WO2008114797A1 - ポジ型感光性ポリイミド前駆体組成物 - Google Patents

ポジ型感光性ポリイミド前駆体組成物 Download PDF

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Publication number
WO2008114797A1
WO2008114797A1 PCT/JP2008/055006 JP2008055006W WO2008114797A1 WO 2008114797 A1 WO2008114797 A1 WO 2008114797A1 JP 2008055006 W JP2008055006 W JP 2008055006W WO 2008114797 A1 WO2008114797 A1 WO 2008114797A1
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WO
WIPO (PCT)
Prior art keywords
polyimide precursor
positive type
type photosensitive
precursor composition
photosensitive polyimide
Prior art date
Application number
PCT/JP2008/055006
Other languages
English (en)
French (fr)
Inventor
Yasuharu Yamada
Tomoyuki Suzuki
Yusuke Nakai
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to JP2009505225A priority Critical patent/JP5188495B2/ja
Publication of WO2008114797A1 publication Critical patent/WO2008114797A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/005—Dendritic macromolecules
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)

Abstract

　硬化物が、従来にはない新規な構造を呈すると共に、優れた機械特性や耐熱性等を発揮し得るポジ型感光性ポリイミド前駆体組成物を提供すること。 　デンドリティック構造を基本とする多分岐ポリイミド前駆体と、キノンジアジド化合物とを用いて、ポジ型感光性ポリイミド前駆体組成物を調製した。                                                                                 
PCT/JP2008/055006 2007-03-19 2008-03-18 ポジ型感光性ポリイミド前駆体組成物 WO2008114797A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505225A JP5188495B2 (ja) 2007-03-19 2008-03-18 ポジ型感光性ポリイミド前駆体組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007069883 2007-03-19
JP2007-069883 2007-03-19

Publications (1)

Publication Number Publication Date
WO2008114797A1 true WO2008114797A1 (ja) 2008-09-25

Family

ID=39765904

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055006 WO2008114797A1 (ja) 2007-03-19 2008-03-18 ポジ型感光性ポリイミド前駆体組成物

Country Status (2)

Country Link
JP (1) JP5188495B2 (ja)
WO (1) WO2008114797A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175357A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009175358A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009258433A (ja) * 2008-04-17 2009-11-05 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
CN110128651A (zh) * 2019-05-10 2019-08-16 成都工业学院 一种可中温成型的含硅线性聚酰亚胺、制备方法及应用
CN110892004A (zh) * 2018-06-21 2020-03-17 株式会社Lg化学 支化共聚物以及使用其的光敏树脂组合物、光敏树脂膜和光学器件
CN112080003A (zh) * 2019-06-13 2020-12-15 北京鼎材科技有限公司 一种支化聚酰亚胺前驱体树脂、光敏树脂组合物及其用途
WO2024141321A1 (en) * 2022-12-29 2024-07-04 Basf Se Photocurable hyperbranched polyimide and preparation process thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102550865B1 (ko) * 2022-11-28 2023-07-04 주식회사 피엔에스테크놀로지 폴리아믹산에스테르와 이의 제조방법 및 상기 폴리아믹산에스테르를 포함하는 감광성 수지 조성물.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221793A (ja) * 2001-01-29 2002-08-09 Jsr Corp ポジ型感光性ポリイミド組成物およびポリイミド膜
WO2004003057A1 (ja) * 2002-06-26 2004-01-08 Kanagawa University 硬化性組成物とその硬化物、並びにそれに用いるポリイミド樹脂
WO2004087793A1 (ja) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. 架橋ポリイミド、それを含む組成物及びその製造方法
JP2006131706A (ja) * 2004-11-04 2006-05-25 Nagoya Institute Of Technology ポリイミド系低誘電材料および高効率分離膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221793A (ja) * 2001-01-29 2002-08-09 Jsr Corp ポジ型感光性ポリイミド組成物およびポリイミド膜
WO2004003057A1 (ja) * 2002-06-26 2004-01-08 Kanagawa University 硬化性組成物とその硬化物、並びにそれに用いるポリイミド樹脂
WO2004087793A1 (ja) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. 架橋ポリイミド、それを含む組成物及びその製造方法
JP2006131706A (ja) * 2004-11-04 2006-05-25 Nagoya Institute Of Technology ポリイミド系低誘電材料および高効率分離膜

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175357A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009175358A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009258433A (ja) * 2008-04-17 2009-11-05 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
CN110892004A (zh) * 2018-06-21 2020-03-17 株式会社Lg化学 支化共聚物以及使用其的光敏树脂组合物、光敏树脂膜和光学器件
JP2020527625A (ja) * 2018-06-21 2020-09-10 エルジー・ケム・リミテッド 分岐型共重合体、それを用いた感光性樹脂組成物、感光性樹脂フィルムおよび光学装置
CN110892004B (zh) * 2018-06-21 2022-03-18 株式会社Lg化学 支化共聚物以及使用其的光敏树脂组合物、光敏树脂膜和光学器件
JP7055463B2 (ja) 2018-06-21 2022-04-18 エルジー・ケム・リミテッド 分岐型共重合体、それを用いた感光性樹脂組成物、感光性樹脂フィルムおよび光学装置
US11981775B2 (en) 2018-06-21 2024-05-14 Lg Chem, Ltd. Branched copolymer, and photosensitive resin composition, photosensitive resin film and optical device using the same
CN110128651A (zh) * 2019-05-10 2019-08-16 成都工业学院 一种可中温成型的含硅线性聚酰亚胺、制备方法及应用
CN112080003A (zh) * 2019-06-13 2020-12-15 北京鼎材科技有限公司 一种支化聚酰亚胺前驱体树脂、光敏树脂组合物及其用途
WO2024141321A1 (en) * 2022-12-29 2024-07-04 Basf Se Photocurable hyperbranched polyimide and preparation process thereof

Also Published As

Publication number Publication date
JP5188495B2 (ja) 2013-04-24
JPWO2008114797A1 (ja) 2010-07-08

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