CN105682367B - A kind of preparation method of the outer-layer circuit with warped surface backboard - Google Patents
A kind of preparation method of the outer-layer circuit with warped surface backboard Download PDFInfo
- Publication number
- CN105682367B CN105682367B CN201610208245.2A CN201610208245A CN105682367B CN 105682367 B CN105682367 B CN 105682367B CN 201610208245 A CN201610208245 A CN 201610208245A CN 105682367 B CN105682367 B CN 105682367B
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- China
- Prior art keywords
- backboard
- preparation
- layer circuit
- warped surface
- circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention relates to a kind of preparation methods of the outer-layer circuit with warped surface backboard, include the following steps：A. lamination pressing；B. punching；C. pad pasting；D. single exposure；E. re-expose and the etching of f. outer layers.The present invention the outer-layer circuit with warped surface backboard preparation method, have the advantages that it is easy to operate, efficient, can be promoted circuit making precision.
Description
Technical field
The present invention relates to the outer-layer circuit production fields of backboard, and in particular to a kind of outer layer line with warped surface backboard
The preparation method on road.
Background technology
Backboard English is Backplane, is a kind of weight tray, can distribute power supply to the system pcb board inserted in thereon or
It is connected to each plate, is widely used in the important events such as communication, space flight, supercomputer, Medical Devices, military base station.
Backboard has size big, the high feature of plate thickness, and often occurs high frequency mixed pressure when stack-design, and lamination is caused to set
Timing generates dissymmetrical structure, and warpage occurs in plank after lamination.The plank of warpage is also easy to produce when light is imaged progress dry-method film coating
Dry film and base copper surface-bonded loosely the phenomenon that.At this point, gap is commonly formed in the interface of dry film and base copper, empty, bubble is residual
It stays, when being etched, once etching solution is into interface void, will result in broken string, the defects of notch.If bubble is too late
When remove, the problems such as light will appear scattering by bubble when exposure, cause vignette, and dry film remains.And it is stuck up if plate face has
Song, then the film combined with plate face not close, inhale vacuum after, the film can deform, and plate face image is caused also to deform.
Invention content
The purpose of the present invention is to provide it is a kind of it is easy to operate, efficient, can be promoted circuit make precision have stick up
The preparation method of the outer-layer circuit of curved surface backboard.
To solve the above problems, the technical solution adopted in the present invention is as follows：
A kind of preparation method of the outer-layer circuit with warped surface backboard, it is characterised in that include the following steps：
A. lamination pressing：Several core plates are taken, the circuit close quarters on the core plate are equipped with telltale mark, the core plate
Edge placement is equipped with first positioning hole, and above-mentioned core plate is aligned and is stacked together according to telltale mark, then carries out lamination pressure
It closes, obtains the backboard with warped surface；
B. punching：Using perforating press, the position with telltale mark is punched out on the backboard obtained by a steps, is obtained
To second location hole；
C. pad pasting：Dry film is taken, dry film is taken, last layer water mist is sprayed on the backboard two sides by b step processing, then will do
Film fits on backboard；
D. single exposure：It is positioned with the second location hole on the backboard by step c processing, is carried out using exposure machine
Exposure-processed；
E. re-expose：It is positioned with the first positioning hole on the backboard by Step d processing, is carried out using exposure machine
Exposure-processed；
F. outer layer etches：Outer layer etching is carried out to the backboard by step e processing, completes the making of outer-layer circuit.
In the present invention, preferred scheme is that the telltale mark is at least 2.
In the present invention, preferred scheme is that the telltale mark is 4,4 telltale marks be centrosymmetric setting or
It arranges in 2 × 2 matrix.
In the present invention, preferred scheme is to be punched out using X-RAY perforating press in the b step.
In the present invention, preferred scheme is to carry out painting water to dry film using water-absorbing sponge in the step c.
In the present invention, preferred scheme is that exposure uses LDI exposure machines in the Step d and step e.
In the present invention, preferred scheme is in the step c, and the one side with the backboard of dry film laminating is copper-based surfaces.
In the present invention, preferred scheme is that the circuit close quarters in the step a are line width, line on circuit on core plate
Away from the region no more than 3mil.
