CN101364479A - 陶瓷生片结构及层叠陶瓷电子部件的制造方法 - Google Patents
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Abstract
一种陶瓷生片结构及层叠陶瓷电子部件的制造方法,其中该陶瓷生片结构包括:至少包含陶瓷材料及树脂的陶瓷生片、和在该陶瓷生片上形成的导电层。电极非形成区域的空隙度为17%以上,优选为25%以下。此外,形成了导电层的电极形成区域的空隙度小于没有形成导电层的电极非形成区域的空隙度。
Description
技术领域
本发明涉及陶瓷生片结构及层叠陶瓷电子部件的制造方法。
背景技术
作为层叠陶瓷电子部件之一的层叠陶瓷电容器通过如下的工序制作。首先,在PET(Polyethylene terephthalate:聚对苯二甲酸乙二醇酯)膜上片状地涂敷电介质糊料,使其干燥而得到陶瓷生片(green sheet)。接着,在该陶瓷生片上按照预定的图案印刷或涂敷导体糊料,并使其干燥。在干燥之后剥离PET膜,得到在上表面配置有内部电极的陶瓷生片。接着,将该陶瓷生片切断为某种程度的大小的片,以内部电极在上下交替错开的方式层叠相当多片数的这种片。将得到的生片层叠体进行模压之后截断,由该生片层叠体得到多个长方体形状的生基片(green chip)。并且,对各生基片实施磨圆角部的抛光处理或烧结处理,进而形成端子电极来得到层叠陶瓷电容器(参照日本特开平9—129486号公报)。
但是,如上所述地层叠多片陶瓷生片而制造层叠陶瓷电子部件时,有在片之间混入气泡、然后在烧结或工序移送时引起原因为气泡的裂缝等,导致可靠性的下降的可能性。
发明内容
本发明是鉴于上述情况做出的,其目的在于,提供一种可消除片之间的气泡混入的陶瓷生片结构及层叠陶瓷电子部件的制造方法。
为了解决上述课题,本发明的陶瓷生片结构包括:至少包含陶瓷材料及树脂的陶瓷生片;以及在该陶瓷生片上形成的导电层;没有形成导电层的电极非形成区域的空隙度为17%以上。
优选,电极非形成区域的空隙度为25%以下。
此外,形成了导电层的电极形成区域的空隙度小于电极非形成区域的空隙度。
解决该课题的本发明的层叠陶瓷电子部件的制造方法包括:准备至少包含陶瓷材料及树脂、空隙度为17%以上的陶瓷生片的工序;在陶瓷生片上形成导电层的工序;对形成了导电层的陶瓷生片进行层叠而构成生片层叠体的工序;将生片层叠体截断为规定的尺寸而获得多个生基片的工序;以及烧结生基片的工序。
根据上述的本发明,可以消除片之间的气泡混入。
并且,本发明的其它特征及基于此的作用效果参照附图通过实施方式更详细地说明。
附图说明
图1是表示层叠陶瓷电容器的结构的截面图。
图2是表示本发明的实施方式涉及的层叠陶瓷电容器的制造方法的工序图。
图3是表示陶瓷生片的形成工序的图。
图4是表示导电层的形成工序的图。
图5是表示陶瓷生片的层叠状态、切断形态等的图。
图6是表示在导电层的形成前后的空隙度的图像的图。
具体实施方式
下面,将本发明涉及的陶瓷生片结构的实施方式、及通过它的层叠陶瓷电子部件的制造方法的实施方式以层叠陶瓷电容器的例子进行说明。并且,在图中假设同一符号表示同一或对应部分。
图1是表示层叠陶瓷电容器的一例的截面图。图示的层叠陶瓷电容器1在由陶瓷构成的陶瓷基体3的内部埋设有多个内部电极(导电层)5、7。陶瓷基体3如后面所述通过层叠多个陶瓷生片而构成。
在图中上下相邻关系的内部电极5、7配置成位置相互不同、隔着构成陶瓷基体3的陶瓷层而相对。内部电极5、7的层数根据所要求的静电电容来决定。
在陶瓷基体3的相对的侧面设有端子电极15、17作为外部电极。内部电极5与其中的端子电极15导通,内部电极7与端子电极17导通。
接着,对本实施方式涉及的层叠陶瓷电容器的制造方法进行说明。如图2所示,首先,作为步骤S1,制作包含陶瓷材料和树脂、空隙度为17%以上的陶瓷生片,并准备多片对该片设置了内部电极的片。
若更详细地例示说明该步骤,则如图3所示,在具有可挠性的PET膜21的上表面,片状地涂敷陶瓷糊料23a。陶瓷糊料的涂敷可以使用刮刀或挤压头等涂敷单元22进行。在图示例中,通过使PET膜21相对于涂敷单元22向箭头S方向移动,从而陶瓷糊料23a被配置成片状。然后,通过使陶瓷糊料23a干燥,从而可以得到支承在PET膜21的上表面的陶瓷生片23(参照图4)。
