CN102485482A - Circuit board filming equipment and circuit board wet filming method - Google Patents
Circuit board filming equipment and circuit board wet filming method Download PDFInfo
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- CN102485482A CN102485482A CN2010105751954A CN201010575195A CN102485482A CN 102485482 A CN102485482 A CN 102485482A CN 2010105751954 A CN2010105751954 A CN 2010105751954A CN 201010575195 A CN201010575195 A CN 201010575195A CN 102485482 A CN102485482 A CN 102485482A
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Abstract
The invention provides circuit board filming equipment and a circuit board wet filming method. The thickness and the uniformity of a produced water film are stable, such that the applied film is firm, and a defective rate is reduced. The invention is realized through technical schemes that: the circuit board filming equipment comprises a filming machine; humidifying equipment is arranged in front of the filming machine; the humidifying equipment comprises a main frame and a top cap; along a board feeding direction, rolling components, a water spraying apparatus and absorbent cotton rolling components are sequentially arranged in the inner cavity of the main frame; the top cap is covered above the rolling component, the water spraying apparatus and the absorbent cotton rolling component; the rolling component comprises an upper pressing wheel and a lower pressing wheel; a plate feeding clearance is provided between the upper and lower pressing wheels; the water spraying apparatus comprises an upper water spraying pipe and a lower water spraying pipe; and water discharging holes are uniformly distributed in the water spraying pipe. The absorbent cotton rolling component comprises an upper absorbent wheel and a lower absorbent wheel which are respectively arranged opposite to the upper and lower water spraying pipes of the water spraying apparatus. The upper and lower absorbent wheels are fixed in the main frame through a support.
Description
Technical field
The invention belongs to wiring board Filming Technology field, relate in particular to a kind of flexibility or rigid wiring board film sticking equipment and wiring board wet combining film method.
Background technology
Along with the become more meticulous requirement of circuit of wiring board, improve yields and line quality and become the more and more important problem of wiring board manufacturer day by day.The film process of wiring board photosensitive resist film is the one procedure during wiring board is made, and the quality that film process is handled directly has influence on the quality of pad pasting effect, also can produce very big influence to subsequent handling (development, exposure, etching etc.).Usually,, can cause the anastomose property of dry film and copper coin not good, promptly possibly in follow-up operation, cause broken string, breach, stay defective such as copper because there are defectives such as uneven, pin hole, depression and scuffing in the copper coin surface.
In the prior art, traditional film coating process is the dry film film coating process, and when copper coin was carried out the hot pressing pad pasting, in the making that the dry film figure shifts, traditional method for adhering film was that copper coin is carried out the heating and pressurizing pad pasting, and the copper coin surface is dry.Though the dry film film coating process is simple to operate; But when running into different defects such as copper coin air spots, pin hole; Can cause dry film not good, be easy to generate the interface bubble behind the pad pasting, influence the yields (as: the open circuit breach of the plating of electroplating work procedure or etching work procedure) of subsequent handling in adhering to of copper coin.The pad pasting process is to make dry film on various copper surface, obtain good combination, how through improving the structure on copper surface, and the pad pasting situation, the flowabilities of dry film etc. are the emphasis of well regarded to obtain good dry film adhesion.
At present, the making of fine-line is many, and wiring board exists buried via hole and blind hole simultaneously.Becoming more meticulous of circuit makes dry film reduce at the bond area of copper face.The copper surface state, pressing process and chemical force are set up the size that process directly influences adhesive force.Pad pasting is that dry film is heated to the nearly state that dissolves, and lowers its viscosity, improves liquidity and improve by pressure to adhere to.The generally use of the water-soluble dry film of prior art uses wet film coating can remedy the deficiency of traditional method for adhering film, and the adhesive force of increase dry film and copper coin reduces defect rate.
Wet film coating process promptly is to utilize special-purpose laminator; Before pad pasting, form water membrane, utilize moisture film to combine the flowability that forms with the solubility dry film, drive away the bubble that is detained on the positions such as cut, sand holes, pit and foreign material depression in the copper coin surface; In heating and pressurizing pad pasting process; Water plays viscosifying action to photoresist, thereby can improve the adhesiveness of dry film and substrate greatly, thereby has improved the qualification rate of making fine wire.
In the wet film coating process of prior art; The liquid of the humidification that uses contains different solvents and surfactant; And need handle the liquid warming of humidification usually, water film thickness that is produced and evenness are also unstable, and employed humidification apparatus effect is undesirable.
