CN102077700A - 电路模块及其制造方法 - Google Patents
电路模块及其制造方法 Download PDFInfo
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- CN102077700A CN102077700A CN2009801248073A CN200980124807A CN102077700A CN 102077700 A CN102077700 A CN 102077700A CN 2009801248073 A CN2009801248073 A CN 2009801248073A CN 200980124807 A CN200980124807 A CN 200980124807A CN 102077700 A CN102077700 A CN 102077700A
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- insulator layer
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- circuit module
- manufacture method
- cutting machine
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- 229920005989 resin Polymers 0.000 claims abstract description 34
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- 238000004528 spin coating Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 45
- 230000007547 defect Effects 0.000 description 11
- 208000034189 Sclerosis Diseases 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
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- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- 238000000638 solvent extraction Methods 0.000 description 1
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Abstract
本发明提供一种能减少在屏蔽层上产生没有涂布导电性树脂的缺陷区域的电路模块及其制造方法。准备母基板(112)。在母基板(112)的主面(S1)上安装多个电子元器件(14a)。以覆盖母基板(112)的主面(S1)和电子元器件(14a)的方式形成绝缘体层(116)。对绝缘体层(116)进行切削,以在绝缘体层(116)的主面(S2)上形成槽(20)和突起(22),且使得绝缘体层(116)的厚度成为厚度(H)。在绝缘层(116)的主面(S2)上涂布导电性树脂以形成屏蔽层(118)。对形成有绝缘体层(116)和屏蔽层(118)的母基板(112)进行分割,得到多个电路模块。
Description
技术领域
本发明涉及电路模块及其制造方法,更特定而言,涉及在基板上安装电子元器件的电路模块及其制造方法。
背景技术
作为现有的电路模块及其制造方法相关联的发明,已知有例如专利文献1所记载的电路模块的制造方法。下面,参照附图,对专利文献1所涉及的电路模块的制造方法进行说明。图14是专利文献1所记载的电路模块500的制造方法的工序剖视图。
首先,如图14(a)所示,在基板502上安装电子元器件504。其次,如图14(b)所示,形成绝缘层506,以覆盖基板502的主面和电子元器件504。接下来,如图14(c)所示,形成切槽508。此时,在切槽508的底部形成宽度比切槽508要窄的槽即前端部508a。接下来,如图14(d)所示,在绝缘层506上和切槽508内涂布导电性树脂,形成屏蔽层510。最后,通过切割装置,将基板502和屏蔽层510切削掉比前端部508a要宽的宽度W。由此,如图14(e)所示,将集合基板分割成独立的电路模块500。
