WO2021180140A1 - 曝光机及曝光方法 - Google Patents

曝光机及曝光方法 Download PDF

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Publication number
WO2021180140A1
WO2021180140A1 PCT/CN2021/080070 CN2021080070W WO2021180140A1 WO 2021180140 A1 WO2021180140 A1 WO 2021180140A1 CN 2021080070 W CN2021080070 W CN 2021080070W WO 2021180140 A1 WO2021180140 A1 WO 2021180140A1
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Prior art keywords
mask
gas
exposure machine
exposure
cleaning device
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PCT/CN2021/080070
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English (en)
French (fr)
Inventor
邹斌
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长鑫存储技术有限公司
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Priority to US17/437,752 priority Critical patent/US11852976B2/en
Publication of WO2021180140A1 publication Critical patent/WO2021180140A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Definitions

  • This application relates to the field of semiconductors, in particular to exposure machines and exposure methods.
  • the exposure machine In photolithography, the exposure machine generally includes a light source and a mask.
  • the mask is a transparent flat plate whose surface is covered by various patterns. Each pattern contains opaque and transparent parts to block and allow light to pass through.
  • the light source can project the pattern onto the photoresist coated wafer through the mask, thereby eliminating the photoresist in the transparent part and leaving the photoresist in the opaque part, generating a three-dimensional relief pattern to assist in etching the circuit pattern on the wafer .
  • the exposure machine in the prior art is usually provided with a detection module to avoid the influence of the adhesion on the surface of the mask, such as dust and particles, on the accuracy and integrity of the lithography.
  • the prior art exposure machine needs to unload the mask to the outside of the exposure machine when detecting the presence of attachments on the surface of the mask, and send it to a special cleaning device for cleaning and then load it into the exposure machine for testing.
  • the working efficiency of the exposure machine is low, and at the same time, the cleaning effect of the mask in the existing method needs to be optimized.
  • the purpose of some embodiments of the present application is to provide an exposure machine and an exposure method to improve the working efficiency of the exposure machine and optimize the cleaning effect of the mask.
  • an exposure machine including: a detection module, the detection module is used to detect whether there are attachments on the surface of the mask; a cleaning device, the cleaning device is used to Cleaning the attachment on the surface of the mask; and an exposure module, which is used to perform an exposure operation on the mask where it is detected that the attachment does not exist.
  • Some embodiments of the present application also provide an exposure method, applied to the aforementioned exposure machine, including: moving a mask to a detection module; detecting the mask to determine whether the surface of the mask is present If there are no attachments on the surface of the mask, move the mask to the exposure module for exposure; if there are attachments on the surface of the mask, apply the cleaning device to the mask The diaphragm is cleaned, and the surface of the mask is inspected again.
  • some embodiments of this application are equipped with a cleaning device in the exposure machine.
  • the detection module detects that there are attachments on the surface of the mask, which may affect the photolithography of the mask
  • the cleaning device is used to perform photolithography on the mask.
  • the surface of the film plate is cleaned, so as to effectively ensure the photoetching effect of the mask plate during photoetching.
  • the cleaning device since the cleaning device is also installed in the lithography machine, when it is detected that there are attachments on the surface of the mask, the mask can be cleaned directly inside the exposure machine without unloading the mask, thereby effectively lifting the exposure machine Work efficiency.
  • the cleaning device includes a housing and a support frame arranged on the housing.
  • the support frame is provided with a gas spray head for cleaning the mask plate; the gas spray head is used to face the Air the mask for cleaning.
  • the mask plate is cleaned by the gas nozzle jet, which can effectively reduce the impact of the cleaning process on other parts in the exposure machine.
  • the angle between the jet direction of the gas spray head and the mask plate is greater than 5° and less than 85°. Set the angle between the air jet direction and the mask to be greater than 5° and less than 85°, which can blow off the attachments more effectively and improve the blowing efficiency.
  • the included angle is 45°.
  • the cleaning device further includes an air flow control device connected to the gas spray head, and the air flow control device is used to control the flow rate of the air flow sprayed by the gas spray head.
  • the flow rate of the air flow is controlled by the air flow control device, which can effectively avoid damage to the mask plate caused by excessive air flow, or the mask plate cannot be effectively cleaned due to too small air flow.