Summary of the invention
The object of the present invention is to provide a kind of wiring board film sticking equipment and wiring board wet combining film method, the water film thickness of generation and evenness are stable, make pad pasting more firm, reduce defect rate.
The present invention realizes through following technical scheme:
The wiring board film sticking equipment includes laminator; Wherein, said laminator the place ahead is provided with humidification apparatus; Said humidification apparatus includes body and top cover, along the entering plate direction, is disposed with pressure reel parts, water injector and absorbent wool rumble parts in the said body inner chamber; Said top cover covers the top of pressure reel parts, water injector and absorbent wool rumble parts; The pressure reel parts include upper pressure wheel and lower pressure wheel, between said upper pressure wheel and the lower pressure wheel for going into the sheet separation; Water injector comprises upper and lower sparge pipe, and the osculum that is evenly distributed is arranged in the sparge pipe; Absorbent wool rumble parts include water sucking wheel and following water sucking wheel, and over against the upper and lower sparge pipe of water injector, last water sucking wheel is fixed in the body through support with following water sucking wheel respectively.
Said absorbent wool rumble parts below is provided with an above drip tray.
The said periphery that goes up water sucking wheel and following water sucking wheel is provided with PVAC polyvinylalcohol absorbent wool layer.
The thickness of said absorbent wool layer is 4-8mm.
Said wiring board film sticking equipment comprises water supply installation and drainpipe.
Said wiring board film sticking equipment comprises the hydraulic controller that is used to regulate the water injector water yield.
Wiring board wet combining film method, wherein, it is following to include the humidification step:
Step 1: the absorbent wool rumble parts of above-mentioned humidification apparatus see through PVAC polyvinylalcohol absorbent wool layer and absorb an amount of room temperature pure water;
Step 2: send copper coin the humidification apparatus of laminator to, through the last water sucking wheel and the even pure water rete of following water sucking wheel surperficial formation one deck of absorbent wool rumble parts;
Step 3: the copper coin that will have water film is seen humidification apparatus off.
The thickness of above-mentioned pure water rete is 20-70um.
Beneficial effect of the present invention is following:
Wiring board film sticking equipment of the present invention is provided with humidification apparatus; Be disposed with pressure reel parts, water injector and absorbent wool rumble parts in the body inner chamber.Wiring board wet combining film method; Absorbent wool rumble parts; See through PVAC polyvinylalcohol absorbent wool layer and absorb an amount of room temperature pure water, after sending copper coin the humidification apparatus of laminator to, through the surperficial even pure water rete of one deck that forms of the last water sucking wheel and the following water sucking wheel of absorbent wool rumble parts.Wiring board film sticking equipment of the present invention and wiring board wet combining film method can be used for the wet combining membrane process that soft and rigid wiring board is made, and especially are applied to 4mil (live width and line gap) or following fine-line; There is not any chemical substance of interpolation; Use the room temperature pure water to make the copper coin surface form the uniform moisture film of a layer thickness through damping device, water film thickness is 20-70um, and moisture film makes dry film softening; More firm when making pad pasting, it is average more than 1% to lower defect rate.
Above-mentioned copper coin: the inferior lamina rara externa that general reference fine copper plate, copper-clad plate and circuit board plant are suppressed voluntarily etc. need be done the material that figure shifts with dry film.
Wiring board film sticking equipment of the present invention; Can be installed at flexibly on the laminator of general dry doubling membrane process, can be easily change the laminator of general traditional film coating process the laminator of wet, the dry doubling dual-purpose type that can use the wet combining membrane process into, this equipment comprises water supply installation; Drainpipe; The absorbent wool rumble, roller bearing, hydraulic pressure is transferred.Can form layer of even pure water film through this humidification apparatus copper face, more firmly reach the minimizing defect rate when making thereafter pad pasting, and this equipment can be transferred than the water supply more in response to needs.Wiring board film sticking equipment of the present invention; Be an oil (gas) filling device in addition, can transfer the laminator of general use dry doubling membrane process to and can use the wet combining membrane process, add the flexibility of its height; Can simply go back to the dry doubling membrane process in response to needs, not influence original dry doubling membrane process after the dismounting.This equipment comprises water supply installation, drainpipe, and the absorbent wool rumble, roller bearing, hydraulic pressure is transferred, and copper coin is carried out humidification, and can control the humidification degree.
