DE3164947D1 - Process for the electroless deposition of metals - Google Patents
Process for the electroless deposition of metalsInfo
- Publication number
- DE3164947D1 DE3164947D1 DE8181101169T DE3164947T DE3164947D1 DE 3164947 D1 DE3164947 D1 DE 3164947D1 DE 8181101169 T DE8181101169 T DE 8181101169T DE 3164947 T DE3164947 T DE 3164947T DE 3164947 D1 DE3164947 D1 DE 3164947D1
- Authority
- DE
- Germany
- Prior art keywords
- metals
- electroless deposition
- electroless
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8181101169T DE3164947D1 (en) | 1980-03-28 | 1981-02-19 | Process for the electroless deposition of metals |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803012006 DE3012006A1 (en) | 1980-03-28 | 1980-03-28 | METHOD FOR DEFLECTIVE METAL DEPOSITION |
DE8181101169T DE3164947D1 (en) | 1980-03-28 | 1981-02-19 | Process for the electroless deposition of metals |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3164947D1 true DE3164947D1 (en) | 1984-08-30 |
Family
ID=6098598
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803012006 Withdrawn DE3012006A1 (en) | 1980-03-28 | 1980-03-28 | METHOD FOR DEFLECTIVE METAL DEPOSITION |
DE8181101169T Expired DE3164947D1 (en) | 1980-03-28 | 1981-02-19 | Process for the electroless deposition of metals |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803012006 Withdrawn DE3012006A1 (en) | 1980-03-28 | 1980-03-28 | METHOD FOR DEFLECTIVE METAL DEPOSITION |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0036940B1 (en) |
JP (1) | JPS56150176A (en) |
BR (1) | BR8101866A (en) |
DE (2) | DE3012006A1 (en) |
ES (1) | ES500790A0 (en) |
FI (1) | FI66437C (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624865A (en) * | 1984-05-21 | 1986-11-25 | Carolina Solvents, Inc. | Electrically conductive microballoons and compositions incorporating same |
US5786785A (en) * | 1984-05-21 | 1998-07-28 | Spectro Dynamics Systems, L.P. | Electromagnetic radiation absorptive coating composition containing metal coated microspheres |
US4624798A (en) * | 1984-05-21 | 1986-11-25 | Carolina Solvents, Inc. | Electrically conductive magnetic microballoons and compositions incorporating same |
FR2763962B1 (en) * | 1997-05-29 | 1999-10-15 | Guy Stremsdoerfer | NON-ELECTROLYTIC PROCESS FOR METALLIZING A SUBSTRATE BY MEANS OF REDUCING METAL SALT (S) AND BY SPRAYING AEROSOL (S) |
US6258223B1 (en) * | 1999-07-09 | 2001-07-10 | Applied Materials, Inc. | In-situ electroless copper seed layer enhancement in an electroplating system |
WO2003051562A1 (en) * | 2001-12-18 | 2003-06-26 | Asahi Kasei Kabushiki Kaisha | Metal oxide dispersion |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE572358A (en) * | 1958-10-24 | 1900-01-01 | ||
NL6405384A (en) * | 1963-06-04 | 1964-12-07 | ||
GB1110765A (en) * | 1964-05-12 | 1968-04-24 | English Numbering Machines | Improvements in or relating to metallizing surfaces which are electrically non-conductive |
FR1536245A (en) * | 1967-05-12 | 1968-08-16 | Comp Generale Electricite | Improvement in the process of depositing a layer of silver on nickel and product obtained by this process |
US3853590A (en) * | 1969-08-20 | 1974-12-10 | Crown City Plating Co | Electroless plating solution and process |
GB1426829A (en) * | 1973-06-09 | 1976-03-03 | Vaq Fos Ltd | Metal plating |
US4144361A (en) * | 1977-07-06 | 1979-03-13 | Nathan Feldstein | Methods for applying metallic silver coatings |
-
1980
- 1980-03-28 DE DE19803012006 patent/DE3012006A1/en not_active Withdrawn
-
1981
- 1981-02-19 EP EP81101169A patent/EP0036940B1/en not_active Expired
- 1981-02-19 DE DE8181101169T patent/DE3164947D1/en not_active Expired
- 1981-03-26 JP JP4327981A patent/JPS56150176A/en active Pending
- 1981-03-27 FI FI810947A patent/FI66437C/en not_active IP Right Cessation
- 1981-03-27 ES ES500790A patent/ES500790A0/en active Granted
- 1981-03-27 BR BR8101866A patent/BR8101866A/en unknown
Also Published As
Publication number | Publication date |
---|---|
FI66437B (en) | 1984-06-29 |
BR8101866A (en) | 1981-09-29 |
DE3012006A1 (en) | 1981-10-08 |
ES8205268A1 (en) | 1982-06-01 |
JPS56150176A (en) | 1981-11-20 |
FI66437C (en) | 1984-10-10 |
FI810947L (en) | 1981-09-29 |
ES500790A0 (en) | 1982-06-01 |
EP0036940A1 (en) | 1981-10-07 |
EP0036940B1 (en) | 1984-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |