CL2012001954A1 - Metodo para depositar un nanorevestimiento conformable sobre una estructura tridimensional o ensamblaje compuesto de elementos electricamente conductores y no conductores, el cual se deposita mediante polimerizacion por plasma de baja presion precedido de una etapa de desgasificacion de la estructura o ensamblaje. - Google Patents
Metodo para depositar un nanorevestimiento conformable sobre una estructura tridimensional o ensamblaje compuesto de elementos electricamente conductores y no conductores, el cual se deposita mediante polimerizacion por plasma de baja presion precedido de una etapa de desgasificacion de la estructura o ensamblaje.Info
- Publication number
- CL2012001954A1 CL2012001954A1 CL2012001954A CL2012001954A CL2012001954A1 CL 2012001954 A1 CL2012001954 A1 CL 2012001954A1 CL 2012001954 A CL2012001954 A CL 2012001954A CL 2012001954 A CL2012001954 A CL 2012001954A CL 2012001954 A1 CL2012001954 A1 CL 2012001954A1
- Authority
- CL
- Chile
- Prior art keywords
- assembly
- nanorecoating
- conformable
- depositing
- deposited
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2506/00—Halogenated polymers
- B05D2506/10—Fluorinated polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/142—Pretreatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
- B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Chemical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Medical Uses (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Método para depositar un nanorevestimiento conformable sobre todas las superficies y todas las partes de una estructura tridimensional, en donde dicho revestimiento se deposita mediante un procedimiento de polimerización por plasma de baja presión precedido de una etapa de desgasificación de la estructura; uso de dicho método; y estructura tridimensional.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE2010/0035A BE1019159A5 (nl) | 2010-01-22 | 2010-01-22 | Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces. |
Publications (1)
Publication Number | Publication Date |
---|---|
CL2012001954A1 true CL2012001954A1 (es) | 2013-02-01 |
Family
ID=42289590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CL2012001954A CL2012001954A1 (es) | 2010-01-22 | 2012-07-12 | Metodo para depositar un nanorevestimiento conformable sobre una estructura tridimensional o ensamblaje compuesto de elementos electricamente conductores y no conductores, el cual se deposita mediante polimerizacion por plasma de baja presion precedido de una etapa de desgasificacion de la estructura o ensamblaje. |
Country Status (14)
Country | Link |
---|---|
US (1) | US20120308762A1 (es) |
EP (1) | EP2525922A1 (es) |
JP (1) | JP2013517382A (es) |
KR (1) | KR20130000373A (es) |
CN (1) | CN102821873A (es) |
AU (1) | AU2011208879B2 (es) |
BE (1) | BE1019159A5 (es) |
BR (1) | BR112012018071A2 (es) |
CA (1) | CA2786855A1 (es) |
CL (1) | CL2012001954A1 (es) |
MX (1) | MX2012008415A (es) |
NZ (1) | NZ601365A (es) |
SG (1) | SG182542A1 (es) |
WO (1) | WO2011089009A1 (es) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
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US8852693B2 (en) | 2011-05-19 | 2014-10-07 | Liquipel Ip Llc | Coated electronic devices and associated methods |
GB2489761B (en) * | 2011-09-07 | 2015-03-04 | Europlasma Nv | Surface coatings |
JP2013143563A (ja) | 2012-01-10 | 2013-07-22 | Hzo Inc | 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム |
AU2013229226B2 (en) * | 2012-03-06 | 2017-08-10 | Semblant Limited | Coated electrical assembly |
HUE047861T2 (hu) | 2012-03-23 | 2020-05-28 | Hzo Inc | Berendezések, rendszerek és eljárások védõbevonatoknak elektronikus eszközök részegységeire történõ felviteléhez |
GB2494946B (en) * | 2012-05-11 | 2013-10-09 | Europlasma Nv | Surface coatings |
WO2013192209A2 (en) * | 2012-06-18 | 2013-12-27 | Hzo, Inc. | Apparatuses, systems and methods for protecting electronic device assemblies |
WO2013192222A2 (en) | 2012-06-18 | 2013-12-27 | Hzo, Inc. | Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices |
GB2510213A (en) * | 2012-08-13 | 2014-07-30 | Europlasma Nv | Forming a protective polymer coating on a component |
DK2906739T3 (en) * | 2012-10-09 | 2017-03-13 | Europlasma Nv | DEVICE AND PROCEDURE FOR APPLYING SURFACE COATINGS |
US10449568B2 (en) | 2013-01-08 | 2019-10-22 | Hzo, Inc. | Masking substrates for application of protective coatings |
