WO2020118747A1 - 柔性显示面板及其制作方法 - Google Patents
柔性显示面板及其制作方法 Download PDFInfo
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- WO2020118747A1 WO2020118747A1 PCT/CN2018/122192 CN2018122192W WO2020118747A1 WO 2020118747 A1 WO2020118747 A1 WO 2020118747A1 CN 2018122192 W CN2018122192 W CN 2018122192W WO 2020118747 A1 WO2020118747 A1 WO 2020118747A1
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- Prior art keywords
- flexible substrate
- flexible
- polymer solution
- layer
- display panel
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 133
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000011737 fluorine Substances 0.000 claims abstract description 44
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 44
- -1 aromatic organic compound Chemical class 0.000 claims abstract description 42
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229920000642 polymer Polymers 0.000 claims description 53
- 238000010521 absorption reaction Methods 0.000 claims description 43
- 239000011521 glass Substances 0.000 claims description 30
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 21
- 229940124543 ultraviolet light absorber Drugs 0.000 claims description 19
- 125000000524 functional group Chemical group 0.000 claims description 14
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical group OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 abstract description 113
- 230000008569 process Effects 0.000 abstract description 36
- 239000002346 layers by function Substances 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 10
- 230000031700 light absorption Effects 0.000 abstract description 8
- 238000010000 carbonizing Methods 0.000 abstract description 5
- 230000002745 absorbent Effects 0.000 abstract 2
- 239000002250 absorbent Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 44
- 125000001153 fluoro group Chemical group F* 0.000 description 8
- 239000000047 product Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/865—Intermediate layers comprising a mixture of materials of the adjoining active layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to the field of display technology, in particular to a flexible display panel and a manufacturing method thereof.
- OLED Organic Light Emitting Diode
- OLED display technology is different from traditional liquid crystal display technology. It does not require a backlight, and uses a very thin organic material coating and glass substrate. When a current passes, these organic materials will emit light. However, because organic materials are easy to react with water vapor or oxygen, as a display device based on organic materials, OLED display screens have very high requirements for packaging. Therefore, the sealing of the OLED device is improved by the packaging of the OLED device, as much as possible with the external environment Isolation is essential for the stable light emission of OLED devices.
- Flexible OLED display adopts flexible substrate (Flexible Substrate) flexible display devices, usually using flexible polyimide (Polyimide, PI) substrate. After completing all processes on the glass substrate, the OLED display panel starts to enter the LLO section.
- the specific principle is to irradiate the bottom glass substrate with laser to carbonize the flexible PI substrate bonded to the glass substrate and weaken the role between the glass and the flexible PI substrate To achieve the purpose of peeling off the flexible OLED display panel from the glass substrate.
- the laser wavelength commonly used in the LLO process is 308 nm, which belongs to ultraviolet light.
- a large yield loss is likely to occur after the LLO process.
- the main reasons are as follows: 1. There is a foreign object between the glass substrate and the flexible PI substrate, or the glass substrate itself has defects, resulting in localization after laser irradiation There is still a strong force between the flexible PI substrate and the glass substrate, which cannot be peeled off normally. 2.
- the flexible PI substrate itself has defects, and the ultraviolet laser easily penetrates the flexible PI substrate, causing part of the laser energy to penetrate to the upper film layer, which affects the OLED structure and thin film transistor (Thin Film Transistor (TFT) structure causes damage.
- TFT Thin Film Transistor
- an existing solution is used to prevent the ultraviolet light from damaging the superstructure by doping the flexible substrate with a flexible substrate.
- the general ultraviolet absorber itself is unstable, and it is easy to decompose under the action of ultraviolet light to produce a series of by-products. Introducing such compounds directly into PI may cause many unexpected consequences. Therefore, in flexible substrates The introduction of a stable ultraviolet light absorber is extremely important for improving the yield of the LLO process.
- An object of the present invention is to provide a flexible display panel, which can prevent excess laser energy in the LLO process from further carbonizing the upper display function layer, thereby effectively improving the LLO process yield of the flexible display panel.
- An object of the present invention is to provide a method for manufacturing a flexible display panel, which can prevent excess laser energy in the LLO process from further carbonizing the upper display function layer, thereby effectively improving the LLO process yield of the flexible display panel.
- the present invention provides a flexible display panel, including a flexible substrate, one or more laser absorption layers provided in the flexible substrate, and a display function layer provided on the flexible substrate;
- the laser absorption layer contains a fluorine-containing aromatic organic compound used as an ultraviolet light absorber.
- the manufacturing material of the flexible substrate is a first polymer solution
- the manufacturing material of the laser absorption layer is a second polymer solution.
- the second polymer solution includes a first polymer solution and an aromatic organic compound mixed in the first polymer solution.
- the fluorine-containing aromatic organic compound includes 2,4-dihydroxybenzophenone substituted with fluorine-containing functional groups.
- the molecular structure of the fluorine-containing aromatic organic compound contains trifluoromethyl.
