JP2009043867A - セラミックグリーンシート構造、及び、積層セラミック電子部品の製造方法 - Google Patents
セラミックグリーンシート構造、及び、積層セラミック電子部品の製造方法 Download PDFInfo
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- JP2009043867A JP2009043867A JP2007206183A JP2007206183A JP2009043867A JP 2009043867 A JP2009043867 A JP 2009043867A JP 2007206183 A JP2007206183 A JP 2007206183A JP 2007206183 A JP2007206183 A JP 2007206183A JP 2009043867 A JP2009043867 A JP 2009043867A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 80
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 239000003985 ceramic capacitor Substances 0.000 description 13
- 229920002799 BoPET Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000013404 process transfer Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/608—Green bodies or pre-forms with well-defined density
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/346—Titania or titanates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249956—Void-containing component is inorganic
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
【解決手段】セラミックグリーンシート構造10は、少なくともセラミック材料及び樹脂を含むセラミックグリーンシート23と、そのセラミックグリーンシート上に形成された導電層5、7とを含む。電極非形成領域53の空隙度は、17%以上であり、好適には、25%以下でもある。また、導電層が形成された電極形成領域51の空隙度は、導電層が形成されていない電極非形成領域53の空隙度よりも小さい。
【選択図】図6
Description
また、導電層が形成された電極形成領域の空隙度は、電極非形成領域の空隙度よりも小さい。
空隙度[%]=(B−X)/B
とする。
5、7 内部電極(導電層)
10 セラミックグリーンシート構造
23 セラミックグリーンシート
51 電極形成領域
53 電極非形成領域
Claims (4)
- セラミック材料及び樹脂を少なくとも含むセラミックグリーンシートと、
そのセラミックグリーンシート上に形成された導電層とを含み、
前記導電層が形成されていない電極非形成領域の空隙度は、17%以上である
セラミックグリーンシート構造。 - 前記電極非形成領域の空隙度は、25%以下である
請求項1に記載のセラミックグリーンシート。 - 前記導電層が形成された電極形成領域の空隙度は、前記電極非形成領域の空隙度よりも小さい
請求項1又は2に記載のセラミックグリーンシート。 - セラミック材料及び樹脂を少なくとも含み、空隙度が17%以上であるセラミックグリーンシートを用意する工程と、
前記セラミックグリーンシート上に導電層を形成する工程と、
前記導電層が形成されたセラミックグリーンシートを積層してグリーンシート積層体を構成する工程と、
前記グリーンシート積層体を所定のサイズに裁断して複数のグリーンチップを獲得する工程と、
前記グリーンチップを焼成する工程と
を含む積層セラミック電子部品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007206183A JP4586831B2 (ja) | 2007-08-08 | 2007-08-08 | セラミックグリーンシート構造、及び、積層セラミック電子部品の製造方法 |
US12/164,553 US7799409B2 (en) | 2007-08-08 | 2008-06-30 | Ceramic green sheet structure and method for manufacturing laminated ceramic electronic component |
KR1020080068991A KR20090015811A (ko) | 2007-08-08 | 2008-07-16 | 세라믹 그린시트 구조 및 적층 세라믹 전자 부품의 제조방법 |
CN2008101456162A CN101364479B (zh) | 2007-08-08 | 2008-08-07 | 陶瓷生片结构及层叠陶瓷电子部件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007206183A JP4586831B2 (ja) | 2007-08-08 | 2007-08-08 | セラミックグリーンシート構造、及び、積層セラミック電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009043867A true JP2009043867A (ja) | 2009-02-26 |
JP4586831B2 JP4586831B2 (ja) | 2010-11-24 |
Family
ID=40346831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007206183A Active JP4586831B2 (ja) | 2007-08-08 | 2007-08-08 | セラミックグリーンシート構造、及び、積層セラミック電子部品の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7799409B2 (ja) |
JP (1) | JP4586831B2 (ja) |
KR (1) | KR20090015811A (ja) |
CN (1) | CN101364479B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5305042B2 (ja) | 2010-07-22 | 2013-10-02 | Tdk株式会社 | 積層型電子部品の製造方法 |
CN106384667B (zh) * | 2010-08-18 | 2018-09-28 | 太阳诱电株式会社 | 叠层型陶瓷电子零件 |
KR101514512B1 (ko) * | 2013-04-08 | 2015-04-22 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