  • the number of the gas spray heads is multiple, and the multiple gas spray heads are arranged oppositely on the support frame; when the cleaning device cleans the mask plate, the multiple gas spray heads are respectively directed toward all the gas spray heads.
  • the two opposite surfaces of the mask are blown.
  • a plurality of gas spray heads respectively blow air toward two opposite surfaces of the mask plate, thereby cleaning the surface of the mask plate more effectively.
  • the interval between the gas nozzles ranges from 0.5 to 10 mm
  • the gas nozzle is cylindrical
  • the diameter of the bottom surface of the cylindrical gas nozzle ranges from 0.5 to 15 mm
  • the length of the cylindrical gas nozzle ranges from 0.5 mm. ⁇ 20mm.
  • each of the gas nozzles has the same angle with the mask plate and is located between 15° and 25°; an exhaust port is provided on the side surface of the casing in the air jet direction.
  • the airflow ejected by the gas nozzle is a pulsed airflow
  • the exhaust port uses a pulse pumping method to pump the gas in the cleaning device.
  • the pulses of the pulsed airflow and the pulses of the pulsed pumping Synchronization or fixed time interval. Adopting the pulsed air method can enhance the ability to blow off the attachments.
  • the pulsed air pumping method coordinated with the pulsed air flow can be used for air pumping, which can maintain the air flow state inside and outside the shell well and ensure the lithography machine Internal environmental stability.
  • the cleaning device further includes an electrical detection component and a gas adjustment component; the electrical detection module is used to detect the electrical type of the attachment; the gas adjustment module is used to adjust the gas ejected by the gas nozzle
  • the electrical properties of the gas are opposite to the electrical properties of the attachment.
  • the electrical type of the gas ejected by the gas regulating module is opposite to that of the attachments, so that the electrical properties of the attachments are effectively neutralized, so that the attachments are more likely to be blown off.
  • the type of the gas is clean air or nitrogen. Using clean air or nitrogen can effectively save costs.
  • Fig. 1 is a schematic structural diagram of an exposure machine provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a mask plate and a cleaning device in an exposure machine provided by an embodiment of the present application;
  • FIG. 3 is a schematic diagram of the structure of the mask plate and the gas shower head in the exposure machine provided by some embodiments of the present application;
  • FIG. 4 is a schematic structural diagram of a mask plate and a cleaning device in an exposure machine provided by another embodiment of the present application;
  • FIG. 5 is a schematic structural diagram of a mask plate and a cleaning device in an exposure machine provided by another embodiment of the present application;
  • FIG. 6 is a schematic structural diagram of a mask plate and a cleaning device in an exposure machine provided by another embodiment of the present application.
  • FIG. 7 is a schematic diagram of an exposure method provided by another embodiment of the present application.
  • An embodiment of the present application relates to an exposure machine.
  • the specific structure is shown in FIG.
  • the cleaning device 11 is used for cleaning the mask when the detection module 10 detects that there is an attachment on the mask, and the exposure module 20 is used for exposing the mask where no attachment is detected.
  • the cleaning device 11 is provided in the detection module 10. It can be understood that the arrangement of the cleaning device 11 in the detection module 10 is only an example of a specific position where the cleaning device 11 is arranged in the exposure machine in this embodiment, and does not constitute a limitation. In other embodiments of the present application, In this case, the cleaning device 11 can also be set in other positions in the exposure machine, and can be set flexibly according to actual needs.
  • a cleaning device 11 is integrated in the exposure machine.
  • the detection module 10 detects that there is an attachment on the surface of the mask
  • the cleaning device 11 is used directly. It can complete the cleaning treatment of the mask surface without unloading the mask to the outside of the exposure machine, thereby eliminating the repeated loading and unloading process, effectively simplifying the exposure process, thereby improving the working efficiency of the exposure machine.
  • the mask plate does not need to undergo repeated loading and unloading processes, and possible damage to the mask plate during the repeated loading and unloading process is avoided, and the reliability of the exposure machine is improved.
  • FIG. 2 is a schematic diagram of the structure of the mask 100 when the cleaning device 11 cleans it. It is understandable that the mask 100 is only drawn in FIG. 2 for ease of understanding in this embodiment. , It is not part of the cleaning device 11.
  • the cleaning device 11 includes a housing 111 and a support frame 112 provided on the housing 111, and the support frame 112 is provided with a gas spray head 113 for cleaning the mask 100.
  • the gas shower head 113 is used to spray air toward the mask 100 to clean the mask 100.
