CN100377331C - 半导体封装装载台及包括半导体封装装载台的半导体封装处理机 - Google Patents
半导体封装装载台及包括半导体封装装载台的半导体封装处理机 Download PDFInfo
- Publication number
- CN100377331C CN100377331C CNB2005100687240A CN200510068724A CN100377331C CN 100377331 C CN100377331 C CN 100377331C CN B2005100687240 A CNB2005100687240 A CN B2005100687240A CN 200510068724 A CN200510068724 A CN 200510068724A CN 100377331 C CN100377331 C CN 100377331C
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- semiconductor packages
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR79284/2000 | 2000-12-20 | ||
KR79282/2000 | 2000-12-20 | ||
KR10-2000-0079282A KR100385876B1 (ko) | 2000-12-20 | 2000-12-20 | 반도체 패키지장치 절단용 핸들러 시스템 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011095148A Division CN1208824C (zh) | 2000-12-20 | 2001-03-29 | 用于切割半导体封装器件的处理*** |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1822344A CN1822344A (zh) | 2006-08-23 |
CN100377331C true CN100377331C (zh) | 2008-03-26 |
Family
ID=36923536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100687240A Expired - Lifetime CN100377331C (zh) | 2000-12-20 | 2001-03-29 | 半导体封装装载台及包括半导体封装装载台的半导体封装处理机 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100385876B1 (ko) |
CN (1) | CN100377331C (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040044225A (ko) * | 2002-11-19 | 2004-05-28 | 세크론 주식회사 | 피커트랜스퍼 |
KR100501403B1 (ko) * | 2002-11-19 | 2005-07-18 | 세크론 주식회사 | 캐리어의 필름 절단장치 |
KR100574584B1 (ko) * | 2003-05-31 | 2006-04-27 | 한미반도체 주식회사 | 반도체 패키지 제조공정용 절단 및 핸들러시스템 |
US7829383B2 (en) | 2004-08-23 | 2010-11-09 | Rokko Systems Pte Ltd. | Supply mechanism for the chuck of an integrated circuit dicing device |
KR101303103B1 (ko) * | 2006-03-29 | 2013-09-06 | 한미반도체 주식회사 | 반도체 패키지 제조장비의 스트립 로케이션 장치 및 방법 |
KR100833283B1 (ko) * | 2006-08-28 | 2008-05-28 | 세크론 주식회사 | 소잉소터 시스템용 리버싱 장치 |
US8011058B2 (en) | 2006-10-31 | 2011-09-06 | Asm Assembly Automation Ltd | Singulation handler system for electronic packages |
JP5285217B2 (ja) * | 2006-11-27 | 2013-09-11 | Towa株式会社 | 電子部品の製造装置及び製造方法 |
KR101305346B1 (ko) | 2007-02-09 | 2013-09-06 | 한미반도체 주식회사 | 반도체 패키지 절단 및 핸들링 장치 |
KR100862638B1 (ko) * | 2007-03-13 | 2008-10-09 | (주) 인텍플러스 | 클리닝 수단이 일체로 구비된 반도체 소자의 검사 장치 및그를 이용한 반도체 소자의 검사 방법 |
KR100873670B1 (ko) * | 2007-05-23 | 2008-12-12 | (주) 인텍플러스 | 반도체 패키지 검사 시스템 |
KR100886403B1 (ko) * | 2007-07-18 | 2009-03-04 | 김일환 | 반도체 패키지장치 절단용 핸들러 시스템 |
KR100917025B1 (ko) * | 2007-09-20 | 2009-09-10 | 세크론 주식회사 | 소잉/소팅 시스템 및 이를 이용한 반도체 패키지의 소팅방법 |
KR101373393B1 (ko) * | 2012-07-31 | 2014-03-13 | 세메스 주식회사 | 회전식 기판 이송 레일 |
KR101411053B1 (ko) * | 2012-10-30 | 2014-06-30 | 세메스 주식회사 | 패키지 개별화 장치 |
KR101414690B1 (ko) * | 2013-04-22 | 2014-07-08 | 한미반도체 주식회사 | 반도체 스트립 절단장치 |
KR101534107B1 (ko) * | 2014-06-10 | 2015-07-09 | 순천향대학교 산학협력단 | 반도체 패키지 검사 및 교체 장치 |
KR102041957B1 (ko) * | 2015-08-27 | 2019-11-08 | 한미반도체 주식회사 | 반도체 스트립 절단 및 정렬장치와 그 방법 |
JP7154195B2 (ja) * | 2019-07-26 | 2022-10-17 | Towa株式会社 | 切断装置及び切断品の製造方法 |
KR102159467B1 (ko) | 2020-03-26 | 2020-09-23 | (주)네온테크 | 반도체 패키지 드라이 장치 및 드라이 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0542980A (ja) * | 1991-07-31 | 1993-02-23 | Mitsubishi Electric Corp | Icパツケージ運搬装置 |
US5725347A (en) * | 1996-05-17 | 1998-03-10 | International Business Machines Corporation | Carousel pin stacker |
US5792304A (en) * | 1993-09-16 | 1998-08-11 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
CN1192825A (zh) * | 1995-07-10 | 1998-09-09 | Pcd公司 | 用于网格焊球阵列的顶装式插座 |
US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5943524B2 (ja) * | 1981-04-23 | 1984-10-23 | 新日本製鐵株式会社 | 高炉炉壁熱間補修装置 |
KR19990066153A (ko) * | 1998-01-22 | 1999-08-16 | 윤종용 | 반도체 패키지 트림/폼 설비 |
JP2000338178A (ja) * | 1999-05-26 | 2000-12-08 | Ando Electric Co Ltd | オートハンドラ、その駆動制御方法、及び記憶媒体 |
KR100342179B1 (ko) * | 2000-07-18 | 2002-07-02 | 윤성석 | 반도체 칩 패키지 컷팅용 핸들러 |
-
2000
- 2000-12-20 KR KR10-2000-0079282A patent/KR100385876B1/ko not_active IP Right Cessation
-
2001
- 2001-03-29 CN CNB2005100687240A patent/CN100377331C/zh not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0542980A (ja) * | 1991-07-31 | 1993-02-23 | Mitsubishi Electric Corp | Icパツケージ運搬装置 |
US5792304A (en) * | 1993-09-16 | 1998-08-11 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
CN1192825A (zh) * | 1995-07-10 | 1998-09-09 | Pcd公司 | 用于网格焊球阵列的顶装式插座 |
US5725347A (en) * | 1996-05-17 | 1998-03-10 | International Business Machines Corporation | Carousel pin stacker |
US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
Also Published As
Publication number | Publication date |
---|---|
CN1822344A (zh) | 2006-08-23 |
KR20020049954A (ko) | 2002-06-26 |
KR100385876B1 (ko) | 2003-06-02 |
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