CN101625730A - 射频集成电路芯片封装及其制造方法 - Google Patents
射频集成电路芯片封装及其制造方法 Download PDFInfo
- Publication number
- CN101625730A CN101625730A CN200910149870A CN200910149870A CN101625730A CN 101625730 A CN101625730 A CN 101625730A CN 200910149870 A CN200910149870 A CN 200910149870A CN 200910149870 A CN200910149870 A CN 200910149870A CN 101625730 A CN101625730 A CN 101625730A
- Authority
- CN
- China
- Prior art keywords
- chip
- encapsulation
- ground plane
- paster
- feeder line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
- H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15323—Connection portion the connection portion being formed on the die mounting surface of the substrate being a land array, e.g. LGA
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/168,328 | 2008-07-07 | ||
US12/168,328 US7728774B2 (en) | 2008-07-07 | 2008-07-07 | Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101625730A true CN101625730A (zh) | 2010-01-13 |
CN101625730B CN101625730B (zh) | 2013-06-19 |
Family
ID=40257346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101498704A Active CN101625730B (zh) | 2008-07-07 | 2009-07-02 | 射频集成电路芯片封装及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7728774B2 (zh) |
EP (1) | EP2144329B1 (zh) |
JP (1) | JP2010016789A (zh) |
CN (1) | CN101625730B (zh) |
TW (1) | TWI506863B (zh) |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103247581A (zh) * | 2012-02-14 | 2013-08-14 | 国际商业机器公司 | 芯片封装和装置 |
CN103329349A (zh) * | 2011-01-21 | 2013-09-25 | 国际商业机器公司 | 用于封装应用的叠层天线结构 |
CN103367269A (zh) * | 2013-07-15 | 2013-10-23 | 香港应用科技研究院有限公司 | 用于射频应用的隔离混合基板 |
CN103392261A (zh) * | 2011-03-04 | 2013-11-13 | 罗德施瓦兹两合股份有限公司 | 用于毫米波扫描仪的印刷电路板装置 |
CN103597593A (zh) * | 2011-05-05 | 2014-02-19 | 英特尔公司 | 包括具有垂直集成相控阵天线和低频功率传递衬底的穿硅过孔管芯的芯片封装 |
CN103782448A (zh) * | 2011-05-05 | 2014-05-07 | 英特尔公司 | 高性能玻璃基60ghz/mm波相控阵列天线及其制造方法 |
CN104465584A (zh) * | 2014-12-10 | 2015-03-25 | 华进半导体封装先导技术研发中心有限公司 | 基于有源埋入的微波射频基板结构及其制备方法 |
CN104867912A (zh) * | 2013-12-18 | 2015-08-26 | 英特尔公司 | 嵌入式毫米波相控阵列模块 |
CN105379007A (zh) * | 2013-08-16 | 2016-03-02 | 英特尔公司 | 具有气隙层或腔的毫米波天线结构 |
CN106409783A (zh) * | 2015-07-28 | 2017-02-15 | 英飞凌科技股份有限公司 | 具有集成电气功能的基于pcb的半导体封装 |
CN106961001A (zh) * | 2016-01-11 | 2017-07-18 | 矽品精密工业股份有限公司 | 电子封装件 |
CN107785655A (zh) * | 2016-08-26 | 2018-03-09 | 株式会社村田制作所 | 天线模块 |
CN109088180A (zh) * | 2018-08-12 | 2018-12-25 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109103589A (zh) * | 2018-08-12 | 2018-12-28 | 瑞声科技(南京)有限公司 | 天线模组及移动终端 |
CN109119768A (zh) * | 2018-08-12 | 2019-01-01 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109149068A (zh) * | 2018-08-12 | 2019-01-04 | 瑞声科技(南京)有限公司 | 封装天线***及移动终端 |
CN109149069A (zh) * | 2018-08-12 | 2019-01-04 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109417224A (zh) * | 2016-05-10 | 2019-03-01 | 集美塔公司 | 组装柱形馈电天线孔径区段的方法 |
US10225922B2 (en) | 2016-02-18 | 2019-03-05 | Cree, Inc. | PCB based semiconductor package with impedance matching network elements integrated therein |