  • the cost of raw materials is lower.
  • the air-jet process has less impact on other parts of the exposure machine, thereby effectively ensuring that the normal operation of the exposure machine is not affected.
  • the angle between the air jet direction of the gas shower head 113 and the mask 100 is greater than 5° and less than 85°.
  • the angle between the air jet direction of the gas nozzle 113 and the mask 100 is greater than 5° and less than 85°, which can make the air jet cleaning more efficient, and the attachments are easier to be swept off, thereby effectively improving the cleaning efficiency of the cleaning device 11 And cleaning effect.
  • the angle between the air jet direction of the aforementioned gas shower head 113 and the mask 100 is greater than 5° and less than 85° is only a preferred example in this embodiment and does not constitute a limitation. In this application In other embodiments, it may also be greater than 85° or less than 5°, which will not be listed here, and can be set flexibly according to actual needs.
  • the angle between the spray direction of the gas spray head 113 and the mask 100 is 45°. It can be understood that when the angle between the air jet direction of the gas spray head 113 and the mask 100 is 45°, a better cleaning effect can be achieved, and it is not a limitation.
  • the number of gas spray heads 113 is multiple, and the multiple gas spray heads 113 are arranged oppositely on the support frame 112; when the cleaning device 11 cleans the mask 100, the multiple gas spray heads 113 are respectively facing The two opposite surfaces of the mask 100 are blown.
  • the surface of the mask plate 100 can be cleaned more comprehensively, and the cleaning can be effectively improved at the same time. Speed, further improve the reliability and work efficiency of the exposure machine.
  • the interval between the gas nozzles 113 ranges from 0.5 to 10 mm, the gas nozzles are cylindrical, the gas nozzles 113 are cylindrical, and the diameter of the bottom surface of the cylindrical gas nozzles 113 ranges from 0.5 to 15 mm.
  • the length of the cylindrical gas shower head 113 ranges from 0.5 to 20 mm.
  • the gas blown from the gas shower head 113 is clean air or nitrogen.
  • Use clean air or nitrogen which is more stable in nature and will not damage the exposure machine and mask.
  • the cost of clean air and nitrogen is lower, which effectively solves the cost.
  • the cleaning device 11 further includes an airflow control device 114, and the airflow control device 114 is used to control the flow rate of the airflow sprayed by the gas nozzle 113.
  • the cleaning device 11 is further provided with an air flow control device 114 connected to the gas spray head 113, and the gas spray head 113 is controlled by the air flow control device 114
  • the flow rate of the jetted airflow prevents damage to the mask plate due to excessive airflow, or prevents the mask plate from being effectively cleaned due to excessive airflow. Further improve the reliability and work efficiency of the exposure machine.
  • FIG. 5 Another embodiment of the present application relates to an exposure machine.
  • the air jet direction of each gas nozzle 113 and the mask 110 have the same angle and are located between 15° and 25°; the air jet direction is on the side of the housing 111
  • An exhaust port 115 is provided.
  • a plurality of exhaust ports 115 may be provided on the side of the housing opposite to the gas shower head 113, and the distribution of the exhaust ports can be adjusted according to the angle between the air jet direction of the gas shower head 113 and the mask plate. , So that the gas ejected by the gas shower head 113 bounces off the mask 110 and is exactly aligned with the exhaust port 115.
  • the included angle is 20°, and the distance between the exhaust ports 115 is 50 mm.
  • the exposure machine provided in another embodiment of the present application retains the technical effects of some of the foregoing embodiments, and uses each gas nozzle to blow in the same direction at a small angle, and at the same time, it blows in the direction of the jet.
  • the corresponding exhaust port on the side of the housing not only makes the attachments easier to be blown away, but also allows the purged airflow to be discharged more effectively and economically, thereby ensuring the balance of the air pressure inside and outside the exposure machine and preventing the air pressure from being too high Cause damage to the exposure machine and improve the safety of the exposure machine.
  • the air flow ejected by the gas nozzle 113 is a pulsed air flow
  • the exhaust port 115 uses a pulse pumping method to pump the gas in the cleaning device 11, and the pulses of the pulsed air flow are synchronized with the pulses of the pulsed pumping.
  • the interval is fixed. Adopting the pulse air method can enhance the ability to blow off the attachments.