根据以上那样的电路模块500的制造方法,在形成屏蔽层510时,切槽508内的空气滞留在前端部508a。而且,由于在分割电路模块500时将前端部508a削掉,因此,可减少介于基板502、绝缘层506与屏蔽层510之间的空气。其结果是,提高屏蔽层510与基板502、绝缘层506的密接性。
然而,如图14所示,形成有屏蔽层510的绝缘层506的主面是平坦的。若在这样平坦的绝缘层506上涂布糊状的导电性树脂,则会延伸得过薄。其结果是,在电路模块500的制造方法中,在屏蔽层510有可能产生没有涂布导电性树脂的缺陷区域。
专利文献1:日本专利特开2008-42152号公报
发明内容
因此,本发明的目的在于提供一种能减少在屏蔽层产生没有涂布导电性树脂的缺陷区域的电路模块及其制造方法。
本发明的方式1所涉及的电路模块的制造方法的特征在于,包括:准备母基板的工序;在所述母基板的主面上安装多个电子元器件的工序;以覆盖所述母基板的主面和所述多个电子元器件的方式形成绝缘体层的工序;对该绝缘体层进行切削的工序,以在所述绝缘体层的主面上形成凹凸,且使得该绝缘体层的厚度成为预定厚度;在所述绝缘层的主面上涂布导电性树脂以形成屏蔽层的工序;以及对形成有所述绝缘体层和所述屏蔽层的所述母基板进行分割以得到多个电路模块的工序。
本发明的方式2所涉及的电路模块的特征在于,包括:基板;安装在所述基板的主面上的电子元器件;覆盖所述基板的主面和所述电子元器件、且在主面上设置有凹凸的绝缘体层;以及由设置在所述绝缘体层的主面上的导电性树脂构成的屏蔽层。
根据本发明,能减少在屏蔽层产生没有涂布导电性树脂的缺陷区域的情况。
附图说明
图1是本发明的一个实施方式所涉及的电路模块的外观立体图。
图2是沿图1的电路模块的A-A的剖视结构图。
图3是电路基板的分解立体图。
图4是制作电路模块时的外观立体图。
图5是制作电路模块时的外观立体图。
图6是制作电路模块时的外观立体图。
图7是电路模块的工序剖视图。
图8是制作电路模块时的外观立体图。
图9是电路模块的工序剖视图。
图10是制作电路模块时的外观立体图。
图11是电路模块的工序剖视图。
图12是变形例所涉及的电路模块的剖视结构图。
图13是变形例所涉及的电路模块的工序剖视图。
图14是专利文献1所记载的电路模块的制造方法的工序剖视图。
具体实施方式
下面,参照附图,对本发明的实施方式所涉及的电路模块及其制造方法进行说明。
(电路模块的结构)
下面,参照附图,对本发明的一个实施方式所涉及的电路模块的结构进行说明。图1是本发明的一个实施方式所涉及的电路模块10的外观立体图。但是,图1是透视一部分来图示的,从而能理解其内部结构。图2是沿图1的电路模块10的A-A的剖视结构图。下面,在大体成长方体形状的电路模块10中,将高度方向定义为z轴方向。此外,将沿z轴方向俯视时的短边方向定义为x轴方向,将长边方向定义为y轴方向。x轴、y轴、以及z轴相互正交。
如图1所示,电路模块10具有电路基板12、电子元器件14a、14b、绝缘体层16、以及屏蔽层18。电路基板12是内置电路、且具有外部电极的印刷基板。下面,参照图3,说明电路基板12的结构。图3是电路基板12的分解立体图。
电路基板12是所谓的多层印刷基板,包含绝缘体层30a~30d、外部电极32、34、38、40、布线36、以及过孔导体V1~V10、接地导体G,在z轴方向的正方向侧具有主面S1。在图3中,关于外部电极32、34、38、40、布线36、以及过孔导体V1~V10,仅对代表性部分标注参考标号。
绝缘体层30a~30d成长方形形状,由环氧玻璃等构成。另外,绝缘体层30a~30d也可由陶瓷构成。下面,将绝缘体层30a~30d的z轴方向的正方向侧的主面称为表面,将绝缘体层30a~30d的z轴方向的负方向侧的主面称为背面。
在绝缘体层30a的表面设置16个外部电极32。在外部电极32上安装有电子元器件14a。在绝缘体层30a的表面设置4个外部电极34。在外部电极34上安装有电子元器件14b。
过孔导体V1设置成沿z轴方向贯穿绝缘体层30a,在z轴方向的正方向侧的端部与外部电极32相连接。过孔导体V2设置成沿z轴方向贯穿绝缘体层30a,在z轴方向的正方向侧的端部与外部电极34相连接。
