AU2001275841A1 - Process for thick film circuit patterning - Google Patents

Process for thick film circuit patterning

Info

Publication number
AU2001275841A1
AU2001275841A1 AU2001275841A AU7584101A AU2001275841A1 AU 2001275841 A1 AU2001275841 A1 AU 2001275841A1 AU 2001275841 A AU2001275841 A AU 2001275841A AU 7584101 A AU7584101 A AU 7584101A AU 2001275841 A1 AU2001275841 A1 AU 2001275841A1
Authority
AU
Australia
Prior art keywords
thick film
film circuit
circuit patterning
patterning
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001275841A
Other languages
English (en)
Inventor
Roupen Leon Keusseyan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of AU2001275841A1 publication Critical patent/AU2001275841A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Electric Cables (AREA)
AU2001275841A 2000-06-30 2001-06-26 Process for thick film circuit patterning Abandoned AU2001275841A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21536300P 2000-06-30 2000-06-30
US60215363 2000-06-30
US26281701P 2001-01-19 2001-01-19
US60262817 2001-01-19
PCT/US2001/020252 WO2002003766A2 (en) 2000-06-30 2001-06-26 Process for thick film circuit patterning

Publications (1)

Publication Number Publication Date
AU2001275841A1 true AU2001275841A1 (en) 2002-01-14

Family

ID=26909954

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001275841A Abandoned AU2001275841A1 (en) 2000-06-30 2001-06-26 Process for thick film circuit patterning

Country Status (8)

Country Link
EP (1) EP1295518B1 (ja)
JP (2) JP3825746B2 (ja)
KR (1) KR100527805B1 (ja)
CN (1) CN100350820C (ja)
AU (1) AU2001275841A1 (ja)
DE (1) DE60134644D1 (ja)
TW (1) TW536927B (ja)
WO (1) WO2002003766A2 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101042667B1 (ko) * 2004-07-05 2011-06-20 주식회사 동진쎄미켐 포토레지스트 조성물
US7384577B2 (en) 2005-03-09 2008-06-10 E.I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7326370B2 (en) 2005-03-09 2008-02-05 E. I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7645564B2 (en) * 2006-03-03 2010-01-12 Haixin Yang Polymer solutions, aqueous developable thick film compositions, processes of making and electrodes formed thereof
US7678296B2 (en) 2006-05-04 2010-03-16 E. I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7608784B2 (en) 2006-07-13 2009-10-27 E. I. Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
US7655864B2 (en) 2006-07-13 2010-02-02 E.I Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
US20080047930A1 (en) * 2006-08-23 2008-02-28 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate
US7875313B2 (en) * 2007-04-05 2011-01-25 E. I. Du Pont De Nemours And Company Method to form a pattern of functional material on a substrate using a mask material
US20090277582A1 (en) * 2008-05-09 2009-11-12 E. I. Du Pont De Nemours And Company Thick film recycling method
KR101005791B1 (ko) * 2008-08-08 2011-01-06 (유)정명산업 도로 표지병
US20100209843A1 (en) * 2009-02-16 2010-08-19 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
TW201115592A (en) * 2009-06-19 2011-05-01 Du Pont Glass compositions used in conductors for photovoltaic cells
EP3025566B1 (en) * 2013-07-23 2021-04-07 Rogers Corporation Circuit materials, circuit laminates, and methods of manufacture thereof
KR102212674B1 (ko) * 2014-07-09 2021-02-05 동우 화인켐 주식회사 후막 패턴 구조 및 그의 형성 방법
JP6839476B2 (ja) * 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1021874C (zh) * 1987-01-19 1993-08-18 福克斯保罗公司 印刷线路板的图形抗蚀法
US4877697A (en) * 1988-05-26 1989-10-31 Hoechst Aktiengesellschaft Color filter array for liquid crystal display device
DE3913117A1 (de) * 1989-04-21 1990-10-25 Du Pont Deutschland Verfahren zur herstellung von elektrisch leitfaehigen mustern
EP0457071A3 (en) * 1990-05-12 1992-09-16 Du Pont De Nemours (Deutschland) Gmbh Process for generating fine conductor lines
KR0155877B1 (ko) * 1995-09-12 1998-12-15 이대원 다층 회로기판 및 그 제조방법
JP3322128B2 (ja) * 1996-07-05 2002-09-09 凸版印刷株式会社 積層体とそれを使用した厚膜回路の製造方法
KR19980084566A (ko) * 1997-05-23 1998-12-05 이대원 다층 인쇄회로기판 및 그 제조방법

Also Published As

Publication number Publication date
EP1295518A2 (en) 2003-03-26
JP4468314B2 (ja) 2010-05-26
WO2002003766A3 (en) 2002-04-04
EP1295518B1 (en) 2008-07-02
KR20030011376A (ko) 2003-02-07
JP3825746B2 (ja) 2006-09-27
CN100350820C (zh) 2007-11-21
JP2006133808A (ja) 2006-05-25
WO2002003766A2 (en) 2002-01-10
TW536927B (en) 2003-06-11
KR100527805B1 (ko) 2005-11-15
DE60134644D1 (de) 2008-08-14
CN1439236A (zh) 2003-08-27
JP2004507884A (ja) 2004-03-11

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