  • the pulse air extraction method coordinated with the pulse air flow is used for air extraction, which can well maintain the air flow state in the housing 111 and ensure the inside of the lithography machine. Environmental stability.
  • the cleaning device 11 further includes an electrical detection component 116 and a gas adjustment component 117, wherein the gas adjustment component 117 is connected to the gas shower head 113; the electrical detection component 116 is used to detect attachments The electrical type of the gas; the gas adjusting module 117 is used to adjust the electrical type of the gas ejected by the gas shower head 113 is opposite to the electrical type of the attachment.
  • the gas adjustment module 117 adds a certain amount of negatively charged charged particles to the gas sprayed by the gas shower head 113. It neutralizes the electrical properties of the attachment, so that the attachment is not charged, and it is easier to blow off the attachment.
  • the exposure machine provided in another embodiment of the present application retains the technical effects of some of the foregoing embodiments, while detecting the electrical type of the attachment by setting the electrical detection component 116, and setting the gas adjustment module 117 adjusts the electrical type of the gas ejected by the gas shower head 113 is opposite to that of the attached matter. This effectively neutralizes the electrical properties of the charged attachments, making the attachments easier to blow off, and further improving the working efficiency of the exposure machine.
  • FIG. 7 Another embodiment of the present application relates to an exposure method, which is applied to the exposure machine provided in some of the above embodiments.
  • the specific steps are shown in FIG. 7 and include:
  • Step S101 Move the mask to the detection module.
  • Step S102 Detect the mask to determine whether there is an attachment on the surface of the mask, if yes, execute step S103, if not, execute step S104.
  • Step S103 cleaning the mask plate via the cleaning device.
  • Step S104 move the mask to the exposure module to perform an exposure operation.
