ATE276382T1 - Absetzung von kupfer auf einer aktivierten oberfläche eines substrats - Google Patents

Absetzung von kupfer auf einer aktivierten oberfläche eines substrats

Info

Publication number
ATE276382T1
ATE276382T1 AT99870243T AT99870243T ATE276382T1 AT E276382 T1 ATE276382 T1 AT E276382T1 AT 99870243 T AT99870243 T AT 99870243T AT 99870243 T AT99870243 T AT 99870243T AT E276382 T1 ATE276382 T1 AT E276382T1
Authority
AT
Austria
Prior art keywords
ions
soln
contg
reducing agent
compd
Prior art date
Application number
AT99870243T
Other languages
English (en)
Inventor
Roger Palmans
Yuri Lantasov
Original Assignee
Imec Interuniversity Microelec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP99870077A external-priority patent/EP1020543A1/de
Application filed by Imec Interuniversity Microelec filed Critical Imec Interuniversity Microelec
Application granted granted Critical
Publication of ATE276382T1 publication Critical patent/ATE276382T1/de

Links

AT99870243T 1999-01-15 1999-11-30 Absetzung von kupfer auf einer aktivierten oberfläche eines substrats ATE276382T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11611099P 1999-01-15 1999-01-15
EP99870077A EP1020543A1 (de) 1999-01-15 1999-04-29 Absetzung von Kupfer auf einer aktivierter Oberfläche eines Substrats

Publications (1)

Publication Number Publication Date
ATE276382T1 true ATE276382T1 (de) 2004-10-15

Family

ID=26153848

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99870243T ATE276382T1 (de) 1999-01-15 1999-11-30 Absetzung von kupfer auf einer aktivierten oberfläche eines substrats

Country Status (3)

Country Link
JP (1) JP4343366B2 (de)
AT (1) ATE276382T1 (de)
DE (1) DE69920157T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6663915B2 (en) * 2000-11-28 2003-12-16 Interuniversitair Microelektronica Centrum Method for copper plating deposition

Also Published As

Publication number Publication date
DE69920157T2 (de) 2005-10-20
DE69920157D1 (de) 2004-10-21
JP2000204481A (ja) 2000-07-25
JP4343366B2 (ja) 2009-10-14

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Legal Events

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