ATE496079T1 - Vernetztes polyamid, dieses enthaltende zusammensetzung und herstellungsverfahren dafür - Google Patents

Vernetztes polyamid, dieses enthaltende zusammensetzung und herstellungsverfahren dafür

Info

Publication number
ATE496079T1
ATE496079T1 AT04723799T AT04723799T ATE496079T1 AT E496079 T1 ATE496079 T1 AT E496079T1 AT 04723799 T AT04723799 T AT 04723799T AT 04723799 T AT04723799 T AT 04723799T AT E496079 T1 ATE496079 T1 AT E496079T1
Authority
AT
Austria
Prior art keywords
cross
composition containing
production method
containing same
polyimide
Prior art date
Application number
AT04723799T
Other languages
English (en)
Inventor
Hiroshi Itatani
Original Assignee
Pi R & D Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pi R & D Co Ltd filed Critical Pi R & D Co Ltd
Application granted granted Critical
Publication of ATE496079T1 publication Critical patent/ATE496079T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Polyamides (AREA)
AT04723799T 2003-03-28 2004-03-26 Vernetztes polyamid, dieses enthaltende zusammensetzung und herstellungsverfahren dafür ATE496079T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003090546 2003-03-28
JP2003112425 2003-04-17
JP2003412832 2003-12-11
PCT/JP2004/004305 WO2004087793A1 (ja) 2003-03-28 2004-03-26 架橋ポリイミド、それを含む組成物及びその製造方法

Publications (1)

Publication Number Publication Date
ATE496079T1 true ATE496079T1 (de) 2011-02-15

Family

ID=33135746

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04723799T ATE496079T1 (de) 2003-03-28 2004-03-26 Vernetztes polyamid, dieses enthaltende zusammensetzung und herstellungsverfahren dafür

Country Status (6)

Country Link
US (3) US20070106056A1 (de)
EP (1) EP1614704B1 (de)
JP (2) JP4646804B2 (de)
AT (1) ATE496079T1 (de)
DE (1) DE602004031098D1 (de)
WO (1) WO2004087793A1 (de)

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WO2008114797A1 (ja) * 2007-03-19 2008-09-25 Ibiden Co., Ltd. ポジ型感光性ポリイミド前駆体組成物
GB0709228D0 (en) 2007-05-14 2007-06-20 Katholieke Universltelt Leuven Cross-linked polyimide membranes
DE112007003540B4 (de) * 2007-06-18 2015-09-17 Solpit Industries Ltd. Polyimid-Copolymere und Verfahren zu deren Herstellung
JP5136179B2 (ja) * 2008-04-17 2013-02-06 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
KR101581065B1 (ko) * 2008-04-24 2015-12-29 메르크 파텐트 게엠베하 전자 디바이스
WO2010111755A2 (en) 2009-04-01 2010-10-07 Katholieke Universiteit Leuven - K.U.Leuven R & D Improved method for making cross-linked polyimide membranes
JP2011105926A (ja) * 2009-10-23 2011-06-02 Toyobo Co Ltd ポリイミド前駆体及びポリイミド前駆体溶液
JP5564908B2 (ja) * 2009-11-30 2014-08-06 株式会社ニコン 固体撮像装置及び固体撮像装置用パッケージ
KR101660315B1 (ko) * 2010-02-11 2016-09-28 삼성전자 주식회사 고분자 및 이를 포함하는 조성물과 필름
US20120152458A1 (en) * 2010-12-20 2012-06-21 E. I. Du Pont De Nemours And Company Method for preparing multilayer article by curing a curable composition comprising imidazolium monocarboxylate salt
US8962890B1 (en) 2012-04-20 2015-02-24 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same
US8791227B1 (en) * 2012-04-20 2014-07-29 The United States Of America As Represented By The Secretary Of The Air Force Crosslinked aromatic polyimides and methods of making the same
JP5862459B2 (ja) * 2012-05-28 2016-02-16 東京エレクトロン株式会社 成膜方法
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US9085661B1 (en) 2012-10-26 2015-07-21 The United States Of America As Represented By The Secretary Of The Air Force Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride
CN105051942A (zh) * 2013-10-31 2015-11-11 株式会社Lg化学 具有反蛋白石结构的二次电池用多孔隔膜及其制造方法
US9139696B1 (en) 2014-03-28 2015-09-22 The United States Of America, As Represented By The Secretary Of The Air Force Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same
US9644071B1 (en) 2014-09-05 2017-05-09 The United States Of America As Represented By The Secretary Of The Air Force Bis(azobenzene) diamines and photomechanical polymers made therefrom
JP6509600B2 (ja) * 2015-03-17 2019-05-08 株式会社日本触媒 オキソカーボン系化合物を含む硬化物の製造方法
US10294255B1 (en) 2015-08-07 2019-05-21 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinking agent, crosslinked polymer, and method of making same
US10239254B1 (en) 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
CN106479177A (zh) * 2016-11-04 2017-03-08 东华大学 一种bpada型bdathq支化聚酰亚胺树脂薄膜及其制备方法
CN110099974B (zh) * 2016-12-27 2022-02-25 日产化学株式会社 基板保护层形成用组合物
GB201705095D0 (en) 2017-03-30 2017-05-17 Innospec Ltd Composition and methods and uses relating thereto
CN111303423A (zh) 2020-04-01 2020-06-19 武汉华星光电半导体显示技术有限公司 聚酰亚胺基材及其制造方法、显示面板
US11380622B2 (en) * 2020-11-20 2022-07-05 Globalfoundries U.S. Inc. Method and related structure to authenticate integrated circuit with authentication film
CN112625278A (zh) * 2020-12-08 2021-04-09 北京科技大学 一种低介电聚酰亚胺薄膜及其制备方法
CN114685987B (zh) * 2020-12-25 2023-05-16 中国科学院化学研究所 一种聚酰亚胺薄膜的制备方法及应用
CN114231029B (zh) * 2021-12-29 2023-08-22 山东华夏神舟新材料有限公司 交联型高透明聚酰亚胺薄膜及其制备方法
CN115873248A (zh) * 2022-12-13 2023-03-31 深圳航天科技创新研究院 一种超支化聚酰亚胺类流动改性剂及其制备方法与应用
CN116925405B (zh) * 2023-07-28 2024-01-23 四川大学 一种本征高导热低介电损耗结晶聚酰亚胺薄膜及其制备方法

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Also Published As

Publication number Publication date
US20110136061A1 (en) 2011-06-09
WO2004087793A1 (ja) 2004-10-14
EP1614704A1 (de) 2006-01-11
US20070106056A1 (en) 2007-05-10
EP1614704A4 (de) 2007-10-03
JPWO2004087793A1 (ja) 2006-06-29
US20130224653A1 (en) 2013-08-29
EP1614704B1 (de) 2011-01-19
JP2010248515A (ja) 2010-11-04
JP4646804B2 (ja) 2011-03-09
DE602004031098D1 (de) 2011-03-03
JP5439268B2 (ja) 2014-03-12

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