shearing device A of the present invention is formed as with workbench 1, described workbench 1 has mounting surface 1a for loading substrate W, and the surface of workbench 1 is provided with many suction holes (not shown), carries out air-breathing using this suction hole and thus substrate W is carried out with absorption holding.
Additionally, workbench 1 can be moved along the track 2 of level in the Y direction using the screw shaft 4 of the rotation by motor 3.And then, workbench 1 can be rotated in the horizontal plane by being built-in with the rotary driving part 5 of motor.
Form the supporting mass of gate by the support column 6,6 clipping the both sides that workbench 1 is arranged and the crossbeam (beam) 7 built bridge in this support column 6,6 and extend in the X direction.And, maintain the upper cut-out bar 10 extending of bearing of trend (X-direction) in crossbeam 7 in crossbeam 7.In the present embodiment, cut-out bar 10 is formed as the position of readiness above substrate W being lifted with respect to substrate W via lifting shaft 8 and cylinder 9.
As shown in figs. 2 to 4, cut-out bar 10 by supporting member 11 and by this supporting member 11 support multiple (in the present embodiment for 5) pressing unit 12 constitute, described supporting member 11 can be maintained at the crossbeam 7 of shearing device A via lifting shaft 8 in the way of lifting.Additionally, pressing unit 12 is made up of the pressing plate 14 of support plate 13 and the lower end being arranged on this support plate 13, described gripper shoe 13 is mounted to adjust upper-lower position with respect to supporting member 11.
Support plate 13 is vertically slidably movable along the dovetail groove 11a being formed at supporting member 11 and extending up and down and vertically moves, by rotating for adjusting upper and lower bolt 15 so as to adjust upper-lower position.
Pressing plate 14 has, in its lower end, the pressing sword 14a that the bearing of trend along crossbeam 7 linearly extends, and configures point-blank in the way of the side end face of each pressing plate 14 is adjacent one another are.
And then, pressing plate 14 by can with respect to substrate W surface adjustment pressing sword 14a the depth of parallelism in the way of be arranged on support plate 13 via parallelism adjusting mechanism 16.In the present embodiment, parallelism adjusting mechanism 16 is formed by pivot 16a and fixing screws 16b, and described pivot 16a carries out pivot suspension to pressing plate 14 in the way of rotatably mounted with respect to support plate 13, and described fixing screws 16b lock to rotation.Additionally, pivot 16a is screwed together in support plate 13 as the elongated hole 16c of the arc-shaped at center via be arranged on pressing plate 14 by fixing screws 16b.
In addition, in the side end face of adjacent pressing plate 14,14 each other, be previously provided with the 0.3～1mm allowing the adjustment depth of parallelism about gap L.
The cut-out bar 10 constituting as described above is by following method so as to simply carry out the correction of each pressing depth of parallelism with respect to substrate W surface for the sword 14a.
First, before the rupturing operation of substrate W, unclamp fixing screws 16b and make pressing plate 14 be in rotatably mounted state, rotate afterwards for adjusting upper and lower bolt 15, make whole pressing plate 14 drop to, from the position of readiness of top, the position abutting with the surface of substrate W.Tighten fixing screws 16b and the attitude of fixing pressing plate 14 in the state of the pressing sword 14a of pressing plate 14 becomes along the parallel orientation of substrate W surface.Then, rotating for adjusting upper and lower bolt 15 makes pressing plate 14 return to original position of readiness.Thereby, it is possible to simply revise the depth of parallelism with respect to substrate W surface of whole pressing sword 14a.
According to the present invention as described above, do not use backing plate 28 as prior art, it is adjusted by the upper-lower position of the pressing plate 14 to each pressing unit 12, rotation attitude, just can accurately and easily revise pressing sword 14a with respect to the depth of parallelism of substrate W surface, can accurately cut off substrate W.Further, since cut-out bar 10 is using the structure of the aggregation being made up of multiple pressing units 12, so increasing and decreasing the quantity of pressing unit 12 by the size coordinating substrate W, thus the cut-out bar 10 of effectively optimal length can be formed.