- the flexible substrate is a polyimide substrate
- the display function layer includes a TFT layer, an OLED layer, and a thin-film encapsulation layer that are sequentially stacked on the flexible substrate.
- the invention also provides a method for manufacturing a flexible display panel, including the following steps:
- Step S1 providing a glass substrate, a first polymer solution and a second polymer solution, coating a layer of the first polymer solution on the glass substrate, and then alternately coating the second polymer solution and the first polymer at least once After the solution is baked and cured, a flexible substrate is formed from the first polymer solution, and one or more laser absorption layers in the flexible substrate are formed from the second polymer solution;
- the laser absorption layer contains a fluorine-containing aromatic organic compound used as an ultraviolet light absorber
- Step S2 forming a display function layer on the flexible substrate
- Step S3 Using a laser to scan the glass substrate side of the flexible substrate to separate the flexible substrate from the glass substrate, and peeling off the flexible substrate from the glass substrate.
- the second polymer solution provided in the step S1 includes a first polymer solution and an aromatic organic compound mixed in the first polymer solution.
- the fluorine-containing aromatic organic compound includes 2,4-dihydroxybenzophenone substituted with fluorine-containing functional groups.
- the molecular structure of the fluorine-containing aromatic organic compound contains trifluoromethyl.
- the flexible substrate formed in the step S1 is a polyimide substrate
- the display function layer formed in the step S2 includes a TFT layer, an OLED layer and a thin film encapsulation layer stacked on the flexible substrate in sequence;
- the wavelength of the laser used in step S3 is 308 nm.
- a flexible display panel provided by the present invention includes a flexible substrate, one or more laser absorption layers provided in the flexible substrate, and a display function layer provided on the flexible substrate, the laser absorption layer Contains a fluorine-containing aromatic organic compound used as an ultraviolet light absorber.
- the ultraviolet light absorber of the fluorine-containing aromatic organic compound has an extremely strong ultraviolet light absorption capability, and has stable chemical properties, and can be stably present in a flexible substrate, thereby enabling the
- the extra laser energy absorption in the LLO process prevents the extra laser energy in the LLO process from further carbonizing the display function layer on the flexible substrate, thereby effectively improving the LLO process yield of the flexible display panel and greatly improving the product yield.
- the present invention provides a method for manufacturing a flexible display panel, by providing a laser absorption layer containing an ultraviolet light absorber in a flexible substrate, the ultraviolet light absorber is a fluorine-containing aromatic organic compound, which has a very strong ultraviolet light absorption capacity, And the chemical properties are stable and can be stably present in the flexible substrate, so it can absorb the excess laser energy in the LLO process, preventing the excess laser energy in the LLO process from further carbonizing the display function layer on the flexible substrate, thereby effectively improving the flexible display panel
- the LLO process yield greatly improves the product yield.
- FIG. 1 is a schematic structural diagram of a flexible display panel of the present invention
- Figure 2 is the ultraviolet absorption spectrum of 2,4-dihydroxybenzophenone and 2,4-dihydroxybenzophenone substituted by fluorine-containing functional groups;
- FIG. 3 is a schematic structural view of a laser absorption layer provided in the flexible substrate of the flexible display panel of the present invention.
- FIG. 4 is a schematic structural view of two flexible laser absorption layers in a flexible substrate of a flexible display panel of the present invention
- FIG. 5 is a schematic structural view of a three-layer laser absorption layer in a flexible substrate of a flexible display panel of the present invention.
- FIG. 6 is a schematic flowchart of a method for manufacturing a flexible display panel of the present invention.
- step S1 of the method for manufacturing a flexible display panel of the present invention is a schematic diagram of step S1 of the method for manufacturing a flexible display panel of the present invention.
- step S2 is a schematic diagram of step S2 of the method for manufacturing a flexible display panel of the present invention.
- 9-10 are schematic diagrams of step S3 of the method for manufacturing a flexible display panel of the present invention.
- the present invention first provides a flexible display panel, including a flexible substrate 10 , One or more layers on the flexible substrate 10 Laser absorption layer 35 And on flexible substrate 10 Display function layer 20 ;
- the laser absorption layer 35 Contains fluorine-containing aromatic organic compounds used as ultraviolet light absorbers.
- the general ultraviolet absorber itself is unstable in chemical nature, and is easily decomposed under the action of ultraviolet light to produce a series of by-products, and directly introduces such compounds into the flexible substrate 10 In China, it is likely to cause many unexpected consequences.
- fluorine-containing functional groups into common UV absorbers, the stability of the absorber can be excellently increased, and among many fluorine-containing UV absorbers, fluorine-containing aromatic organic compounds are more stable, such as Fluorinated functional group substituted 2,4- Dihydroxybenzophenone, etc.