并且,陶瓷糊料23a由钛酸钡等陶瓷材料粉、包含树脂材料粉的粘合剂、溶剂,进而根据需要由可塑剂等构成。
此外,陶瓷生片23的空隙度要求为17%以上,在此,空隙度如下地测量。用电子显微镜观察陶瓷生片的背面即具有PET膜的一侧的面,测量基准线上由于粒子的存在而占的长度的合计。并且,设该合计的长度为X[μm],基准线的长度为B[μm](例如10[μm])时,
假设空隙度[%]=(B—X)/B。
空隙度通过构成陶瓷糊料的原料中的、溶剂及树脂材料的调节来控制。例如,树脂使用丁缩醛类的情况下,通过调节对丁缩醛为良溶剂的“醇类”、“丁酮”、和对丁缩醛为不良溶剂的“甲苯”、“二甲苯”、“粗汽油等石油类溶剂”的配合状态,从而可以控制空隙度。这里,所谓良溶剂表示对树脂溶解度大的溶剂,所谓不良溶剂表示对树脂的溶解度小的溶剂。此外,作为其它例子,树脂使用丙烯类树脂时,通过调节对丙烯类树脂为良溶剂的“丙酮”、“丁酮”、“乙酸乙酯”和对丙烯类树脂为不良溶剂的“粗汽油等石油类溶剂”的配合状态,从而可以控制空隙度。
接着,如图4所示,在干燥之后得到的空隙度为17%以上的陶瓷生片23的上表面,在适当的地方涂敷导电糊料25。导电糊料25的配置例如可以通过丝网印刷法或凹版印刷法来进行,在图4中例示丝网印刷法。即,在丝网27的表面上使橡皮刮板(squeegee)29向箭头F的方向移动,通过将导电糊料25挤压到陶瓷生片23的表面上来进行印刷。进而,进行印刷的导电糊料的干燥而得到内部电极5、7。导电糊料25由镍或铜等导电金属材料粉、包含树脂材料粉的粘合剂、溶剂,进而根据需要由作为共同材料的钛酸钡等陶瓷材料粉和可塑剂等构成。
然后,通过从陶瓷生片23剥离PET膜21,从而得到在陶瓷生片23上具有内部电极(导电层)5、7的陶瓷生片结构10(参照图5)。
接着,作为步骤S2,将多片通过步骤S1得到的陶瓷生片结构10如图5所示地在底台31上层叠。并且,在层叠方向下层和上层,层叠未设置内部电极5、7的陶瓷生片。设有内部电极5、7的区域是层叠陶瓷电容器1的所谓内层部分,在其上下没有设置内部电极5、7的仅为陶瓷层的区域成为层叠陶瓷电容器1的所谓外层部分。被使用的陶瓷生片23的层数由所要求的电容值等决定。
此外,陶瓷生片的层叠方法有各种方式。例如,也可以将设有内部电极5、7的陶瓷生片23仅层叠必要层数来形成内层部分,另一方面通过其它工序形成外层部分,其后重合两者。或者,也可以不是所谓内层部分和外层部分的区分,而是制作出综合多片进行干燥的陶瓷生片层叠体,并对其依次层叠的方式。
对于内层部分用的陶瓷生片结构10的层叠,在邻接的2片陶瓷生片结构10中,使一方的陶瓷生片结构10上的内部电极5、7与另一方的陶瓷生片结构10的内部电极5、7的一部分、及内部电极5、7间的间隙重合,并依次层叠。
接着,作为步骤S3,模压生片层叠体之后,在图5中在以符号C例示的位置截断,由该生片层叠体得到多个长方体状的生基片。进而,对于生基片,作为步骤S4,实施固化干燥处理(根据需要)和第一滚筒抛光,作为步骤S5,进行脱粘合剂处理,从生基片中烧除粘合剂成分之后,进行烧结,作为步骤S6进行第二滚筒抛光,作为步骤S7形成端子电子15、17,得到图1所示的层叠陶瓷电容器1。
因此,层叠多片陶瓷生片而制造层叠陶瓷电子部件时,在片之间混入气泡,然后,有在烧结或工序移送时引起原因为气泡的裂缝等、导致可靠性下降的可能性。但是,在本实施方式中,陶瓷生片具有如下的结构,所以可以消除该问题。
若参照图6进行说明,则形成内部电极5、7之前的陶瓷生片23的空隙度为17%以上。对该陶瓷生片23形成内部电极5、7时,形成了内部电极5、7的电极形成区域51的空隙度减少为15%左右,另一方面,没有形成内部电极5、7的电极非形成区域的53的空隙度仍是17%以上。因此,将应构成生片层叠体的陶瓷生片23进行层叠时,气泡容易从空隙度大的电极非形成区域53透过,可以消除片之间的气泡的混入。
对此,本发明人对电极非形成区域的空隙度和不良状况的关系进行实验时,得到了如下表所示的结果。