Above the representational embodiment of the present invention is illustrated, but the present invention is not limited to above-mentioned embodiment.Although for example showing by depressing to make substrate W bend the example thus being cut off along score line the cut-out position of readiness from top for the bar 10 towards substrate W in the above-described embodiment, but, replace in this, also the position that cut-out bar 10 contacts on the surface with substrate W can be made static, make hammer drop to cut-out bar 10 in this condition, so that substrate W is cut off along score line by its impact.In addition, the present invention can reaching the purpose of the present invention, without departing from claims in the range of suitably revised, changed.
Industrial utilizability
The present invention can be used in the shearing device to split substrate along the score line being formed on substrate.
Description of reference numerals
A：Shearing device；
W：Substrate；
1：Workbench；
1a：Mounting surface；
7：Crossbeam；
8：Lifting shaft；
10：Cut-out bar；
11：Supporting member；
12：Pressing unit；
13：Support plate；
14：Pressing plate；
14a：Pressing sword；
15：For adjusting upper and lower bolt；
16：Parallelism adjusting mechanism；
16a：Pivot；
16b：Fixing screws.
Claims (3)
1. a kind of shearing device, the brittle substrate being formed with score line is cut off along described score line,
Described shearing device includes：
Workbench, has the mounting surface loading described brittle substrate；And
Cut-out bar, configures above described workbench,
Described cut-out bar is constituted by being arranged as linear multiple pressing plate,
It is provided with gap between adjacent each pressing plate.
2. shearing device as claimed in claim 1, wherein,
Each described pressing plate has for adjusting the surface that described pressing plate is with respect to described brittle substrate
The parallelism adjusting mechanism of the depth of parallelism.
3. shearing device as claimed in claim 2, wherein,
Described parallelism adjusting mechanism is formed by pivot and fixing screws,
Described pivot carries out pivot suspension, institute in the way of rotatably mounted with respect to support plate to described pressing plate
State fixing screws rotation is locked.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-162847 | 2015-08-20 | ||
| JP2015162847A JP6627326B2 (en) | 2015-08-20 | 2015-08-20 | Break device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106466887A true CN106466887A (en) | 2017-03-01 |
| CN106466887B CN106466887B (en) | 2020-05-26 |
Family
ID=58202845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610270643.7A Expired - Fee Related CN106466887B (en) | 2015-08-20 | 2016-04-27 | Cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6627326B2 (en) |
| KR (1) | KR20170022856A (en) |
| CN (1) | CN106466887B (en) |
| TW (1) | TWI695767B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108724482A (en) * | 2018-08-01 | 2018-11-02 | 北京铂阳顶荣光伏科技有限公司 | A kind of device for exerting |
| CN109927185A (en) * | 2017-12-15 | 2019-06-25 | 三星钻石工业股份有限公司 | Substrate breaking apparatus |
| WO2020093596A1 (en) * | 2018-11-09 | 2020-05-14 | 深圳市华星光电半导体显示技术有限公司 | Substrate breaking device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109822767B (en) * | 2019-04-03 | 2021-01-29 | 南通苏东新型外墙保温板有限公司 | Building insulation material processing system with practical structure |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100092417A (en) * | 2010-07-30 | 2010-08-20 | 강두석 | Mill machine for grain |
| CN101933128A (en) * | 2007-12-04 | 2010-12-29 | 松下电器产业株式会社 | Component mounting apparatus and method |
| CN102218777A (en) * | 2010-03-31 | 2011-10-19 | 三星钻石工业股份有限公司 | Disjunction method of brittle material substrate |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| CN103568073A (en) * | 2012-07-18 | 2014-02-12 | 三星钻石工业股份有限公司 | Breaking apparatus for brittle material substrate |
| CN204183493U (en) * | 2014-09-16 | 2015-03-04 | 中国建材国际工程集团有限公司 | Valve plate dip angle regulating device |
