CN100533722C - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN100533722C CN100533722C CNB200710140318XA CN200710140318A CN100533722C CN 100533722 C CN100533722 C CN 100533722C CN B200710140318X A CNB200710140318X A CN B200710140318XA CN 200710140318 A CN200710140318 A CN 200710140318A CN 100533722 C CN100533722 C CN 100533722C
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- China
- Prior art keywords
- lead
- wire
- fin
- hermetic unit
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002191666 | 2002-07-01 | ||
JP191666/2002 | 2002-07-01 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038155214A Division CN100342533C (zh) | 2002-07-01 | 2003-05-30 | 半导体器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN101118891A CN101118891A (zh) | 2008-02-06 |
CN100533722C true CN100533722C (zh) | 2009-08-26 |
Family
ID=29996942
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CNB200710140318XA Expired - Lifetime CN100533722C (zh) | 2002-07-01 | 2003-05-30 | 半导体器件 |
CNB038155214A Expired - Lifetime CN100342533C (zh) | 2002-07-01 | 2003-05-30 | 半导体器件及其制造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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CNB038155214A Expired - Lifetime CN100342533C (zh) | 2002-07-01 | 2003-05-30 | 半导体器件及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (4) | US7525184B2 (zh) |
JP (3) | JP4149439B2 (zh) |
KR (1) | KR100975692B1 (zh) |
CN (2) | CN100533722C (zh) |
TW (1) | TWI290764B (zh) |
WO (1) | WO2004004005A1 (zh) |
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JP2006108306A (ja) * | 2004-10-04 | 2006-04-20 | Yamaha Corp | リードフレームおよびそれを用いた半導体パッケージ |
JP4698234B2 (ja) * | 2005-01-21 | 2011-06-08 | スタンレー電気株式会社 | 表面実装型半導体素子 |
JP2008277405A (ja) * | 2007-04-26 | 2008-11-13 | Rohm Co Ltd | 半導体モジュール |
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JP5155644B2 (ja) * | 2007-07-19 | 2013-03-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7847376B2 (en) * | 2007-07-19 | 2010-12-07 | Renesas Electronics Corporation | Semiconductor device and manufacturing method of the same |
JP5173654B2 (ja) * | 2007-08-06 | 2013-04-03 | セイコーインスツル株式会社 | 半導体装置 |
US20090315159A1 (en) * | 2008-06-20 | 2009-12-24 | Donald Charles Abbott | Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same |
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JP4987041B2 (ja) * | 2009-07-27 | 2012-07-25 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
TWI453831B (zh) | 2010-09-09 | 2014-09-21 | 台灣捷康綜合有限公司 | 半導體封裝結構及其製造方法 |
JP5699322B2 (ja) * | 2010-09-28 | 2015-04-08 | 大日本印刷株式会社 | 半導体装置 |
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US20140131086A1 (en) * | 2011-09-06 | 2014-05-15 | Texas Instuments Incorporated | Lead Frame Strip with Half (1/2) Thickness Pull Out Tab |
JP5953703B2 (ja) * | 2011-10-31 | 2016-07-20 | ソニー株式会社 | リードフレームおよび半導体装置 |
JP5947107B2 (ja) * | 2012-05-23 | 2016-07-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5954013B2 (ja) * | 2012-07-18 | 2016-07-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
JP2014056985A (ja) * | 2012-09-13 | 2014-03-27 | Nitto Denko Corp | 封止体の製造方法、封止体製造用枠状スペーサ、封止体及び電子機器 |
CN103715102A (zh) * | 2012-09-28 | 2014-04-09 | 德克萨斯仪器股份有限公司 | 带有改进的封装分离性的引脚框架带 |
US9966330B2 (en) | 2013-03-14 | 2018-05-08 | Vishay-Siliconix | Stack die package |
US9589929B2 (en) * | 2013-03-14 | 2017-03-07 | Vishay-Siliconix | Method for fabricating stack die package |
JP6513465B2 (ja) * | 2015-04-24 | 2019-05-15 | 日本航空電子工業株式会社 | リード接合構造 |
JP6555927B2 (ja) * | 2015-05-18 | 2019-08-07 | 大口マテリアル株式会社 | 半導体素子搭載用リードフレーム及び半導体装置の製造方法 |
JP6468085B2 (ja) * | 2015-06-11 | 2019-02-13 | 株式会社デンソー | 基板、および、その製造方法 |
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JP6399126B2 (ja) * | 2017-03-07 | 2018-10-03 | 大日本印刷株式会社 | リードフレームおよびリードフレームの製造方法 |
