CN1968575A - Wet film coating process for flexible circuit board - Google Patents
Wet film coating process for flexible circuit board Download PDFInfo
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- CN1968575A CN1968575A CN 200510101656 CN200510101656A CN1968575A CN 1968575 A CN1968575 A CN 1968575A CN 200510101656 CN200510101656 CN 200510101656 CN 200510101656 A CN200510101656 A CN 200510101656A CN 1968575 A CN1968575 A CN 1968575A
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- copper foil
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- warm water
- circuit board
- flexible circuit
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Abstract
The invention relates to a wet pasting method of flexible circuit board, wherein it comprises that: (1), heating copper foil at warm temperature at 45-65Deg. C; wetting, increasing the temperature, and forming worm water film on face; (2), feeding copper foil into pasting machine; (3); pasting machine pastes film on the face with warm water film. The invention can reduce viscosity and increase flow property, to make the connection between film and copper foil stable and integral.
Description
Affiliated technical field
The present invention relates to the film coating process in the flexible circuit board making, relate in particular to the wet film coating process in the flexible circuit board making.
Background technology
Along with high density flexible wiring board (Flexible Printed Circuit is called for short FPC) high speed development in recent years, the continuous increase of line density and variation, the multiple stratification of interlayer structure make traditional line manufacturing process in the face of more challenge.Correspond to the manufacture craft of traditional circuit plate, the technology difficulty of high density flexible wiring board, complexity can be described as and be multiplied.Pad pasting is the one procedure during flexible circuit board is made, and the quality that film process is handled directly has influence on the quality of pad pasting effect, also can produce very big influence to subsequent handling (development, exposure, etching etc.).Usually, because defectives such as rough and uneven in surface, the pin hole of copper foil surface, depression and sliding injury can cause the anastomose property of dry film and Copper Foil not good, promptly may in follow-up operation, cause broken string, breach, stay copper etc. bad.
The film coating process of more traditional flexible circuit board is a dry-method film coating process, and dry-method film coating process is characterised in that: when Copper Foil was carried out the hot pressing pad pasting, copper foil surface was dry.Traditional dry-method film coating process is simple to operate, but can not remove the air that copper foil surface is detained because of defectives such as rough and uneven in surface, pin hole, depression and sliding injuries effectively when pad pasting, so that the anastomose property of dry film and Copper Foil is not good, the fraction defective height.
Afterwards, along with the development and the industry requirement more and more higher of flexible circuit board self to the flexible circuit board film coating process, another kind of film coating process, wet film coating process arises at the historic moment.Wet film coating process promptly is to utilize special-purpose laminator, forms water membrane in copper foil surface before pad pasting.Utilize moisture film to combine the flowability that forms with the solubility dry film, under extruding, remove the gas at Copper Foil depression position, thereby can on copper foil surface, form the coating performance similar to the liquid photoresist.
Wet film coating process can promote the coating performance of dry film and Copper Foil effectively, but, existing wet film coating process is analyzed, can find, still there is following weak point in it, promptly when pad pasting, dry film is subjected to hot pressing roller heat temperature raising (about 100 ℃) will be higher than room temperature, and (room temperature under normal circumstances can not surpass 37 ℃ of human body temperature, typically refer to the temperature about 20 ℃), and Copper Foil and moisture film still keep room temperature, therefore the dry film under the high temperature is affixed on room temperature when having on the Copper Foil of moisture film, there is bigger temperature difference, make that the applying between dry film and the Copper Foil is stable inadequately, complete, thus can't be effectively with the indentation of flexible circuit board copper foil surface, trachoma, the gas that is detained on the positions such as pit thoroughly extrudes, and then causes the product percent of pass of flexible PCB lower.
Summary of the invention
The wet film coating process that the purpose of this invention is to provide a kind of flexible circuit board, be used for improving the pad pasting effect of dry film, make that the applying between dry film and the Copper Foil is stable, complete, thereby the gas that is detained on the positions such as effective indentation with the flexible circuit board copper foil surface, trachoma, pit extrudes, and then improves the product percent of pass of flexible circuit board.
For achieving the above object, the present invention has disclosed a kind of wet film coating process of flexible circuit board, comprise following technological process: (1) is put into 45 ℃～65 ℃ warm water with Copper Foil and is heated, adds wet process, makes the Copper Foil self-temperature raise, and form the warm water film on copper foil surface; (2) will heat up and Copper Foil that the surface has a warm water film is sent into laminator; (3) through laminator, laminator is affixed on dry film and heats up and carry on the surface of Copper Foil of warm water film.
As mentioned above, one aspect of the present invention is softened dry film resistance agent by the warm water film, to reach the purpose that reduces dry film viscosity, the warm water of warm water film plays a part plasticizer for dry film photoresist on the other hand, this two aspect all can increase the flowability of dry film, make dry film improve at the deposited shape degree of copper foil surface, applying between dry film and the Copper Foil is stable, complete, thereby make the water on the copper foil surface effectively replace the gas that is detained on the positions such as indentation, trachoma, pit, and then improve the product percent of pass of flexible PCB.