- UV-0 2,4- Dihydroxybenzophenone is denoted as UV-0
- UV-F 2,4- Dihydroxybenzophenone is denoted as UV-F
- UV absorption spectra of the two shown at different concentrations can be found in commonly used UV absorbers UV-0 After introducing fluorine atoms into it, its ultraviolet absorption performance has been greatly improved, and it has extremely strong ultraviolet light absorption capacity.
- the flexible substrate 10 The production material is the first polymer solution.
- the flexible substrate 10 It is a polyimide substrate, and the first polymer solution is a polyimide solution.
- the manufacturing material is a second polymer solution
- the second polymer solution includes a first polymer solution and an aromatic organic compound mixed in the first polymer solution.
- the second polymer solution may be obtained by doping a small molecule of a fluorine-containing aromatic organic compound into the first polymer solution, or by modifying a polyimide to introduce a fluorine-containing aromatic functional group into its chemical structure A macromolecular aromatic organic compound, and then a second polymer solution is obtained from the macromolecular aromatic organic compound, thereby forming a laser absorption layer 35 .
- the fluorine-containing functional group in the fluorine-containing aromatic organic compound includes trifluoromethyl and the like.
- the fluorine-containing aromatic organic compound includes a fluorine-substituted functional group substituted 2,4- Dihydroxybenzophenone.
- the display function layer 20 Including sequentially stacked on the flexible substrate 10 Up TFT Floor twenty one , OLED Floor twenty two And film encapsulation twenty three .
- the flexible substrate 10 One layer, two layers, three layers or more laser absorption layers can be set inside 35 ,
- the laser absorption layer 35 Set on flexible substrate 10 Of the display function layer 20 Within the area of the flexible substrate 10
- Inner laser absorption layer 35 Closest to the display function layer 20 Flexible substrate on one side 10 Is thicker than the laser absorption layer 35 Farthest from display function layer 20 Flexible substrate on one side 10 thickness of.
- the TFT Floor twenty one Used for the OLED Floor twenty two Row drive including multiple arrays TFT Device
- the TFT The device is low temperature polysilicon ( Low Temperature Poly-silicon , LTPS ) Type, or metal oxide semiconductor ( Metal-Oxide Semiconductor , MOS ) Type, such as indium gallium zinc oxide (IGZO ) Of metal oxide semiconductor type.
- the OLED Floor twenty two Including set in the TFT Floor twenty one
- the first electrode layer on the TFT Floor twenty one And a pixel definition layer on the first electrode layer, an organic functional layer provided on the first electrode layer, and a second electrode layer (not shown) provided on the pixel definition layer and the organic functional layer.
- the pixel definition layer surrounds a plurality of pixel openings arranged in an array on the first electrode layer; the organic functional layer is disposed in the pixel opening; the organic functional layer in each pixel opening, the corresponding An electrode layer and the corresponding second electrode layer above constitute a OLED Device.
- the first electrode layer and the second electrode layer are used as OLED
- the organic functional layer includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer that are sequentially arranged from bottom to top.
- the thin film encapsulation layer twenty three It includes an inorganic barrier layer and an organic buffer layer (not shown) that are stacked.
- the flexible display panel and flexible substrate of the present invention 10 With one or more laser absorption layers inside 35 ,
- the laser absorption layer 35 Contains a fluorine-containing aromatic organic compound used as an ultraviolet absorber Stable on flexible substrate 10 In order to be able to place LLO Excessive laser energy absorption in the process to prevent LLO The excess laser energy in the process further carbonizes the flexible substrate 10 Display function layer 20 To effectively improve the flexible display panel’s LLO Process yield, greatly improve product yield.
- the present invention also provides a method for manufacturing a flexible display panel, which includes the following steps:
- step S1 As shown 7 As shown, a glass substrate is provided 50 , The first polymer solution and the second polymer solution on the glass substrate 50 A layer of first polymer solution is coated thereon, and then the second polymer solution and the first polymer solution are alternately coated at least once. After baking and curing, a flexible substrate is formed from the first polymer solution 10 , One or more layers are formed on the flexible substrate by the second polymer solution 10 Laser absorption layer 35 .
- the laser absorption layer 35 Contains a fluorine-containing aromatic organic compound used as an ultraviolet light absorber. Compared with a general ultraviolet light absorber, the ultraviolet light absorber of the fluorine-containing aromatic organic compound has an extremely strong ultraviolet light absorption capacity, and has stable chemical properties. Stable on flexible substrate 10 in.
- the second polymer solution provided in includes a first polymer solution and an aromatic organic compound mixed in the first polymer solution.
- the flexible substrate 10 It is a polyimide substrate, and the first polymer solution is a polyimide solution.
- the second polymer solution may be obtained by doping small molecules of a fluorine-containing aromatic organic compound into the first polymer solution; or, by modifying the polyimide to introduce fluorine-containing aromatic into its chemical structure Functional group to obtain a macromolecular aromatic organic compound, and then obtain a second polymer solution from the macromolecular aromatic organic compound to form a laser absorption layer 35 .
