CN101453829B - 提供替代电源给绘图卡的方法、绘图卡及计算机运算装置 - Google Patents

提供替代电源给绘图卡的方法、绘图卡及计算机运算装置 Download PDF

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CN101453829B
CN101453829B CN200710195127.3A CN200710195127A CN101453829B CN 101453829 B CN101453829 B CN 101453829B CN 200710195127 A CN200710195127 A CN 200710195127A CN 101453829 B CN101453829 B CN 101453829B
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electric wire
golden finger
circuit board
pcb
power supply
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CN101453829A (zh
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张涛
王智慧
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Nvidia Corp
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

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Abstract

本发明公开了一种绘图卡、提供替代电源给绘图卡的方法、以及计算机运算装置。特别是，本发明的一个具体实施例公开一种方法，该方法包含根据工业标准总线接口在印刷电路板上配置一组金手指、将电线放置在印刷电路板的中间层内、将该电线的第一末端连接至特定金手指以及将该替代电源连接至该电线的第二末端的步骤，其中该电线的该第二末端为突出于电路板外端的电镀接点。

Description

提供替代电源给绘图卡的方法、绘图卡及计算机运算装置
技术领域
本发明一般涉及支援周边组件互连(PCI)快速总线接口的配接卡，尤其涉及提供替代电源给绘图卡的设备及方法。 
背景技术
除非有其他指示，第一部分内说明的方法并不属于本申请权利要求的先前技术，并且不因包含在本段落内而公认为先前技术。 
计算机***通常包含专用图形子***，诸如绘图卡，来彩现用于计算机***的图形影像。周边组件互连快速版(PCI-E)已经过业界采用当成连接绘图卡与计算机***主机板的标准总线接口。 
一般绘图卡100包含至少一处理单元、存储器单元以及印刷电路板(PCB)上的引线。PCB一般包含具有引线(未显示)通过至少顶层与底层的多层。引线由连接材料制成，并且连接至许多组件来帮助信号传输以及电源供应。引线也连接至卡边缘连接器的镀金端子(也称之为“金手指”)。为了说明，图1A为显示传统绘图卡100的简化示意图，该绘图卡具有PCI-E接口以及一组金手指110。金手指110区分成第一部分102以及第二部分104。在此，第一部分102内的金手指主要负责输送数据信号，并且第二部分104内的金手指主要负责供应电源给整张绘图卡100。一般而言，绘图卡100利用连接电源供应器至空焊垫(未显示)来供电。特别是，空焊垫透过线路连接至第二部分104，如此来自电源供应器的电荷流过第二部分104。然后电荷从第二部分104导引流至第一部分102。 
一个现有的解决方案为使用电线将第一部分102连接至第二部分104。图1B为显示传统金手指配置与电线连接结构的示意图。在此，每一第一部分102和第二部分104分别包含缩短的金手指118和120。对于第一部分102而言，缩短的金手指118位于PCB的顶层112上。对于第二部分104而言，缩短的金手指120位于相同PCB的底层116上。设计该缩短的金手指是为了两种目的。一种是提供防呆设计，确定绘图卡正确***插槽内，使其连接 紧密。另一种目的为供电给绘图卡。两缩短的金手指118和120都分别连接至穿透孔124和126，穿透孔124和126为圆柱形并且具有电镀介质，如此可传输诸如电源信号的这类电气信号。外部电源连接至空焊垫130，其从底层116上的第二部分104连接至缩短的金手指120。为传递电源信号从第二部分104到达第一部分102，使用电线128。电线128将第一部分102的缩短金手指118连接至第二部分104的缩短金手指120。电线128位于PCB的中间层114内。如图1B内所示，电线128透过穿透孔126连接至底层116上的缩短金手指120，并且也透过穿透孔124连接至顶层112上的缩短金手指118。将电线128定位在不同层，相对于在顶层112或底层116上，帮助减少将电线128配置通过PCB所导致的信号干扰。不过，信号干扰的问题仍就无法完全去除，特别是若在电线128上传输的信号强度增加时。在信号干扰之下，整体信号传输品质，特别是在高速时，仍旧要受到影响。 
图1C为显示另一传统金手指配置与电线连接的结构的示意图。在此，电线160位于PCB的顶层150上。缩短的金手指154位于一组金手指152的末端上，该组金手指位于相同的顶层150上。电线160从顶层150上缩短的金手指154连接至空焊垫158。空焊垫158一般位于靠近缩短的金手指154的位置上，并且如上面所讨论，通常连接至电源供应器。在缩短的金手指154与空焊垫158之间为最后一个金手指156。 
所说明的组态有一个值得注意的缺陷。因为电线160位于顶层150上，而连接至也位于相同顶层150上最后金手指156的引线162必须与连接在缩短的金手指154与空焊垫158间的电线160交错。这样的交错会产生不允许的短路。为避免短路，使最后金手指156实无作用(即是不能连接至引线)，但仍旧占用PCB上宝贵的空间。 
如上面所述，所需为一种可提供替代电源而仍旧维持目前金手指配置，并且解决至少上述问题的方法与设备。 
发明内容
本发明的一个具体实施例公开一种方法，该方法包含根据工业标准总线接口在印刷电路板上配置一组金手指、将电线放置在印刷电路板的中间层内、将该电线的第一末端连接至特定金手指以及将该替代电源连接至该电线的第二末端的步骤，其中该电线的该第二末端为突出于电路板外端的电镀接 点。 
此处所披露的本发明至少一优点为提供有效方式，来提供电源给PCB并且解决至少上述问题。 
附图说明
为详细了解本发明上述特色的方式，本发明的更特定说明已于以上简短汇整，可参照具体实施例，其中某些具体实施例说明于附图内。不过应该注意，附图只说明本发明的典型具体实施例，因此并不对发明领域产生限制，本发明容许包含其他等效具体实施例。 
图1A为显示传统绘图卡的简化示意图，该绘图卡具有PCI-E接口以及一组金手指； 
图1B为显示传统金手指配置与电线连接的结构的示意图； 
图1C为显示另一传统金手指配置与电线连接的结构的示意图； 
图2说明根据本发明一个具体实施例，显示在配接卡内连接至替代电源的电线的示意图；以及 
图3为根据本发明一个具体实施例，使用穿透孔与PCB不同层的电线连接的透视图。 
附图标记说明 
100绘图卡              102第一部分 
104第二部分            106处理单元 
108存储器单元          110金手指 
112顶层                114中间层 
116底层                118缩短的金手指 
120缩短的金手指        124穿透孔 
126穿透孔              128电线 
130空焊垫              150顶层 
152金手指              154缩短的金手指 
156最后金手指          158空焊垫 
160电线                162引线 
200印刷电路板          202第一部分 
204第二部分            206空焊垫 
208缩短的金手指    212电线 
214中间层          216穿透孔 
218缩短的金手指    220连接电线 
222顶层            224电镀接点 
具体实施方式
图2说明根据本发明一个具体实施例，显示在配接卡内连接至替代电源的电线的示意图。根据标准PCI-E接口规格，PCB 200内的金手指区分成两个部分：第一部分202与第二部分204。第二部分204透过空焊垫206连接至电源。空焊垫206进一步从配接卡底层上的第二部分204连接至缩短的金手指208。不同于第二部分204，第一部分202是利用位于中间层214内的电线212直接连接至替代电源(未显示)，来提供第一部分202金手指所需的电源。特别是，利用将电线212的一端接至穿透孔216，而穿透孔透过连接电线220进一步连接至缩短的金手指218，该替代电源可透过电线212供应电源信号给缩短的金手指218。在电线212的另一端上为电镀接点224，其伸出PCB 200之外并且暴露在空气中。 
与图2相连来进一步说明电线连接，图3为根据本发明一个具体实施例，使用穿透孔216与PCB 200不同层的电线连接的透视图。特别是，电线212的一端接至PCB 200中间层214内的穿透孔216。穿透孔216为电镀，并且利用连接电线220连接至顶层222上缩短的金手指218。电线212的一端接至中间层214内的穿透孔216，电线212的另一端从中间层214伸出PCB 200之外。电线212的另一端为电镀接点224。接点224为圆形，并且用于与其他电源连接，该电源与图2内连接至空焊垫206的电源不同。 
虽然上述指向本发明的具体实施例，不过可想出不悖离本发明基本领域以及权利要求的其他与进一步具体实施例。 

