CN100452312C - 抛光装置和抛光方法 - Google Patents

抛光装置和抛光方法 Download PDF

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Publication number
CN100452312C
CN100452312C CNB2005800348057A CN200580034805A CN100452312C CN 100452312 C CN100452312 C CN 100452312C CN B2005800348057 A CNB2005800348057 A CN B2005800348057A CN 200580034805 A CN200580034805 A CN 200580034805A CN 100452312 C CN100452312 C CN 100452312C
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CN
China
Prior art keywords
sand belt
guide surface
targeting part
matrix
polishing
Prior art date
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CNB2005800348057A
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English (en)
Chinese (zh)
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CN101040370A (zh
Inventor
窪田壮男
重田厚
丰田现
高桥圭瑞
福冈大作
伊藤贤也
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Ebara Corp
Original Assignee
Ebara Corp
Toshiba Corp
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Publication of CN101040370A publication Critical patent/CN101040370A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CNB2005800348057A 2004-10-15 2005-10-12 抛光装置和抛光方法 Active CN100452312C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004302005 2004-10-15
JP302005/2004 2004-10-15

Publications (2)

Publication Number Publication Date
CN101040370A CN101040370A (zh) 2007-09-19
CN100452312C true CN100452312C (zh) 2009-01-14

Family

ID=36148480

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800348057A Active CN100452312C (zh) 2004-10-15 2005-10-12 抛光装置和抛光方法

Country Status (7)

Country Link
US (1) US7744445B2 (ja)
EP (1) EP1810321B1 (ja)
JP (1) JP5026957B2 (ja)
KR (1) KR101249430B1 (ja)
CN (1) CN100452312C (ja)
TW (1) TWI415710B (ja)
WO (1) WO2006041196A1 (ja)