- the fluorine-containing functional group in the fluorine-containing aromatic organic compound includes trifluoromethyl and the like.
- the fluorine-containing aromatic organic compound includes a fluorine-substituted functional group substituted 2,4- Dihydroxybenzophenone.
- the flexible substrate 10 One layer, two layers, three layers or more laser absorption layers can be set inside 35 ,
- the laser absorption layer 35 Set on flexible substrate 10 Relatively close to the glass substrate 50 Within the area of the flexible substrate 10 Inner laser absorption layer 35 Closest to the glass substrate 50 Flexible substrate on one side 10
- the thickness is less than the laser absorption layer 35 Farthest from the glass substrate 50 Flexible substrate on one side 10 thickness of.
- step S2 As shown 8 As shown in the flexible substrate 10 Display function layer 20 .
- steps S2 Display function layer 20 Including sequentially stacked on the flexible substrate 10 Up TFT Floor twenty one , OLED Floor twenty two And film encapsulation twenty three .
- the steps S2 Formed in TFT Floor twenty one Used for the OLED Floor twenty two Row drive, including multiple arrays TFT Device, the TFT The device is a low-temperature polysilicon type or a metal oxide semiconductor type, such as a metal oxide semiconductor type of indium gallium zinc oxide.
- the OLED Floor twenty two Including set in the TFT Floor twenty one
- the first electrode layer on the TFT Floor twenty one And a pixel definition layer on the first electrode layer, an organic functional layer provided on the first electrode layer, and a second electrode layer (not shown) provided on the pixel definition layer and the organic functional layer.
- the pixel definition layer surrounds a plurality of pixel openings arranged in an array on the first electrode layer; the organic functional layer is disposed in the pixel opening; the organic functional layer in each pixel opening, the corresponding An electrode layer and the corresponding second electrode layer above constitute a OLED Device.
- the first electrode layer and the second electrode layer are used as OLED
- the anode and the cathode of the device; the organic functional layer includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer arranged in this order from bottom to top.
- the thin film encapsulation layer twenty three It includes an inorganic barrier layer and an organic buffer layer (not shown) that are stacked.
- step S3 As shown 9-10 As shown, the laser is applied to the flexible substrate 10 Glass substrate 50 Scan one side to make the flexible substrate 10 With glass substrate 50 Separate the flexible substrate 10 From glass substrate 50 Peel off.
- the wavelength of the laser used in is 308nm .
- the manufacturing method of the flexible display panel of the present invention 10 Laser absorption layer containing ultraviolet light absorber 35 ,
- the ultraviolet light absorber is a fluorine-containing aromatic organic compound, has a very strong ultraviolet light absorption capacity, and the chemical properties are stable, can be stably present in the flexible substrate 10 Medium, so that LLO Excessive laser energy absorption in the process to prevent LLO The excess laser energy in the process further carbonizes the flexible substrate 10 Display function layer 20 To effectively improve the flexible display panel’s LLO Process yield, greatly improve product yield.
- a flexible display panel provided by the present invention includes a flexible substrate, one or more laser absorption layers provided in the flexible substrate, and a display function layer provided on the flexible substrate.
- the laser absorption layer includes Fluorine-containing aromatic organic compound used as an ultraviolet light absorber.
- the fluorine-containing aromatic organic compound's ultraviolet light absorber has extremely strong ultraviolet light absorption capacity, and has stable chemical properties, which can be stably present in a flexible substrate, thereby enabling the LLO Excessive laser energy absorption in the process to prevent LLO The excess laser energy in the process further carbonizes the display function layer on the flexible substrate, thereby effectively enhancing the flexible display panel LLO Process yield, greatly improve product yield.
- the present invention provides a method for manufacturing a flexible display panel, by providing a laser absorption layer containing an ultraviolet light absorber in a flexible substrate, the ultraviolet light absorber is a fluorine-containing aromatic organic compound, which has a very strong ultraviolet light absorption capacity, And the chemical properties are stable, it can be stable in the flexible substrate, so it can LLO Excessive laser energy absorption in the process to prevent LLO The excess laser energy in the process further carbonizes the display function layer on the flexible substrate, thereby effectively enhancing the flexible display panel LLO Process yield, greatly improve product yield.