接地导体G是覆盖绝缘体层30b的表面的大体整个表面的导体层。所以,如图3所示,接地导体G与绝缘体层30b的四条边相接。但是,在接地导体G上设置有空白部B1、B2,该空白部B1、B2没有设置导体层。过孔导体V4、V5设置成分别在沿z轴方向俯视时、与空白部B1、B2重叠的位置沿z轴方向贯穿绝缘体层30b。由此,过孔导体V4、V5与接地导体G绝缘。过孔导体V4、V5的z轴方向的正方向侧的端部分别与在沿z轴方向俯视时重叠的过孔导体V1、V2相连接。此外,与过孔导体V4、V5相连接的过孔导体V1、V2以外的过孔导体V1、V2的负方向侧的端部与接地导体G相连接。
过孔导体V3、V6设置成沿z轴方向贯穿绝缘体层30b,在z轴方向的正方向侧的端部与接地导体G相连接。此外,过孔导体V3、V6分别设置在沿z轴方向俯视时与过孔导体V1、V2重叠的位置。
过孔导体V7设置成沿z轴方向贯穿绝缘体层30c,在z轴方向的正方向侧的端部与过孔导体V3或过孔导体V4相连接。此外,过孔导体V8设置成沿z轴方向贯穿绝缘体层30c,在z轴方向的正方向侧的端部与过孔导体V5或过孔导体V6相连接。
布线36设置于绝缘体层30c的表面,将过孔导体V7彼此之间或过孔导体V7、V8之间连接。
过孔导体V9设置成沿z轴方向贯穿绝缘体层30d,在z轴方向的正方向侧的端部与过孔导体V7相连接。此外,过孔导体V10设置成沿z轴方向贯穿绝缘体层30d,在z轴方向的正方向侧的端部与过孔导体V8相连接。
在绝缘体层30d的背面设置16个外部电极38。外部连接38与过孔导体V9的z轴方向的负方向侧的端部相连接。此外,在绝缘体层30d的背面设置4个外部电极40。外部连接40与过孔导体V10的z轴方向的负方向侧的端部相连接。在将电路基板12安装在母板上时,外部电极38、40与母板的外部电极相连接。而且,对与接地导体G电连接的外部电极38、40施加接地电位。
另外,对于电路基板12的内部结构,由于除设置有接地导体G这一点以外,不是特别重要,因此,省略进一步的说明。但是,电路基板12例如也可内置电容器、线圈、微带线等。
电子元器件14a例如是半导体集成电路,像图1和图2所示的那样,安装在电路基板12的主面S1上。在电子元器件14a的z轴方向的负方向侧的主面上设置有多个(例如16个)外部电极(未图示),通过焊料等与图3的外部电极32相连接。
电子元器件14b例如是噪声滤波器等贴片型电子元器件,像图1和图2所示的那样,安装在电路基板12的主面S1上。在电子元器件14b的z轴方向的负方向侧的主面上设置有多个(例如4个)外部电极(未图示),通过焊料等与图3的外部电极34相连接。
绝缘体层16由绝缘性树脂(例如环氧树脂)形成,像图1和图2所示的那样,覆盖电路基板12的主面S1和电子元器件14a、14b。绝缘体层16起到如下作用:保护电路基板12的主面S1和电子元器件14a、14b,并且,将电子元器件14a、14b与后述的屏蔽层18绝缘。
而且,在位于绝缘体层16的z轴方向的正方向侧的主面S2上设置有凹凸。更详细而言,凹凸由沿y轴方向延伸的多个槽20和多个突起22形成。槽20和突起22设置成在x轴方向交替排列。此外,多个槽20像图2所示的那样,在与y轴方向垂直的截面具有相同形状,多个突起22像图2所示的那样,在与y轴方向垂直的截面形成相同形状。而且,多个槽20和多个突起22在x轴方向等间隔排列。即,在主面S2上设置有具有周期性结构的凹凸。另外,在图1和图2中,为了易于理解凹凸的情况,将槽20和突起22的起伏画得比实际要夸张。
屏蔽层18由设置在绝缘体层的主面S2上的导电性树脂形成。由于屏蔽层18具有较薄的膜厚,因此,在屏蔽层18的主面上形成与绝缘体层16的主面的凹凸相仿的凹凸。此外,屏蔽层18覆盖绝缘体层16的位于x轴方向两侧的侧面。
此外,屏蔽层18覆盖电路基板12的位于x轴方向两侧的部分侧面。具体而言,在电路基板12的主面S1的x轴方向的两侧,设置有像图1和图2所示那样的高低差。即,通过将主面S1的x轴方向的两侧的一部分削掉,来形成像图2所示那样的面S4、S5,该面S4、S5位于主面S1的z轴方向的负方向侧,且朝着z轴方向的正方向侧。面S4位于x轴方向的负方向侧,面S5位于x轴方向的正方向侧。此外,形成面S6来连接主面S1和面S4,并且,形成面S7来连接主面S1和面S5。面S6、S7是与x轴方向正交的面。另外,在面S6与绝缘体层16的x轴方向的负方向侧的侧面之间处于不存在高低差的一个面的状态。同样地,在面S7与绝缘体层16的x轴方向的正方向侧的侧面之间处于不存在高低差的一个面的状态。
