CN106304643A - The outer-layer circuit manufacture method of big drop hard plate - Google Patents
The outer-layer circuit manufacture method of big drop hard plate Download PDFInfo
- Publication number
- CN106304643A CN106304643A CN201610740326.7A CN201610740326A CN106304643A CN 106304643 A CN106304643 A CN 106304643A CN 201610740326 A CN201610740326 A CN 201610740326A CN 106304643 A CN106304643 A CN 106304643A
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- Prior art keywords
- hard plate
- dry film
- film
- wet film
- layer circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention discloses the outer-layer circuit manufacture method of a kind of big drop hard plate, comprises the steps: to prepare the hard plate of a stepped distribution and dry film to be fit and wet film, and described hard plate is provided with position, hole, described wet film is printed with line pattern；Hard plate is coated with dry film, so that described dry film seals the aperture of the position, hole of hard plate side；Coating wet film it is coated with on a surface of dry film, so that wet film covers described dry film at hard plate；Wet film is exposed and development treatment, so that the line pattern on wet film is transferred on hard plate；Hard plate transferred with line pattern is carried out successively line pattern plating and outer layer etch processes, forms the outer-layer circuit on hard plate.Technical scheme can improve the yields of hard plate outer-layer circuit.
Description
Technical field
The present invention relates to printed circuit board technology field, particularly relate to the outer-layer circuit making side of a kind of big drop hard plate
Method.
Background technology
In printed circuit board industry, the surface of hard plate typically requires attached one layer of dry film or wet film to make outer layer line
Road.In prior art, when selecting dry film to make outer-layer circuit, owing to the adhesive force of dry film is more weak, it is only suitable for and hard plate plane
Laminating, and the hard that improper processing drop is bigger.As for drop > hardboard of 0.15mm is when making outer-layer circuit, hard
The stability of the dry film laminating of the junction of plate hight low head is more weak there will be pad pasting bubble, can be because of dry film after exposure imaging
More weak meeting causes dry film to come off problem with the adhesion of hard plate.When selecting wet film to make outer-layer circuit, due to wet film mobility
Preferably, can fill the drop of the hardboard of 0.15mm, but wet film anti-plate to the sealing of hole on hardboard and wet film medicine own
The ability of water is more weak, causes the problem that the quality of hard plate outer-layer circuit is bad.
Summary of the invention
The main object of the present invention is to provide the outer-layer circuit manufacture method of a kind of big drop hard plate, it is possible to solve individually
When using dry film or wet film laminating hard plate, the problem that hard plate outer-layer circuit quality is bad.
For achieving the above object, the technical scheme that the present invention uses is: provide the outer layer of a kind of big drop hard plate
Circuit manufacturing method, comprises the steps:
Preparing the hard plate of a stepped distribution and dry film to be fit and wet film, described hard plate is provided with position, hole,
It is printed with line pattern on described wet film；
Hard plate is coated with dry film, so that described dry film seals the aperture of the position, hole of hard plate side；
Coating wet film it is coated with on a surface of dry film, so that wet film covers described dry film at hard plate；
Wet film is exposed and development treatment, so that the line pattern on wet film is transferred on hard plate；
Hard plate transferred with line pattern is carried out successively line pattern plating and outer layer etch processes, forms hard plate
On outer-layer circuit.
Preferably, described coating dry film on hard plate, so that described dry film seals the aperture of the position, hole of hard plate side
Step in, utilize the hot pressing rumble pressure with parameter as 0.3-0.5MPa, the pad pasting temperature of 50-60 DEG C that dry film is coated hard
On plate.
Preferably, described coating dry film on hard plate, so that described dry film seals the aperture of the position, hole of hard plate side
Step in, the thickness that described hard plate is coated with dry film is 40-60um.
Preferably, in the step of the hard plate of the described stepped distribution of preparation one and dry film to be fit and wet film, institute
State and on dry film, be printed with line pattern；
Described on hard plate be coated with dry film so that described dry film seal the aperture of the position, hole of hard plate side step it
After, also include carrying out dry film exposing and development treatment, to be transferred on hard plate by the line pattern on dry film for the first time.