  • this embodiment is a method embodiment corresponding to some of the foregoing device embodiments, and this embodiment can be implemented in cooperation with some of the foregoing embodiments.
  • the related technical details mentioned in the foregoing embodiments are still valid in the embodiments of this part, and the technical effects of the two are also the same. In order to reduce repetition, the details are not repeated here. Correspondingly, the related technical details mentioned in this embodiment can also be applied to some of the foregoing embodiments.
  • modules involved in some embodiments of this application are all logical modules.
  • a logical unit can be a physical unit, or a part of a physical unit, or more The combination of two physical units is realized.
  • the embodiments of this part do not introduce units that are not closely related to solving the technical problems proposed by the application, but this does not indicate that there are no other units in the embodiments of this part. .

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Abstract

一种曝光机及曝光方法，涉及半导体领域。曝光机包括：检测模块（10），检测模块（10）用于检测掩膜板表面是否存在附着物；清洁装置（11），清洁装置（11）用于对掩膜板表面的附着物进行清洁；曝光模块（20），曝光模块（20）用于对检测到不存在附着物的掩膜板进行曝光作业。曝光机及曝光方法具有提升曝光机工作效率的优点。

Description

曝光机及曝光方法
交叉引用
本申请要求于2020年03月13日递交的名称为“曝光机及曝光方法”、申请号为2020101766333的中国专利申请的优先权，其通过引用被全部并入本申请。
技术领域
本申请涉及半导体领域，特别涉及曝光机及曝光方法。
背景技术
在光刻技术中，曝光机一般包括光源和掩膜板。掩膜板是一种表面被各种图案覆盖的透明平板，每个图案都包含有不透明和透明的部分，用来阻挡和允许光线通过。光源通过掩膜板可将图案投射到涂有光刻胶的晶片上，从而消除透明部分的光刻胶而保留不透明部分的光刻胶，生成三维的浮雕图案，用以辅助在晶片上刻蚀电路图案。
在实际使用过程中，为了保证光刻图像的完整性和精准性，在使用掩膜板进行光刻前，通常需要对掩膜板的表面进行检测，判断是否存在附着物。因此，现有技术的曝光机中通常设置有检测模块，以避免掩膜板表面的附着物如灰尘、微粒等对光刻精准性和完整性的影响。
然而，现有技术的曝光机在检测到掩膜板表面存在附着物时，需要卸载掩膜板至曝光机外，并送入专门的清洁装置中进行清洁后再装载进曝光机中进行检测，导致曝光机的工作效率低下，与此同时现有方法中掩膜板的清洁效果还有待优化。
申请内容
本申请部分实施例的目的在于提供一种曝光机及曝光方法，提升曝光机的工作效率以及优化掩膜板的清洁效果。
为解决上述技术问题，本申请的部分实施例提供了一种曝光机，包括：检测模块，所述检测模块用于检测掩膜板表面是否存在附着物；清洁装置，所述清洁装置用于对所述掩膜板表面的所述附着物进行清洁；曝光模块，所述曝光模块用于对检测到不存在所述附着物的所述掩膜板进行曝光作业。
本申请的部分实施例还提供了一种曝光方法，应用于前述的曝光机，包括：移动掩膜板至检测模块；对所述掩膜板进行检测，判断所述掩膜板的表面是否存在附着物；若所述掩膜板的表面不存在附着物，移动所述掩膜板至曝光模块进行曝光作业；若所述掩膜板的表面存在附着物，经由所述清洁装置对所述掩膜板进行清洁、并再次对所述掩膜板的表面进行检测。