Claims (7)

1.一种提供替代电源给绘图卡的方法，该方法包含：
根据工业标准总线接口将一组金手指配置在印刷电路板上；
所述金手指区分成第一部分以及第二部分，所述第二部分通过空焊垫连接至电源；
在该印刷电路板的中间层内放置电线；
将该电线的第一末端接至穿透孔；以及用连接电线将该穿透孔连接至所述第一部分的特定金手指；以及
将该替代电源接至该电线的第二末端，其中该电线的该第二末端为突出于电路板外端的电镀接点。
2.如权利要求1所述的方法，其中该工业标准总线接口为周边组件互连快速总线接口。
3.如权利要求1所述的方法，其中该特定金手指为缩短的金手指。
4.一种配置成连接至替代电源的绘图卡，该绘图卡包含：
印刷电路板；
一组金手指，其根据工业标准总线接口配置在该印刷电路板上；
所述金手指区分成第一部分以及第二部分，所述第二部分通过空焊垫连接至电源；以及
电线，其位于该印刷电路板的中间层内，其中该电线的第一末端连接至穿透孔；以及用连接电线将该穿透孔连接至所述第一部分的特定金手指，并且该电线的第二末端，其为突出于电路板外端的电镀接点，接至该替代电源。
5.如权利要求4所述的绘图卡，其中该特定金手指为缩短的金手指。
6.如权利要求4所述的绘图卡，其中该电线的该第二末端为圆形接点。
7.一种计算机运算装置，该装置包含：
运算处理装置；
存储装置；以及
配置连接至替代电源的绘图卡，该绘图卡进一步包含：
印刷电路板，
一组金手指，其根据工业标准总线接口配置在该印刷电路板上，
所述金手指区分成第一部分以及第二部分，所述第二部分通过空焊垫连接至电源；以及
电线，其位于该印刷电路板的中间层内，其中该电线的第一末端连接至穿透孔；以及用连接电线将该穿透孔连接至所述第一部分的特定金手指，并且该电线的第二末端，其为突出于电路板外端的电镀接点，接至该替代电源。
CN200710195127.3A 2007-11-29 2007-11-29 提供替代电源给绘图卡的方法、绘图卡及计算机运算装置 Active CN101453829B (zh)

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US11/955,317 US8045330B2 (en) 2007-11-29 2007-12-12 Method and apparatus for providing an alternative power source for a graphics card
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