Compared with prior art, the invention has the advantages that：Exposure in the present invention (is used and is divided using re-expose
Regional exposure) form exposure, on core plate circuit close quarters be arranged positioning target, after lamination use X-RAY perforating press
Location hole is gone out, and partial exposure is carried out in this, as location hole, the circuit for improving regional area makes precision；Also,
Last layer water is applied to backboard before pad pasting, in this way, dry film rear be heated on fitting to backboard can be swollen, can will contain warping table
The depressed area in face is filled, and the bubble being detained between dry film and backboard is driven away, the stability of backboard and dry film is improved, is being exposed
Light time will not scatter, vignette, dry film residual and the follow-up film is caused to be combined untight problem with plate face；Come from entirety
It sees, method of the invention is easy to operate, and accuracy is high, to high yield rate, and then improves production efficiency.
The present invention is described in detail With reference to embodiment.
Specific implementation mode
A kind of preparation method of the outer-layer circuit with warped surface backboard, it is characterised in that include the following steps：
A. lamination pressing：Several core plates are taken, the circuit close quarters on the core plate (are arranged wired on core plate of the invention
Road, different location Density Distribution of the circuit on core plate is different, circuit close quarters specifically refer to line width on the circuit on core plate,
Region of the line-spacing no more than 3mil) it is equipped with telltale mark, the edge placement of the core plate is equipped with first positioning hole, by above-mentioned core
Plate is aligned and is stacked together according to telltale mark, then carries out lamination pressing, obtains the backboard with warped surface；
B. punching：Using perforating press, the position with telltale mark is punched out on the backboard obtained by a steps, is obtained
To second location hole；
C. pad pasting：Dry film is taken, dry film is taken, last layer water mist is sprayed on the backboard two sides by b step processing, then will do
Film fits on backboard；
D. single exposure：It is positioned with the second location hole on the backboard by step c processing, is carried out using exposure machine
Exposure-processed；
E. re-expose：It is positioned with the first positioning hole on the backboard by Step d processing, is carried out using exposure machine
Exposure-processed；
F. outer layer etches：Outer layer etching is carried out to the backboard by step e processing, completes the making of outer-layer circuit.
In the present invention, the telltale mark on core plate can be 1, can also be at least 2；It is further preferably described
Telltale mark be 4,4 telltale marks be centrosymmetric setting or in 2 × 2 matrix arrange, in this way can setting, energy
Enough promote the precision of post-exposure.
In the present invention, the machinery in prior art to wiring board punching may be used in the b step and carry out, including but not
It is limited to be punched out using X-RAY perforating press.
In the present invention, painting water is carried out to dry backboard in the step c, an existing past body surface coating liquid may be used
The mode of body carries out；In order to enable the water on dry film surface is more uniformly distributed, water-absorbing sponge may be used, painting water is carried out to backboard.
In the present invention, the machinery exposed to wiring board in the prior art that may be used is exposed in the Step d and step e
It carries out, including but not limited to LDI exposure machines.
In the present invention, preferred scheme is in the step c, and the one side with the backboard of dry film laminating is copper-based surfaces.
Exposure in the present invention in the form of re-expose (being exposed using subregion) using exposing, to the circuit on core plate
Positioning target is arranged in close quarters, goes out location hole using X-RAY perforating press after lamination, and carry out part in this, as location hole
Exposure, the circuit for improving regional area make precision；Also, last layer water is applied to backboard before pad pasting, in this way, dry film is pasting
It is heated after closing on backboard to be swollen, the depressed area containing warped surface can be filled, it will be stagnant between dry film and backboard
The bubble stayed is driven away, and the stability of backboard and dry film is improved, and will not be scattered in exposure, be caused vignette, dry film residual
And the follow-up film is combined untight problem with plate face；As a whole, method of the invention is easy to operate, and accuracy is high,
To high yield rate, and then improve production efficiency.