如图2所示,接地导体G从这些面S6、S7露出。而且,屏蔽层18覆盖面S4~S7。由此,屏蔽层18与接地导体G相连接。即,对接地导体G施加接地电位。其结果是,屏蔽层18防止噪声辐射到电路模块10外、或噪声侵入到电路模块10内。
(电路模块的制造方法)
下面,参照附图说明电路模块10的制造方法。图4至图6、图8、以及图10是制作电路模块10时的外观立体图。图7、图9、以及图11是电路模块10时的工序剖视图。
首先,准备图4所示的母基板112。母基板112是将多个电路基板12配置成矩阵状的集合基板。在图4中,排列24个电路基板12。另外,母基板112可通过制作来准备,也可通过购买成品来准备。另外,由于母基板112是一般的基板,因此,省略对其制造方法的说明。
接下来,如图4所示,在母基板112的主面S1上安装多个电子元器件14a、14b。具体而言,通过点划线将母基板112划分成多个电路基板12。在图4的点划线中,沿x轴方向延伸的点划线是切割线CLx,沿y轴方向延伸的点划线是切割线CLy。切割线CLx、CLy表示母基板112的分割线。然后,在各电路基板12的主面S1上各将一个电子元器件14a、14b进行焊料安装。
接下来,如图5所示,形成绝缘体层116以覆盖母基板112的主面S1和多个电子元器件14a、14b。具体而言,通过涂布器(dispenser)在母基板112的主面S1和多个电子元器件14a、14b上涂布绝缘性树脂。然后,将绝缘性树脂加热,使其硬化。
接下来,如图6和图7所示,对绝缘体层116进行切削,以在绝缘体层116的主面S2上形成凹凸,且使得绝缘体层116的厚度成为预定厚度H。在本实施方式中,如图7所示,在绝缘体层116的主面S2上形成沿y轴方向延伸的多条槽20和多条突起22。而且,如图7所示,多条槽20的间隔L2和多条突起22的间隔L2小于电路模块10在x轴方向的宽度L1。
进一步具体地说明对绝缘体层116的切削。在切削绝缘体层116的工序中,如图6所示,在绝缘体层116的主面S2上使切割机D1朝y轴方向的负方向侧移动。之后,将切割机D1朝x轴方向的正方向侧挪动。然后,在绝缘体层116的主面S2上,使切割机D1朝y轴方向的负方向侧移动。通过重复该工序,对绝缘体层116的主面S2的整个表面进行切削。
这里,如图7所示,切割机D1的切削面F具有凹凸,具体而言,具有凸部F1和凹部F2。凸部F1朝z轴方向的负方向侧相对突出,凹部F2朝z轴方向的正方向侧相对凹陷。而且,凹部F2位于凸部F1的x轴方向的正方向侧。切割机D1的切削面F具有这种结构的理由如下。
切割机D1的切削面F在新品的状态下是平坦的。然而,切割机D1如上述那样,朝y轴方向的负方向侧移动,且朝x轴方向的正方向侧挪动。因而,切割机D1在最开始切削绝缘体层116时,与绝缘体层116的主面S2的x轴方向的负方向侧的边相接触。此时,切割机D1并非以整个切削面F与绝缘体层116相接触,而以位于x轴方向的负方向侧的凹部F2与绝缘体层116相接触。因此,凹部F2比凸部F1更先磨损。其结果是,如图7所示,切削面F具有凸部F1和凹部F2。
在通过具有上述那样的切削面F的切割机D1来切削绝缘体层116时,用凸部F1对绝缘体层116相对多削掉一点而形成槽20。此外,用凹部F2对绝缘体层116相对少削掉一点而形成突起22。
此外,如图7所示,切割机D1在x轴方向的宽度L4小于电路模块10在x轴方向的宽度L1。由此,对电路模块10形成具有周期性结构的多条槽20和多条突起22。此外,如图7所示,将切割机D1朝x轴方向的正方向侧挪动的宽度L3小于切割机D1在x轴方向的宽度L4。由此,切割机D1通过绝缘体层116的主面S 1的区域有重复。由此,防止残留未切削绝缘体层116的区域。
另外,在图7中,绝缘体层116的厚度H是从母基板112的主面S1到绝缘体层116的主面S2的距离的平均值。
接下来,如图8所示,利用具有比切割机D1要窄的宽度的切割机D2,形成沿y轴方向延伸的多个槽42。具体而言,沿图6的切割线CLy,使切割机D2朝y轴方向的负方向侧行进。这时,如图9所示,以槽42的底面未到达母基板112的z轴方向的负方向侧的主面、且比接地导体G更位于z轴方向的负方向侧的方式形成槽42。由此,在槽42的内周面露出接地导体G。
接下来,如图10和图11所示,在绝缘体层116的主面S2上和槽42的内周面涂布导电性树脂,形成屏蔽层118。通过旋涂法来涂布导电性树脂。具体而言,在旋转台上配置母基板112,并使母基板112以预定角速度旋转。然后,将浆料状的导电性树脂滴下到绝缘体层116的中心。由此,导电性树脂因离心力而较薄地扩展到绝缘体层116的整个主面S2。此时,导电性树脂滞留在槽20内,或被突起22挂住,同时慢慢地扩展到绝缘体层116的整个主面S2。由此,防止导电性树脂过度延伸、而在屏蔽层118上产生没有涂布导电性树脂的缺陷区域。之后,使屏蔽层118硬化。另外,在屏蔽层118的主面S3上形成与主面S2的凹凸相仿的凹凸。
接下来,对形成有绝缘体层116和屏蔽层118的母基板112进行分割,得到多个电路模块10。具体而言,使具有比切割机D2的宽度要窄的宽度的切割机沿切割线CLx、CLy行进,对母基板112进行切割。经过以上的工序,完成图1和图2所示的电路模块10。
(效果)
根据以上那样的电路模块10及其制造方法,能减少在屏蔽层18上产生没有涂布导电性树脂的缺陷区域。更详细而言,在专利文献1所记载的电路模块500的制造方法中,如图14所示,形成有屏蔽层510的绝缘层506的主面是平坦的。若在这样平坦的绝缘层506上涂布糊状的导电性树脂,则会过薄地延伸。其结果是,在电路模块500的制造方法中,在屏蔽层510上有可能产生没有涂布导电性树脂的缺陷区域。
另一方面,在电路模块10及其制造方法中,在绝缘体层116的主面S2上形成凹凸(槽20和突起22)。因此,例如在通过旋涂法将导电性树脂涂布在绝缘体层116的主面S2上时,导电性树脂被凹凸挂住,并扩展到整个主面S2。因此,减少导电性树脂过度延伸、而在屏蔽层118上产生没有涂布导电性树脂的缺陷区域。
此外,在电路模块10及其制造方法中,根据以下理由也能减少产生缺陷区域。更详细而言,若槽20和突起22的间隔过宽,则导电性树脂有可能过分延伸。因此,在电路模块10及其制造方法中,如图7所示,切割机D1在x轴方向的宽度L4小于电路模块10在x轴方向的宽度L1。此外,将切割机D1沿x轴方向挪动的宽度L3小于切割机D1在x轴方向的宽度L4。由此,在一个电路基板12上形成多条槽20和突起22。其结果是,防止槽20和突起22的间隔过宽而导致导电性树脂过分延伸,减少产生缺陷区域。
此外,在电路模块10及其制造方法中,像下面所说明的那样,减少在电子元器件14a、14b与电路基板12之间产生断路的情况。更详细而言,在电路模块10及其制造方法中,切割机D1在x轴方向的宽度L4小于电路模块10在x轴方向的宽度L1。这样,若利用较窄宽度的切割机D1对绝缘体层116进行切削,则对绝缘体层116的每单位时间的切削量较少。因此,在对绝缘体层116进行切削时给母基板112施加的负荷较小。其结果是,减少在对绝缘体层116进行切削时对母基板112施加负荷、而在母基板112与电子元器件14a、14b之间产生断路的情况。
(变形例)
下面,参照附图,对变形例所涉及的电路模块及其制造方法进行说明。图12是变形例所涉及的电路模块10a的剖视结构图。图13是变形例所涉及的电路模块10a的工序剖视图。
电路模块10a与电路模块10的不同之处在于绝缘体层16的主面S2的凹凸形状不同。这是由于电路模块10a的制造方法中的切割机D1’与电路模块10的制造方法中的切割机D1不同。下面,以所述不同点为中心进行说明。
如图2和图12所示,电路模块10a的绝缘体层16的主面S2具有比电路模块10的绝缘体层16的主面S2要小的凹凸。这是由于在电路模块10a的制造方法中,作为切割机D1’是使用用于切削金属的较大的切割机。更详细而言,由于切割机D1’是用于切削金属的切割机,因此,与切割机D1相比,具有较高的硬度。所以,与切割机D1相比,由于切割机D1’不易磨损,因此,不会具有切割机D1那样的凸部F1和凹部F2。取而代之,切割机D1’即使处于没有磨损的状态,也具有较粗的切削面F’。而且,在电路模块10a的制造方法中,利用该切削面F’在绝缘体层116的主面S2上形成凹凸(槽120和突起122)。由此,能在电路模块10a的绝缘体层16的主面S2上,得到比电路模块10的绝缘体层16的主面S2要小的凹凸。