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JP5045089B2 (ja) * 2006-12-19 2012-10-10 日産自動車株式会社 ラッピング加工方法およびラッピング加工装置
US20080293336A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus to control substrate bevel and edge polishing profiles of films
JP2009004765A (ja) * 2007-05-21 2009-01-08 Applied Materials Inc 基板研磨のためにローリングバッキングパッドを使用する方法及び装置
US8142260B2 (en) * 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
US7976361B2 (en) * 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
JP2009018363A (ja) * 2007-07-11 2009-01-29 Ebara Corp 研磨装置
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP5274993B2 (ja) 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
US20100112909A1 (en) * 2008-02-22 2010-05-06 Nihon Micro Coating Co., Ltd. Method of and apparatus for abrading outer peripheral parts of a semiconductor wafer
US20100105294A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus to minimize the effect of tape tension in electronic device polishing
EP2213415A1 (en) * 2009-01-29 2010-08-04 S.O.I. TEC Silicon Device for polishing the edge of a semiconductor substrate
JP5519256B2 (ja) * 2009-12-03 2014-06-11 株式会社荏原製作所 裏面が研削された基板を研磨する方法および装置
JP5663295B2 (ja) * 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
KR101089480B1 (ko) * 2010-06-01 2011-12-07 주식회사 엘지실트론 웨이퍼 연마장치
JP5464497B2 (ja) * 2010-08-19 2014-04-09 株式会社サンシン 基板研磨方法及びその装置
JP5649417B2 (ja) * 2010-11-26 2015-01-07 株式会社荏原製作所 固定砥粒を有する研磨テープを用いた基板の研磨方法
JP6101378B2 (ja) * 2011-03-25 2017-03-22 株式会社荏原製作所 研磨装置
US9457447B2 (en) * 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
US10857649B2 (en) * 2011-09-22 2020-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for performing a polishing process in semiconductor fabrication
JP6013849B2 (ja) * 2012-09-24 2016-10-25 株式会社荏原製作所 研磨方法
JP2014143247A (ja) * 2013-01-22 2014-08-07 Toshiba Corp 研磨装置
JP6071611B2 (ja) * 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
CN103786083B (zh) * 2014-02-24 2016-05-11 苏州卡波尔模具科技有限公司 玻璃模具腔体抛光设备
CN104816222B (zh) * 2015-05-12 2017-03-15 吉林大学 无级变曲率砂带磨削工具头
CN104972377A (zh) * 2015-07-03 2015-10-14 黄其清 亮光节能型换向器砂带抛光机构
CN105127870A (zh) * 2015-09-09 2015-12-09 成都川睿科技有限公司 用于智能交通***中智能设备的轴类件除毛刺装置
CN105127869A (zh) * 2015-09-09 2015-12-09 成都川睿科技有限公司 智能交通***中智能设备的多种类轴类件除毛刺装置
CN105150045A (zh) * 2015-09-09 2015-12-16 成都川睿科技有限公司 智能交通***中智能设备轴类零件的表面除毛刺装置
CN105150061B (zh) * 2015-09-09 2017-09-26 盐城市三川轴承制造有限公司 智能交通***中智能设备的轴类件的表面除毛刺装置
CN105150062A (zh) * 2015-09-09 2015-12-16 成都川睿科技有限公司 智能交通***中智能设备的轴类件除毛刺装置
JP6974117B2 (ja) * 2016-12-15 2021-12-01 株式会社荏原製作所 研磨装置、および研磨具を押圧する押圧パッド
EP3335832B1 (en) * 2016-12-15 2021-02-03 Ebara Corporation Polishing apparatus and pressing pad for pressing polishing tool
CN106670933B (zh) * 2017-01-03 2018-10-23 东莞理工学院 一种桌板的自动抛光倒角机
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置
CN108044462B (zh) * 2018-01-10 2019-08-06 咸宁南玻节能玻璃有限公司 一种玻璃划伤修复装置及玻璃修复方法
CN109759930A (zh) * 2018-12-28 2019-05-17 枣庄北航机床创新研究院有限公司 一种具有任意界面形状的带状抛光***
JP2022063417A (ja) * 2020-10-12 2022-04-22 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN113231935B (zh) * 2021-07-09 2021-10-08 联享家居(徐州)有限公司 一种家具制造木质板材表面精加工打磨机械

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JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JPH0976148A (ja) * 1995-09-12 1997-03-25 Shin Etsu Handotai Co Ltd ウェーハのノッチ部研磨装置
JP2000024914A (ja) * 1998-07-03 2000-01-25 Hitachi Ltd 半導体ウエハの研磨装置
JP2000331971A (ja) * 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2002170799A (ja) * 2000-11-30 2002-06-14 Nikon Corp 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス

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JPS4732712U (ja) 1971-04-30 1972-12-12
JPH069781B2 (ja) * 1986-05-29 1994-02-09 株式会社ベルデックス 磁気ヘツド研摩方法および装置
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JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JPH0976148A (ja) * 1995-09-12 1997-03-25 Shin Etsu Handotai Co Ltd ウェーハのノッチ部研磨装置
JP2000024914A (ja) * 1998-07-03 2000-01-25 Hitachi Ltd 半導体ウエハの研磨装置
JP2000331971A (ja) * 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2002170799A (ja) * 2000-11-30 2002-06-14 Nikon Corp 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス

Also Published As

Publication number Publication date
US7744445B2 (en) 2010-06-29
EP1810321B1 (en) 2014-01-01
KR20070056167A (ko) 2007-05-31
CN101040370A (zh) 2007-09-19
KR101249430B1 (ko) 2013-04-03
TWI415710B (zh) 2013-11-21
US20090017730A1 (en) 2009-01-15
EP1810321A1 (en) 2007-07-25
TW200618937A (en) 2006-06-16
JP2008518792A (ja) 2008-06-05
EP1810321A4 (en) 2011-03-02
WO2006041196A1 (en) 2006-04-20
JP5026957B2 (ja) 2012-09-19
WO2006041196A8 (en) 2006-06-29

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