Description of drawings
The present invention is described in further detail below in conjunction with drawings and Examples.
Fig. 1 carries out the schematic diagram of pad pasting for utilization wet film coating process of the present invention.
Fig. 2 is the flow chart of wet film coating process of the present invention.
The description of reference numerals of each element is as follows among the figure: 1. dry film, and 2. Copper Foil, 11. dry film rollers, 12,13. film feeding rollers, 14,15. diaphragm rolling rollers, 21. containers, 22. send the Copper Foil roller, 31. hot pressing rollers.
Embodiment
By describing technology contents of the present invention in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
At first, introduce the principle of the wet film coating process of flexible circuit board of the present invention: at first, Copper Foil is soaked, make Copper Foil self temperature raise, and form the warm water film in copper foil surface in warm water.Then, when Copper Foil is carried out pad pasting, soften dry film resistance agent by the warm water film on the one hand, to reach the purpose that reduces dry film viscosity, the warm water of warm water film plays a part plasticizer for dry film photoresist on the other hand, this two aspect all can increase the flowability of dry film, make dry film improve at the deposited shape degree of copper foil surface, applying between dry film and the Copper Foil is stable, complete, thereby make the water on the copper foil surface effectively replace the gas that is detained on the positions such as indentation, trachoma, pit, and then improve the product percent of pass of flexible PCB.
Under request in person to cooperate and consult Fig. 1 and Fig. 2, the technological process of the wet film coating process of flexible circuit board of the present invention is described in detail in detail.
(1) Copper Foil is put into warm water and heated, add wet process, make the Copper Foil self-temperature raise, and on copper foil surface, form the warm water film.Specific implementation method is: with container 21 storage warm water, this warm water is pure water, heat by the reflux cycle heater, temperature is controlled between 45 ℃～65 ℃, Copper Foil 2 is put into container 21, it was soaked in warm pure water 3～5 minutes, thereby Copper Foil 2 is heated, adds wet process simultaneously, make the Copper Foil self-temperature raise, and on copper foil surface, form the warm water film.
(2) will heat up and Copper Foil that the surface has a warm water film is sent into laminator.Specific implementation method is: after Copper Foil 2 soaked in warm water, temperature raise and the surface carries the warm water film, and and then the Copper Foil 2 that this intensification back and surface carry the warm water film is admitted in the laminator, prepares to stick dry film 1.
(3) through laminator, laminator is affixed on dry film and heats up and carry on the surface of Copper Foil of warm water film.Specific implementation method is: after Copper Foil 2 enters laminator, and will be by sending Copper Foil roller 22 to be sent to hot pressing roller 31 places.Meanwhile, the dry film of being sent by dry film roller 11 1 will be sent to hot pressing roller 31 places through film feeding roller 12,13, and wherein, in the dry film transport process, the polyethylene protective film on dry film 1 surface is by 14,15 rollings of diaphragm rolling roller.When between Copper Foil 2 is by hot pressing roller 31, passing through, Copper Foil 2 contacts with dry film 1 and through high temperature, the HIGH PRESSURE TREATMENT of hot pressing roller 31, dry film 1 is close on Copper Foil 2 surfaces, and the warm water of inciting somebody to action therebetween extrudes, thus the gas that is detained on the positions such as the indentation on flexible circuit board Copper Foil 2 surfaces, trachoma, pit is extruded, thereby finish pad pasting.
In order to embody the beneficial effect of wet film coating process of the present invention, the inventor has carried out following experiment to this warm water wet film coating process.Wherein, processing object: have dynamic layered four layers of wiring board of flexibility; Quantity: 1200, i.e. 600 of normal-temperature water (20 ℃) processing, 600 of warm water (55 ℃) processing.Finish pad pasting at the dry film that uses same a certain model, and after development under the identical conditions, exposure and etching, institute's assay is as follows:
| Water temperature condition | The Copper Foil broken string | The Copper Foil breach | Copper Foil stays copper | The Copper Foil fraction defective |
| Normal-temperature water (20 ℃) | 5.1％ | 2.9％ | 4.4％ | 12.4％ |
| Warm water (55 ℃) | 3.6％ | 2.1％ | 3.5％ | 9.2％ |
As mentioned above, the wet film coating process of use flexible circuit board of the present invention can effectively improve the flowability of dry film, make dry film can spread on copper foil surface more fully, make product percent of pass be highly improved (in above-mentioned test, promoted 3.2%), thus the input of producing the bad production cost that causes because of pad pasting reduced.
Claims (4)
1. the wet film coating process of a flexible circuit board is characterized in that: comprise following technological process:
(1) warm water of Copper Foil being put into 45 ℃～65 ℃ heats, adds wet process, makes the Copper Foil self-temperature raise, and form the warm water film on copper foil surface;
(2) will heat up and Copper Foil that the surface has a warm water film is sent into laminator;
(3) through laminator, laminator is affixed on dry film and heats up and carry on the surface of Copper Foil of warm water film.
