BR0012290A - Pó de cério aperfeiçoado - Google Patents

Pó de cério aperfeiçoado

Info

Publication number
BR0012290A
BR0012290A BR0012290-4A BR0012290A BR0012290A BR 0012290 A BR0012290 A BR 0012290A BR 0012290 A BR0012290 A BR 0012290A BR 0012290 A BR0012290 A BR 0012290A
Authority
BR
Brazil
Prior art keywords
slurry
cmp
cerium
cerium powder
improved
Prior art date
Application number
BR0012290-4A
Other languages
English (en)
Other versions
BR0012290B1 (pt
Inventor
Ajay K Garg
Brahmanandam V Tanikella
Arup Khaund
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of BR0012290A publication Critical patent/BR0012290A/pt
Publication of BR0012290B1 publication Critical patent/BR0012290B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)

Abstract

"Pó DE CéRIO APERFEIçOADO". Pasta fluida de polimento, útil em aplicações ópticas ou de CMP compreende um cério com uma área de superfície de BET de pelo menos 10 m^ 2^/gm. A pasta fluida deve ser feita por meio de sujeição de uma pasta fluida de cério comercial compreendendo aglomerados para um tratamento mecano - química em um pH de 9 a 11, usando meios que são alfa alumina ou zircónia de baixa pureza. As pastas fluidas preferidas mantêm uma carga de superfície positiva em todos os valores de pH. As pastas fluidas de CMP, de preferência, compreendem, em adição, uma tensoativo aniónico para auxiliar na remoção de resíduos de superfície.
BRPI0012290-4A 1999-06-16 2000-06-06 processo para a produÇço de pasta fluida de àxido de cÉrio e a referida pasta. BR0012290B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33422299A 1999-06-16 1999-06-16
US09/553,968 US6238450B1 (en) 1999-06-16 2000-04-21 Ceria powder
PCT/US2000/015479 WO2000076920A1 (en) 1999-06-16 2000-06-06 Improved ceria powder

Publications (2)

Publication Number Publication Date
BR0012290A true BR0012290A (pt) 2002-04-16
BR0012290B1 BR0012290B1 (pt) 2009-01-13

Family

ID=26989098

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0012290-4A BR0012290B1 (pt) 1999-06-16 2000-06-06 processo para a produÇço de pasta fluida de àxido de cÉrio e a referida pasta.

Country Status (14)

Country Link
US (1) US6238450B1 (pt)
EP (1) EP1200352B1 (pt)
JP (1) JP3887230B2 (pt)
KR (1) KR100429940B1 (pt)
CN (1) CN1129554C (pt)
AU (1) AU752038B2 (pt)
BR (1) BR0012290B1 (pt)
CA (1) CA2374373C (pt)
DE (1) DE60001958T2 (pt)
IL (1) IL147040A (pt)
MX (1) MXPA01013093A (pt)
MY (1) MY125250A (pt)
TW (1) TW503216B (pt)
WO (1) WO2000076920A1 (pt)

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Also Published As

Publication number Publication date
DE60001958D1 (de) 2003-05-08
CA2374373C (en) 2005-04-05
KR100429940B1 (ko) 2004-05-03
BR0012290B1 (pt) 2009-01-13
MY125250A (en) 2006-07-31
CN1355769A (zh) 2002-06-26
JP3887230B2 (ja) 2007-02-28
IL147040A (en) 2005-07-25
AU5464700A (en) 2001-01-02
IL147040A0 (en) 2002-08-14
DE60001958T2 (de) 2004-03-04
KR20020015698A (ko) 2002-02-28
EP1200352A1 (en) 2002-05-02
AU752038B2 (en) 2002-09-05
CN1129554C (zh) 2003-12-03
US6238450B1 (en) 2001-05-29
TW503216B (en) 2002-09-21
CA2374373A1 (en) 2000-12-21
WO2000076920A1 (en) 2000-12-21
EP1200352B1 (en) 2003-04-02
JP2003502255A (ja) 2003-01-21
MXPA01013093A (es) 2002-06-04

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Legal Events

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B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

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B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE AS 13A, 14A, 15A, 16A, 17A, 18A, 19A E 20A ANUIDADES.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2607 DE 22-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.