CN202649640U

CN202649640U - Structure having adjustable depth of parallelism

Info

Publication number: CN202649640U
Application number: CN 201220149352
Authority: CN
Inventors: 朱长林; 任继良; 穆军伟; 秦非; 戚湧; 冯锋; 方赓
Original assignee: Nanjing University of Science and Technology; Nanjing University of Science and Technology Changshu Research Institute Co Ltd
Current assignee: Nanjing University of Science and Technology; Nanjing University of Science and Technology Changshu Research Institute Co Ltd
Priority date: 2012-04-11
Filing date: 2012-04-11
Publication date: 2013-01-02
Anticipated expiration: 2022-04-11

Abstract

The utility model discloses a structure having adjustable depth of parallelism. The structure having adjustable depth of parallelism comprises an adjusting upper board 1, an adjusting lower board 2, a heat protection fixed board 3, a heat dissipation column 4, a second synthetic stone insulation board 5, a DJAB600-11-07 6, a DJAB 600-11-08 7, a first synthetic stone insulation board 8, a steel ball 9 and inner hexagon column head screws 10. The structure having adjustable depth of parallelism overcomes the defects that the depth of parallelism of an existing hot pressing head is inconvenient to adjust, poor in stability of the depth of parallelism, and weak in heat protection performance during high-frequency pressure sticking. Meanwhile, the structure having adjustable depth of parallelism can achieve high-precision hot pressure head manufacturing on the condition of common working accuracy, can effectively reduce processing cost, is convenient to process, rapid to adjust, and helps to improve the whole rigidity and equipment production speed of the press head.

Description

A kind of depth of parallelism adjustable structure

Technical field

The utility model relates to the adjustable structure of a kind of depth of parallelism, be applicable in the LCDs manufacture process, with integrated circuit (IC) chip and the glass substrate that is distributed with small circuit, by the anisotropic conductive film plate, press down in uniform temperature and load and to be connected together, guaranteeing that circuit on integrated circuit (IC) chip and the glass substrate coincide deviation do not occur, and is suitable for the depth of parallelism between two larger flat boards of regulating action area, the situation not high to accuracy requirement.

Technical background

The purpose of this utility model provides a kind of depth of parallelism adjustable structure.It has overcome the existing thermal head depth of parallelism and has regulated inconvenience, the shortcomings such as depth of parallelism when high-frequency overlays, stability are bad, realize simultaneously the high precision hot press head manufacturing under the general machining precision condition, can effectively reduce processing cost, easy to process, assembling is quick, and helps to improve pressure head integral rigidity and device fabrication speed.

The utility model content

The technical solution that realizes the utility model purpose is:

Thermal head depth of parallelism adjustment structure comprises: regulates upper plate 1, regulates lower plate 2, and heat insulation fixed head 3, thermal column 4, synthetic stone thermal insulation board 25, DJAB600-11-07 6, and DJAB600-11-08 7, synthetic stone thermal insulation board 1, steel ball 9, interior hexagonal chapiter screw 10.Regulative mode is as single-point support take steel ball 9, by regulating interior hexagonal chapiter screw 10, regulate 6 and 7 do simultaneously about, about fine setting guarantee the depth of parallelism of its pressure head and chip, by tightening or loosening interior hexagonal chapiter screw 10 and adjust and regulate upper plate 1 and be rotated around the concave spherical surface that it cooperates with steel ball, regulate itself and the depth of parallelism of regulating lower plate 2, the smooth of the depth of parallelism of indirect regulation pressure head end face and integrated circuit (IC) chip coincide.

The utility model structure is comparatively simple, and handling ease realizes that the parts precision prescribed is low, effectively reduces cost.The thermal head overall volume is little simultaneously, and heat-insulating capability is strong, and integral rigidity is good, and the depth of parallelism is easy to adjust, realizes easily and the stable depth of parallelism that keeps pressure head and glass microscope carrier.

Description of drawings:

Fig. 1 is exploded perspective view of the present utility model:

1-regulates upper plate, and 2-regulates lower plate, the heat insulation fixed head of 3-, and the 4-thermal column, 5-synthesizes stone thermal insulation board two, 6-DJAB600-11-07,7-DJAB600-11-08,8-synthesizes stone thermal insulation board one, hexagonal chapiter screw in the 9-steel ball, 10-

Embodiment:

Below in conjunction with Fig. 1, describe embodiment of the present utility model in detail.

At first will synthesize stone thermal insulation board 1, heat insulation fixed head 3, thermal column 4, synthetic stone thermal insulation board 25, DJAB600-11-07 6, DJAB600-11-08 7 is according to the sequencing of its installation, in conjunction with threaded hole corresponding on it installation that is connected, guarantee the mutual problems such as gap between the two in the installation process, guarantee that its plane clearance is in meeting the requirements, reduce the cumulative errors of its installation, then steel ball 9 is put on the concave spherical surface of regulating lower plate 2, then put into and regulate upper plate 1 and the concave spherical surface coupling of regulating lower plate 2, put into first simultaneously hexagonal chapiter screw 10, be connected with the threaded hole of regulating lower plate 2 in conjunction with regulating upper plate 1, put into again hexagonal chapiter screw 10 at last and be screwed into the screw end face and rigidly connect the end face that contacts adjusting lower plate 2.(be similar to chain connection) take steel ball 9 as single-point support again, tighten up and down or loosen by interior hexagonal chapiter screw 10, set screw is adjusted and is regulated upper plate 1 and the depth of parallelism of regulating lower plate 2 repeatedly, the circuit of the circuit on the embodiment thermal head and integrated circuit (IC) chip is smooth identical indirectly, and the requirement that reaches regulation gets final product.

Claims

1. depth of parallelism adjustable structure, comprise: regulate upper plate (1), regulate lower plate (2), heat insulation fixed head (3), thermal column (4), synthetic stone thermal insulation board two (5), DJAB600-11-07 (6), DJAB600-11-08 (7), synthetic stone thermal insulation board one (8), steel ball (9), interior hexagonal chapiter screw (10) is characterized in that: take steel ball (9) as single-point support, by tightening or loosening interior hexagonal chapiter screw (10) and adjust and regulate upper plate (1) and be rotated around the concave spherical surface that it cooperates with steel ball, regulate itself and the depth of parallelism of regulating lower plate (2), the smooth of the depth of parallelism of indirect regulation pressure head end face and integrated circuit (IC) chip coincide.