EP2179442A4 - Semiconductor die having a redistribution layer - Google Patents

Semiconductor die having a redistribution layer

Info

Publication number
EP2179442A4
EP2179442A4 EP08796037.3A EP08796037A EP2179442A4 EP 2179442 A4 EP2179442 A4 EP 2179442A4 EP 08796037 A EP08796037 A EP 08796037A EP 2179442 A4 EP2179442 A4 EP 2179442A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor die
redistribution layer
redistribution
layer
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08796037.3A
Other languages
German (de)
French (fr)
Other versions
EP2179442A2 (en
Inventor
Chien-Ko Liao
Chin-Tien Chiu
Jack Chang Chien
Cheemen Yu
Hem Takiar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SanDisk Technologies LLC
Original Assignee
SanDisk Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/769,927 external-priority patent/US7772047B2/en
Priority claimed from US11/769,937 external-priority patent/US7763980B2/en
Application filed by SanDisk Technologies LLC filed Critical SanDisk Technologies LLC
Publication of EP2179442A2 publication Critical patent/EP2179442A2/en
Publication of EP2179442A4 publication Critical patent/EP2179442A4/en
Withdrawn legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
EP08796037.3A 2007-06-28 2008-06-27 Semiconductor die having a redistribution layer Withdrawn EP2179442A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/769,927 US7772047B2 (en) 2007-06-28 2007-06-28 Method of fabricating a semiconductor die having a redistribution layer
US11/769,937 US7763980B2 (en) 2007-06-28 2007-06-28 Semiconductor die having a distribution layer
PCT/US2008/068542 WO2009006284A2 (en) 2007-06-28 2008-06-27 Semiconductor die having a redistribution layer

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EP2179442A2 EP2179442A2 (en) 2010-04-28
EP2179442A4 true EP2179442A4 (en) 2013-08-07

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KR (1) KR101475467B1 (en)
CN (1) CN101765911B (en)
TW (1) TWI371807B (en)
WO (1) WO2009006284A2 (en)

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US9177926B2 (en) 2011-12-30 2015-11-03 Deca Technologies Inc Semiconductor device and method comprising thickened redistribution layers
US9196509B2 (en) 2010-02-16 2015-11-24 Deca Technologies Inc Semiconductor device and method of adaptive patterning for panelized packaging
US10373870B2 (en) 2010-02-16 2019-08-06 Deca Technologies Inc. Semiconductor device and method of packaging
US10050004B2 (en) 2015-11-20 2018-08-14 Deca Technologies Inc. Fully molded peripheral package on package device
US9831170B2 (en) 2011-12-30 2017-11-28 Deca Technologies, Inc. Fully molded miniaturized semiconductor module
US9613830B2 (en) 2011-12-30 2017-04-04 Deca Technologies Inc. Fully molded peripheral package on package device
US10672624B2 (en) 2011-12-30 2020-06-02 Deca Technologies Inc. Method of making fully molded peripheral package on package device
AT515443B1 (en) * 2014-02-28 2019-10-15 At & S Austria Tech & Systemtechnik Ag Method for producing a printed circuit board and printed circuit board
WO2015138359A1 (en) * 2014-03-10 2015-09-17 Deca Technologies Inc. Semiconductor device and method comprising thickened redistribution layers
CN106469657B (en) * 2015-08-14 2020-03-31 晟碟半导体（上海）有限公司 Semiconductor device having spacer layer, method of forming the same, and spacer layer tape
US10157803B2 (en) 2016-09-19 2018-12-18 Deca Technologies Inc. Semiconductor device and method of unit specific progressive alignment
US10573601B2 (en) 2016-09-19 2020-02-25 Deca Technologies Inc. Semiconductor device and method of unit specific progressive alignment
US11056453B2 (en) 2019-06-18 2021-07-06 Deca Technologies Usa, Inc. Stackable fully molded semiconductor structure with vertical interconnects

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CN101765911B (en) 2012-06-27
TWI371807B (en) 2012-09-01
WO2009006284A3 (en) 2009-04-09
EP2179442A2 (en) 2010-04-28
CN101765911A (en) 2010-06-30
TW200910474A (en) 2009-03-01
KR20100034756A (en) 2010-04-01
WO2009006284A2 (en) 2009-01-08
KR101475467B1 (en) 2014-12-22

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