2. the wet film coating process of flexible circuit board as claimed in claim 1, it is characterized in that: described 45 ℃～65 ℃ warm water is pure water, this pure water is by a container storage, and by the heating of reflux cycle heater.
3. the wet film coating process of flexible circuit board as claimed in claim 1 is characterized in that: described Copper Foil is put into described 45 ℃～65 ℃ warm water heating, was added wet process 3～5 minutes.
4. the wet film coating process of flexible circuit board as claimed in claim 1 is characterized in that: heat up and Copper Foil that the surface has a warm water film during through laminator, the hot pressing roller of laminator is affixed on dry film on the copper foil surface under the condition of heating, pressurization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510101656 CN1968575A (en) | 2005-11-17 | 2005-11-17 | Wet film coating process for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510101656 CN1968575A (en) | 2005-11-17 | 2005-11-17 | Wet film coating process for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1968575A true CN1968575A (en) | 2007-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510101656 Pending CN1968575A (en) | 2005-11-17 | 2005-11-17 | Wet film coating process for flexible circuit board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626665B (en) * | 2009-08-07 | 2011-01-26 | 奉化市东欣仪表有限公司 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102079158A (en) * | 2010-11-11 | 2011-06-01 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN101772270B (en) * | 2009-12-31 | 2011-11-09 | 广州杰赛科技股份有限公司 | Preprocessing method for image transfer of flexible PCB (printed circuit board) |
| CN102485482A (en) * | 2010-12-03 | 2012-06-06 | 珠海丰洋化工有限公司 | Circuit board filming equipment and circuit board wet filming method |
| WO2015035754A1 (en) * | 2013-09-13 | 2015-03-19 | 番禺南沙殷田化工有限公司 | Wet process-based film pasting method for flexible printed circuit board |
| CN106102332A (en) * | 2016-07-07 | 2016-11-09 | 深圳市景旺电子股份有限公司 | A kind of wiring board and method for adhering film thereof |
| CN109714901A (en) * | 2019-01-04 | 2019-05-03 | 珠海杰赛科技有限公司 | Wet film coating processes the method and rigid-flex combined board of the rigid-flex combined board of outer layer flexibility |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN109714904B (en) * | 2019-02-15 | 2021-08-13 | 福建世卓电子科技有限公司 | Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board |
| CN115515329A (en) * | 2022-09-02 | 2022-12-23 | 广州添利电子科技有限公司 | Method for manufacturing signal transmission line layer on surface of inner-layer copper foil |
-
2005
- 2005-11-17 CN CN 200510101656 patent/CN1968575A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626665B (en) * | 2009-08-07 | 2011-01-26 | 奉化市东欣仪表有限公司 | Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
| CN101772270B (en) * | 2009-12-31 | 2011-11-09 | 广州杰赛科技股份有限公司 | Preprocessing method for image transfer of flexible PCB (printed circuit board) |
| CN101961942A (en) * | 2010-08-09 | 2011-02-02 | 代芳 | Circuit board wet-lamination method and device |
| CN102079158A (en) * | 2010-11-11 | 2011-06-01 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102079158B (en) * | 2010-11-11 | 2013-06-19 | 东莞红板多层线路板有限公司 | Circuit board film-adhering method |
| CN102485482A (en) * | 2010-12-03 | 2012-06-06 | 珠海丰洋化工有限公司 | Circuit board filming equipment and circuit board wet filming method |
| WO2015035754A1 (en) * | 2013-09-13 | 2015-03-19 | 番禺南沙殷田化工有限公司 | Wet process-based film pasting method for flexible printed circuit board |
| CN106102332A (en) * | 2016-07-07 | 2016-11-09 | 深圳市景旺电子股份有限公司 | A kind of wiring board and method for adhering film thereof |
| CN106102332B (en) * | 2016-07-07 | 2019-01-01 | 深圳市景旺电子股份有限公司 | A kind of wiring board and its method for adhering film |
| CN109714901A (en) * | 2019-01-04 | 2019-05-03 | 珠海杰赛科技有限公司 | Wet film coating processes the method and rigid-flex combined board of the rigid-flex combined board of outer layer flexibility |
| CN109714901B (en) * | 2019-01-04 | 2022-03-22 | 珠海杰赛科技有限公司 | Method for processing outer-layer flexible rigid-flex board by wet film pasting and rigid-flex board |
| CN109714904B (en) * | 2019-02-15 | 2021-08-13 | 福建世卓电子科技有限公司 | Direct dry film pasting process for hollowed-out area of hollowed-out flexible circuit board |
| CN112020233A (en) * | 2020-08-28 | 2020-12-01 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN112020233B (en) * | 2020-08-28 | 2021-11-05 | 李钟波 | Film coating module for PCB micro-defect plate |
| CN115515329A (en) * | 2022-09-02 | 2022-12-23 | 广州添利电子科技有限公司 | Method for manufacturing signal transmission line layer on surface of inner-layer copper foil |
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