JPH0322467B2 - - Google Patents

Info

Publication number: JPH0322467B2
Authority: JP; Japan
Prior art keywords: plating; catalytic ink; silane coupling; coupling agent; conductor
Prior art date: 1986-12-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP62312933A

Other languages

English (en)

Japanese (ja)

Other versions

JPS63270474A (ja

Inventor

Minoru Tsuda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-12-10

Filing date

1987-12-09

Publication date

1991-03-26

1987-12-09 Application filed by Individual filed Critical Individual

1987-12-09 Priority to JP62312933A priority Critical patent/JPS63270474A/ja

1988-11-08 Publication of JPS63270474A publication Critical patent/JPS63270474A/ja

1991-03-26 Publication of JPH0322467B2 publication Critical patent/JPH0322467B2/ja

Status Granted legal-status Critical Current

Links

230000003197 catalytic effect Effects 0.000 claims description 44
239000006087 Silane Coupling Agent Substances 0.000 claims description 30
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 17
229920002472 Starch Polymers 0.000 claims description 11
235000019698 starch Nutrition 0.000 claims description 11
239000008107 starch Substances 0.000 claims description 11
238000007772 electroless plating Methods 0.000 claims description 10
239000000203 mixture Substances 0.000 claims description 9
239000011230 binding agent Substances 0.000 claims description 7
239000004480 active ingredient Substances 0.000 claims description 4
238000007747 plating Methods 0.000 description 62
239000000976 ink Substances 0.000 description 45
239000000758 substrate Substances 0.000 description 35
239000004020 conductor Substances 0.000 description 34
239000003054 catalyst Substances 0.000 description 16
239000000243 solution Substances 0.000 description 14
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
239000007788 liquid Substances 0.000 description 9
238000007788 roughening Methods 0.000 description 9
229910000679 solder Inorganic materials 0.000 description 9
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 8
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical group Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
238000000034 method Methods 0.000 description 7
229910052709 silver Inorganic materials 0.000 description 7
239000004332 silver Substances 0.000 description 7
239000000126 substance Substances 0.000 description 7
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
239000011248 coating agent Substances 0.000 description 6
238000000576 coating method Methods 0.000 description 6
238000007639 printing Methods 0.000 description 6
SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 6
SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
150000003464 sulfur compounds Chemical class 0.000 description 6
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 5
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 5
230000005484 gravity Effects 0.000 description 5
239000011347 resin Substances 0.000 description 5
229920005989 resin Polymers 0.000 description 5
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
229910000147 aluminium phosphate Inorganic materials 0.000 description 4
239000007864 aqueous solution Substances 0.000 description 4
150000001875 compounds Chemical class 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
235000010265 sodium sulphite Nutrition 0.000 description 4
229920000945 Amylopectin Polymers 0.000 description 3
229920000856 Amylose Polymers 0.000 description 3
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
239000003638 chemical reducing agent Substances 0.000 description 3
239000010949 copper Substances 0.000 description 3
238000009472 formulation Methods 0.000 description 3
MCPLVIGCWWTHFH-UHFFFAOYSA-L methyl blue Chemical compound [Na+].[Na+].C1=CC(S(=O)(=O)[O-])=CC=C1NC1=CC=C(C(=C2C=CC(C=C2)=[NH+]C=2C=CC(=CC=2)S([O-])(=O)=O)C=2C=CC(NC=3C=CC(=CC=3)S([O-])(=O)=O)=CC=2)C=C1 MCPLVIGCWWTHFH-UHFFFAOYSA-L 0.000 description 3
238000007650 screen-printing Methods 0.000 description 3
229910001961 silver nitrate Inorganic materials 0.000 description 3
YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
229920001353 Dextrin Polymers 0.000 description 2
239000004375 Dextrin Substances 0.000 description 2
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
229910021607 Silver chloride Inorganic materials 0.000 description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical class OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
239000000919 ceramic Substances 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
238000010668 complexation reaction Methods 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
235000019425 dextrin Nutrition 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000005530 etching Methods 0.000 description 2
125000000524 functional group Chemical group 0.000 description 2
239000000499 gel Substances 0.000 description 2
229910010272 inorganic material Inorganic materials 0.000 description 2
239000011147 inorganic material Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
-1 methyl blue Chemical class 0.000 description 2
229910000077 silane Inorganic materials 0.000 description 2
150000003378 silver Chemical class 0.000 description 2
HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 2
239000011734 sodium Substances 0.000 description 2
238000001179 sorption measurement Methods 0.000 description 2
238000003860 storage Methods 0.000 description 2
XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 description 2
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
JBHRGAHUHVVXQI-UHFFFAOYSA-N 1-triethoxysilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)C(N)CC JBHRGAHUHVVXQI-UHFFFAOYSA-N 0.000 description 1
NLPBRTBBFUOESW-UHFFFAOYSA-N 1-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)C(CC)OC(=O)C(C)=C NLPBRTBBFUOESW-UHFFFAOYSA-N 0.000 description 1
POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
AFENDNXGAFYKQO-UHFFFAOYSA-N 2-hydroxybutyric acid Chemical class CCC(O)C(O)=O AFENDNXGAFYKQO-UHFFFAOYSA-N 0.000 description 1
LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
239000005711 Benzoic acid Substances 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
PDQAZBWRQCGBEV-UHFFFAOYSA-N Ethylenethiourea Chemical compound S=C1NCCN1 PDQAZBWRQCGBEV-UHFFFAOYSA-N 0.000 description 1
241000287462 Phalacrocorax carbo Species 0.000 description 1
239000004372 Polyvinyl alcohol Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
235000010233 benzoic acid Nutrition 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
238000013329 compounding Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
239000000839 emulsion Substances 0.000 description 1
FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
230000007062 hydrolysis Effects 0.000 description 1
238000006460 hydrolysis reaction Methods 0.000 description 1
230000003301 hydrolyzing effect Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
229910021645 metal ion Inorganic materials 0.000 description 1
ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
STZCRXQWRGQSJD-GEEYTBSJSA-M methyl orange Chemical compound [Na+].C1=CC(N(C)C)=CC=C1\N=N\C1=CC=C(S([O-])(=O)=O)C=C1 STZCRXQWRGQSJD-GEEYTBSJSA-M 0.000 description 1
229940012189 methyl orange Drugs 0.000 description 1
YYGBVRCTHASBKD-UHFFFAOYSA-M methylene green Chemical compound [Cl-].C1=CC(N(C)C)=C([N+]([O-])=O)C2=[S+]C3=CC(N(C)C)=CC=C3N=C21 YYGBVRCTHASBKD-UHFFFAOYSA-M 0.000 description 1
238000002156 mixing Methods 0.000 description 1
KCFBMYSSGZGILB-UHFFFAOYSA-N n'-(1-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)C(CC)NCCN KCFBMYSSGZGILB-UHFFFAOYSA-N 0.000 description 1
GVVNVWMBOHQMEV-UHFFFAOYSA-N n'-(1-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)C(CC)NCCN GVVNVWMBOHQMEV-UHFFFAOYSA-N 0.000 description 1
239000011368 organic material Substances 0.000 description 1
229920000620 organic polymer Polymers 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
239000004033 plastic Substances 0.000 description 1
239000002574 poison Substances 0.000 description 1
231100000614 poison Toxicity 0.000 description 1
229920002451 polyvinyl alcohol Polymers 0.000 description 1
230000002265 prevention Effects 0.000 description 1
230000001737 promoting effect Effects 0.000 description 1
230000001105 regulatory effect Effects 0.000 description 1
230000001846 repelling effect Effects 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000010008 shearing Methods 0.000 description 1
150000003377 silicon compounds Chemical class 0.000 description 1
229910052814 silicon oxide Inorganic materials 0.000 description 1
CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
229940071536 silver acetate Drugs 0.000 description 1
YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
229910000367 silver sulfate Inorganic materials 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
230000008961 swelling Effects 0.000 description 1
229960003080 taurine Drugs 0.000 description 1
UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
231100000331 toxic Toxicity 0.000 description 1
230000002588 toxic effect Effects 0.000 description 1
231100000419 toxicity Toxicity 0.000 description 1
230000001988 toxicity Effects 0.000 description 1
JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
NKLYMYLJOXIVFB-UHFFFAOYSA-N triethoxymethylsilane Chemical compound CCOC([SiH3])(OCC)OCC NKLYMYLJOXIVFB-UHFFFAOYSA-N 0.000 description 1
ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical compound COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 description 1
238000005406 washing Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating

JP62312933A 1986-12-10 1987-12-09 触媒性インク Granted JPS63270474A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP62312933A JPS63270474A (ja)	1986-12-10	1987-12-09	触媒性インク

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP61-294373		1986-12-10
JP29437386		1986-12-10
JP62312933A JPS63270474A (ja)	1986-12-10	1987-12-09	触媒性インク

Publications (2)

Publication Number	Publication Date
JPS63270474A JPS63270474A (ja)	1988-11-08
JPH0322467B2 true JPH0322467B2 (de)	1991-03-26

Family

ID=26559799

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP62312933A Granted JPS63270474A (ja)	1986-12-10	1987-12-09	触媒性インク

Country Status (1)

Country	Link
JP (1)	JPS63270474A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1999059386A1 (fr) *	1998-05-14	1999-11-18	Seiko Epson Corporation	Substrat pour la formation de motifs speciaux et procede de fabrication d'un tel substrat

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5227223A (en) *	1989-12-21	1993-07-13	Monsanto Company	Fabricating metal articles from printed images
JP3598317B2 (ja) *	1999-01-20	2004-12-08	独立行政法人産業技術総合研究所	無電解めっきの前処理方法
JP3670238B2 (ja) *	2000-01-07	2005-07-13	株式会社日鉱マテリアルズ	金属めっき方法、前処理剤、それを用いた半導体ウェハー及び半導体装置
US7045461B2 (en)	2000-01-07	2006-05-16	Nikkon Materials Co., Ltd.	Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these
JP4775664B2 (ja) *	2005-06-17	2011-09-21	住友金属鉱山株式会社	ニッケル膜形成用塗布液、及びニッケル膜とその製造方法
CN103163737B (zh) *	2011-12-09	2015-06-17	北大方正集团有限公司	一种pcb阻焊层显影效果的监测方法

1987
- 1987-12-09 JP JP62312933A patent/JPS63270474A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1999059386A1 (fr) *	1998-05-14	1999-11-18	Seiko Epson Corporation	Substrat pour la formation de motifs speciaux et procede de fabrication d'un tel substrat

Also Published As

Publication number	Publication date
JPS63270474A (ja)	1988-11-08

Publication	Publication Date	Title
US4632857A (en)	1986-12-30	Electrolessly plated product having a polymetallic catalytic film underlayer
US4232060A (en)	1980-11-04	Method of preparing substrate surface for electroless plating and products produced thereby
JP3117386B2 (ja)	2000-12-11	基板を選択的に金属被覆する方法
JPH0575246A (ja)	1993-03-26	プリント回路の作成法
EP0545218A2 (de)	1993-06-09	Komplexmittel für die Zinnplatierung nach der Antauschmethode
KR900001089B1 (ko)	1990-02-26	동스로우호올프린트 배선판의 제조방법
US4816070A (en)	1989-03-28	Use of immersion tin and alloys as a bonding medium for multilayer circuits
GB2037488A (en)	1980-07-09	Thermoplastics printed circuit board material
US3799816A (en)	1974-03-26	Metallizing insulating bases
US4847114A (en)	1989-07-11	Preparation of printed circuit boards by selective metallization
EP0707093B1 (de)	1998-10-28	Verfahren zur selektiven Plattierung
JP3337802B2 (ja)	2002-10-28	酸化銅（ｉ）コロイドの金属化によるダイレクトプレーティング方法
JPH0322467B2 (de)	1991-03-26
EP0926266B1 (de)	2002-10-16	Verfahren und Lösung zum Ätzen von Al-Cu Schichten zur Herstellung von elektronischen Schaltungen
US5358602A (en)	1994-10-25	Method for manufacture of printed circuit boards
US4537799A (en)	1985-08-27	Selective metallization process
US3674485A (en)	1972-07-04	Method of manufacturing electrically conducting metal layers
JP4646376B2 (ja)	2011-03-09	ダイレクトプレーティング用アクセレレータ浴液およびダイレクトプレーティング方法
EP0163089B1 (de)	1988-08-10	Verfahren zum Aktivieren eines Trägers für stromlose leitfähige Metallabscheidung
JPH0413876B2 (de)	1992-03-11
JPS638638B2 (de)	1988-02-23
KR20090009734A (ko)	2009-01-23	표면처리제
US4968398A (en)	1990-11-06	Process for the electrolytic removal of polyimide resins
JPH0413877B2 (de)	1992-03-11
JP2008510885A (ja)	2008-04-10	アンチモン化合物を含有する基板にスズおよびスズ合金をコーティングするための方法

JPH0322467B2 - - Google Patents

Info

Links

Classifications

Priority Applications (1)

Applications Claiming Priority (3)

Publications (2)

Family

ID=26559799

Family Applications (1)

Country Status (1)

Cited By (1)

Families Citing this family (6)

Cited By (1)

Also Published As

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