CN101765911A - 具有重新分布层的半导体芯片 - Google Patents
具有重新分布层的半导体芯片 Download PDFInfo
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- CN101765911A CN101765911A CN200880022454A CN200880022454A CN101765911A CN 101765911 A CN101765911 A CN 101765911A CN 200880022454 A CN200880022454 A CN 200880022454A CN 200880022454 A CN200880022454 A CN 200880022454A CN 101765911 A CN101765911 A CN 101765911A
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/769,927 US7772047B2 (en) | 2007-06-28 | 2007-06-28 | Method of fabricating a semiconductor die having a redistribution layer |
US11/769,937 US7763980B2 (en) | 2007-06-28 | 2007-06-28 | Semiconductor die having a distribution layer |
US11/769,927 | 2007-06-28 | ||
US11/769,937 | 2007-06-28 | ||
PCT/US2008/068542 WO2009006284A2 (en) | 2007-06-28 | 2008-06-27 | Semiconductor die having a redistribution layer |
Publications (2)
Publication Number | Publication Date |
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CN101765911A true CN101765911A (zh) | 2010-06-30 |
CN101765911B CN101765911B (zh) | 2012-06-27 |
Family
ID=40226779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2008800224541A Active CN101765911B (zh) | 2007-06-28 | 2008-06-27 | 具有重新分布层的半导体芯片 |
Country Status (5)
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EP (1) | EP2179442A4 (zh) |
KR (1) | KR101475467B1 (zh) |
CN (1) | CN101765911B (zh) |
TW (1) | TWI371807B (zh) |
WO (1) | WO2009006284A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106465546A (zh) * | 2014-02-28 | 2017-02-22 | At&S奥地利科技与***技术股份公司 | 用于生产嵌入了传感器晶片的印刷电路板的方法,以及印刷电路板 |
CN106469657A (zh) * | 2015-08-14 | 2017-03-01 | 晟碟半导体(上海)有限公司 | 具有间隔体层的半导体装置、其形成方法和间隔体层带 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10373870B2 (en) | 2010-02-16 | 2019-08-06 | Deca Technologies Inc. | Semiconductor device and method of packaging |
US9196509B2 (en) | 2010-02-16 | 2015-11-24 | Deca Technologies Inc | Semiconductor device and method of adaptive patterning for panelized packaging |
US9576919B2 (en) | 2011-12-30 | 2017-02-21 | Deca Technologies Inc. | Semiconductor device and method comprising redistribution layers |
US9177926B2 (en) | 2011-12-30 | 2015-11-03 | Deca Technologies Inc | Semiconductor device and method comprising thickened redistribution layers |
US10050004B2 (en) | 2015-11-20 | 2018-08-14 | Deca Technologies Inc. | Fully molded peripheral package on package device |
US9613830B2 (en) | 2011-12-30 | 2017-04-04 | Deca Technologies Inc. | Fully molded peripheral package on package device |
US10672624B2 (en) | 2011-12-30 | 2020-06-02 | Deca Technologies Inc. | Method of making fully molded peripheral package on package device |
US9831170B2 (en) | 2011-12-30 | 2017-11-28 | Deca Technologies, Inc. | Fully molded miniaturized semiconductor module |
KR102434823B1 (ko) * | 2014-03-10 | 2022-08-19 | 데카 테크놀로지 유에스에이 인코포레이티드 | 두꺼운 재배선 층을 포함하는 반도체 디바이스 및 방법 |
US10573601B2 (en) | 2016-09-19 | 2020-02-25 | Deca Technologies Inc. | Semiconductor device and method of unit specific progressive alignment |
US10157803B2 (en) | 2016-09-19 | 2018-12-18 | Deca Technologies Inc. | Semiconductor device and method of unit specific progressive alignment |
US11056453B2 (en) | 2019-06-18 | 2021-07-06 | Deca Technologies Usa, Inc. | Stackable fully molded semiconductor structure with vertical interconnects |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87107692A (zh) * | 1986-11-13 | 1988-05-25 | Mt化学公司 | 半导体器件的制造方法 |
US6011314A (en) * | 1999-02-01 | 2000-01-04 | Hewlett-Packard Company | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps |
US6036809A (en) * | 1999-02-16 | 2000-03-14 | International Business Machines Corporation | Process for releasing a thin-film structure from a substrate |
JP2001323228A (ja) * | 2000-05-15 | 2001-11-22 | Nitto Denko Corp | 加熱剥離型粘着シート |
JP2002076576A (ja) * | 2000-08-23 | 2002-03-15 | Nec Corp | 配線パターン形成方法およびその方法に用いられる原版 |
US6847105B2 (en) * | 2001-09-21 | 2005-01-25 | Micron Technology, Inc. | Bumping technology in stacked die configurations |
US6965160B2 (en) * | 2002-08-15 | 2005-11-15 | Micron Technology, Inc. | Semiconductor dice packages employing at least one redistribution layer |
US20040191955A1 (en) * | 2002-11-15 | 2004-09-30 | Rajeev Joshi | Wafer-level chip scale package and method for fabricating and using the same |
JP2005085799A (ja) * | 2003-09-04 | 2005-03-31 | Seiko Epson Corp | 成膜方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置、及び電子機器 |
US7410825B2 (en) * | 2005-09-15 | 2008-08-12 | Eastman Kodak Company | Metal and electronically conductive polymer transfer |
-
2008
- 2008-06-27 TW TW097124363A patent/TWI371807B/zh not_active IP Right Cessation
- 2008-06-27 WO PCT/US2008/068542 patent/WO2009006284A2/en active Application Filing
- 2008-06-27 KR KR1020107001950A patent/KR101475467B1/ko not_active IP Right Cessation
- 2008-06-27 CN CN2008800224541A patent/CN101765911B/zh active Active
- 2008-06-27 EP EP08796037.3A patent/EP2179442A4/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106465546A (zh) * | 2014-02-28 | 2017-02-22 | At&S奥地利科技与***技术股份公司 | 用于生产嵌入了传感器晶片的印刷电路板的方法,以及印刷电路板 |
CN106465546B (zh) * | 2014-02-28 | 2019-08-23 | At&S奥地利科技与***技术股份公司 | 用于生产嵌入了传感器晶片的印刷电路板的方法,以及印刷电路板 |
CN106469657A (zh) * | 2015-08-14 | 2017-03-01 | 晟碟半导体(上海)有限公司 | 具有间隔体层的半导体装置、其形成方法和间隔体层带 |
CN106469657B (zh) * | 2015-08-14 | 2020-03-31 | 晟碟半导体(上海)有限公司 | 具有间隔体层的半导体装置、其形成方法和间隔体层带 |
Also Published As
Publication number | Publication date |
---|---|
EP2179442A4 (en) | 2013-08-07 |
CN101765911B (zh) | 2012-06-27 |
TWI371807B (en) | 2012-09-01 |
EP2179442A2 (en) | 2010-04-28 |
KR101475467B1 (ko) | 2014-12-22 |
TW200910474A (en) | 2009-03-01 |
KR20100034756A (ko) | 2010-04-01 |
WO2009006284A2 (en) | 2009-01-08 |
WO2009006284A3 (en) | 2009-04-09 |
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