KR102089700B1 (ko) * | 2014-05-28 | 2020-04-14 | 삼성전기주식회사 | 적층 세라믹 커패시터, 적층 세라믹 커패시터의 제조 방법 및 적층 세라믹 커패시터의 실장 기판 |
US10217614B2 (en) | 2015-01-12 | 2019-02-26 | Lam Research Corporation | Ceramic gas distribution plate with embedded electrode |
WO2017066241A1 (en) * | 2015-10-14 | 2017-04-20 | Sfc Fluidics, Inc | Measurement of electric signals to detect presence or flow of electroactive species in solution |
US20190032211A1 (en) * | 2017-07-28 | 2019-01-31 | Lam Research Corporation | Monolithic ceramic gas distribution plate |
WO2019087777A1 (ja) * | 2017-11-02 | 2019-05-09 | 株式会社村田製作所 | サーミスタ素子およびその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11111560A (ja) * | 1997-10-06 | 1999-04-23 | Matsushita Electric Ind Co Ltd | セラミック電子部品の製造方法 |
JPH11260665A (ja) * | 1998-03-10 | 1999-09-24 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
JP2004299973A (ja) * | 2003-03-31 | 2004-10-28 | Tdk Corp | 厚膜グリーンシート用塗料、厚膜グリーンシート用塗料の製造方法、厚膜グリーンシートの製造方法、厚膜グリーンシートおよび電子部品の製造方法 |
JP2005213053A (ja) * | 2004-01-27 | 2005-08-11 | Teijin Solfill Kk | 自立性多孔質セラミックシートおよびそれからなる電子部品 |
WO2005113208A1 (ja) * | 2004-05-20 | 2005-12-01 | Tdk Corporation | グリーンシート、グリーンシートの製造方法、および電子部品の製造方法 |
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US4030004A (en) * | 1971-04-16 | 1977-06-14 | Nl Industries, Inc. | Dielectric ceramic matrices with end barriers |
US3965552A (en) * | 1972-07-24 | 1976-06-29 | N L Industries, Inc. | Process for forming internal conductors and electrodes |
JPH09129486A (ja) | 1995-10-30 | 1997-05-16 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
JPH11340082A (ja) | 1998-05-28 | 1999-12-10 | Taiyo Yuden Co Ltd | 積層チップ部品とその製造方法 |
JP3521774B2 (ja) | 1998-12-03 | 2004-04-19 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
JP2001023852A (ja) * | 1999-07-06 | 2001-01-26 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2001114569A (ja) * | 1999-10-20 | 2001-04-24 | Murata Mfg Co Ltd | セラミックスラリー組成物、セラミックグリーンシート及び積層セラミック電子部品の製造方法 |
JP2002361624A (ja) | 2001-06-04 | 2002-12-18 | Koa Corp | セラミックグリーンシートおよび積層セラミック電子部品の製造方法 |
-
2007
- 2007-08-08 JP JP2007206183A patent/JP4586831B2/ja active Active
-
2008
- 2008-06-30 US US12/164,553 patent/US7799409B2/en active Active
- 2008-07-16 KR KR1020080068991A patent/KR20090015811A/ko not_active Application Discontinuation
- 2008-08-07 CN CN2008101456162A patent/CN101364479B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11111560A (ja) * | 1997-10-06 | 1999-04-23 | Matsushita Electric Ind Co Ltd | セラミック電子部品の製造方法 |
JPH11260665A (ja) * | 1998-03-10 | 1999-09-24 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
JP2004299973A (ja) * | 2003-03-31 | 2004-10-28 | Tdk Corp | 厚膜グリーンシート用塗料、厚膜グリーンシート用塗料の製造方法、厚膜グリーンシートの製造方法、厚膜グリーンシートおよび電子部品の製造方法 |
JP2005213053A (ja) * | 2004-01-27 | 2005-08-11 | Teijin Solfill Kk | 自立性多孔質セラミックシートおよびそれからなる電子部品 |
WO2005113208A1 (ja) * | 2004-05-20 | 2005-12-01 | Tdk Corporation | グリーンシート、グリーンシートの製造方法、および電子部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090042048A1 (en) | 2009-02-12 |
US7799409B2 (en) | 2010-09-21 |
CN101364479A (zh) | 2009-02-11 |
JP4586831B2 (ja) | 2010-11-24 |
KR20090015811A (ko) | 2009-02-12 |
CN101364479B (zh) | 2013-01-16 |
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