Description of drawings
Fig. 1 is the structural representation of wiring board film sticking equipment of the present invention;
Fig. 2 is the schematic flow sheet of wiring board wet combining film method of the present invention;
Fig. 3 is the schematic block diagram of wiring board wet combining film method of the present invention.
The specific embodiment
Ask for an interview Fig. 1, the invention discloses a kind of wiring board film sticking equipment, include laminator; Wherein, said laminator the place ahead is provided with humidification apparatus; Said humidification apparatus includes body and top cover, along the entering plate direction, is disposed with pressure reel parts 4, water injector 2 and absorbent wool rumble parts 1 in the said body inner chamber; Said top cover covers the top of pressure reel parts 4, water injector 2 and absorbent wool rumble parts 1; Pressure reel parts 4 include upper pressure wheel and lower pressure wheel, between said upper pressure wheel and the lower pressure wheel for going into the sheet separation; Water injector 2 comprises upper and lower sparge pipe, and the osculum that is evenly distributed is arranged in the sparge pipe; Absorbent wool rumble parts 1 include water sucking wheel and following water sucking wheel, and over against the upper and lower sparge pipe of water injector, last water sucking wheel is fixed in the body through support with following water sucking wheel respectively.
Said absorbent wool rumble parts 1 below is provided with an above drip tray 3.
The said periphery that goes up water sucking wheel and following water sucking wheel is provided with PVAC polyvinylalcohol absorbent wool layer.
The thickness of said absorbent wool layer is 4-8mm.
Said wiring board film sticking equipment comprises water supply installation and drainpipe.
Said wiring board film sticking equipment comprises the hydraulic controller that is used to regulate the water injector water yield, is connected with the upper and lower sparge pipe of water injector 2.
As shown in Figure 1; Humidification apparatus is installed in the place ahead of laminator, has a lid to cover humidification apparatus and pressure reel, and water injector comprises sparge pipe up and down; The osculum that is evenly distributed is arranged in the sparge pipe; There are a little drip tray and a big drip tray in absorbent wool rumble below, collects unnecessary water, in order to avoid other parts of laminator of getting wet.Sparge pipe is connected to hydraulic controller, the controlled water yield of making.Two PVA absorbent wool rumbles are up and down arranged on the support in addition.
Copper coin is sent laminator to after the pressure reel heating, spray moisturing device is got PVA absorbent wool rumble wet, and the copper coin of process can be coated with layer of even pure water film; The water film thickness that produces is 20-70um; Unnecessary water can extrude and take to drip tray, and the moisture film on the copper coin improves the flowability of dry film, drives away the bubble that is detained on the positions such as cut, sand holes, pit and foreign material depression; In heating and pressurizing pad pasting process, can improve the adhesiveness of dry film and substrate greatly, thereby improve the qualification rate of making fine wire.This device can be used for the film coating process of flexible or rigid circuit board pattern transfering process.
Wiring board wet combining film method, wherein, it is following to include the humidification step:
Step 1: the absorbent wool rumble parts of above-mentioned humidification apparatus see through PVAC polyvinylalcohol absorbent wool layer and absorb an amount of room temperature pure water;
Step 2: send copper coin the humidification apparatus of laminator to, through the last water sucking wheel and the even pure water rete of following water sucking wheel surperficial formation one deck of absorbent wool rumble parts;
Step 3: the copper coin that will have water film is seen humidification apparatus off.
The thickness of above-mentioned pure water rete is 20-70um.
Wiring board wet combining film method like Fig. 2,3, comprises that specifically step is following:
9) handle through chemistry or physical method earlier on the copper coin surface, removes some greases and oxide, increases the roughness on copper coin surface;
10) will pass through copper coin after the surface treatment, send humidification apparatus to, carry out the humidification step;
The copper coin that 11) will have water film is sent laminator to;
12) during pad pasting, peel polyethylene protective film from dry film earlier, then under the condition of heating and pressurizing with dry film pasting on copper coin;
13) the room temperature pure water is pressed between dry film and copper interface as intermediate medium replacement air;
14) pure water gets into water-soluble dry film through the effect of liquid-solid two-phase diffusion and intermolecular polar bond, makes water absorbed by dry film, and the dry film deliquescing is expanded, and reaches the inner chemical bond of dry film simultaneously between part copper surface and the dry film and quickens to form;
15) dry film of expansion deliquescing, by means of the pressure of hot pressing roller, flowability constantly increases, and fills the depression that dry film does not press to gradually, copper knurl, foreign material, rejected regions such as surperficial scratch simultaneously;
16) with cooling of the copper coin behind the pad pasting and recovery.
