CN109149068B - 封装天线***及移动终端 - Google Patents
封装天线***及移动终端 Download PDFInfo
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Abstract
本发明提供了一种封装天线***及移动终端。所述移动终端包括主板,其特征在于,所述封装天线***包括基板、设于所述基板远离所述主板的一侧的金属天线、设于所述基板朝向所述主板的一侧的集成电路芯片、设于所述基板内并与所述金属天线间隔设置的馈电网络及连接所述馈电网络与所述集成电路芯片的电路,所述电路与所述主板电连接,所述馈电网络对应所述金属天线的位置开设有缝隙,所述金属天线通过所述缝隙与所述馈电网络耦合馈电。与相关技术相比,本发明的封装天线***采用PCB工艺或者LTCC工艺层叠而成,并通过馈电网络与金属天线耦合馈电,达到了相同厚度下更宽带的天线阻抗带宽。
Description
【技术领域】
本发明涉及无线通信技术领域,尤其涉及一种封装天线***及移动终端。
【背景技术】
5G作为全球业界的研发焦点,发展5G技术制定5G标准已经成为业界共识。国际电信联盟ITU在2015年6月召开的ITU-RWP5D第22次会议上明确了5G的三个主要应用场景:增强型移动宽带、大规模机器通信、高可靠低延时通信。这三个应用场景分别对应着不同的关键指标,其中增强型移动带宽场景下用户峰值速度为20Gbps,最低用户体验速率为100Mbps。目前3GPP正在对5G技术进行标准化工作,第一个5G非独立组网(NSA)国际标准于2017年12月正式完成并冻结,并计划在2018年6月完成5G独立组网标准。3GPP会议期间诸多关键技术和***架构等研究工作得到迅速聚焦,其中包含毫米波技术。毫米波独有的高载频、大带宽特性是实现5G超高数据传输速率的主要手段。
毫米波频段丰富的带宽资源为高速传输速率提供了保障,但是由于该频段电磁波剧烈的空间损耗,利用毫米波频段的无线通信***需要采用相控阵的架构。通过移相器使得各个阵元的相位按一定规律分布,从而形成高增益波束,并且通过相移的改变使得波束在一定空间范围内扫描。
天线作为射频前端***中不可缺少的部件,在射频电路向着集成化、小型化方向发展的同时,将天线与射频前端电路进行***集成和封装成为未来射频前端发展的必然趋势。封装天线(AiP)技术是通过封装材料与工艺将天线集成在携带芯片的封装内,很好地兼顾了天线性能、成本及体积,深受广大芯片及封装制造商的青睐。目前高通,Intel,IBM等公司都采用了封装天线技术。毋庸置疑,AiP技术也将为5G毫米波移动通信***提供很好的天线解决方案。
相关的天线封装技术中,在封装天线***有限的空间,固定的层叠结构中很难实现10%以上的带宽。
因此,实有必要提供一种新的封装天线***及移动终端以解决上述问题。
【发明内容】
本发明的目的在于提供一种频带宽的封装天线***及移动终端。
本发明的技术方案如下:一种封装天线***,应用于移动终端,所述移动终端包括主板,所述封装天线***包括与所述主板相对设置的基板、设于所述基板远离所述主板的一侧的金属天线、设于所述基板朝向所述主板的一侧的集成电路芯片、设于所述基板内并与所述金属天线间隔设置的馈电网络及连接所述馈电网络与所述集成电路芯片的电路,所述电路与所述主板电连接,所述馈电网络对应所述金属天线的位置开设有缝隙,所述金属天线通过所述缝隙耦合馈电。
优选的,所述封装天线***为毫米波相控阵天线***。
优选的,所述馈电网络为带状线,其包括靠近所述金属天线的第一金属层、与所述第一金属层相对间隔设置的第二金属层以及夹设于所述第一金属层和所述第二金属层之间的带状线路层,所述带状线路层与所述第一金属层和所述第二金属层间隔设置,所述带状线路层包括一长条形传输线,所述缝隙设置于所述第一金属层。
优选的,所述缝隙包括第一部分、与所述第一部分平行间隔设置的第二部分及连接所述第一部分和所述第二部分的第三部分,所述第一部分、所述第二部分及所述第三部分均为直线型缝隙,所述第三部分的两端分别连接所述第一部分和所述第二部分的正中间。
优选的,所述金属天线为一维直线阵,其包括多个金属天线单元,所述缝隙的数量与所述金属天线单元的数量相匹配,每个所述金属天线单元通过所述缝隙耦合馈电。
