CN101454680A - 基板检查装置和基板检查方法 - Google Patents

基板检查装置和基板检查方法 Download PDF

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Publication number
CN101454680A
CN101454680A CNA2007800194236A CN200780019423A CN101454680A CN 101454680 A CN101454680 A CN 101454680A CN A2007800194236 A CNA2007800194236 A CN A2007800194236A CN 200780019423 A CN200780019423 A CN 200780019423A CN 101454680 A CN101454680 A CN 101454680A
Authority
CN
China
Prior art keywords
inspection
substrate
group
wiring pattern
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800194236A
Other languages
English (en)
Chinese (zh)
Inventor
角田晴美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Corp
Original Assignee
Nidec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Corp filed Critical Nidec Corp
Publication of CN101454680A publication Critical patent/CN101454680A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
CNA2007800194236A 2006-06-20 2007-06-19 基板检查装置和基板检查方法 Pending CN101454680A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006169820A JP2008002823A (ja) 2006-06-20 2006-06-20 基板検査装置及び基板検査方法
JP169820/2006 2006-06-20

Publications (1)

Publication Number Publication Date
CN101454680A true CN101454680A (zh) 2009-06-10

Family

ID=38833438

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800194236A Pending CN101454680A (zh) 2006-06-20 2007-06-19 基板检查装置和基板检查方法

Country Status (5)

Country Link
JP (1) JP2008002823A (ja)
KR (1) KR20090027610A (ja)
CN (1) CN101454680A (ja)
TW (1) TW200809226A (ja)
WO (1) WO2007148696A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102928685A (zh) * 2011-08-11 2013-02-13 富士施乐株式会社 基板检查装置及基板检查方法
CN103487608A (zh) * 2012-06-12 2014-01-01 日本电产理德株式会社 基板检查夹具以及基板检查装置
CN103543374A (zh) * 2012-07-13 2014-01-29 日置电机株式会社 基板检查装置及基板检查方法
CN104237669A (zh) * 2013-06-17 2014-12-24 日本电产理德株式会社 基板检查装置
CN104422859A (zh) * 2013-08-27 2015-03-18 日本电产理德股份有限公司 检测装置
CN105209924A (zh) * 2013-05-20 2015-12-30 日本电产理德股份有限公司 基板检测方法
CN110865293A (zh) * 2018-08-27 2020-03-06 日本麦可罗尼克斯股份有限公司 检查装置及检查方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5215026B2 (ja) * 2008-04-23 2013-06-19 日置電機株式会社 絶縁検査装置および絶縁検査方法
JP2010014597A (ja) * 2008-07-04 2010-01-21 Micronics Japan Co Ltd 可動式コンタクト検査装置
JP5208701B2 (ja) * 2008-12-04 2013-06-12 日置電機株式会社 絶縁検査方法および絶縁検査装置
JP2011027578A (ja) * 2009-07-27 2011-02-10 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
JP5428748B2 (ja) * 2009-10-21 2014-02-26 日本電産リード株式会社 検査用治具のメンテナンス方法及び基板検査装置
JP5828697B2 (ja) * 2011-07-15 2015-12-09 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP5866943B2 (ja) * 2011-10-06 2016-02-24 日本電産リード株式会社 基板検査装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52155364A (en) * 1976-06-18 1977-12-23 Matsushita Electric Ind Co Ltd Circuit wiring board inspecting system
JPS63262572A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd プリント基板箔スクリ−ニング検査方法
JPH1114710A (ja) * 1997-06-27 1999-01-22 Rohm Co Ltd 電子回路における不良素子検出方法および記憶媒体
JP2002504690A (ja) * 1998-02-18 2002-02-12 ルーテル ウント メルツァー ゲーエムベーハー プリント回路基板の検査を行なうための方法および装置
JP4068248B2 (ja) * 1998-12-28 2008-03-26 日本電産リード株式会社 基板の絶縁検査装置及びその絶縁検査方法
JP2000338166A (ja) * 1999-05-31 2000-12-08 Nidec-Read Corp 基板検査装置
JP3546046B2 (ja) * 2001-09-26 2004-07-21 日本電産リード株式会社 回路基板の絶縁検査装置及び絶縁検査方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102928685A (zh) * 2011-08-11 2013-02-13 富士施乐株式会社 基板检查装置及基板检查方法
CN102928685B (zh) * 2011-08-11 2017-06-23 富士施乐株式会社 基板检查装置及基板检查方法
CN103487608A (zh) * 2012-06-12 2014-01-01 日本电产理德株式会社 基板检查夹具以及基板检查装置
CN103543374A (zh) * 2012-07-13 2014-01-29 日置电机株式会社 基板检查装置及基板检查方法
CN105209924A (zh) * 2013-05-20 2015-12-30 日本电产理德股份有限公司 基板检测方法
CN105209924B (zh) * 2013-05-20 2018-11-20 日本电产理德股份有限公司 基板检测方法及基板检测用夹具
CN104237669A (zh) * 2013-06-17 2014-12-24 日本电产理德株式会社 基板检查装置
CN104422859A (zh) * 2013-08-27 2015-03-18 日本电产理德股份有限公司 检测装置
CN104422859B (zh) * 2013-08-27 2018-11-30 日本电产理德股份有限公司 检测装置
CN110865293A (zh) * 2018-08-27 2020-03-06 日本麦可罗尼克斯股份有限公司 检查装置及检查方法
CN110865293B (zh) * 2018-08-27 2021-11-09 日本麦可罗尼克斯股份有限公司 检查装置及检查方法

Also Published As

Publication number Publication date
TW200809226A (en) 2008-02-16
KR20090027610A (ko) 2009-03-17
WO2007148696A1 (ja) 2007-12-27
JP2008002823A (ja) 2008-01-10

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Open date: 20090610