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Abstract
本发明提供一种柔性显示面板及其制作方法。本发明的柔性显示面板包括柔性基板、一层或多层设于柔性基板中的激光吸收层及设于柔性基板上的显示功能层,所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物,该含氟芳香有机化合物的紫外光吸收剂具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板中,从而能够将LLO工艺中多余的激光能量吸收,防止LLO制程中多余的激光能量进一步碳化柔性基板上的显示功能层,进而有效提升柔性显示面板的LLO工艺良率,大幅度改善产品良率。
Description
本发明涉及显示技术领域,尤其涉及一种柔性显示面板及其制作方法。
有机发光二极管 ( Organic Light Emitting Diode,OLED ) 显示器具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽、可实现柔性显示与大面积全色显示等诸多优点,被业界公认为是最有发展潜力的显示装置。
OLED显示技术与传统的液晶显示技术不同,无需背光灯,采用非常薄的有机材料涂层和玻璃基板,当有电流通过时,这些有机材料就会发光。但是由于有机材料易与水汽或氧气反应,作为基于有机材料的显示设备,OLED显示屏对封装的要求非常高,因此,通过OLED器件的封装提高OLED器件内部的密封性,尽可能的与外部环境隔离,对于OLED器件的稳定发光至关重要。
对于OLED器件来说,最具竞争力的优势是能做成柔性器件,这将给器件相关的电子行业带来巨大的改革变化。为了得到柔性OLED器件,首先需要利用柔性基底取代传统的刚性玻璃基底,但从实际操作性考虑,目前行业内首先选择将柔性基底做在刚性玻璃基板表面,待完成所有工艺制程后,再通过激光剥离(Laser
Lift Off,LLO)制程将柔性基底从玻璃基板表面剥离,从而实现制备柔性OLED器件的目的。通过上述描述可以发现,LLO工艺是柔性OLED器件生产中的关键工艺,如何有效地提升该工艺的良率极为关键。
柔性OLED显示器是采用柔性基板(Flexible
Substrate)制成的可弯曲显示设备,通常采用柔性聚酰亚胺(Polyimide ,PI)基板。OLED显示面板在玻璃基板上完成所有工艺后,开始进入LLO工段,其具体原理是通过激光照射底部玻璃基板,让与玻璃基板贴合的柔性PI基板碳化,弱化玻璃与柔性PI基板之间的作用力,从而到达将柔性OLED显示面板从玻璃基板上剥离下来的目的。
LLO工艺过程中常用的激光波长为308nm,属于紫外光。但是在实际的剥离工艺中,LLO制程过后容易出现较大的良率损失,主要原因大致如下:1、玻璃基板与柔性PI基板之间存在异物,或者玻璃基板自身存在缺陷,导致激光照射后局部柔性PI基板与玻璃基板之间仍然存在较强的作用力,不能正常剥离。2、柔性PI基板自身存在缺陷,紫外激光很容易透过柔性PI基板,导致部分区域激光能量穿透至上层膜层,对OLED结构及薄膜晶体管(Thin
Film Transistor,TFT)结构造成损伤,因以上存在的不可避免的因素总会给LLO工艺带来极大挑战,严重影响该工艺的良率。
为了解决以上问题,现有一种方案通过将具有紫外吸收能力的材料掺杂于柔性基板中,用来防范多余紫外光对上层结构可能造成的灼伤。然而一般的紫外光吸收剂本身不稳定,在紫外光作用下容易分解而产生一系列副产物,直接引入该类化合物到PI中,极可能会引发很多意想不到的后果,因此,在柔性基板中引入稳定的紫外光吸收剂对提升LLO工艺良率极为重要。
本发明的目的在于提供一种柔性显示面板,能够防止LLO制程中多余的激光能量进一步碳化上层的显示功能层,从而有效提升柔性显示面板的LLO工艺良率。
本发明的目的在于提供一种柔性显示面板的制作方法,能够防止LLO制程中多余的激光能量进一步碳化上层的显示功能层,从而有效提升柔性显示面板的LLO工艺良率。
为实现上述目的,本发明提供一种柔性显示面板,包括柔性基板、一层或多层设于柔性基板中的激光吸收层及设于柔性基板上的显示功能层;
所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物。
所述柔性基板的制作材料为第一聚合物溶液;
所述激光吸收层的制作材料为第二聚合物溶液,所述第二聚合物溶液包括第一聚合物溶液及混合于第一聚合物溶液中的芳香有机化合物。
所述含氟芳香有机化合物包括经含氟官能团取代的2,4-二羟基二苯甲酮。
所述含氟芳香有机化合物的分子结构中包含三氟甲基。
所述柔性基板为聚酰亚胺基板;
所述显示功能层包括依次层叠设于所述柔性基板上的TFT层、OLED层及薄膜封装层。
本发明还提供一种柔性显示面板的制作方法,包括如下步骤:
步骤S1、提供玻璃基板、第一聚合物溶液及第二聚合物溶液,在玻璃基板上涂布一层第一聚合物溶液,然后至少一次地交替涂布第二聚合物溶液和第一聚合物溶液,经烘烤固化后,由第一聚合物溶液形成柔性基板,由第二聚合物溶液形成一层或多层位于柔性基板中的激光吸收层;
所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物;
步骤S2、在所述柔性基板上形成显示功能层;
步骤S3、采用激光对柔性基板的玻璃基板一侧进行扫描,使所述柔性基板与玻璃基板分离,将所述柔性基板从玻璃基板上剥离下来。
所述步骤S1中提供的所述第二聚合物溶液包括第一聚合物溶液及混合于第一聚合物溶液中的芳香有机化合物。
所述含氟芳香有机化合物包括经含氟官能团取代的2,4-二羟基二苯甲酮。
所述含氟芳香有机化合物的分子结构中包含三氟甲基。
所述步骤S1中所形成的柔性基板为聚酰亚胺基板;
所述步骤S2中所形成的显示功能层包括依次层叠设于所述柔性基板上的TFT层、OLED层及薄膜封装层;
所述步骤S3中所采用的激光的波长为308nm。
本发明的有益效果:本发明提供的一种柔性显示面板,包括柔性基板、一层或多层设于柔性基板中的激光吸收层及设于柔性基板上的显示功能层,所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物,该含氟芳香有机化合物的紫外光吸收剂具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板中,从而能够将LLO工艺中多余的激光能量吸收,防止LLO制程中多余的激光能量进一步碳化柔性基板上的显示功能层,进而有效提升柔性显示面板的LLO工艺良率,大幅度改善产品良率。本发明提供的一种柔性显示面板的制作方法,通过在柔性基板中设置含有紫外光吸收剂的激光吸收层,该紫外光吸收剂为含氟芳香有机化合物,具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板中,因此能够将LLO工艺中多余的激光能量吸收,防止LLO制程中多余的激光能量进一步碳化柔性基板上的显示功能层,进而有效提升柔性显示面板的LLO工艺良率,大幅度改善产品良率。
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其它有益效果显而易见。
附图中,
图1为本发明柔性显示面板的结构示意图;
图2为2,4-二羟基二苯甲酮和经含氟官能团取代的2,4-二羟基二苯甲酮的紫外吸收光谱图;
图3为本发明柔性显示面板的柔性基板中设有一层激光吸收层的结构示意图;
图4为本发明柔性显示面板的柔性基板中设有两层激光吸收层的结构示意图;
图5为本发明柔性显示面板的柔性基板中设有三层激光吸收层的结构示意图;
图6为本发明柔性显示面板的制作方法的流程示意图;
图7为本发明柔性显示面板的制作方法的步骤S1的示意图;
图8为本发明柔性显示面板的制作方法的步骤S2的示意图;
图9-10为本发明柔性显示面板的制作方法的步骤S3的示意图。
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图
1
,本发明首先提供一种柔性显示面板,包括柔性基板
10
、一层或多层设于柔性基板
10
中的激光吸收层
35
及设于柔性基板
10
上的显示功能层
20
;
所述激光吸收层
35
包含用作紫外光吸收剂的含氟芳香有机化合物。
需要说明的是,一般的紫外吸收剂本身化学性质不稳定,在紫外光作用下容易分解而产生一系列副产物,直接引入该类化合物到柔性基板
10
中,极可能会引发很多意想不到的后果。而通过向常见紫外吸收剂中引入含氟官能团后,可以极好地增加该吸收剂的稳定性,且在众多的含氟紫外吸收剂中,含氟的芳香类有机化合物更为稳定,如经含氟官能团取代的
2,4-
二羟基二苯甲酮等。将
2,4-
二羟基二苯甲酮记为
UV-0
,将经含氟官能团取代的
2,4-
二羟基二苯甲酮记为
UV-F
,通过图
2
所示的两者不同浓度下的紫外吸收光谱可以发现,在常用紫外吸收剂
UV-0
中引入氟原子后,其紫外吸收性能获得极大地提升,具有极强的紫外光吸收能力。
具体地,所述柔性基板
10
的制作材料为第一聚合物溶液。本实施例中,所述柔性基板
10
为聚酰亚胺基板,所述第一聚合物溶液为聚酰亚胺溶液。
具体地,所述激光吸收层
35
的制作材料为第二聚合物溶液,所述第二聚合物溶液包括第一聚合物溶液及混合于第一聚合物溶液中的芳香有机化合物。所述第二聚合物溶液可以通过向第一聚合物溶液中掺杂小分子的含氟芳香有机化合物得到,或者,通过对聚酰亚胺进行修饰在其化学结构中引入含氟芳香官能团而得到大分子的芳香有机化合物,然后由该大分子的芳香有机化合物得到第二聚合物溶液,进而形成激光吸收层
35
。
具体地,所述含氟芳香有机化合物中的含氟官能团包括三氟甲基等。
具体地,本实施例中,所述含氟芳香有机化合物包括经含氟官能团取代的
2,4-
二羟基二苯甲酮。
具体地,所述显示功能层
20
包括依次层叠设于所述柔性基板
10
上的
TFT
层
21
、
OLED
层
22
及薄膜封装层
23
。
具体地,如图
3-5