本申请部分实施例相对于现有技术而言，在曝光机内设置清洁装置，当检测模块检测到掩膜板表面存在附着物，有可能影响掩膜板进行光刻时，通过清洁装置对掩膜板表面进行清洁，从而有效的保证掩膜板进行光刻时的光刻效果。此外，由于清洁装置也设置在光刻机内，当检测到掩膜板表面存在附着物时，可以直接在曝光机内部对掩膜板进行清洁而无需卸载掩膜板，从而有效的提升曝光机的工作效率。
另外，所述清洁装置包括壳体和设置在所述壳体上的支撑架，所述支撑架上设置有用于对所述掩膜板进行清洁的气体喷头；所述气体喷头用于朝向所述掩膜板喷气以进行清洁。通过气体喷头喷气对掩膜板进行清洁，可以有效的减少清洁过程对曝光机内其它零部件的影响。
另外，所述清洁装置对所述掩膜板进行清洁时，所述气体喷头的喷气方向与所述掩膜板的夹角大于5°且小于85°。设置喷气方向与掩膜板的夹角大于5°且小于85°，可以更加有效的将附着物吹落，提升吹扫效率。
另外，所述夹角为45°。
另外，所述清洁装置还包括与所述气体喷头相连的气流控制装置，所述气流控制装置用于控制所述气体喷头所喷出的气流的流速。通过气流控制装置对气流的流速进行控制，可以有效的避免气流过大对掩膜板造成损坏、或气流过小导致无法有效的对掩膜板进行清洁。
另外，所述气体喷头的数量为多个，多个所述气体喷头相对设置在所述 支撑架上；所述清洁装置对所述掩膜板进行清洁时，多个所述气体喷头分别朝向所述掩膜板的两个相对的表面进行吹气。多个气体喷头分别朝向掩膜板的两个相对的表面进行吹气，从而更加有效的对掩膜板的表面进行清洁。
另外，所述气体喷头之间的间隔范围为0.5～10mm，所述气体喷头为圆柱状，所述圆柱状气体喷头的底面直径范围为0.5～15mm，所述圆柱状气体喷头的长度范围为0.5～20mm。如此设置的气体喷头能够在保证吹扫效果的前提下节约气体喷头的占用空间。
另外，每个所述气体喷头的喷气方向与所述掩膜板的夹角相同且位于15°～25°之间；所述喷气方向上的所述壳体侧面上设置有排气口。利用各个气体喷头采用大角度的同一方向吹扫，可以使得附着物更容易被吹走。
另外所述气体喷头所喷出的气流为脉冲气流，所述排气口采用脉冲抽气的方式对所述清洁装置内的气体抽气，所述脉冲气流的脉冲与所述脉冲抽气的脉冲同步或间隔固定时间。采用脉冲的冲气方式，可以增强吹除附着物的能力，同时采用与所述脉冲气流相协调的脉冲抽气方式进行抽气，能够很好的维持壳体内外的气流状态，保证光刻机内部的环境稳定性。
另外，所述清洁装置还包括电性检测组件和气体调节组件；所述电性检测模块用于检测所述附着物的电性种类；所述气体调节模块用于调节所述气体喷头所喷出的气体的电性种类与所述附着物的电性相反。通过气体调节模块调节喷出的气体的电性种类与附着物的电性相反，从而有效的中和附着物的电性，使得附着物更容易被吹落。
另外，所述气体的种类为清洁的空气或氮气。使用清洁的空气或氮气，可以有效的节约成本。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，除非有特别申明，附图中的图不构成比例限制。
图1是本申请一种实施例所提供的曝光机的结构示意图；
图2是掩膜板和本申请一种实施例所提供的曝光机中清洁装置的结构示 意图；
图3是掩膜板和本申请一种部分实施例所提供的曝光机中气体喷头的结构示意图；
图4是掩膜板和本申请又一种实施例所提供的曝光机中清洁装置的结构示意图；
图5是掩膜板和本申请还一种实施例所提供的曝光机中清洁装置的结构示意图；
图6是掩膜板和本申请再一种实施例所提供的曝光机中清洁装置的结构示意图；
图7是本申请另一种实施例所提供的曝光方法示意图。
具体实施例
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请的部分实施例进行详细的阐述。然而，本领域的普通技术人员可以理解，在本申请部分实施例中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以下部分实施例的种种变化和修改，也可以实现本申请所要求保护的技术方案。
本申请的一种实施例涉及一种曝光机，具体结构如图1所示，包括：检测模块10，清洁装置11和曝光模块20，检测模块10用于检测掩膜板表面是否存在附着物，清洁装置11用于在检测模块10检测到掩膜板上存在附着物时对掩膜板进行清洁，曝光模块20用于对检测到不存在附着物的掩膜板进行曝光作业。可选的，在本实施例中，清洁装置11设置在检测模块10内。可以理解的是，清洁装置11设置在检测模块10内仅为本实施例中的清洁装置11设置在曝光机内的一种具***置的举例说明，并不构成限定，在本申请的其它实施例中，清洁装置11也可以是设置在曝光机内的其它位置，具体可以根据实际需要进行灵活的设置。
与现有技术相比，本申请部分实施例所提供的曝光机中，在曝光机内集成设置清洁装置11，当检测模块10检测到掩膜板表面存在附着物时，直接通过清洁装置11即可完成对掩膜板表面的清洁处理，而无需卸载掩膜板至曝光机 外部，从而去除了重复的装载和卸载过程，有效的简化曝光作业过程，从而提升曝光机的工作效率。此外，掩膜板无需进行重复的装载和卸载过程，也避免了重复的装载和卸载过程中对掩膜板可能造成的损伤，提升了曝光机的可靠性。