CN109786933A (zh) * | 2018-12-29 | 2019-05-21 | 瑞声科技(南京)有限公司 | 封装天线***及移动终端 |
CN109888508A (zh) * | 2018-12-28 | 2019-06-14 | 瑞声光电科技(苏州)有限公司 | 相控阵天线 |
CN111653527A (zh) * | 2020-06-15 | 2020-09-11 | 华进半导体封装先导技术研发中心有限公司 | 封装天线及其制造方法 |
CN112103622A (zh) * | 2019-06-18 | 2020-12-18 | 联发科技股份有限公司 | 半导体封装 |
CN112216994A (zh) * | 2017-01-23 | 2021-01-12 | 三星电机株式会社 | 集成天线的射频模块 |
CN112534646A (zh) * | 2018-08-02 | 2021-03-19 | 维尔塞特公司 | 天线元件模块 |
CN113330636A (zh) * | 2019-01-25 | 2021-08-31 | 康宁股份有限公司 | 天线堆叠体 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9713258B2 (en) * | 2006-04-27 | 2017-07-18 | International Business Machines Corporation | Integrated circuit chip packaging |
US8509709B2 (en) * | 2008-08-07 | 2013-08-13 | Wilocity, Ltd. | Consumer electronic device having a distributed form factor millimeter wave receiver and transmitter |
US8269671B2 (en) * | 2009-01-27 | 2012-09-18 | International Business Machines Corporation | Simple radio frequency integrated circuit (RFIC) packages with integrated antennas |
KR101113443B1 (ko) * | 2009-09-11 | 2012-02-29 | 삼성전기주식회사 | 패치 안테나 및 무선통신 모듈 |
US8169060B2 (en) * | 2010-03-29 | 2012-05-01 | Infineon Technologies Ag | Integrated circuit package assembly including wave guide |
US8558637B2 (en) | 2010-05-12 | 2013-10-15 | Mediatek Inc. | Circuit device with signal line transition element |
KR20120035394A (ko) * | 2010-10-05 | 2012-04-16 | 삼성전자주식회사 | 수직구조의 전송선로 트랜지션 및 랜드 그리드 어레이 접합를 이용한 단일 칩 패키지를 위한 장치 |
GB2484704A (en) * | 2010-10-21 | 2012-04-25 | Bluwireless Tech Ltd | Patch antenna structure formed with an air gap in a flip-chip assembly |
US8988299B2 (en) | 2011-02-17 | 2015-03-24 | International Business Machines Corporation | Integrated antenna for RFIC package applications |
GB201113129D0 (en) * | 2011-07-29 | 2011-09-14 | Bae Systems Plc | Radio frequency communication |
KR101898967B1 (ko) | 2012-01-26 | 2018-09-14 | 삼성전자주식회사 | 고효율 광대역 안테나 |
FR2992103B1 (fr) * | 2012-06-19 | 2014-06-13 | St Microelectronics Sa | Structure integree tridimensionnelle comportant une antenne |
US9356352B2 (en) * | 2012-10-22 | 2016-05-31 | Texas Instruments Incorporated | Waveguide coupler |
US9252491B2 (en) | 2012-11-30 | 2016-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedding low-k materials in antennas |
US9252077B2 (en) * | 2013-09-25 | 2016-02-02 | Intel Corporation | Package vias for radio frequency antenna connections |
JP2015065553A (ja) * | 2013-09-25 | 2015-04-09 | 株式会社東芝 | 接続部材、半導体デバイスおよび積層構造体 |
US9659904B2 (en) * | 2013-12-12 | 2017-05-23 | Intel Corporation | Distributed on-package millimeter-wave radio |
US9472859B2 (en) | 2014-05-20 | 2016-10-18 | International Business Machines Corporation | Integration of area efficient antennas for phased array or wafer scale array antenna applications |
US10103447B2 (en) | 2014-06-13 | 2018-10-16 | Nxp Usa, Inc. | Integrated circuit package with radio frequency coupling structure |