Embodiment 1
A kind of preparation method of the outer-layer circuit with warped surface backboard, it is characterised in that include the following steps：
A. lamination pressing：Several core plates are taken, the circuit close quarters on the core plate are equipped with 4 telltale marks, 4 positioning marks
Note be in 2 × 2 matrix arrangement；The edge placement of the core plate is equipped with first positioning hole, by above-mentioned core plate according to telltale mark
It is aligned and is stacked together, then carry out lamination pressing, obtain the backboard with warped surface；
B. punching：Using X-RAY perforating press, the position with telltale mark is rushed on the backboard obtained by a steps
Hole obtains second location hole；
C. pad pasting：Dry film is taken, dry film is taken, last layer water mist is sprayed on the backboard two sides by b step processing, then will do
Film fits on backboard；The one side of the backboard of dry film laminating is copper-based surfaces；
D. single exposure：It is positioned with the second location hole on the backboard by step c processing, utilizes LDI exposure machines
It is exposed processing；
E. re-expose：It is positioned with the first positioning hole on the backboard by Step d processing, utilizes LDI exposure machines
It is exposed processing；
F. outer layer etches：Outer layer etching is carried out to the backboard by step e processing, completes the making of outer-layer circuit.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (7)
1. a kind of preparation method of the outer-layer circuit with warped surface backboard, it is characterised in that include the following steps：
A. lamination pressing：Several core plates are taken, the circuit close quarters on the core plate are equipped with telltale mark, the edge of the core plate
Position is equipped with first positioning hole, and above-mentioned core plate is aligned and is stacked together according to telltale mark, lamination pressing is then carried out, obtains
To the backboard with warped surface；
B. punching：Using perforating press, the position with telltale mark is punched out on the backboard obtained by a steps, obtains the
Two location holes；
C. pad pasting：Dry film is taken, last layer water mist is sprayed on the backboard two sides by b step processing, then by dry film laminating to the back of the body
On plate；
D. single exposure：It is positioned with the second location hole on the backboard by step c processing, is exposed using exposure machine
Processing；
E. re-expose：It is positioned with the first positioning hole on the backboard by Step d processing, is exposed using exposure machine
Processing；
F. outer layer etches：Outer layer etching is carried out to the backboard by step e processing, completes the making of outer-layer circuit；
Painting water is carried out to backboard using water-absorbing sponge in the step c.
2. the preparation method of the outer-layer circuit with warped surface backboard according to claim 1, it is characterised in that：It is described fixed
Position label is at least 2.
3. the preparation method of the outer-layer circuit with warped surface backboard according to claim 1, it is characterised in that：It is described fixed
Position is labeled as 4, and 4 telltale marks are centrosymmetric setting.
4. the preparation method of the outer-layer circuit with warped surface backboard according to claim 1, it is characterised in that：The b
It is punched out using X-RAY perforating press in step.
5. the preparation method of the outer-layer circuit with warped surface backboard according to claim 1, it is characterised in that：The d
Exposure uses LDI exposure machines in step and step e.
6. the preparation method of the outer-layer circuit with warped surface backboard according to claim 1, it is characterised in that：The c
In step, the one side with the backboard of dry film laminating is copper-based surfaces.
7. the preparation method of the outer-layer circuit with warped surface backboard according to claim 1, it is characterised in that：The step
Circuit close quarters in rapid a are the region of line width, line-spacing no more than 3mil on the circuit on core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208245.2A CN105682367B (en) | 2016-04-01 | 2016-04-01 | A kind of preparation method of the outer-layer circuit with warped surface backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208245.2A CN105682367B (en) | 2016-04-01 | 2016-04-01 | A kind of preparation method of the outer-layer circuit with warped surface backboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682367A CN105682367A (en) | 2016-06-15 |
| CN105682367B true CN105682367B (en) | 2018-10-19 |
Family
ID=56308499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610208245.2A Active CN105682367B (en) | 2016-04-01 | 2016-04-01 | A kind of preparation method of the outer-layer circuit with warped surface backboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105682367B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102378494A (en) * | 2011-10-31 | 2012-03-14 | 深南电路有限公司 | Resistance welding processing method for circuit board |
| CN102485482A (en) * | 2010-12-03 | 2012-06-06 | 珠海丰洋化工有限公司 | Circuit board filming equipment and circuit board wet filming method |
| CN103476203A (en) * | 2013-09-13 | 2013-12-25 | 番禺南沙殷田化工有限公司 | Wet process film pasting method of flexible printed circuit board |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
-
2016
- 2016-04-01 CN CN201610208245.2A patent/CN105682367B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102485482A (en) * | 2010-12-03 | 2012-06-06 | 珠海丰洋化工有限公司 | Circuit board filming equipment and circuit board wet filming method |
| CN102378494A (en) * | 2011-10-31 | 2012-03-14 | 深南电路有限公司 | Resistance welding processing method for circuit board |
| CN103476203A (en) * | 2013-09-13 | 2013-12-25 | 番禺南沙殷田化工有限公司 | Wet process film pasting method of flexible printed circuit board |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN105682367A (en) | 2016-06-15 |
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