在一些实施例中，如图2所示为清洁装置11对掩膜板100进行清洁时的结构示意图，可以理解的是，掩膜板100仅为本实施例中为了便于理解而绘制在图2中，其并不属于清洁装置11的一部分。其中，清洁装置11包括壳体111和设置在壳体111上的支撑架112，支撑架112上设置有用于对掩膜板100进行清洁的气体喷头113。气体喷头113用于朝向掩膜板100喷气以对掩膜板100进行清洁。通过设置气体喷头113对掩膜板进行喷气，原材料的成本较低。此外，喷气过程对曝光机内其它零部件的影响较小，从而有效的保证曝光机的正常工作不受影响。
在一些实施例中，如图3所示，清洁装置11对掩膜板100进行清洁时，气体喷头113的喷气方向与掩膜板100的夹角大于5°且小于85°。设置气体喷头113的喷气方向与掩膜板100的夹角大于5°且小于85°，可以使得喷气清扫的效率更高，附着物更容易被扫落，从而有效的提升清洁装置11的清洁效率和清洁效果。可以理解的是，前述气体喷头113的喷气方向与掩膜板100的夹角大于5°且小于85°仅为本实施例中的一种较优的举例说明，并不构成限定，在本申请的其它实施例中，也可以是大于85°或小于5°，在此不进行一一列举，具体可以根据实际需要进行灵活的设置。
在一些实施例中，在本实施例中，气体喷头113的喷气方向与掩膜板100的夹角为45°。可以理解的是，气体喷头113的喷气方向与掩膜板100的夹角为45°时，可以达到较好的清洁效果，而并不构成限定。
进一步的，在本实施例中，气体喷头113的数量为多个，多个气体喷头113相对设置在支撑架112上；清洁装置11对掩膜板100进行清洁时，多个气体喷头113分别朝向掩膜板100的两个相对的表面进行吹气。通过设置多个气体喷头113，且多个气体喷头113分别朝向掩膜板100的两个相对的表面进行吹气，可以更全面的对掩膜板100的表面进行清洁的同时、有效的提升清洁速度，进一步提升曝光机的可靠性和工作效率。
在一些实施例中，所述气体喷头113之间的间隔范围为0.5～10mm，所述 气体喷头为圆柱状，气体喷头113为圆柱状，圆柱状气体喷头113的底面直径范围为0.5～15mm，圆柱状气体喷头113的长度范围为0.5～20mm。如此设置的气体喷头113能够在保证吹扫效果的前提下节约气体喷头113的占用空间。
在一些实施例中，气体喷头113中吹出的气体为洁净的空气或氮气。使用洁净的空气或氮气，其性质较为稳定，不会对曝光机和掩膜板造成损坏。此外，洁净的空气和氮气的成本较低，从而有效的解决成本。
本申请的又一种实施例涉及一种曝光机。在本实施例中，如图4所示，清洁装置11还包括气流控制装置114，气流控制装置114用于控制气体喷头113所喷出气流的流速。
与现有技术相比，本申请又一种实施例所提供的曝光机中，在清洁装置11内进一步的设置了与气体喷头113相连的气流控制装置114，通过气流控制装置114控制气体喷头113所喷出气流的流速，从而防止气流过大导致损坏掩膜板或是气流过小导致掩膜板无法有效的清洁。进一步的提升曝光机的可靠性和工作效率。
本申请的还一种实施例涉及一种曝光机。在本实施例中，如图5所示，每个气体喷头113的喷气方向与掩膜板110的夹角相同且位于15°～25°之间；所述喷气方向上的壳体111侧面上设置有排气口115。在一些实施例中，可在与气体喷头113相对的壳体侧面上设置若干个排气口115，所述排气口的分布可根据气体喷头113的喷气方向与掩膜板的夹角进行调整，以使得气体喷头113喷出的气体经掩膜板110反弹后恰好对准排气口115。在一些实施例中，所述夹角为20°，所述排气口115之间的间距为50mm。
与现有技术相比，本申请还一种实施例所提供的曝光机在保留前述部分实施例的技术效果的同时，利用各个气体喷头采用小角度的同一方向吹扫，同时在喷气方向上的壳体侧面上对应的设置排气口，不仅可以使得附着物更容易被吹走，同时也可以使吹扫的气流更有效经济的排出去，从而保证曝光机内外的气压平衡，防止气压过高对曝光机造成损害，提升曝光机的安全性。
在一些实施例中，气体喷头113所喷出的气流为脉冲气流，排气口115采用脉冲抽气的方式对清洁装置11内的气体抽气，脉冲气流的脉冲与脉冲抽气的脉冲同步或间隔固定时间。采用脉冲的冲气方式，可以增强吹除附着物的能 力，同时采用与脉冲气流相协调的脉冲抽气方式进行抽气，能够很好的维持壳体111内的气流状态，保证光刻机内部的环境稳定性。
本申请的再一种实施例涉及一种曝光机。在本实施例中，如图6所示，清洁装置11还包括电性检测组件116和气体调节组件117，其中，气体调节组件117与气体喷头113连接；电性检测组件116用于检测附着物的电性种类；气体调节模块117用于调节气体喷头113所喷出的气体的电性种类与附着物的电性相反。
例如，在本实施例中，当电性检测组件116检测到附着物电性种类为正电荷时，气体调节模块117向气体喷头113喷出的气体中加入一定量的带负电荷的带电粒子。以中和附着物的电性，使得附着物不带电，更便于吹落附着物。