Preferably, it is coated with on a surface of dry film coating wet film at hard plate, so that wet film covers the step of described dry film
In Zhou, the described wet-film thickness being coated with on hard plate is 10-14um.
Preferably, described being coated with on a surface of dry film at hard plate is coated with wet film, so that wet film covers described dry film
Step in, utilize scraper to be coated on the dry film of hard plate by wet film with the pressure of parameter 0.1-0.2Mpa.
Preferably, described the hard plate transferred with line pattern is carried out at line pattern plating and outer layer etching successively
Reason, is formed in the step of the outer-layer circuit on hard plate, and described outer layer etch processes is that acid etching processes, so that electroplated
Line pattern forms outer-layer circuit.
Technical scheme mainly uses reaches the standard grade coating dry film at hard plate, can seal hard plate one by dry film
The aperture of the position, hole of side, owing to dry film has preferably intensity, the dry film at the position, hole of hard plate may not flow in position, hole, it is possible to
Play preferably sealing of hole and anti-plate effect；And use and be coated with on a surface of dry film coating wet film, wet film at hard plate
There is preferably mobility, it is possible to fill the drop of the hard plate of stepped distribution, it is to avoid dry film easily produces with hard plate laminating
The problem of angry bubble, especially for the region of the stepped distribution of hard plate, it is possible to greatly reduces dry film and fits with hard plate
Unstable problem, therefore, this programme is by pasting wet film after first pasting dry film on hard plate, it is possible to be greatly increased what hard plate produced
Yields.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to the structure shown in these accompanying drawings.
Fig. 1 is the schematic flow sheet of outer-layer circuit manufacture method one embodiment of the present invention big drop hard plate；
Fig. 2 is the schematic flow sheet of outer-layer circuit another embodiment of manufacture method of the present invention big drop hard plate.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further referring to the drawings.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under not making creative work premise all its
His embodiment, broadly falls into the scope of protection of the invention.
It is to be appreciated that the description relating to " first ", " second " etc. in the present invention be only used for describe purpose, and it is not intended that
Indicate or imply its relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ",
The feature of " second " can express or implicitly include at least one this feature.It addition, the technical side between each embodiment
Case can be combined with each other, but must be based on those of ordinary skill in the art are capable of, when the combination of technical scheme
Occur conflicting will be understood that the combination of this technical scheme does not exists, the most not the guarantor of application claims when maybe cannot realize
Within the scope of protecting.
The outer-layer circuit manufacture method of the big drop hard plate of the present invention, is applied to wiring board and prints field, mainly solve
Be easily to produce the problem of pad pasting bubble more than when using dry film pad pasting on the same hard plate of 0.15mm drop having, and
Cannot sealing of hole and the problem of anti-plate ability during employing wet film pad pasting.To this end, this employing is first coated with dry film on hard plate, so
After on dry film, be coated with wet film, in conjunction with sealing of hole and the anti-plate ability of dry film, and the performance filling drop of wet film, reduce and be coated with
The caducous problem of film layer of cloth, it is simple to the making of outer-layer circuit, can improve the yields that hard plate produces.
Embodiment one
Refer to Fig. 1, the invention provides the outer-layer circuit manufacture method of a kind of big drop hard plate, including walking as follows
Rapid:
Step S11, the hard plate preparing a stepped distribution and dry film to be fit and wet film, described hard plate sets
Porose position, described wet film is printed with line pattern.This hard plate is specifically as follows thick copper coin, the drop at the ladder of thick copper coin
More than 0.15mm, the intensity on dry film is preferable, and for sealing of hole and have stronger anti-plate ability, and wet film has and preferably flows
Dynamic property, may be used for filling the drop on hard plate.Certainly, the hard plate in the present embodiment through outer layer pre-treatment, as boring,
Clean and surface polishing etc. processes, to facilitate the pad pasting of dry film and wet film.It is pointed out that in the present embodiment, dry film is coated with
During the plate face of the hard plate of cloth, the one side of something at hard plate is reserved with the width of 1.0-4.0mm, and this width is preferably 2.0mm.