所示,所述柔性基板
10
内可以设置一层、两层、三层或其他更多层的激光吸收层
35
,所述激光吸收层
35
设置在柔性基板
10
的相对远离显示功能层
20
的区域内,即在所述柔性基板
10
内激光吸收层
35
最靠近显示功能层
20
一侧的柔性基板
10
的厚度大于激光吸收层
35
最远离显示功能层
20
一侧的柔性基板
10
的厚度。
具体地,所述
TFT
层
21
用于对所述
OLED
层
22
行驱动,包括多个阵列排布的
TFT
器件,所述
TFT
器件为低温多晶硅(
Low Temperature Poly-silicon
,
LTPS
)型、或者金属氧化物半导体(
Metal-Oxide
Semiconductor
,
MOS
)型,例如铟镓锌氧化物(
IGZO
)的金属氧化物半导体型。
具体地,所述
OLED
层
22
包括设于所述
TFT
层
21
上的第一电极层、设于所述
TFT
层
21
和第一电极层上的像素定义层、设于第一电极层上的有机功能层、以及设于像素定义层和有机功能层上的第二电极层(未图示)。所述像素定义层在第一电极层上围出多个阵列排布的像素开口;所述有机功能层设于所述像素开口内;每一像素开口内的有机功能层、其下方对应的第一电极层、以及其上方对应的第二电极层共同构成一
OLED
器件。
具体地,所述第一电极层、第二电极层分别用作
OLED
器件的阳极(
Anode
)和阴极(
Cathode
);所述有机功能层包括由下到上依次设置的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层。
具体地,薄膜封装层
23
包括层叠设置的无机阻挡层和有机缓冲层(未图示)。
本发明的柔性显示面板,柔性基板
10
内设有一层或多层激光吸收层
35
,所述激光吸收层
35
包含用作紫外光吸收剂的含氟芳香有机化合物,该含氟芳香有机化合物的紫外光吸收剂,相比于一般紫外光吸收剂,具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板
10
中,从而能够将
LLO
工艺中多余的激光能量吸收,防止
LLO
制程中多余的激光能量进一步碳化柔性基板
10
上的显示功能层
20
,进而有效提升柔性显示面板的
LLO
工艺良率,大幅度改善产品良率。
基于上述的柔性显示面板,请参阅图
6
,本发明还提供一种柔性显示面板的制作方法,其特征在于,包括如下步骤:
步骤
S1
、如图
7
所示,提供玻璃基板
50
、第一聚合物溶液及第二聚合物溶液,在玻璃基板
50
上涂布一层第一聚合物溶液,然后至少一次地交替涂布第二聚合物溶液和第一聚合物溶液,经烘烤固化后,由第一聚合物溶液形成柔性基板
10
,由第二聚合物溶液形成一层或多层位于柔性基板
10
中的激光吸收层
35
。
所述激光吸收层
35
包含用作紫外光吸收剂的含氟芳香有机化合物,该含氟芳香有机化合物的紫外光吸收剂,相比于一般紫外光吸收剂,具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板
10
中。
具体地,所述步骤
S1
中提供的所述第二聚合物溶液包括第一聚合物溶液及混合于第一聚合物溶液中的芳香有机化合物。本实施例中,所述柔性基板
10
为聚酰亚胺基板,所述第一聚合物溶液为聚酰亚胺溶液。
具体地,所述第二聚合物溶液可以为向第一聚合物溶液中掺杂小分子的含氟芳香有机化合物得到;或者,通过对聚酰亚胺进行修饰在其化学结构中引入含氟芳香官能团而得到大分子的芳香有机化合物,然后由该大分子的芳香有机化合物得到第二聚合物溶液,进而形成激光吸收层
35
。
具体地,所述含氟芳香有机化合物中的含氟官能团包括三氟甲基等。
具体地,本实施例中,所述含氟芳香有机化合物包括经含氟官能团取代的
2,4-
二羟基二苯甲酮。
具体地,所述柔性基板
10
内可以设置一层、两层、三层或其他更多层的激光吸收层
35
,所述激光吸收层
35
设置在柔性基板
10
的相对靠近玻璃基板
50
的区域内,即在所述柔性基板
10
内激光吸收层
35
最靠近玻璃基板
50
一侧的柔性基板
10
的厚度小于激光吸收层
35
最远离玻璃基板
50
一侧的柔性基板
10
的厚度。
步骤
S2
、如图
8
所示,在所述柔性基板
10
上形成显示功能层
20
。
具体地,所述步骤
S2
中所形成的显示功能层
20
包括依次层叠设于所述柔性基板
10
上的
TFT
层
21
、
OLED
层
22
及薄膜封装层
23
。
具体地,所述步骤
S2
中所形成的
TFT
层
21
用于对所述
OLED
层
22
行驱动,包括多个阵列排布的
TFT
器件,所述
TFT
器件为低温多晶硅型、或者金属氧化物半导体型,例如铟镓锌氧化物的金属氧化物半导体型。
具体地,所述
OLED
层
22
包括设于所述
TFT
层
21
上的第一电极层、设于所述
TFT
层
21