US9917372B2 (en) * | 2014-06-13 | 2018-03-13 | Nxp Usa, Inc. | Integrated circuit package with radio frequency coupling arrangement |
US9620841B2 (en) | 2014-06-13 | 2017-04-11 | Nxp Usa, Inc. | Radio frequency coupling structure |
KR102185196B1 (ko) | 2014-07-04 | 2020-12-01 | 삼성전자주식회사 | 무선 통신 기기에서 안테나 장치 |
US10225925B2 (en) | 2014-08-29 | 2019-03-05 | Nxp Usa, Inc. | Radio frequency coupling and transition structure |
US9887449B2 (en) | 2014-08-29 | 2018-02-06 | Nxp Usa, Inc. | Radio frequency coupling structure and a method of manufacturing thereof |
US9444135B2 (en) | 2014-09-19 | 2016-09-13 | Freescale Semiconductor, Inc. | Integrated circuit package |
US10411360B2 (en) | 2014-10-21 | 2019-09-10 | Nec Corporation | Planar antenna |
DE102015201445A1 (de) | 2015-01-28 | 2016-07-28 | Robert Bosch Gmbh | Radarsensor |
CN107369673B (zh) * | 2016-05-13 | 2019-11-05 | 华为技术有限公司 | 设置有天线的集成电路封装装置及其制造方法 |
DE112016007571T5 (de) * | 2016-12-30 | 2019-10-24 | Intel Corporation | Mikroelektronische bauelemente entworfen mit flexiblengehäusesubstraten mit verteilten gestapelten antennen fürhochfrequenz-kommunikationssysteme |
EP3429026B1 (en) * | 2017-07-10 | 2020-12-02 | Nxp B.V. | An integrated circuit package and method of making thereof |
US10734332B2 (en) | 2017-08-22 | 2020-08-04 | Qualcomm Incorporated | High aspect ratio interconnects in air gap of antenna package |
US10993315B2 (en) * | 2017-10-31 | 2021-04-27 | Avl Technologies, Inc. | Printed circuit via for KA satcom circuit boards |
DE102018202364B4 (de) * | 2018-02-15 | 2022-10-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Moduleinheit mit integrierten Antennen und Verfahren zum Herstellen derselben |
JP6564902B1 (ja) * | 2018-03-30 | 2019-08-21 | 株式会社フジクラ | アンテナ |
JP6712613B2 (ja) * | 2018-03-30 | 2020-06-24 | 株式会社フジクラ | アンテナ |
EP3780279A4 (en) * | 2018-05-15 | 2021-04-07 | Mitsubishi Electric Corporation | NETWORK ANTENNA DEVICE AND COMMUNICATION DEVICE |
KR102565703B1 (ko) * | 2018-07-18 | 2023-08-10 | 삼성전기주식회사 | 패키지 기판 및 이를 포함하는 칩 패키지 |
JP7417448B2 (ja) * | 2019-03-23 | 2024-01-18 | 京セラ株式会社 | アンテナ基板およびアンテナモジュール |
JP6801739B2 (ja) * | 2019-04-18 | 2020-12-16 | 株式会社村田製作所 | アンテナモジュール及び通信装置 |
CN110212300B (zh) * | 2019-05-22 | 2021-05-11 | 维沃移动通信有限公司 | 一种天线单元及终端设备 |
TWI700801B (zh) * | 2019-09-16 | 2020-08-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
DE102019128779B4 (de) | 2019-10-24 | 2021-05-12 | Infineon Technologies Ag | Hochfrequenz-Vorrichtung mit Hochfrequenz-Signalführungselement und zugehöriges Herstellungsverfahren |
US11049792B1 (en) | 2020-05-06 | 2021-06-29 | Semiconductor Components Industries, Llc | Package structure for semiconductor devices |
US20220084740A1 (en) * | 2020-09-14 | 2022-03-17 | Intel Corporation | Embedded cooling channel in magnetics |
US11658391B2 (en) | 2020-12-21 | 2023-05-23 | Qualcomm Incorporated | Antenna module |
CN113690594B (zh) * | 2021-07-23 | 2022-11-18 | 华南理工大学 | 应用于多普勒雷达的毫米波高增益平面口径天线 |
US20230253702A1 (en) * | 2022-02-10 | 2023-08-10 | Swiftlink Technologies Co., Ltd. | Periodic Mode-Selective Structure for Surface Wave Scattering Mitigation in Millimeter Wave Antenna Arrays |
EP4362219A1 (en) * | 2022-10-27 | 2024-05-01 | Sony Group Corporation | Antenna structure and antenna structure manufacturing method |
CN117154423B (zh) * | 2023-10-31 | 2023-12-29 | 成都辰星迅联科技有限公司 | 一种平面式高容差毫米波相控阵天线 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63258102A (ja) | 1987-04-15 | 1988-10-25 | Matsushita Electric Works Ltd | 平面アンテナ |
JPH01135105A (ja) * | 1987-11-20 | 1989-05-26 | Fujitsu Ltd | パッチアンテナ |
JPH02104006A (ja) | 1989-06-28 | 1990-04-17 | Matsushita Electric Works Ltd | 平面アンテナ |
JP3427040B2 (ja) * | 1996-02-29 | 2003-07-14 | 京セラ株式会社 | 高周波用パッケージ |
JPH10303640A (ja) * | 1997-04-25 | 1998-11-13 | Nippon Telegr & Teleph Corp <Ntt> | アンテナ装置 |
AU2001261141A1 (en) | 2000-05-02 | 2001-11-12 | Sun Microsystems, Inc. | Method and system for achieving high availability in a networked computer system |
EP1304766A4 (en) * | 2000-06-30 | 2009-05-13 | Sharp Kk | RADIO COMMUNICATION DEVICE WITH INTEGRATED ANTENNA, INTEGRATED TRANSMITTER AND INTEGRATED RECEIVER |
DE10063437A1 (de) * | 2000-12-20 | 2002-07-11 | Bosch Gmbh Robert | Antennenanordnung |
CN1316858C (zh) | 2001-04-27 | 2007-05-16 | 日本电气株式会社 | 高频电路基板及其制造方法 |
US6982480B2 (en) * | 2003-07-31 | 2006-01-03 | The Boeing Company | Near hermetic packaging of gallium arsenide semiconductor devices and manufacturing method therefor |
JP4684730B2 (ja) * | 2004-04-30 | 2011-05-18 | シャープ株式会社 | 高周波半導体装置、送信装置および受信装置 |
US7119745B2 (en) | 2004-06-30 | 2006-10-10 | International Business Machines Corporation | Apparatus and method for constructing and packaging printed antenna devices |
TWI239681B (en) | 2004-12-22 | 2005-09-11 | Tatung Co Ltd | Circularly polarized array antenna |
DE102006023123B4 (de) | 2005-06-01 | 2011-01-13 | Infineon Technologies Ag | Abstandserfassungsradar für Fahrzeuge mit einem Halbleitermodul mit Komponenten für Höchstfrequenztechnik in Kunststoffgehäuse und Verfahren zur Herstellung eines Halbleitermoduls mit Komponenten für ein Abstandserfassungsradar für Fahrzeuge in einem Kunststoffgehäuse |
CN100428591C (zh) * | 2006-02-08 | 2008-10-22 | 中国科学院微电子研究所 | 高速率半导体光发射组件的封装结构及方法 |
US7518229B2 (en) | 2006-08-03 | 2009-04-14 | International Business Machines Corporation | Versatile Si-based packaging with integrated passive components for mmWave applications |
US7675465B2 (en) | 2007-05-22 | 2010-03-09 | Sibeam, Inc. | Surface mountable integrated circuit packaging scheme |
-
2008
- 2008-07-07 US US12/168,328 patent/US7728774B2/en active Active
- 2008-10-27 EP EP08167616A patent/EP2144329B1/en active Active
- 2008-10-28 JP JP2008276631A patent/JP2010016789A/ja active Pending
-
2009
- 2009-07-02 CN CN2009101498704A patent/CN101625730B/zh active Active
- 2009-07-07 TW TW098122897A patent/TWI506863B/zh active