Step S12, on hard plate be coated with dry film so that described dry film seals the aperture of the position, hole of hard plate side.Patch
During dry film, from dry film, first peel polyethylene protective film, then under conditions of heating pressurization, dry film photoresist is pasted onto firmly
On scutum.Resist layer in dry film be heated after deliquescing, mobility increases, and makes resist flow on hard plate surface, by means of
In the pressure of hot pressing rumble and resist layer, the effect of binding agent completes pad pasting.
Step S13, hard plate be coated with on a surface of dry film coating wet film so that wet film cover described dry film.Patch
During wet film, wet film is coated on hard plate, and make wet film be positioned on dry film, and make the edges of boards of wet film and hard plate reserve spacing
For 2-15mm, concrete spacing can design according to actual requirement, and in the present embodiment, selecting reserved spacing is 5mm conduct
Optimal case.
Step S14, wet film is exposed and development treatment, so that the line pattern on wet film is transferred on hard plate.
Exposure in the present embodiment and development treatment, can use exposure parameter and the photographic parameter of routine, such as wet film exposure energy, protects
Card exposure guide rule 6 lattice have glue, can select the development liquid medicine that wiring board is conventional, and temperature controls between 20-30 DEG C.
Step S15, the hard plate transferred with line pattern is carried out successively line pattern plating and outer layer etch processes, shape
Become the outer-layer circuit on hard plate.In the present embodiment, after line pattern transfers, follow-up line pattern plating can be carried out
And outer layer etch processes, now, owing to the dry film of previously coating has preferably intensity, stable layout now can be formed
Shape, to improve the accuracy of outer layer etching.
Technical scheme mainly uses reaches the standard grade coating dry film at hard plate, can seal hard plate one by dry film
The aperture of the position, hole of side, owing to dry film has preferably intensity, the dry film at the position, hole of hard plate may not flow in position, hole, it is possible to
Play preferably sealing of hole and anti-plate effect；And use and be coated with on a surface of dry film coating wet film, wet film at hard plate
There is preferably mobility, it is possible to fill the drop of the hard plate of stepped distribution, it is to avoid dry film easily produces with hard plate laminating
The problem of angry bubble, especially for the region of the stepped distribution of hard plate, it is possible to greatly reduces dry film and fits with hard plate
Unstable problem, therefore, this programme is by pasting wet film after first pasting dry film on hard plate, it is possible to be greatly increased what hard plate produced
Yields.
In a specific embodiment, in described step S12, utilize the hot pressing rumble pressure with parameter as 0.3-0.5MPa,
Dry film is coated on hard plate by the pad pasting temperature of 50-60 DEG C.The present embodiment affects the factor of pad pasting quality predominantly: hot pressing
The temperature of rumble, pressure and speed, the present embodiment selection hot pressing rumble optimum pressure value is 0.4MPa, and Optimal Temperature is 55 DEG C.Additionally
By controlling coating speed, the efficiency of dry film coating can be improved.
In a specific embodiment, in described step S12, the thickness that described hard plate is coated with dry film is 40-60um.
In the present embodiment, preferably build is 50um, to ensure that dry film has preferably intensity, facilitate subsequent step sealing of hole and
Improve anti-plate ability.
In a specific embodiment, in described step S13, the described wet-film thickness being coated with on hard plate is 10-
14um.The optimum wet-film thickness of the wet film that the present embodiment is selected is 12um, and the thickness of wet film is less than the thickness of dry film, such energy
Enough realize the flexibility of wet film, preferably to fill the big drop on hard plate.
