DK130878A - Fremgangsmaade til fremstilling af metalkompleksforbindelser der egner sig til kemisk afsaetning af metal samt apparat til anvendelse ved udoevelse af denne fremgangsmaade - Google Patents

Fremgangsmaade til fremstilling af metalkompleksforbindelser der egner sig til kemisk afsaetning af metal samt apparat til anvendelse ved udoevelse af denne fremgangsmaade

Info

Publication number
DK130878A
DK130878A DK130878A DK130878A DK130878A DK 130878 A DK130878 A DK 130878A DK 130878 A DK130878 A DK 130878A DK 130878 A DK130878 A DK 130878A DK 130878 A DK130878 A DK 130878A
Authority
DK
Denmark
Prior art keywords
procedure
metal
appliance
preparation
performance
Prior art date
Application number
DK130878A
Other languages
English (en)
Inventor
F Stahl
H Steffen
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of DK130878A publication Critical patent/DK130878A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1671—Electric field
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00—Electrolytic production of organic compounds
    • C25B3/01—Products
    • C25B3/13—Organo-metallic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
DK130878A 1977-03-23 1978-03-22 Fremgangsmaade til fremstilling af metalkompleksforbindelser der egner sig til kemisk afsaetning af metal samt apparat til anvendelse ved udoevelse af denne fremgangsmaade DK130878A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2713392A DE2713392C2 (de) 1977-03-23 1977-03-23 Verfahren zum Herstellen von Metallkomplexlösungen

Publications (1)

Publication Number Publication Date
DK130878A true DK130878A (da) 1978-09-24

Family

ID=6004743

Family Applications (1)

Application Number Title Priority Date Filing Date
DK130878A DK130878A (da) 1977-03-23 1978-03-22 Fremgangsmaade til fremstilling af metalkompleksforbindelser der egner sig til kemisk afsaetning af metal samt apparat til anvendelse ved udoevelse af denne fremgangsmaade

Country Status (17)

Country Link
US (1) US4208255A (da)
JP (1) JPS585983B2 (da)
AT (1) AT358894B (da)
AU (1) AU519455B2 (da)
BE (1) BE865220A (da)
BR (1) BR7801802A (da)
CA (1) CA1124675A (da)
CH (1) CH644154A5 (da)
DE (1) DE2713392C2 (da)
DK (1) DK130878A (da)
FR (1) FR2384863A1 (da)
GB (1) GB1562176A (da)
IL (1) IL54192A (da)
IT (1) IT1156173B (da)
NL (1) NL187245C (da)
SE (1) SE446197B (da)
ZA (1) ZA781667B (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312719A (en) * 1980-11-24 1982-01-26 Monsanto Company Electrochemical process for incorporating copper in nylon
US4360410A (en) * 1981-03-06 1982-11-23 Western Electric Company, Inc. Electroplating processes and equipment utilizing a foam electrolyte
CA1213243A (en) * 1982-01-07 1986-10-28 Manchem Limited Electrolysis using two electrolytically conducting phases
US4425205A (en) * 1982-03-13 1984-01-10 Kanto Kasei Co., Ltd. Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
GB2260927A (en) * 1991-10-28 1993-05-05 Jong Yi Dai Disposable razor
FR2708002A1 (fr) * 1993-07-23 1995-01-27 Assoun Christian Daniel Procédé de préparation de complexes organométalliques et leurs applications en tant que médicament et en catalyse chimique.
US6294071B1 (en) 2000-01-07 2001-09-25 Huntsman Petrochemical Corporation Methods of forming copper solutions
US8172627B2 (en) * 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1129307A (en) * 1914-12-26 1915-02-23 Howard L Marsh Process of forming compounds of iron and carbohydrates.
US2865832A (en) * 1953-06-10 1958-12-23 Edgar C Pitzer Electrolytic dissolution of stainless steel
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
DE1521253A1 (de) 1966-05-05 1969-07-24 Hoechst Ag Verfahren zum Vernickeln von Kunstst stoffen
US3474011A (en) * 1967-08-03 1969-10-21 American Bank Note Co Electroplating method and apparatus
ZA703750B (en) * 1969-06-06 1971-01-27 Australian Iron And Steel Ltd Addition of metal ions to plating bath
SU400581A1 (ru) * 1971-01-05 1973-10-01 Ленинградска ордена Ленина лесотехническа академи С. М. Кирова Способ получения металлокомплексов
DE2114652A1 (de) * 1971-03-23 1972-10-05 Schering Ag Verfahren zum Regenerieren von Elektrolyten fur die chemische Ab scheidung von Metallen
US3962494A (en) * 1971-07-29 1976-06-08 Photocircuits Division Of Kollmorgan Corporation Sensitized substrates for chemical metallization
GB1433800A (en) * 1973-12-27 1976-04-28 Imi Refinery Holdings Ltd Method of and anodes for use in electrowinning metals

Also Published As

Publication number Publication date
NL187245B (nl) 1991-02-18
US4208255A (en) 1980-06-17
BR7801802A (pt) 1979-01-23
JPS585983B2 (ja) 1983-02-02
FR2384863A1 (fr) 1978-10-20
IL54192A0 (en) 1978-06-15
IT7848566A0 (it) 1978-03-23
ZA781667B (en) 1979-02-28
SE7803186L (sv) 1978-09-24
AU3469878A (en) 1979-10-11
FR2384863B1 (da) 1983-07-18
NL7802900A (nl) 1978-09-26
NL187245C (nl) 1991-07-16
SE446197B (sv) 1986-08-18
DE2713392A1 (de) 1978-09-28
GB1562176A (en) 1980-03-05
DE2713392C2 (de) 1981-11-12
AU519455B2 (en) 1981-12-03
IT1156173B (it) 1987-01-28
BE865220A (nl) 1978-09-25
AT358894B (de) 1980-10-10
ATA205278A (de) 1980-02-15
CA1124675A (en) 1982-06-01
JPS53146934A (en) 1978-12-21
IL54192A (en) 1981-03-31
CH644154A5 (de) 1984-07-13

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