The water yield of the water injector of said humidification apparatus is regulated through hydraulic controller.
This technology is before pasting dry film, to form water membrane in the copper coin surface, and the effect of moisture film is: the flowability that improves dry film; Drive away the bubble that is detained on the positions such as cut, sand holes, pit and fabric depression; In heating and pressurizing pad pasting process, water has played viscosifying action to dry film, thereby can improve the adhesiveness of dry film and copper coin greatly, thereby has improved the qualification rate of making fine wire.Intact pad pasting should be that surfacing, no wrinkle, no bubble, free from dust particle etc. are mingled with, and for keeping the stability of technology, should make public through supercooling and convalescence behind the pad pasting again.
The mechanism of wet film coating process can be divided into three phases, and the phase I is to replace air with the room temperature pure water as intermediate medium to be pressed into dry film and copper interface moistening copper surface.Second stage is that the effect that pure water passes through liquid-solid two-phase diffusion and intermolecular polar bond gets into water-soluble dry film, makes water absorbed by dry film, and the dry film deliquescing is expanded, simultaneously between part copper surface and the dry film and the inner chemical bond of dry film quicken formation.Phase III is the dry film of expansion deliquescing, and flowability constantly increases, and fills the depression that dry film does not press to gradually, copper knurl, foreign material, rejected regions such as surperficial scratch.The effect of pure water is 1 in the wet film coating) speeding-up ion crosslinked 2) promotion chemical reaction 3) the raising diffusion rate.Wet film coating improves surperficial adhesion and has hysteresis effect, needs certain pad pasting time of repose.
Above-mentioned listed concrete implementation is nonrestrictive, to one skilled in the art, is not departing from the scope of the invention, and various improvement and the variation carried out all belong to protection scope of the present invention.
Claims (10)
1. the wiring board film sticking equipment includes laminator; It is characterized in that: said laminator the place ahead is provided with humidification apparatus; Said humidification apparatus includes body and top cover, along the entering plate direction, is disposed with pressure reel parts (4), water injector (2) and absorbent wool rumble parts (1) in the said body inner chamber; Said top cover covers the top of pressure reel parts (4), water injector (2) and absorbent wool rumble parts (1); Pressure reel parts (4) include upper pressure wheel and lower pressure wheel, between said upper pressure wheel and the lower pressure wheel for going into the sheet separation; Water injector (2) comprises upper and lower sparge pipe, and the osculum that is evenly distributed is arranged in the sparge pipe; Absorbent wool rumble parts (1) include water sucking wheel and following water sucking wheel, and over against the upper and lower sparge pipe of water injector, last water sucking wheel is fixed in the body through support with following water sucking wheel respectively.
2. wiring board film sticking equipment as claimed in claim 1 is characterized in that: said absorbent wool rumble parts (1) below is provided with an above drip tray (3).
3. wiring board film sticking equipment as claimed in claim 2 is characterized in that: the said periphery that goes up water sucking wheel and following water sucking wheel is provided with PVAC polyvinylalcohol absorbent wool layer.
4. wiring board film sticking equipment as claimed in claim 3 is characterized in that: the thickness of said absorbent wool layer is 4-8mm.
5. like each described wiring board film sticking equipment in the claim 1 to 4, it is characterized in that: said wiring board film sticking equipment comprises water supply installation and drainpipe.
6. wiring board film sticking equipment as claimed in claim 5 is characterized in that: said wiring board film sticking equipment comprises the hydraulic controller that is used to regulate the water injector water yield, is connected with the upper and lower sparge pipe of water injector (2).
7. wiring board wet combining film method, it is characterized in that: it is following to include the humidification step:
Step 1:, see through PVAC polyvinylalcohol absorbent wool layer and absorb an amount of room temperature pure water like the absorbent wool rumble parts of the said humidification apparatus of claim 6;
Step 2: send copper coin the humidification apparatus of laminator to, through the last water sucking wheel and the even pure water rete of following water sucking wheel surperficial formation one deck of absorbent wool rumble parts;
Step 3: the copper coin that will have water film is seen humidification apparatus off.