In a specific embodiment, in described step S13, utilize scraper with the pressure of parameter 0.1-0.2Mpa by wet film
Coat on the dry film of hard plate.The optimum pressure of scraper that the present embodiment is selected is 0.15Mpa, due to wet film adhesiveness more
Good, just can be realized the coating of wet film by less pressure, it is to avoid when pressure is excessive, the scraper damage to wet film itself.
In a specific embodiment, in described step S15, described outer layer etch processes is that acid etching processes, so that
Electroplated line pattern forms outer-layer circuit.During this acid etching processes, can be selected for the hydrochloric acid solution of chloracid sodium, wherein,
Hydrogen chloride is that in 1:6, and this etching solution, the concentration of hydrogen chloride is less than or equal to 6mol/L with the weight ratio of sodium chloride.
To sum up, the embodiment of the present invention makes the outer-layer circuit of hard plate by the method that dry film and wet film combine, it is possible to subtract
The scrappage that little hard plate produces, improves the product qualified rate that hard plate produces, and this product qualified rate can reach more than 99%.
Employing single exposure develops, and can simplify the Making programme of the outer-layer circuit of the present embodiment hard plate, improves what hard plate produced
Efficiency.
Embodiment two
Refer to Fig. 2, the invention provides the outer-layer circuit manufacture method of a kind of big drop hard plate, including walking as follows
Rapid:
Step S21, the hard plate preparing a stepped distribution and dry film to be fit and wet film, described hard plate sets
Porose position, described dry film and wet film are printed with line pattern respectively.This hard plate is specifically as follows thick copper coin, the rank of thick copper coin
Drop at Ti is more than 0.15mm, and the intensity on dry film is preferable, for sealing of hole and have stronger anti-plate ability, and wet film tool
There is preferably mobility, may be used for filling the drop on hard plate.Certainly, the hard plate in the present embodiment is located before outer layer
Reason, processes such as boring, cleaning and surface polishing etc., to facilitate the pad pasting of dry film and wet film.It is pointed out that this enforcement
In example, during the plate face of hard plate of dry film coating, the one side of something at hard plate is reserved with the width of 1.0-4.0mm, and this width is preferred
For 2.0mm.
Step S22, on hard plate be coated with dry film so that described dry film seals the aperture of the position, hole of hard plate side.Patch
During dry film, from dry film, first peel polyethylene protective film, then under conditions of heating pressurization, dry film photoresist is pasted onto firmly
On scutum.Resist layer in dry film be heated after deliquescing, mobility increases, and makes resist flow on hard plate surface, by means of
In the pressure of hot pressing rumble and resist layer, the effect of binding agent completes pad pasting.
Step S23, carry out dry film exposing and development treatment, so that the line pattern on dry film is transferred to hard for the first time
On plate.Exposure in the present embodiment and development treatment, can use exposure parameter and the photographic parameter of routine, as dry film exposes energy
Amount, it is ensured that exposure guide rule 6 lattice have glue, can select the development liquid medicine that wiring board is conventional, and temperature controls between 20-30 DEG C.
Step S24, hard plate be coated with on a surface of dry film coating wet film so that wet film cover described dry film.Patch
During wet film, wet film is coated on hard plate, and make wet film be positioned on dry film, and make the edges of boards of wet film and hard plate reserve spacing
For 2-15mm, concrete spacing can design according to actual requirement, and in the present embodiment, selecting reserved spacing is 5mm conduct
Optimal case.
Step S25, wet film is carried out second time expose and development treatment, so that the line pattern on wet film is transferred to hard
On plate.Exposure in the present embodiment and development treatment, can use exposure parameter and the photographic parameter of routine, as wet film exposes energy
Amount, it is ensured that exposure guide rule 6 lattice have glue, can select the development liquid medicine that wiring board is conventional, and temperature controls between 20-30 DEG C.
Step S26, the hard plate transferred with line pattern is carried out successively line pattern plating and outer layer etch processes, shape
Become the outer-layer circuit on hard plate.In the present embodiment, after line pattern transfers, follow-up line pattern plating can be carried out
And outer layer etch processes, now, owing to the dry film of previously coating has preferably intensity, stable layout now can be formed
Shape, to improve the accuracy of outer layer etching.
