CN100377331C - 半导体封装装载台及包括半导体封装装载台的半导体封装处理机 - Google Patents

半导体封装装载台及包括半导体封装装载台的半导体封装处理机 Download PDF

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Publication number
CN100377331C
CN100377331C CNB2005100687240A CN200510068724A CN100377331C CN 100377331 C CN100377331 C CN 100377331C CN B2005100687240 A CNB2005100687240 A CN B2005100687240A CN 200510068724 A CN200510068724 A CN 200510068724A CN 100377331 C CN100377331 C CN 100377331C
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CNB2005100687240A
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Chinese (zh)
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CN1822344A (zh
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罗益均
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HAHNMI CO Ltd
Hanmi Co Ltd
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HAHNMI CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CNB2005100687240A 2000-12-20 2001-03-29 半导体封装装载台及包括半导体封装装载台的半导体封装处理机 Expired - Lifetime CN100377331C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR79284/2000 2000-12-20
KR79282/2000 2000-12-20
KR10-2000-0079282A KR100385876B1 (ko) 2000-12-20 2000-12-20 반도체 패키지장치 절단용 핸들러 시스템

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB011095148A Division CN1208824C (zh) 2000-12-20 2001-03-29 用于切割半导体封装器件的处理***

Publications (2)

Publication Number Publication Date
CN1822344A CN1822344A (zh) 2006-08-23
CN100377331C true CN100377331C (zh) 2008-03-26

Family

ID=36923536

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100687240A Expired - Lifetime CN100377331C (zh) 2000-12-20 2001-03-29 半导体封装装载台及包括半导体封装装载台的半导体封装处理机

Country Status (2)

Country Link
KR (1) KR100385876B1 (ko)
CN (1) CN100377331C (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040044225A (ko) * 2002-11-19 2004-05-28 세크론 주식회사 피커트랜스퍼
KR100501403B1 (ko) * 2002-11-19 2005-07-18 세크론 주식회사 캐리어의 필름 절단장치
KR100574584B1 (ko) * 2003-05-31 2006-04-27 한미반도체 주식회사 반도체 패키지 제조공정용 절단 및 핸들러시스템
US7829383B2 (en) 2004-08-23 2010-11-09 Rokko Systems Pte Ltd. Supply mechanism for the chuck of an integrated circuit dicing device
KR101303103B1 (ko) * 2006-03-29 2013-09-06 한미반도체 주식회사 반도체 패키지 제조장비의 스트립 로케이션 장치 및 방법
KR100833283B1 (ko) * 2006-08-28 2008-05-28 세크론 주식회사 소잉소터 시스템용 리버싱 장치
US8011058B2 (en) 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
JP5285217B2 (ja) * 2006-11-27 2013-09-11 Ｔｏｗａ株式会社 電子部品の製造装置及び製造方法
KR101305346B1 (ko) 2007-02-09 2013-09-06 한미반도체 주식회사 반도체 패키지 절단 및 핸들링 장치
KR100862638B1 (ko) * 2007-03-13 2008-10-09 (주) 인텍플러스 클리닝 수단이 일체로 구비된 반도체 소자의 검사 장치 및그를 이용한 반도체 소자의 검사 방법
KR100873670B1 (ko) * 2007-05-23 2008-12-12 (주) 인텍플러스 반도체 패키지 검사 시스템
KR100886403B1 (ko) * 2007-07-18 2009-03-04 김일환 반도체 패키지장치 절단용 핸들러 시스템
KR100917025B1 (ko) * 2007-09-20 2009-09-10 세크론 주식회사 소잉/소팅 시스템 및 이를 이용한 반도체 패키지의 소팅방법
KR101373393B1 (ko) * 2012-07-31 2014-03-13 세메스 주식회사 회전식 기판 이송 레일
KR101411053B1 (ko) * 2012-10-30 2014-06-30 세메스 주식회사 패키지 개별화 장치
KR101414690B1 (ko) * 2013-04-22 2014-07-08 한미반도체 주식회사 반도체 스트립 절단장치
KR101534107B1 (ko) * 2014-06-10 2015-07-09 순천향대학교 산학협력단 반도체 패키지 검사 및 교체 장치
KR102041957B1 (ko) * 2015-08-27 2019-11-08 한미반도체 주식회사 반도체 스트립 절단 및 정렬장치와 그 방법
JP7154195B2 (ja) * 2019-07-26 2022-10-17 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
KR102159467B1 (ko) 2020-03-26 2020-09-23 (주)네온테크 반도체 패키지 드라이 장치 및 드라이 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542980A (ja) * 1991-07-31 1993-02-23 Mitsubishi Electric Corp Ｉｃパツケージ運搬装置
US5725347A (en) * 1996-05-17 1998-03-10 International Business Machines Corporation Carousel pin stacker
US5792304A (en) * 1993-09-16 1998-08-11 Hitachi, Ltd. Method of holding substrate and substrate holding system
CN1192825A (zh) * 1995-07-10 1998-09-09 Pcd公司 用于网格焊球阵列的顶装式插座
US6139243A (en) * 1997-07-09 2000-10-31 Systemation Engineering Method and system for flipping a tray of parts

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943524B2 (ja) * 1981-04-23 1984-10-23 新日本製鐵株式会社 高炉炉壁熱間補修装置
KR19990066153A (ko) * 1998-01-22 1999-08-16 윤종용 반도체 패키지 트림/폼 설비
JP2000338178A (ja) * 1999-05-26 2000-12-08 Ando Electric Co Ltd オートハンドラ、その駆動制御方法、及び記憶媒体
KR100342179B1 (ko) * 2000-07-18 2002-07-02 윤성석 반도체 칩 패키지 컷팅용 핸들러

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542980A (ja) * 1991-07-31 1993-02-23 Mitsubishi Electric Corp Ｉｃパツケージ運搬装置
US5792304A (en) * 1993-09-16 1998-08-11 Hitachi, Ltd. Method of holding substrate and substrate holding system
CN1192825A (zh) * 1995-07-10 1998-09-09 Pcd公司 用于网格焊球阵列的顶装式插座
US5725347A (en) * 1996-05-17 1998-03-10 International Business Machines Corporation Carousel pin stacker
US6139243A (en) * 1997-07-09 2000-10-31 Systemation Engineering Method and system for flipping a tray of parts

Also Published As

Publication number Publication date
CN1822344A (zh) 2006-08-23
KR20020049954A (ko) 2002-06-26
KR100385876B1 (ko) 2003-06-02

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