CN101454680A - 基板检查装置和基板检查方法 - Google Patents
基板检查装置和基板检查方法 Download PDFInfo
- Publication number
- CN101454680A CN101454680A CNA2007800194236A CN200780019423A CN101454680A CN 101454680 A CN101454680 A CN 101454680A CN A2007800194236 A CNA2007800194236 A CN A2007800194236A CN 200780019423 A CN200780019423 A CN 200780019423A CN 101454680 A CN101454680 A CN 101454680A
- Authority
- CN
- China
- Prior art keywords
- inspection
- substrate
- group
- wiring pattern
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 199
- 238000000034 method Methods 0.000 title claims description 13
- 238000007689 inspection Methods 0.000 claims abstract description 255
- 239000000523 sample Substances 0.000 claims abstract description 52
- 238000001514 detection method Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 28
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006169820A JP2008002823A (ja) | 2006-06-20 | 2006-06-20 | 基板検査装置及び基板検査方法 |
JP169820/2006 | 2006-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101454680A true CN101454680A (zh) | 2009-06-10 |
Family
ID=38833438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2007800194236A Pending CN101454680A (zh) | 2006-06-20 | 2007-06-19 | 基板检查装置和基板检查方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2008002823A (ja) |
KR (1) | KR20090027610A (ja) |
CN (1) | CN101454680A (ja) |
TW (1) | TW200809226A (ja) |
WO (1) | WO2007148696A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102928685A (zh) * | 2011-08-11 | 2013-02-13 | 富士施乐株式会社 | 基板检查装置及基板检查方法 |
CN103487608A (zh) * | 2012-06-12 | 2014-01-01 | 日本电产理德株式会社 | 基板检查夹具以及基板检查装置 |
CN103543374A (zh) * | 2012-07-13 | 2014-01-29 | 日置电机株式会社 | 基板检查装置及基板检查方法 |
CN104237669A (zh) * | 2013-06-17 | 2014-12-24 | 日本电产理德株式会社 | 基板检查装置 |
CN104422859A (zh) * | 2013-08-27 | 2015-03-18 | 日本电产理德股份有限公司 | 检测装置 |
CN105209924A (zh) * | 2013-05-20 | 2015-12-30 | 日本电产理德股份有限公司 | 基板检测方法 |
CN110865293A (zh) * | 2018-08-27 | 2020-03-06 | 日本麦可罗尼克斯股份有限公司 | 检查装置及检查方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5215026B2 (ja) * | 2008-04-23 | 2013-06-19 | 日置電機株式会社 | 絶縁検査装置および絶縁検査方法 |
JP2010014597A (ja) * | 2008-07-04 | 2010-01-21 | Micronics Japan Co Ltd | 可動式コンタクト検査装置 |
JP5208701B2 (ja) * | 2008-12-04 | 2013-06-12 | 日置電機株式会社 | 絶縁検査方法および絶縁検査装置 |
JP2011027578A (ja) * | 2009-07-27 | 2011-02-10 | Hioki Ee Corp | 回路基板検査方法および回路基板検査装置 |
JP5428748B2 (ja) * | 2009-10-21 | 2014-02-26 | 日本電産リード株式会社 | 検査用治具のメンテナンス方法及び基板検査装置 |
JP5828697B2 (ja) * | 2011-07-15 | 2015-12-09 | 日置電機株式会社 | 回路基板検査装置および回路基板検査方法 |
JP5866943B2 (ja) * | 2011-10-06 | 2016-02-24 | 日本電産リード株式会社 | 基板検査装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52155364A (en) * | 1976-06-18 | 1977-12-23 | Matsushita Electric Ind Co Ltd | Circuit wiring board inspecting system |
JPS63262572A (ja) * | 1987-04-20 | 1988-10-28 | Matsushita Electric Ind Co Ltd | プリント基板箔スクリ−ニング検査方法 |
JPH1114710A (ja) * | 1997-06-27 | 1999-01-22 | Rohm Co Ltd | 電子回路における不良素子検出方法および記憶媒体 |
JP2002504690A (ja) * | 1998-02-18 | 2002-02-12 | ルーテル ウント メルツァー ゲーエムベーハー | プリント回路基板の検査を行なうための方法および装置 |
JP4068248B2 (ja) * | 1998-12-28 | 2008-03-26 | 日本電産リード株式会社 | 基板の絶縁検査装置及びその絶縁検査方法 |
JP2000338166A (ja) * | 1999-05-31 | 2000-12-08 | Nidec-Read Corp | 基板検査装置 |
JP3546046B2 (ja) * | 2001-09-26 | 2004-07-21 | 日本電産リード株式会社 | 回路基板の絶縁検査装置及び絶縁検査方法 |
-
2006
- 2006-06-20 JP JP2006169820A patent/JP2008002823A/ja active Pending
-
2007
- 2007-06-05 TW TW096120180A patent/TW200809226A/zh unknown
- 2007-06-19 KR KR1020087026199A patent/KR20090027610A/ko not_active Application Discontinuation
- 2007-06-19 CN CNA2007800194236A patent/CN101454680A/zh active Pending
- 2007-06-19 WO PCT/JP2007/062336 patent/WO2007148696A1/ja active Application Filing
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102928685A (zh) * | 2011-08-11 | 2013-02-13 | 富士施乐株式会社 | 基板检查装置及基板检查方法 |
CN102928685B (zh) * | 2011-08-11 | 2017-06-23 | 富士施乐株式会社 | 基板检查装置及基板检查方法 |
CN103487608A (zh) * | 2012-06-12 | 2014-01-01 | 日本电产理德株式会社 | 基板检查夹具以及基板检查装置 |
CN103543374A (zh) * | 2012-07-13 | 2014-01-29 | 日置电机株式会社 | 基板检查装置及基板检查方法 |
CN105209924A (zh) * | 2013-05-20 | 2015-12-30 | 日本电产理德股份有限公司 | 基板检测方法 |
CN105209924B (zh) * | 2013-05-20 | 2018-11-20 | 日本电产理德股份有限公司 | 基板检测方法及基板检测用夹具 |
CN104237669A (zh) * | 2013-06-17 | 2014-12-24 | 日本电产理德株式会社 | 基板检查装置 |
CN104422859A (zh) * | 2013-08-27 | 2015-03-18 | 日本电产理德股份有限公司 | 检测装置 |
CN104422859B (zh) * | 2013-08-27 | 2018-11-30 | 日本电产理德股份有限公司 | 检测装置 |
CN110865293A (zh) * | 2018-08-27 | 2020-03-06 | 日本麦可罗尼克斯股份有限公司 | 检查装置及检查方法 |
CN110865293B (zh) * | 2018-08-27 | 2021-11-09 | 日本麦可罗尼克斯股份有限公司 | 检查装置及检查方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200809226A (en) | 2008-02-16 |
KR20090027610A (ko) | 2009-03-17 |
WO2007148696A1 (ja) | 2007-12-27 |
JP2008002823A (ja) | 2008-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Open date: 20090610 |