In a specific embodiment, in described step S22, utilize the hot pressing rumble pressure with parameter as 0.3-0.5MPa,
Dry film is coated on hard plate by the pad pasting temperature of 50-60 DEG C.The present embodiment affects the factor of pad pasting quality predominantly: hot pressing
The temperature of rumble, pressure and speed, the present embodiment selection hot pressing rumble optimum pressure value is 0.4MPa, and Optimal Temperature is 55 DEG C.Additionally
By controlling coating speed, the efficiency of dry film coating can be improved.
In a specific embodiment, in described step S22, the thickness that described hard plate is coated with dry film is 40-60um.
In the present embodiment, preferably build is 50um, to ensure that dry film has preferably intensity, facilitate subsequent step sealing of hole and
Improve anti-plate ability.
In a specific embodiment, in described step S24, the described wet-film thickness being coated with on hard plate is 10-
14um.The optimum wet-film thickness of the wet film that the present embodiment is selected is 12um, and the thickness of wet film is less than the thickness of dry film, such energy
Enough realize the flexibility of wet film, preferably to fill the big drop on hard plate.
In a specific embodiment, in described step S24, utilize scraper with the pressure of parameter 0.1-0.2Mpa by wet film
Coat on the dry film of hard plate.The optimum pressure of scraper that the present embodiment is selected is 0.15Mpa, due to wet film adhesiveness more
Good, just can be realized the coating of wet film by less pressure, it is to avoid when pressure is excessive, the scraper damage to wet film itself.
In a specific embodiment, in described step S26, described outer layer etch processes is that acid etching processes, so that
Electroplated line pattern forms outer-layer circuit.During this acid etching processes, can be selected for the hydrochloric acid solution of chloracid sodium, wherein,
Hydrogen chloride is that in 1:6, and this etching solution, the concentration of hydrogen chloride is less than or equal to 6mol/L with the weight ratio of sodium chloride.
To sum up, the embodiment of the present invention makes the outer-layer circuit of hard plate by the method that dry film and wet film combine, it is possible to subtract
The scrappage that little hard plate produces, uses double exposure development, it is possible to achieve the transfer of the line pattern of the present embodiment hard plate,
And improve the efficiency that hard plate produces.Therefore, qualification rate and the production efficiency of the production of the hard plate in the present embodiment are the highest
Making in current hard plate outer-layer circuit.
The foregoing is only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every at this
Under the inventive concept of invention, utilize the equivalent structure transformation that description of the invention and accompanying drawing content are made, or directly/indirectly use
The technical field relevant at other is included in the scope of patent protection of the present invention.
Claims (7)
1. the outer-layer circuit manufacture method of a big drop hard plate, it is characterised in that comprise the steps:
Preparing the hard plate of a stepped distribution and dry film to be fit and wet film, described hard plate is provided with position, hole, described
Line pattern it is printed with on wet film；
Hard plate is coated with dry film, so that described dry film seals the aperture of the position, hole of hard plate side；
Coating wet film it is coated with on a surface of dry film, so that wet film covers described dry film at hard plate；
Wet film is exposed and development treatment, so that the line pattern on wet film is transferred on hard plate；
Hard plate transferred with line pattern is carried out successively line pattern plating and outer layer etch processes, is formed on hard plate
Outer-layer circuit.
2. the outer-layer circuit manufacture method of big drop hard plate as claimed in claim 1, it is characterised in that described at hard plate
Upper coating dry film, so that in the step in the described dry film aperture that seals the position, hole of hard plate side, utilizes the hot pressing rumble with parameter to be
The pressure of 0.3-0.5MPa, dry film is coated on hard plate by the pad pasting temperature of 50-60 DEG C.
3. the outer-layer circuit manufacture method of big drop hard plate as claimed in claim 1, it is characterised in that described at hard plate
Upper coating dry film, so that in the step in the described dry film aperture that seals the position, hole of hard plate side, on described hard plate, coating is dry
The thickness of film is 40-60um.