US10211128B2 (en) | 2017-06-06 | 2019-02-19 | Amkor Technology, Inc. | Semiconductor package having inspection structure and related methods |
JP6417466B1 (ja) * | 2017-11-28 | 2018-11-07 | アオイ電子株式会社 | 半導体装置およびその製造方法 |
CN109037078A (zh) * | 2018-06-13 | 2018-12-18 | 南通通富微电子有限公司 | 一种半导体芯片封装方法 |
CN109065519B (zh) * | 2018-06-13 | 2020-12-25 | 南通通富微电子有限公司 | 一种半导体芯片封装器件 |
CN109065518B (zh) * | 2018-06-13 | 2020-12-25 | 南通通富微电子有限公司 | 一种半导体芯片封装阵列 |
CN109037183A (zh) * | 2018-06-13 | 2018-12-18 | 南通通富微电子有限公司 | 一种半导体芯片封装阵列和半导体芯片封装器件 |
US11600557B2 (en) * | 2018-08-21 | 2023-03-07 | Texas Instruments Incorporated | Packaged device having selective lead pullback for dimple depth control |
JP6631669B2 (ja) * | 2018-09-05 | 2020-01-15 | 大日本印刷株式会社 | リードフレームおよびリードフレームの製造方法 |
US11270969B2 (en) * | 2019-06-04 | 2022-03-08 | Jmj Korea Co., Ltd. | Semiconductor package |
US10910294B2 (en) | 2019-06-04 | 2021-02-02 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor device and method of manufacturing semiconductor device |
JP7381168B2 (ja) | 2019-12-09 | 2023-11-15 | 日清紡マイクロデバイス株式会社 | 半導体装置の設計方法 |
TWM606836U (zh) * | 2020-09-18 | 2021-01-21 | 長華科技股份有限公司 | 導線架 |
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JP3482888B2 (ja) * | 1998-10-12 | 2004-01-06 | 松下電器産業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
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JP2001358279A (ja) * | 2000-06-13 | 2001-12-26 | Sony Corp | 半導体装置及びリードフレーム |
JP2002057244A (ja) | 2000-08-10 | 2002-02-22 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2002118222A (ja) * | 2000-10-10 | 2002-04-19 | Rohm Co Ltd | 半導体装置 |
JP2002134674A (ja) * | 2000-10-20 | 2002-05-10 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2002184927A (ja) | 2000-12-19 | 2002-06-28 | Mitsui High Tec Inc | 半導体装置の製造方法 |
US7525184B2 (en) * | 2002-07-01 | 2009-04-28 | Renesas Technology Corp. | Semiconductor device and its manufacturing method |
-
2003
- 2003-05-30 US US10/519,785 patent/US7525184B2/en not_active Expired - Fee Related
- 2003-05-30 CN CNB200710140318XA patent/CN100533722C/zh not_active Expired - Lifetime
- 2003-05-30 JP JP2004517247A patent/JP4149439B2/ja not_active Expired - Lifetime
- 2003-05-30 CN CNB038155214A patent/CN100342533C/zh not_active Expired - Lifetime
- 2003-05-30 WO PCT/JP2003/006830 patent/WO2004004005A1/ja active Application Filing
- 2003-05-30 KR KR1020047021634A patent/KR100975692B1/ko active IP Right Grant
- 2003-06-16 TW TW092116267A patent/TWI290764B/zh not_active IP Right Cessation
-
2008
- 2008-05-09 JP JP2008122984A patent/JP4945508B2/ja not_active Expired - Lifetime
-
2009
- 2009-03-23 US US12/408,890 patent/US7843049B2/en not_active Expired - Lifetime
-
2010
- 2010-11-24 US US12/953,499 patent/US8222720B2/en not_active Expired - Fee Related
-
2011
- 2011-06-27 JP JP2011141849A patent/JP5379189B2/ja not_active Expired - Lifetime
-
2012
- 2012-06-27 US US13/534,078 patent/US8390133B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5379189B2 (ja) | 2013-12-25 |
JP4945508B2 (ja) | 2012-06-06 |
US20130001804A1 (en) | 2013-01-03 |
WO2004004005A1 (ja) | 2004-01-08 |
CN101118891A (zh) | 2008-02-06 |
JP4149439B2 (ja) | 2008-09-10 |
US7525184B2 (en) | 2009-04-28 |
TW200416992A (en) | 2004-09-01 |
CN1666338A (zh) | 2005-09-07 |
JP2008227531A (ja) | 2008-09-25 |
US20110089548A1 (en) | 2011-04-21 |
TWI290764B (en) | 2007-12-01 |
US20060017143A1 (en) | 2006-01-26 |
US7843049B2 (en) | 2010-11-30 |
US20090200656A1 (en) | 2009-08-13 |
KR100975692B1 (ko) | 2010-08-12 |
JP2011187996A (ja) | 2011-09-22 |
US8390133B2 (en) | 2013-03-05 |
CN100342533C (zh) | 2007-10-10 |
US8222720B2 (en) | 2012-07-17 |
JPWO2004004005A1 (ja) | 2005-11-04 |
KR20050024447A (ko) | 2005-03-10 |
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