CN201471816U

CN201471816U - Wet lamination mechanism for laminators

Info

Publication number: CN201471816U
Application number: CN2009201936140U
Authority: CN
Inventors: 李兆辉; 何克辛
Original assignee: GUANGZHOU NANSHA HUAZHUO CHEMICAL CO Ltd
Current assignee: GUANGZHOU NANSHA HUAZHUO CHEMICAL CO Ltd
Priority date: 2009-08-28
Filing date: 2009-08-28
Publication date: 2010-05-19
Anticipated expiration: 2019-08-28

Abstract

The utility model discloses a wet lamination mechanism for laminators. Both ends of each sponge wet roller are mounted on supports, drip tubes which can drip water on the sponge wet rollers are mounted over the sponge wet rollers, spindles are arranged in the sponge wet rollers, one end of each spindle is mounted on the support, and the other end of the spindle is provided with a drive gear, and is mounted in the notch of the support. The gears mounted on the two sponge wet rollers are engaged with each other, in addition, a water-receiving tray is mounted under the sponge wet rollers, retainer rings are mounted on both ends of the water-receiving tray and can retain redundant water, and the drip tubes are connected with a flow controller which can control the volume of the water dripped to the drip tubes. When a copper plate needs to be wetted, a conveyer can convey the copper plate to the sponge wet rollers, and the flow controller controls the volume of water.

Description

The wet film coating device that a kind of press mold machine is used

Technical field

The utility model relates to the wet film coating device, particularly a kind of wet film coating device that is used for printed circuit board surface pad pasting pad pasting.

Background technology

Press mold is the important step in the PC board fabricating processes, and its manufacturing process is that dry film is pressed on substrate surface, makes wiring board through operation subsequently again.Because the press mold machine carries out the press mold operation to circuit board, surface behind its pad pasting is easy to generate the interface bubble, cause yield rate to reduce greatly, thereby adopt the wetting wet film coating process that promptly adopts of dry film to strengthen the flowability of dry film, make dry film to obtain excellent combination on various substrate copper surface, its existing apparatus is to use running water to connect water pipe by water valve, utilizes the pore in the water pipe that water laterally is mapped on the wet roller of sponge, utilizes the wet roller of sponge in rotary course that copper coin is wetting again.Its shortcoming is, owing to adopt the jetting pattern to supply water, the water yield is difficult to control, thereby it is excessive to the dry film volume to have a large amount of water in the pad pasting process, cause often taking place demoulding, and the excessive water yield combining with copper coin of can causing that dry film can not success, and make the study of water film distribution on the copper coin inhomogeneous, cause pad pasting wrinkling.

The utility model content

The technical problems to be solved in the utility model provides a kind of wet film coating device, accurately the minimum moisture content of the wet roller of the whole sponge of control.

Wet film coating device described in the utility model, the wet roller of sponge is installed on two end supports, being equipped with respectively above the wet roller of sponge can be with the weep pipe of water droplet at the wet roller of sponge, weep pipe is fixed on two end supports, and water inlet arranged respectively, weep pipe is arranged a plurality of delivery ports, and weep pipe joins by pipeline and flow controller.

Wet film coating device described in the utility model, above the wet roller of sponge, weep pipe is installed, it adopts the pattern of the wetting sponge roller of the pattern of dripping to replace original jetting to drench, can come the corresponding required water yield according to different press mold speed, and can make the sponge roller evenly wetting and do not have other parts of water effect of flood, thereby can improve the flowability of dry film on circuit board, make dry film on various substrate copper surface, all can obtain excellent combination, thereby the yields that improves wiring board manufacturer effectively reduce production costs.

Description of drawings

Fig. 1 is the structural representation of wet film coating device;

Fig. 2 is the planar structure schematic diagram of weep pipe;

Fig. 3 is the side sectional view of wet film coating device;

Fig. 4 is the wet film coating schematic representation of apparatus that flow controller is installed.

The specific embodiment

As shown in Figure 1 and Figure 2, the wet roller 1 of sponge is installed on two end supports 2, being equipped with respectively above the wet roller 1 of sponge can be with the weep pipe 3 of water droplet at the wet roller of sponge, weep pipe 3 is fixed on two end supports 2, and water inlet 4 arranged respectively, weep pipe is arranged some delivery ports 5, below the wet roller 1 of sponge drip tray 7 is housed, and drip ring 8 is equipped with at the two ends of drip tray 7.As shown in Figure 4, weep pipe 3 is connected to flow controller 9 and is existing product, can accurately control the water yield size that flows to weep pipe.11 is pressure pump.As shown in Figure 3, in wet roller 1 one sides of sponge rubber roll 6 is housed.

When needs carry out the wet film coating operation to circuit board, can circuit board be sent to the wet roller of sponge by conveyer, before being sent to the wet roller of sponge, carrying out roll extrusion by 6 pairs of copper coins of rubber roll earlier handles, the wet needed water of roller of wetting sponge then leads to the water inlet 4 of weep pipe 3 by water regulator 9, drip on the wet roller 1 of sponge by delivery port 5 again, its water yield of dripping can be regulated by water regulator 9, can accurately control the amount of dripping according to different press mold speed, and can make the sponge roller evenly wetting and do not have other parts of water effect of flood, thereby can improve the flowability of dry film on circuit board, make dry film on various copper surface, all can obtain excellent combination, thereby the yields that improves wiring board manufacturer effectively reduce production costs.Below the wet roller 1 of sponge, drip tray 7 is housed in addition, and drip ring 8 is housed at the two ends of drip tray 7, thereby thereby the seepage that can prevent to drip influence other equipment on the press mold machine.

Claims

1. wet film coating device that the press mold machine is used, it is characterized in that: the sponge roller (1) that wets is installed on two end supports (2), being equipped with respectively in the wet roller (1) of sponge top can be with the weep pipe (3) of water droplet at the wet roller of sponge, weep pipe (3) is fixed on two end supports (2), and water inlet (4) arranged respectively, weep pipe is arranged a plurality of delivery ports (5), and weep pipe (3) joins by pipeline (10) and flow controller (9) and pressure pump (11).

2. the wet film coating device that press mold machine according to claim 1 is used is characterized in that: drip tray (7) is equipped with in wet roller (1) below of sponge, and drip ring (8) is equipped with at its drip tray two ends.