8. wiring board wet combining film method as claimed in claim 7 is characterized in that: the thickness of pure water rete is 20-70um.
9. wiring board wet combining film method as claimed in claim 8 is characterized in that: comprise that specifically step is following:
1) handle through chemistry or physical method earlier on the copper coin surface, removes some greases and oxide, increases the roughness on copper coin surface;
2) will pass through copper coin after the surface treatment, send humidification apparatus to, carry out the humidification step;
The copper coin that 3) will have water film is sent laminator to;
4) during pad pasting, peel polyethylene protective film from dry film earlier, then under the condition of heating and pressurizing with dry film pasting on copper coin;
5) the room temperature pure water is pressed between dry film and copper interface as intermediate medium replacement air;
6) pure water gets into water-soluble dry film through the effect of liquid-solid two-phase diffusion and intermolecular polar bond, makes water absorbed by dry film, and the dry film deliquescing is expanded, and reaches the inner chemical bond of dry film simultaneously between part copper surface and the dry film and quickens to form;
7) dry film of expansion deliquescing, by means of the pressure of hot pressing roller, flowability constantly increases, and fills the depression that dry film does not press to gradually, copper knurl, foreign material, rejected regions such as surperficial scratch simultaneously;
8) with cooling of the copper coin behind the pad pasting and recovery.
10. wiring board wet combining film method as claimed in claim 9 is characterized in that: the water yield of the water injector of said humidification apparatus is regulated through hydraulic controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105751954A CN102485482A (en) | 2010-12-03 | 2010-12-03 | Circuit board filming equipment and circuit board wet filming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105751954A CN102485482A (en) | 2010-12-03 | 2010-12-03 | Circuit board filming equipment and circuit board wet filming method |
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| Publication Number | Publication Date |
|---|---|
| CN102485482A true CN102485482A (en) | 2012-06-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105751954A Pending CN102485482A (en) | 2010-12-03 | 2010-12-03 | Circuit board filming equipment and circuit board wet filming method |
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| CN (1) | CN102485482A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682367A (en) * | 2016-04-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Preparation method of external-layer circuit of backplane having warp surface |
| CN106211616A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | Pressure technique after a kind of pad pasting producing pcb board |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0040842A1 (en) * | 1980-05-27 | 1981-12-02 | E.I. Du Pont De Nemours And Company | Laminating process |
| CN1292896C (en) * | 2001-04-25 | 2007-01-03 | Mec株式会社 | Laminate and its production method |
| CN1968575A (en) * | 2005-11-17 | 2007-05-23 | 上海华仕德电路技术有限公司 | Wet film coating process for flexible circuit board |
| CN201471816U (en) * | 2009-08-28 | 2010-05-19 | 广州南沙华卓化工有限公司 | Wet lamination mechanism for laminators |
| CN201928523U (en) * | 2010-12-03 | 2011-08-10 | 珠海丰洋化工有限公司 | Films sticking device for circuit boards |
-
2010
- 2010-12-03 CN CN2010105751954A patent/CN102485482A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0040842A1 (en) * | 1980-05-27 | 1981-12-02 | E.I. Du Pont De Nemours And Company | Laminating process |
| CN1292896C (en) * | 2001-04-25 | 2007-01-03 | Mec株式会社 | Laminate and its production method |
| CN1968575A (en) * | 2005-11-17 | 2007-05-23 | 上海华仕德电路技术有限公司 | Wet film coating process for flexible circuit board |
| CN201471816U (en) * | 2009-08-28 | 2010-05-19 | 广州南沙华卓化工有限公司 | Wet lamination mechanism for laminators |
| CN201928523U (en) * | 2010-12-03 | 2011-08-10 | 珠海丰洋化工有限公司 | Films sticking device for circuit boards |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682367A (en) * | 2016-04-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Preparation method of external-layer circuit of backplane having warp surface |
| CN105682367B (en) * | 2016-04-01 | 2018-10-19 | 广州兴森快捷电路科技有限公司 | A kind of preparation method of the outer-layer circuit with warped surface backboard |
| CN106211616A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | Pressure technique after a kind of pad pasting producing pcb board |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN112020233B (en) * | 2020-08-28 | 2021-11-05 | 李钟波 | Film coating module for PCB micro-defect plate |
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Application publication date: 20120606 |