根据以上那样的电路模块10a及其制造方法,由于绝缘体层16的主面S2的凹凸变小,因此,容易利用屏蔽层18填充主面S2的凹凸。其结果是,屏蔽层18的主面S3形成平坦面。即使是这种较大的切割机D1’,通过利用表面较粗的切割机D1’,也能在绝缘体层16的主面上形成凹凸,减少产生没有涂布导电性树脂的缺陷区域。
另外,在电路模块10的制造方法中,也可利用具有平坦的切削面F的切割机D1,对绝缘体层116的主面S2进行切削。但是,在该情况下,为了在绝缘体层116的主面S2上形成凹凸,需要改变切割机D1对绝缘体层116的切入深度。
工业上的实用性
本发明可用于电路模块及其制造方法,特别是其优点在于,能减少在屏蔽层上产生没有涂布导电性树脂的缺陷区域的情况。
标号说明
F、F’切削面
F1凸部
F2凹部
G接地导体
S1~S3主面
10、10a 电路模块
12电路基板
14a、14b 电子元器件
16、116绝缘体层
18、118屏蔽层
20、42、120槽
22、122突起
D1、D1’、D2切割机
112母基板
Claims (12)
1.一种电路模块的制造方法,其特征在于,包括:
准备母基板的工序;
在所述母基板的主面上安装多个电子元器件的工序;
以覆盖所述母基板的主面和所述多个电子元器件的方式形成绝缘体层的工序;
对该绝缘体层进行切削的工序,以在所述绝缘体层的主面上形成凹凸,且使得该绝缘体层的厚度成为预定厚度;
在所述绝缘层的主面上涂布导电性树脂以形成屏蔽层的工序;以及
对形成有所述绝缘体层和所述屏蔽层的所述母基板进行分割以得到多个电路模块的工序。
2.如权利要求1所述的电路模块的制造方法,其特征在于,
在对所述绝缘体层进行切削的工序中,在该绝缘体层的主面上形成沿第一方向延伸的多条槽和多条突起。
3.如权利要求2所述的电路模块的制造方法,其特征在于,
所述多条槽的间隔或所述多条突起的间隔比所述电路模块在与所述第一方向正交的第二方向的宽度要窄。
4.如权利要求2或3所述的电路模块的制造方法,其特征在于,
在对所述绝缘体层进行切削的工序中,在该绝缘体层的主面上,重复如下动作:使切割机沿所述第一方向移动之后,在与该第一方向正交的第二方向将该切割机挪动,再沿该第一方向移动。
5.如权利要求4所述的电路模块的制造方法,其特征在于,
所述切割机在所述第二方向的宽度小于所述电路模块在该第二方向的宽度。
6.如权利要求4或5所述的电路模块的制造方法,其特征在于,
在对所述绝缘体层进行切削的工序中,将所述切割机在所述第二方向挪动的宽度小于该切割机在所述第二方向的宽度。
7.如权利要求4至6的任一项所述的电路模块的制造方法,其特征在于,
所述切割机的切削面具有凹凸。
8.如权利要求1至7的任一项所述的电路模块的制造方法,其特征在于,
在形成所述屏蔽层的工序中,通过旋涂法将导电性树脂涂布在所述绝缘体层的主面上。
9.一种电路模块,其特征在于,包括:
基板;
安装在所述基板的主面上的电子元器件;
覆盖所述基板的主面和所述电子元器件、且在主面上设置有凹凸的绝缘体层;以及
由设置在所述绝缘体层的主面上的导电性树脂构成的屏蔽层。
10.如权利要求9所述的电路模块,其特征在于,
所述凹凸是沿第一方向延伸的槽或突起。
11.如权利要求10所述的电路模块,其特征在于,
以预定间隔设置多个所述槽或所述突起。
12.如权利要求9至11所述的电路模块,其特征在于,
在所述屏蔽层的主面上形成与所述绝缘体层的主面的凹凸相仿的凹凸。
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US8240035B2 (en) | 2012-08-14 |
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CN102077700B (zh) | 2014-03-26 |
EP2320718A4 (en) | 2017-08-02 |
US20120281370A1 (en) | 2012-11-08 |
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