Cited By (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103329349A (zh) * | 2011-01-21 | 2013-09-25 | 国际商业机器公司 | 用于封装应用的叠层天线结构 |
CN103329349B (zh) * | 2011-01-21 | 2015-02-11 | 国际商业机器公司 | 用于封装应用的叠层天线结构 |
CN103392261A (zh) * | 2011-03-04 | 2013-11-13 | 罗德施瓦兹两合股份有限公司 | 用于毫米波扫描仪的印刷电路板装置 |
CN103392261B (zh) * | 2011-03-04 | 2015-09-09 | 罗德施瓦兹两合股份有限公司 | 用于毫米波扫描仪的印刷电路板装置 |
CN103597593B (zh) * | 2011-05-05 | 2016-09-14 | 英特尔公司 | 包括具有垂直集成相控阵天线和低频功率传递衬底的穿硅过孔管芯的芯片封装 |
TWI619221B (zh) * | 2011-05-05 | 2018-03-21 | 英特爾公司 | 含有具有垂直集成之相位陣列天線與低頻和功率遞送基體的通矽孔晶粒之晶片封裝體 |
CN103597593A (zh) * | 2011-05-05 | 2014-02-19 | 英特尔公司 | 包括具有垂直集成相控阵天线和低频功率传递衬底的穿硅过孔管芯的芯片封装 |
CN103782448A (zh) * | 2011-05-05 | 2014-05-07 | 英特尔公司 | 高性能玻璃基60ghz/mm波相控阵列天线及其制造方法 |
US9653805B2 (en) | 2011-05-05 | 2017-05-16 | Intel Corporation | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates |
CN103782448B (zh) * | 2011-05-05 | 2017-02-15 | 英特尔公司 | 高性能玻璃基60ghz/mm波相控阵列天线及其制造方法 |
CN103247581A (zh) * | 2012-02-14 | 2013-08-14 | 国际商业机器公司 | 芯片封装和装置 |
CN103247581B (zh) * | 2012-02-14 | 2015-10-14 | 国际商业机器公司 | 芯片封装和装置 |
CN103367269B (zh) * | 2013-07-15 | 2016-03-02 | 香港应用科技研究院有限公司 | 用于射频应用的隔离混合基板 |
CN103367269A (zh) * | 2013-07-15 | 2013-10-23 | 香港应用科技研究院有限公司 | 用于射频应用的隔离混合基板 |
CN105379007A (zh) * | 2013-08-16 | 2016-03-02 | 英特尔公司 | 具有气隙层或腔的毫米波天线结构 |
US9773742B2 (en) | 2013-12-18 | 2017-09-26 | Intel Corporation | Embedded millimeter-wave phased array module |
CN104867912A (zh) * | 2013-12-18 | 2015-08-26 | 英特尔公司 | 嵌入式毫米波相控阵列模块 |
US10658312B2 (en) | 2013-12-18 | 2020-05-19 | Intel Corporation | Embedded millimeter-wave phased array module |
CN104465584B (zh) * | 2014-12-10 | 2017-08-11 | 华进半导体封装先导技术研发中心有限公司 | 基于有源埋入的微波射频基板结构及其制备方法 |
CN104465584A (zh) * | 2014-12-10 | 2015-03-25 | 华进半导体封装先导技术研发中心有限公司 | 基于有源埋入的微波射频基板结构及其制备方法 |
CN106409783A (zh) * | 2015-07-28 | 2017-02-15 | 英飞凌科技股份有限公司 | 具有集成电气功能的基于pcb的半导体封装 |
CN109994436A (zh) * | 2015-07-28 | 2019-07-09 | 科锐 | 具有集成电气功能的基于pcb的半导体封装 |
CN109994436B (zh) * | 2015-07-28 | 2023-08-18 | 科锐 | 具有集成电气功能的基于pcb的半导体封装 |
CN106961001B (zh) * | 2016-01-11 | 2019-04-02 | 矽品精密工业股份有限公司 | 电子封装件 |
CN106961001A (zh) * | 2016-01-11 | 2017-07-18 | 矽品精密工业股份有限公司 | 电子封装件 |
US10743404B2 (en) | 2016-02-18 | 2020-08-11 | Cree, Inc. | PCB based semiconductor device |
US10225922B2 (en) | 2016-02-18 | 2019-03-05 | Cree, Inc. | PCB based semiconductor package with impedance matching network elements integrated therein |
US10575394B2 (en) | 2016-02-18 | 2020-02-25 | Cree, Inc. | PCB based semiconductor package with impedance matching network elements integrated therein |
CN109417224A (zh) * | 2016-05-10 | 2019-03-01 | 集美塔公司 | 组装柱形馈电天线孔径区段的方法 |
US10763583B2 (en) | 2016-05-10 | 2020-09-01 | Kymeta Corporation | Method to assemble aperture segments of a cylindrical feed antenna |
US10673142B2 (en) | 2016-08-26 | 2020-06-02 | Murata Manufacturing Co., Ltd. | Antenna module |
CN107785655A (zh) * | 2016-08-26 | 2018-03-09 | 株式会社村田制作所 | 天线模块 |
CN112216994A (zh) * | 2017-01-23 | 2021-01-12 | 三星电机株式会社 | 集成天线的射频模块 |
CN112216994B (zh) * | 2017-01-23 | 2024-03-15 | 三星电机株式会社 | 集成天线的射频模块 |
CN112534646A (zh) * | 2018-08-02 | 2021-03-19 | 维尔塞特公司 | 天线元件模块 |
US11936124B2 (en) | 2018-08-02 | 2024-03-19 | Viasat, Inc. | Antenna element module |
JP7476168B2 (ja) | 2018-08-02 | 2024-04-30 | ヴィアサット,インコーポレイテッド | アンテナ素子モジュール |
CN109149068A (zh) * | 2018-08-12 | 2019-01-04 | 瑞声科技(南京)有限公司 | 封装天线***及移动终端 |
CN109149069A (zh) * | 2018-08-12 | 2019-01-04 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109088180B (zh) * | 2018-08-12 | 2020-11-20 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109088180A (zh) * | 2018-08-12 | 2018-12-25 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109103589A (zh) * | 2018-08-12 | 2018-12-28 | 瑞声科技(南京)有限公司 | 天线模组及移动终端 |
CN109119768A (zh) * | 2018-08-12 | 2019-01-01 | 瑞声科技(南京)有限公司 | Aog天线***及移动终端 |
CN109149068B (zh) * | 2018-08-12 | 2021-04-02 | 瑞声科技(南京)有限公司 | 封装天线***及移动终端 |
US11031671B2 (en) | 2018-08-12 | 2021-06-08 | AAC Technologies Pte. Ltd. | AOG antenna system and mobile terminal |
CN109888508A (zh) * | 2018-12-28 | 2019-06-14 | 瑞声光电科技(苏州)有限公司 | 相控阵天线 |
CN109786933B (zh) * | 2018-12-29 | 2021-09-07 | 瑞声科技(南京)有限公司 | 封装天线***及移动终端 |
CN109786933A (zh) * | 2018-12-29 | 2019-05-21 | 瑞声科技(南京)有限公司 | 封装天线***及移动终端 |
CN113330636B (zh) * | 2019-01-25 | 2023-05-16 | 康宁股份有限公司 | 天线堆叠体 |
CN113330636A (zh) * | 2019-01-25 | 2021-08-31 | 康宁股份有限公司 | 天线堆叠体 |
CN112103622A (zh) * | 2019-06-18 | 2020-12-18 | 联发科技股份有限公司 | 半导体封装 |
CN111653527A (zh) * | 2020-06-15 | 2020-09-11 | 华进半导体封装先导技术研发中心有限公司 | 封装天线及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101625730B (zh) | 2013-06-19 |
JP2010016789A (ja) | 2010-01-21 |
US20100001906A1 (en) | 2010-01-07 |
EP2144329A1 (en) | 2010-01-13 |
US7728774B2 (en) | 2010-06-01 |
TWI506863B (zh) | 2015-11-01 |
EP2144329B1 (en) | 2012-08-29 |
TW201015784A (en) | 2010-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101625730B (zh) | 射频集成电路芯片封装及其制造方法 | |
US8269671B2 (en) | Simple radio frequency integrated circuit (RFIC) packages with integrated antennas | |
US7696930B2 (en) | Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities | |
US8256685B2 (en) | Compact millimeter wave packages with integrated antennas | |
KR101397748B1 (ko) | 집적 어퍼쳐- 결합 패치 안테나를 갖는 라디오-주파수 집적회로 칩 패키지 | |
EP3474370B1 (en) | Antenna-in-package with frequency-selective surface structure | |
CN103329349B (zh) | 用于封装应用的叠层天线结构 | |
US8648454B2 (en) | Wafer-scale package structures with integrated antennas | |
CN109244641A (zh) | 封装天线及其制造方法 | |
CN107968084A (zh) | 具有集成天线的半导体封装及其形成方法 | |
CN109326584B (zh) | 封装天线及其制造方法 | |
CN109166845B (zh) | 封装天线及其制造方法 | |
CN108269790A (zh) | 具有集成天线的封装的装置 | |
CN117748105A (zh) | 集成基板的三维模塑扇出型毫米波封装天线及其制作方法 | |
CN113488458A (zh) | 封装结构及其形成方法 | |
CN112216687A (zh) | 电子封装件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171101 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171101 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
|
TR01 | Transfer of patent right |