US9894776B2 (en) | 2013-01-08 | 2018-02-13 | Hzo, Inc. | System for refurbishing or remanufacturing an electronic device |
EP2780935A4 (en) | 2013-01-08 | 2015-11-11 | Hzo Inc | REMOVAL OF SELECTED PARTS FROM SUBSTRATE PROTECTIVE COATINGS |
US9002041B2 (en) | 2013-05-14 | 2015-04-07 | Logitech Europe S.A. | Method and apparatus for improved acoustic transparency |
BE1021288B1 (nl) * | 2013-10-07 | 2015-10-20 | Europlasma Nv | Verbeterde manieren om plasma te genereren op continue vermogens wijze voor lage druk plasma processen |
GB2521137A (en) * | 2013-12-10 | 2015-06-17 | Europlasma Nv | Surface Coatings |
CN104179011B (zh) * | 2014-07-18 | 2016-08-24 | 青岛纺联控股集团有限公司 | 纺织品纳米等离子防水处理方法 |
CN105276554A (zh) * | 2014-07-24 | 2016-01-27 | 北京中科纳通电子技术有限公司 | 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果 |
CN105047514B (zh) * | 2015-07-27 | 2017-06-13 | 郑州大学 | 在玻璃表面等离子体刻蚀形成纹理结构的方法 |
JP6593903B2 (ja) * | 2016-01-19 | 2019-10-23 | 華為技術有限公司 | 電子デバイスのための防水方法および装置、並びに電子デバイス |
WO2017188490A1 (ko) * | 2016-04-29 | 2017-11-02 | 노재호 | 나노 코팅층이 형성된 흡수제품 및 그 제조방법 |
US11154903B2 (en) | 2016-05-13 | 2021-10-26 | Jiangsu Favored Nanotechnology Co., Ltd. | Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization |
GB201610481D0 (en) * | 2016-06-14 | 2016-08-03 | Surface Innovations Ltd | Coating |
CN106868473B (zh) * | 2017-01-23 | 2018-07-13 | 江苏菲沃泰纳米科技有限公司 | 一种梯度递减结构防液涂层的制备方法 |
CN107058979B (zh) * | 2017-01-23 | 2018-05-11 | 江苏菲沃泰纳米科技有限公司 | 一种防水耐电击穿涂层的制备方法 |
US11270871B2 (en) | 2017-05-21 | 2022-03-08 | Jiangsu Favored Nanotechnology Co., LTD | Multi-layer protective coating |
CN107217243B (zh) * | 2017-05-21 | 2018-07-13 | 江苏菲沃泰纳米科技有限公司 | 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法 |
CN107177835B (zh) * | 2017-05-21 | 2018-06-19 | 江苏菲沃泰纳米科技有限公司 | 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法 |
CN107904574A (zh) * | 2017-10-27 | 2018-04-13 | 中国船舶重工集团公司第七二三研究所 | 一种基于海上复杂环境的纳米防护涂层涂覆方法 |
ES2944107T3 (es) | 2019-10-24 | 2023-06-19 | Saati Spa | Un método para preparar un medio filtrante compuesto y el medio filtrante compuesto obtenido con este método |
KR20220073739A (ko) | 2019-10-24 | 2022-06-03 | 사아티 에스.피.에이. | 복합 필터 매체의 제조 방법 및 이 방법으로 얻어지는 복합 필터 매체 |
IT201900019760A1 (it) | 2019-10-24 | 2021-04-24 | Saati Spa | Procedimento per la realizzazione di un mezzo filtrante composito e mezzo filtrante composito ottenuto con questo procedimento. |
CN113275217B (zh) * | 2021-05-18 | 2022-06-24 | 佛山市思博睿科技有限公司 | 等离子体接枝共聚膜层的制备方法 |
CN113365433B (zh) * | 2021-06-07 | 2024-02-02 | 深圳奥拦科技有限责任公司 | Pcba板表面派瑞林膜层的除去方法 |
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GB0703172D0 (en) * | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
JP5223325B2 (ja) * | 2007-12-21 | 2013-06-26 | 住友金属鉱山株式会社 | 金属被覆ポリエチレンナフタレート基板とその製造方法 |
GB0800305D0 (en) * | 2008-01-09 | 2008-02-20 | P2I Ltd | Abatement apparatus and processing method |
-
2010
- 2010-01-22 BE BE2010/0035A patent/BE1019159A5/nl active
-
2011
- 2011-01-21 CA CA2786855A patent/CA2786855A1/en not_active Abandoned
- 2011-01-21 US US13/574,626 patent/US20120308762A1/en not_active Abandoned
- 2011-01-21 AU AU2011208879A patent/AU2011208879B2/en not_active Ceased
- 2011-01-21 BR BR112012018071A patent/BR112012018071A2/pt not_active IP Right Cessation
- 2011-01-21 JP JP2012549293A patent/JP2013517382A/ja active Pending
- 2011-01-21 MX MX2012008415A patent/MX2012008415A/es not_active Application Discontinuation
- 2011-01-21 NZ NZ60136511A patent/NZ601365A/en not_active IP Right Cessation
- 2011-01-21 CN CN2011800153321A patent/CN102821873A/zh active Pending
- 2011-01-21 EP EP11704527A patent/EP2525922A1/en not_active Ceased
- 2011-01-21 KR KR1020127018995A patent/KR20130000373A/ko not_active Application Discontinuation
- 2011-01-21 SG SG2012052296A patent/SG182542A1/en unknown
- 2011-01-21 WO PCT/EP2011/000242 patent/WO2011089009A1/en active Application Filing
-
2012
- 2012-07-12 CL CL2012001954A patent/CL2012001954A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
BR112012018071A2 (pt) | 2016-05-03 |
CA2786855A1 (en) | 2011-07-28 |
JP2013517382A (ja) | 2013-05-16 |
WO2011089009A1 (en) | 2011-07-28 |
AU2011208879A1 (en) | 2012-08-09 |
KR20130000373A (ko) | 2013-01-02 |
BE1019159A5 (nl) | 2012-04-03 |
MX2012008415A (es) | 2012-08-15 |
AU2011208879B2 (en) | 2015-12-17 |
EP2525922A1 (en) | 2012-11-28 |
NZ601365A (en) | 2015-03-27 |
CN102821873A (zh) | 2012-12-12 |
US20120308762A1 (en) | 2012-12-06 |
SG182542A1 (en) | 2012-08-30 |
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