| CN104552614A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Cutting method and device of substrate made of fragile material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3792508B2 (en) | 2000-12-19 | 2006-07-05 | 三星ダイヤモンド工業株式会社 | Method for dividing bonded brittle substrates |
| JP2014080336A (en) | 2012-10-17 | 2014-05-08 | Mitsuboshi Diamond Industrial Co Ltd | Substrate dividing device |
-
2015
- 2015-08-20 JP JP2015162847A patent/JP6627326B2/en not_active Expired - Fee Related
-
2016
- 2016-04-07 TW TW105110890A patent/TWI695767B/en not_active IP Right Cessation
- 2016-04-22 KR KR1020160049368A patent/KR20170022856A/en unknown
- 2016-04-27 CN CN201610270643.7A patent/CN106466887B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101933128A (en) * | 2007-12-04 | 2010-12-29 | 松下电器产业株式会社 | Component mounting apparatus and method |
| CN102218777A (en) * | 2010-03-31 | 2011-10-19 | 三星钻石工业股份有限公司 | Disjunction method of brittle material substrate |
| KR20100092417A (en) * | 2010-07-30 | 2010-08-20 | 강두석 | Mill machine for grain |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| CN103568073A (en) * | 2012-07-18 | 2014-02-12 | 三星钻石工业股份有限公司 | Breaking apparatus for brittle material substrate |
| CN104552614A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Cutting method and device of substrate made of fragile material |
| CN204183493U (en) * | 2014-09-16 | 2015-03-04 | 中国建材国际工程集团有限公司 | Valve plate dip angle regulating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109927185A (en) * | 2017-12-15 | 2019-06-25 | 三星钻石工业股份有限公司 | Substrate breaking apparatus |
| CN108724482A (en) * | 2018-08-01 | 2018-11-02 | 北京铂阳顶荣光伏科技有限公司 | A kind of device for exerting |
| CN108724482B (en) * | 2018-08-01 | 2022-05-27 | 上海祖强能源有限公司 | Pressure applying device |
| WO2020093596A1 (en) * | 2018-11-09 | 2020-05-14 | 深圳市华星光电半导体显示技术有限公司 | Substrate breaking device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106466887B (en) | 2020-05-26 |
| KR20170022856A (en) | 2017-03-02 |
| TW201707909A (en) | 2017-03-01 |
| JP6627326B2 (en) | 2020-01-08 |
| JP2017039272A (en) | 2017-02-23 |
| TWI695767B (en) | 2020-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106466887A (en) | Shearing device | |
| JPH11260764A (en) | Method and device of cleaving semiconductor wafer | |
| KR100889308B1 (en) | Scribing apparatus and method, apparatus for cutting substrate using the scribing apparatus | |
| JP2002187098A (en) | Brittle board cutting method and its apparatus | |
| JP2017039271A (en) | Break device | |
| JP2014019044A (en) | Break device for brittle material substrate | |
| JP2015209357A (en) | Break method and break device | |
| CN107775403A (en) | A kind of plate type part double-sided compression Special clamping equipment | |
| JP2019069611A (en) | Break device | |
| KR20130014835A (en) | A breaking apparatus using breaking bar | |
| CN104249412A (en) | Brittle material base board parting tool and brittle material base board supporting fixture | |
| JP2018015903A (en) | Scribing method and scribing device | |
| JP2017039266A (en) | Break device | |
| KR20200115307A (en) | Scribing apparatus and dividing system for curved substrate | |
| CN107151091A (en) | Scribing equipment | |
| CN109553286B (en) | Scribing equipment | |
| JP6154713B2 (en) | Method and apparatus for breaking brittle material substrate | |
| KR102571055B1 (en) | Scribing method and scribing apparatus | |
| KR102147126B1 (en) | Apparatus for breaking substrate | |
| TW201929062A (en) | Device for dividing substrate capable of maintaining the parallelism of a breaking bar with respect to a substrate while the device for dividing substrate rotates the breaking bar and changes its direction of the extension | |
| JP6072215B2 (en) | Break bar for brittle material substrate | |
| KR20200065896A (en) | Apparatus for breaking substrate | |
| JP2015212016A (en) | Scribe head and scribe device | |
| KR100905898B1 (en) | Scribing apparatus, apparatus and method for cutting substrate using the same | |
| JP6185812B2 (en) | Method and apparatus for breaking brittle material substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200526 Termination date: 20210427 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |