ZA781667B - Process and device for the production of metal-complex compounds suitable for electroless metal deposition - Google Patents
Process and device for the production of metal-complex compounds suitable for electroless metal depositionInfo
- Publication number
- ZA781667B ZA781667B ZA00781667A ZA781667A ZA781667B ZA 781667 B ZA781667 B ZA 781667B ZA 00781667 A ZA00781667 A ZA 00781667A ZA 781667 A ZA781667 A ZA 781667A ZA 781667 B ZA781667 B ZA 781667B
- Authority
- ZA
- South Africa
- Prior art keywords
- metal
- production
- complex compounds
- compounds suitable
- electroless
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1669—Agitation, e.g. air introduction
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1671—Electric field
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B3/00—Electrolytic production of organic compounds
- C25B3/01—Products
- C25B3/13—Organo-metallic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2713392A DE2713392C2 (de) | 1977-03-23 | 1977-03-23 | Verfahren zum Herstellen von Metallkomplexlösungen |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA781667B true ZA781667B (en) | 1979-02-28 |
Family
ID=6004743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA00781667A ZA781667B (en) | 1977-03-23 | 1978-03-22 | Process and device for the production of metal-complex compounds suitable for electroless metal deposition |
Country Status (17)
Country | Link |
---|---|
US (1) | US4208255A (xx) |
JP (1) | JPS585983B2 (xx) |
AT (1) | AT358894B (xx) |
AU (1) | AU519455B2 (xx) |
BE (1) | BE865220A (xx) |
BR (1) | BR7801802A (xx) |
CA (1) | CA1124675A (xx) |
CH (1) | CH644154A5 (xx) |
DE (1) | DE2713392C2 (xx) |
DK (1) | DK130878A (xx) |
FR (1) | FR2384863A1 (xx) |
GB (1) | GB1562176A (xx) |
IL (1) | IL54192A (xx) |
IT (1) | IT1156173B (xx) |
NL (1) | NL187245C (xx) |
SE (1) | SE446197B (xx) |
ZA (1) | ZA781667B (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4312719A (en) * | 1980-11-24 | 1982-01-26 | Monsanto Company | Electrochemical process for incorporating copper in nylon |
US4360410A (en) * | 1981-03-06 | 1982-11-23 | Western Electric Company, Inc. | Electroplating processes and equipment utilizing a foam electrolyte |
CA1213243A (en) * | 1982-01-07 | 1986-10-28 | Manchem Limited | Electrolysis using two electrolytically conducting phases |
US4425205A (en) * | 1982-03-13 | 1984-01-10 | Kanto Kasei Co., Ltd. | Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath |
GB2260927A (en) * | 1991-10-28 | 1993-05-05 | Jong Yi Dai | Disposable razor |
FR2708002A1 (fr) * | 1993-07-23 | 1995-01-27 | Assoun Christian Daniel | Procédé de préparation de complexes organométalliques et leurs applications en tant que médicament et en catalyse chimique. |
US6294071B1 (en) | 2000-01-07 | 2001-09-25 | Huntsman Petrochemical Corporation | Methods of forming copper solutions |
US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1129307A (en) * | 1914-12-26 | 1915-02-23 | Howard L Marsh | Process of forming compounds of iron and carbohydrates. |
US2865832A (en) * | 1953-06-10 | 1958-12-23 | Edgar C Pitzer | Electrolytic dissolution of stainless steel |
US3303111A (en) * | 1963-08-12 | 1967-02-07 | Arthur L Peach | Electro-electroless plating method |
DE1521253A1 (de) | 1966-05-05 | 1969-07-24 | Hoechst Ag | Verfahren zum Vernickeln von Kunstst stoffen |
US3474011A (en) * | 1967-08-03 | 1969-10-21 | American Bank Note Co | Electroplating method and apparatus |
ZA703750B (en) * | 1969-06-06 | 1971-01-27 | Australian Iron And Steel Ltd | Addition of metal ions to plating bath |
SU400581A1 (ru) * | 1971-01-05 | 1973-10-01 | Ленинградска ордена Ленина лесотехническа академи С. М. Кирова | Способ получения металлокомплексов |
DE2114652A1 (de) * | 1971-03-23 | 1972-10-05 | Schering Ag | Verfahren zum Regenerieren von Elektrolyten fur die chemische Ab scheidung von Metallen |
US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
GB1433800A (en) * | 1973-12-27 | 1976-04-28 | Imi Refinery Holdings Ltd | Method of and anodes for use in electrowinning metals |
-
1977
- 1977-03-23 DE DE2713392A patent/DE2713392C2/de not_active Expired
-
1978
- 1978-03-03 IL IL54192A patent/IL54192A/xx unknown
- 1978-03-13 US US05/885,649 patent/US4208255A/en not_active Expired - Lifetime
- 1978-03-16 NL NLAANVRAGE7802900,A patent/NL187245C/xx not_active IP Right Cessation
- 1978-03-17 CA CA299,131A patent/CA1124675A/en not_active Expired
- 1978-03-20 GB GB10854/78A patent/GB1562176A/en not_active Expired
- 1978-03-20 SE SE7803186A patent/SE446197B/sv not_active IP Right Cessation
- 1978-03-21 CH CH309178A patent/CH644154A5/de not_active IP Right Cessation
- 1978-03-22 BR BR7801802A patent/BR7801802A/pt unknown
- 1978-03-22 ZA ZA00781667A patent/ZA781667B/xx unknown
- 1978-03-22 AT AT205278A patent/AT358894B/de not_active IP Right Cessation
- 1978-03-22 DK DK130878A patent/DK130878A/da not_active Application Discontinuation
- 1978-03-23 JP JP53034017A patent/JPS585983B2/ja not_active Expired
- 1978-03-23 IT IT48566/78A patent/IT1156173B/it active
- 1978-03-23 BE BE2056788A patent/BE865220A/xx not_active IP Right Cessation
- 1978-03-23 FR FR7808488A patent/FR2384863A1/fr active Granted
- 1978-04-03 AU AU34698/78A patent/AU519455B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL187245B (nl) | 1991-02-18 |
US4208255A (en) | 1980-06-17 |
DK130878A (da) | 1978-09-24 |
BR7801802A (pt) | 1979-01-23 |
JPS585983B2 (ja) | 1983-02-02 |
FR2384863A1 (fr) | 1978-10-20 |
IL54192A0 (en) | 1978-06-15 |
IT7848566A0 (it) | 1978-03-23 |
SE7803186L (sv) | 1978-09-24 |
AU3469878A (en) | 1979-10-11 |
FR2384863B1 (xx) | 1983-07-18 |
NL7802900A (nl) | 1978-09-26 |
NL187245C (nl) | 1991-07-16 |
SE446197B (sv) | 1986-08-18 |
DE2713392A1 (de) | 1978-09-28 |
GB1562176A (en) | 1980-03-05 |
DE2713392C2 (de) | 1981-11-12 |
AU519455B2 (en) | 1981-12-03 |
IT1156173B (it) | 1987-01-28 |
BE865220A (nl) | 1978-09-25 |
AT358894B (de) | 1980-10-10 |
ATA205278A (de) | 1980-02-15 |
CA1124675A (en) | 1982-06-01 |
JPS53146934A (en) | 1978-12-21 |
IL54192A (en) | 1981-03-31 |
CH644154A5 (de) | 1984-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2008592B (en) | Process for the production of nitrodiarylamines | |
ZA782054B (en) | Coating process | |
JPS5475430A (en) | Method of depositing metal on surface | |
IL52789A0 (en) | Process for electroless deposition of metals on zirconium materials | |
DE2861246D1 (en) | Process for the solvent-free coating of substrates | |
US4701350B1 (en) | Process for electroless metal deposition | |
ZA781667B (en) | Process and device for the production of metal-complex compounds suitable for electroless metal deposition | |
DE3063023D1 (en) | Process for the regeneration of electroless plating baths | |
GB2006267B (en) | Phosphating of metallic substrate | |
JPS5435136A (en) | Multiilayer plating for preventing whisker production of tin plating | |
GB2007724B (en) | Process of low-melting-point metals | |
YU307178A (en) | Process for coating metallic surfaces by means of selfdeposition of the coating | |
GB2009253B (en) | Coating process | |
PT67863B (en) | Process for obtaining hard-facing substrates | |
GB2006201B (en) | Process for the production of nitroguanidine | |
DE3164947D1 (en) | Process for the electroless deposition of metals | |
IL50093A0 (en) | New polymeric substrates for electroless metal deposition | |
JPS53139664A (en) | Process for metal coating of plastics | |
GB2005270B (en) | Process for the production of amino-i-acid | |
GB2003193B (en) | Metal phosphating process | |
GB2003191B (en) | Metal phosphating process | |
GB2003192B (en) | Metal phosphating process | |
GB1540308A (en) | Process for the treatment of metal surfaces | |
IL56071A0 (en) | Process for the production of phenyl-butenones | |
JPS5417915A (en) | Ceramic coating process |