4. the outer-layer circuit manufacture method of big drop hard plate as claimed in claim 1, it is characterised in that
The hard plate of the described stepped distribution of preparation one and dry film to be fit, with the step of wet film, described dry film are printed
There is line pattern；
Described on hard plate, it is coated with dry film, so that after the step in the described dry film aperture that seals the position, hole of hard plate side,
Also include carrying out dry film exposing and development treatment, to be transferred on hard plate by the line pattern on dry film for the first time.
5. the outer-layer circuit manufacture method of big drop hard plate as claimed in claim 1, it is characterised in that be coated with at hard plate
There is on a surface of dry film coating wet film, so that wet film covers in the step of described dry film, described coating wet on hard plate
Film thickness is 10-14um.
6. the outer-layer circuit manufacture method of big drop hard plate as claimed in claim 1, it is characterised in that described at hard plate
It is coated with on a surface of dry film coating wet film, so that wet film covers in the step of described dry film, utilizes the scraper with parameter to be
Wet film is coated on the dry film of hard plate by the pressure of 0.1-0.2Mpa.
7. the outer-layer circuit manufacture method of drop hard plate as claimed in claim 1 big, it is characterised in that described to transferred with
The hard plate of line pattern carries out line pattern plating and outer layer etch processes, the step of the outer-layer circuit on formation hard plate successively
In Zhou, described outer layer etch processes is that acid etching processes, so that electroplated line pattern forms outer-layer circuit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610740326.7A CN106304643A (en) | 2016-08-26 | 2016-08-26 | The outer-layer circuit manufacture method of big drop hard plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610740326.7A CN106304643A (en) | 2016-08-26 | 2016-08-26 | The outer-layer circuit manufacture method of big drop hard plate |
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| CN201610740326.7A Pending CN106304643A (en) | 2016-08-26 | 2016-08-26 | The outer-layer circuit manufacture method of big drop hard plate |
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| CN109413872A (en) * | 2018-11-21 | 2019-03-01 | 奥士康精密电路（惠州）有限公司 | A kind of processing method reducing the short circuit of pcb board internal layer, residual copper |
| CN110958778A (en) * | 2019-12-31 | 2020-04-03 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with BGA boss |
| CN112739039A (en) * | 2020-11-18 | 2021-04-30 | 江门崇达电路技术有限公司 | Manufacturing method of PCB with large PTH hole and fine line |
| CN115016229A (en) * | 2022-06-13 | 2022-09-06 | 明士(北京)新材料开发有限公司 | Preparation method of photoresist low-temperature cured thick film |
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| CN105873368A (en) * | 2016-04-29 | 2016-08-17 | 深圳崇达多层线路板有限公司 | Method for manufacturing outer layer graph of thick copper plate |
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| US20130104365A1 (en) * | 2011-10-31 | 2013-05-02 | Tripod Technology Corporation | Method of embedding magnetic component in substrate |
| CN104023479A (en) * | 2014-06-12 | 2014-09-03 | 深圳崇达多层线路板有限公司 | Method for manufacturing outer line of rigid-flexible combined circuit boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109413872A (en) * | 2018-11-21 | 2019-03-01 | 奥士康精密电路（惠州）有限公司 | A kind of processing method reducing the short circuit of pcb board internal layer, residual copper |
| CN110958778A (en) * | 2019-12-31 | 2020-04-03 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with BGA boss |
| CN110958778B (en) * | 2019-12-31 | 2020-12-22 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with BGA boss |
| CN112739039A (en) * | 2020-11-18 | 2021-04-30 | 江门崇达电路技术有限公司 | Manufacturing method of PCB with large PTH hole and fine line |
| CN115016229A (en) * | 2022-06-13 | 2022-09-06 | 明士(北京)新材料开发有限公司 | Preparation method of photoresist low-temperature cured thick film |
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Application publication date: 20170104 |