与现有技术相比，本申请还一种实施例所提供的曝光机在保留前述部分实施例的技术效果的同时，通过设置电性检测组件116检测到附着物电性种类，设置气体调节模块117调节气体喷头113所喷出的气体的电性种类与附着物的电性相反。从而有效的对带电的附着物的电性进行中和，使得附着物更容易被吹落，进一步提升曝光机的工作效率。
本申请另一种实施例涉及一种曝光方法，应用于上述部分实施例所提供的曝光机，具体步骤如图7所示，包括：
步骤S101：移动掩膜板至检测模块。
步骤S102：对掩膜板进行检测，判断掩膜板的表面是否存在附着物，若是，执行步骤S103，若否，执行步骤S104。
步骤S103：经由所述清洁装置对所述掩膜板进行清洁。
步骤S104：移动掩膜板至曝光模块进行曝光作业。
不难发现，本实施例为与前述装置部分实施例相对应的方法实施例，本实施例可与前述部分实施例互相配合实施。前述实施例中提到的相关技术细节在本部分实施例中依然有效，两者的技术效果也相同，为了减少重复，这里不再赘述。相应地，本实施例中提到的相关技术细节也可应用在前述部分实施例中。
上面各种方法的步骤划分，只是为了描述清楚，实现时可以合并为一个 步骤或者对某些步骤进行拆分，分解为多个步骤，只要包含相同的逻辑关系，都在本专利的保护范围内；对算法中或者流程中添加无关紧要的修改或者引入无关紧要的设计，但不改变其算法和流程的核心设计都在该专利的保护范围内。
值得一提的是，本申请部分实施例中所涉及到的各模块均为逻辑模块，在实际应用中，一个逻辑单元可以是一个物理单元，也可以是一个物理单元的一部分，还可以以多个物理单元的组合实现。此外，为了突出本申请的创新部分，本部分实施例中并没有将与解决本申请所提出的技术问题关系不太密切的单元引入，但这并不表明本部分实施例中不存在其它的单元。
本领域的普通技术人员可以理解，上述各部分实施例是实现本申请的具体实施例，而在实际应用中，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。

Claims (12)

  1. 一种曝光机，包括：
    检测模块，所述检测模块用于检测掩膜板表面是否存在附着物；
    清洁装置，所述清洁装置用于对所述掩膜板表面的所述附着物进行清洁；
    曝光模块，所述曝光模块用于对检测到不存在所述附着物的所述掩膜板进行曝光作业。
  2. 根据权利要求1所述的曝光机，其中，所述清洁装置包括壳体和设置在所述壳体上的支撑架，所述支撑架上设置有用于对所述掩膜板进行清洁的气体喷头；
    所述气体喷头用于朝向所述掩膜板喷气以进行清洁。
  3. 根据权利要求2所述的曝光机，其中，所述清洁装置对所述掩膜板进行清洁时，所述气体喷头的喷气方向与所述掩膜板的夹角大于5°且小于85°。
  4. 根据权利要求3所述的曝光机，其中，所述夹角为45°。
  5. 根据权利要求2所述的曝光机，其中，所述清洁装置还包括与所述气体喷头相连的气流控制装置，所述气流控制装置用于控制所述气体喷头所喷出的气流的流速。
  6. 根据权利要求2所述的曝光机，其中，所述气体喷头的数量为多个，多个所述气体喷头相对设置在所述支撑架上；
    所述清洁装置对所述掩膜板进行清洁时，多个所述气体喷头分别朝向所述掩膜板的两个相对的表面进行吹气。
  7. 根据权利要求6所述的曝光机，其中，所述气体喷头之间的间隔范围为0.5～10mm，所述气体喷头为圆柱状，所述圆柱状气体喷头的底面直径范围为0.5～15mm，所述圆柱状气体喷头的长度范围为0.5～20mm。
  8. 根据权利要求6所述的曝光机，其中，每个所述气体喷头的喷气方向与所述掩膜板的夹角相同且位于15～25°之间；所述喷气方向上的所述壳体侧面上设置有排气口。
  9. 根据权利要求8所述的曝光机，其中，所述气体喷头所喷出的气流为脉冲气流，所述排气口采用脉冲抽气的方式对所述清洁装置内的气体抽气，所述脉冲气流的脉冲与所述脉冲抽气的脉冲同步或间隔固定时间。
  10. 根据权利要求2所述的曝光机，其中，所述清洁装置还包括电性检测组件和气体调节组件；
    所述电性检测组件用于检测所述附着物的电性种类；
    所述气体调节模块用于调节所述气体喷头所喷出的气体的电性种类与所述附着物的电性相反。
  11. 根据权利要求2所述的曝光机，其中，所述气体的种类为清洁的空气或氮气。
  12. 一种曝光方法，应用于权利要求1至11中任一项所述的曝光机，包括：
    移动掩膜板至检测模块；
    对所述掩膜板进行检测，判断所述掩膜板的表面是否存在附着物；
    若所述掩膜板的表面不存在附着物，移动所述掩膜板至曝光模块进行曝光作业；
    若所述掩膜板的表面存在附着物，经由所述清洁装置对所述掩膜板进行清洁、并再次对所述掩膜板的表面进行检测。
PCT/CN2021/080070 2020-03-13 2021-03-10 曝光机及曝光方法 WO2021180140A1 (zh)

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