优选的,所述缝隙向所述金属天线单元方向的正投影完全位于所述金属天线单元的范围内。
优选的,所述第三部分向所述带状线路层的正投影与所述传输线垂直相交,所述第一部分和所述第二部分向所述带状线路层的正投影位于所述传输线的两侧且关于所述传输线对称。
优选的,所述金属天线选自方形贴片天线、环形贴片天线、圆形贴片天线及十字形贴片天线中的一种。
优选的,所述金属天线表面贴敷有保护膜。
本发明还提供一种移动终端,其包括所述封装天线***。
与相关技术相比,本发明提供的封装天线***及移动终端具有如下有益效果:通过具有缝隙的带状线与金属天线耦合馈电,在较薄的天线厚度下,实现了较宽阻抗带宽,相较于传统的馈电方式,带宽拓展了50%。
【附图说明】
图1为本发明提供的移动终端的立体结构示意图;
图2为图1所示的移动终端的部分结构的平面结构示意图;
图3为图1所示的馈电网络的分层结构示意图;
图4为图1所示的馈电网络的正视图;
图5(a)为本发明提供的封装天线***中,各金属天线单元的相移为45°的辐射方向图;
图5(b)为本发明提供的封装天线***中,各金属天线单元的相移为0°的辐射方向图;
图5(c)为本发明提供的封装天线***中,各金属天线单元的相移为-45°的辐射方向图;
图6为本发明提供的封装天线***的覆盖效率曲线图。
【具体实施方式】
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部份实施例,而不是全部的实施例。
如图1-3所示,本发明提供一种移动终端100,该移动终端100可以是手机、ipad以及POS机等,本发明对此不作限定,所述移动终端100包括边框1、盖合于所述边框1并与其围成收容空间的3D玻璃后盖2、收容于所述收容空间内并与所述3D玻璃后盖2间隔设置的主板3和与所述主板3电连接的封装天线***4。
所述3D玻璃后盖2可以通过胶粘剂盖合在所述边框1上,或者可以在所述边框1和所述3D玻璃后盖2上分别设置相应的卡扣结构,使得3D玻璃后盖2可以通过卡接方式固定连接在所述边框1上,或者所述边框1与所述3D玻璃后盖一体成型。所述3D玻璃后盖2能提供更好的保护、美观度、热扩散、色彩度以及用户体验。
所述封装天线***4可以接收和发送电磁波信号,进而实现所述移动终端100的通信功能。具体地,所述封装天线***4可以通过BGA封装技术与所述主板3连接。
所述封装天线***4为毫米波相控阵,具体地,所述封装天线***4包括基板41、设于所述基板41远离所述主板3的一侧的金属天线42、设于所述基板41内并与所述金属天线42间隔设置的馈电网络43、设于所述基板41朝向所述主板3的一侧的集成电路芯片44及连接所述馈电网络44和所述集成电路芯片44的电路45。
所述基板41用于承载所述封装天线***4的其他器件,所述基板41可以一体成型,也可以分层设置。
所述金属天线42选自方形贴片天线、环形贴片天线、圆形贴片天线及十字形贴片天线中的一种。优选的,所述金属天线42为正方形贴片天线。当然,在其他实施方式中,所述金属天线42也可以选用其他形式的天线。
进一步的,所述金属天线42为一维直线阵,在手机中占用的空间窄,并只需扫描一个角度,简化了设计难度、测试难度、以及波束管理的复杂度。优选的,所述金属天线42为1*4的直线阵,即所述金属天线42包括四个金属天线单元421。
所述馈电网络43为带状线,阻抗容易控制,同时屏蔽较好,可以有效减少电磁能量的损耗,提高天线效率。所述馈电网络43包括靠近所述金属天线42的第一金属层431、与所述第一金属层431相对间隔设置的第二金属层432及夹设于所述第一金属层431和所述第二金属层432之间的带状线路层433。
所述第一金属层431对应所述金属天线42的位置设有缝隙40,所述馈电网络43通过所述缝隙40耦合馈电。
所述缝隙40的数量与所述金属天线单元421的数量相匹配,每个所述金属天线单元421通过所述缝隙40耦合馈电,具体的,电磁能量通过所述缝隙40耦合至所述金属天线单元421。在本实施方式中,所述缝隙40的数量为四个,每个所述缝隙40与一个所述金属天线单元421对应设置。