由该表的结果可知,在电极非形成区域的空隙度为27%、25%、23%、21%、17%的样品1、2、3、4、5中,没有气泡的混入现象的发生。另一方面,在电极非形成区域的空隙度为16%、15%的样品6、7中发现气泡的混入现象的产生。
此外,在上述实验中,不仅对气泡的混入现象的发生,也对有没有短路故障进行了调查。由此,电极非形成区域的空隙度为从15%~25%为止的样品2~7中没有发生短路故障,但是,在电极非形成区域的空隙度为27%的样品1中确认发生了短路故障。因此,若采取更严格的基准,则电极非形成区域的空隙度优选为25%以下。
进而,根据上述实验结果可知,在本发明中考虑为更好的范围的、至少电极非形成区域的空隙度为17%~25%的结构中,可以确认电极形成区域的空隙度小于电极非形成区域的空隙度,即,电极非形成区域的空隙度维持为较大的同时,在电极形成区域可以确保高密度化。因此,具有还适于防止分层的充分的强度。
以上,参照优选实施方式具体地说明了本发明的内容,但是基于本发明的基本技术思想及启示,若是本领域技术人员,就可以采取各种改变方式,这是显而易见的。
应用本发明的层叠陶瓷电子部件不限于层叠陶瓷电容器。因此,例如还可以应用于电感、LC滤波器等。
Claims (4)
1.一种陶瓷生片结构,其特征在于,包括:
至少包含陶瓷材料及树脂的陶瓷生片;以及
在该陶瓷生片上形成的导电层,
没有形成上述导电层的电极非形成区域的空隙度为17%以上。
2.如权利要求1所述的陶瓷生片结构,其特征在于,
上述电极非形成区域的空隙度为25%以下。
3.如权利要求1所述的陶瓷生片结构,其特征在于,
形成了上述导电层的电极形成区域的空隙度小于上述电极非形成区域的空隙度。
4.一种层叠陶瓷电子部件的制造方法,其特征在于,包括:
准备至少包含陶瓷材料及树脂、空隙度为17%以上的陶瓷生片的工序;
在上述陶瓷生片上形成导电层的工序;
对形成了上述导电层的陶瓷生片进行层叠而构成生片层叠体的工序;
将上述生片层叠体截断为规定的尺寸而获得多个生基片的工序;以及
烧结上述生基片的工序。
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CN103026621A (zh) * | 2010-07-22 | 2013-04-03 | Tdk株式会社 | 层叠型电子部件的制造方法以及层叠型电子部件 |
CN111295724A (zh) * | 2017-11-02 | 2020-06-16 | 株式会社村田制作所 | 热敏电阻元件及其制造方法 |
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JP2001023852A (ja) * | 1999-07-06 | 2001-01-26 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
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CN103026621A (zh) * | 2010-07-22 | 2013-04-03 | Tdk株式会社 | 层叠型电子部件的制造方法以及层叠型电子部件 |
US8864925B2 (en) | 2010-07-22 | 2014-10-21 | Tdk Corporation | Method for producing laminated electronic component, and laminated electronic component |
CN111295724A (zh) * | 2017-11-02 | 2020-06-16 | 株式会社村田制作所 | 热敏电阻元件及其制造方法 |
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US20090042048A1 (en) | 2009-02-12 |
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