请参阅图4,在本实施方式中,所述缝隙40呈工字型,所述缝隙40包括第一部分410、与所述第一部分410平行间隔设置的第二部分420及连接所述第一部分410和所述第二部分420的第三部分430,所述第一部分410、所述第二部分420及所述第三部分430均为直线型缝隙,所述第三部分430的两端分别连接所述第一部分410和所述第二部分420的正中间。所述带状线路层433包括一长条形传输线4331。所述第三部分430向所述带状线路层433的正投影与所述传输线4331垂直相交,所述第一部分410和所述第二部分420向所述带状线路层433的正投影位于所述传输线4331的两侧且关于所述传输线4331对称。
在其他实施方式中,所述缝隙40的形状还可方形、环形、圆形或者三角形,本发明对此不做限制。
进一步的,所述缝隙40向所述金属天线单元421方向的正投影完全落入所述金属天线单元421的范围内。
所述集成电路芯片44通过倒桩焊工艺与所述基板41固定连接。
请参阅图5(a)~图6,其中图5(a)为本发明提供的封装天线***中,各金属天线单元的相移为45°的辐射方向图;图5(b)为本发明提供的封装天线***中,各金属天线单元的相移为0°的辐射方向图;图5(c)为本发明提供的封装天线***中,各金属天线单元的相移为-45°的辐射方向图;图6为本发明提供的封装天线***的覆盖效率曲线图。由图6可知,在覆盖效率为50%的情况下,所述封装天线***4的增益阈值下降12.4dB,而在3GPP讨论中,对于50%覆盖效率,该增益阈值下降为12.98dB,因此,说明本发明的封装天线***4具有更优的覆盖效率。
相比于相关技术中的封装天线,本实施方式中的封装天线***4采用PCB工艺或者LTCC工艺层叠而成,并通过馈电网络43与金属天线42耦合馈电,达到了相同厚度下更宽带的天线阻抗带宽,其中以5G通信n257(26.5-29.5GHz)频段的阻抗带宽为例,相较于传统的馈电方式,带宽拓展了50%。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其它相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (8)
1.一种封装天线***,应用于移动终端,所述移动终端包括主板,其特征在于,所述封装天线***包括与所述主板相对设置的基板、设于所述基板远离所述主板的一侧表面的金属天线、设于所述基板朝向所述主板的一侧的集成电路芯片、设于所述基板内并与所述金属天线间隔设置的馈电网络及连接所述馈电网络与所述集成电路芯片的电路,所述电路与所述主板电连接,所述馈电网络为带状线,所述馈电网络包括靠近所述金属天线的第一金属层、与所述第一金属层相对间隔设置的第二金属层以及夹设于所述第一金属层和所述第二金属层之间的带状线路层,所述带状线路层与所述第一金属层和所述第二金属层间隔设置,所述带状线路层包括一长条形传输线;
所述馈电网络对应所述金属天线的位置开设有缝隙,所述缝隙设置于所述第一金属层,所述金属天线通过所述缝隙耦合馈电,所述金属天线包括多个金属天线单元,所述缝隙的数量与所述金属天线单元的数量相匹配,每个所述金属天线单元通过所述缝隙耦合馈电;
所述金属天线为一维直线阵;所述基板为一体成型结构。
2.根据权利要求1所述的封装天线***,其特征在于,所述封装天线***为毫米波相控阵天线***。
3.根据权利要求1所述的封装天线***,其特征在于,所述缝隙包括第一部分、与所述第一部分平行间隔设置的第二部分及连接所述第一部分和所述第二部分的第三部分,所述第一部分、所述第二部分及所述第三部分均为直线型缝隙,所述第三部分的两端分别连接所述第一部分和所述第二部分的正中间。
4.根据权利要求1所述的封装天线***,其特征在于,所述缝隙向所述金属天线单元方向的正投影完全位于所述金属天线单元的范围内。
5.根据权利要求4所述的封装天线***,其特征在于,所述第三部分向所述带状线路层的正投影与所述传输线垂直相交,所述第一部分和所述第二部分向所述带状线路层的正投影位于所述传输线的两侧且关于所述传输线对称。
6.根据权利要求1所述的封装天线***,其特征在于,所述金属天线选自方形贴片天线、环形贴片天线、圆形贴片天线及十字形贴片天线中的一种。
7.根据权利要求1所述的封装天线***,其特征在于,所述金属天线表面贴敷有保护膜。
8.一种移动终端,其特征在于,包括权利要求1-7任一项所述的封装天线***。
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