和第一电极层上的像素定义层、设于第一电极层上的有机功能层、以及设于像素定义层和有机功能层上的第二电极层(未图示)。所述像素定义层在第一电极层上围出多个阵列排布的像素开口;所述有机功能层设于所述像素开口内;每一像素开口内的有机功能层、其下方对应的第一电极层、以及其上方对应的第二电极层共同构成一
OLED
器件。
具体地,所述第一电极层、第二电极层分别用作
OLED
器件的阳极和阴极;所述有机功能层包括由下到上依次设置的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层。
具体地,薄膜封装层
23
包括层叠设置的无机阻挡层和有机缓冲层(未图示)。
步骤
S3
、如图
9-10
所示,采用激光对柔性基板
10
的玻璃基板
50
一侧进行扫描,使所述柔性基板
10
与玻璃基板
50
分离,将所述柔性基板
10
从玻璃基板
50
上剥离下来。
具体地,所述步骤
S3
中所采用的激光的波长为
308nm
。
本发明的柔性显示面板的制作方法,通过在柔性基板
10
中设置含有紫外光吸收剂的激光吸收层
35
,该紫外光吸收剂为含氟芳香有机化合物,具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板
10
中,因此能够将
LLO
工艺中多余的激光能量吸收,防止
LLO
制程中多余的激光能量进一步碳化柔性基板
10
上的显示功能层
20
,进而有效提升柔性显示面板的
LLO
工艺良率,大幅度改善产品良率。
综上所述,本发明提供的一种柔性显示面板,包括柔性基板、一层或多层设于柔性基板中的激光吸收层及设于柔性基板上的显示功能层,所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物,该含氟芳香有机化合物的紫外光吸收剂具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板中,从而能够将
LLO
工艺中多余的激光能量吸收,防止
LLO
制程中多余的激光能量进一步碳化柔性基板上的显示功能层,进而有效提升柔性显示面板的
LLO
工艺良率,大幅度改善产品良率。本发明提供的一种柔性显示面板的制作方法,通过在柔性基板中设置含有紫外光吸收剂的激光吸收层,该紫外光吸收剂为含氟芳香有机化合物,具有极强的紫外光吸收能力,且化学性质稳定,可以稳定存在于柔性基板中,因此能够将
LLO
工艺中多余的激光能量吸收,防止
LLO
制程中多余的激光能量进一步碳化柔性基板上的显示功能层,进而有效提升柔性显示面板的
LLO
工艺良率,大幅度改善产品良率。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。
Claims (10)
- 一种柔性显示面板,包括柔性基板、一层或多层设于柔性基板中的激光吸收层及设于柔性基板上的显示功能层;所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物。
- 如权利要求1所述的柔性显示面板,其中,所述柔性基板的制作材料为第一聚合物溶液;所述激光吸收层的制作材料为第二聚合物溶液,所述第二聚合物溶液包括第一聚合物溶液及混合于第一聚合物溶液中的芳香有机化合物。
- 如权利要求1所述的柔性显示面板,其中,所述含氟芳香有机化合物包括经含氟官能团取代的2,4-二羟基二苯甲酮。
- 如权利要求3所述的柔性显示面板,其中,所述含氟芳香有机化合物的分子结构中包含三氟甲基。
- 如权利要求1所述的柔性显示面板,其中,所述柔性基板为聚酰亚胺基板;所述显示功能层包括依次层叠设于所述柔性基板上的TFT层、OLED层及薄膜封装层。
- 一种柔性显示面板的制作方法,包括如下步骤:步骤S1、提供玻璃基板、第一聚合物溶液及第二聚合物溶液,在玻璃基板上涂布一层第一聚合物溶液,然后至少一次地交替涂布第二聚合物溶液和第一聚合物溶液,经烘烤固化后,由第一聚合物溶液形成柔性基板,由第二聚合物溶液形成一层或多层位于柔性基板中的激光吸收层;所述激光吸收层包含用作紫外光吸收剂的含氟芳香有机化合物;步骤S2、在所述柔性基板上形成显示功能层;步骤S3、采用激光对柔性基板的玻璃基板一侧进行扫描,使所述柔性基板与玻璃基板分离,将所述柔性基板从玻璃基板上剥离下来。
- 如权利要求6所述的柔性显示面板的制作方法,其中,所述步骤S1中提供的所述第二聚合物溶液包括第一聚合物溶液及混合于第一聚合物溶液中的芳香有机化合物。
- 如权利要求6所述的柔性显示面板的制作方法,其中,所述含氟芳香有机化合物包括经含氟官能团取代的2,4-二羟基二苯甲酮。
- 如权利要求8所述的柔性显示面板的制作方法,其中,所述含氟芳香有机化合物的分子结构中包含三氟甲基。
- 如权利要求6所述的柔性显示面板的制作方法,其中,所述步骤S1中所形成的柔性基板为聚酰亚胺基板;所述步骤S2中所形成的显示功能层包括依次层叠设于所述柔性基板上的TFT层、OLED层及薄膜封装层;所述步骤S3中所采用的激光的波长为308nm。
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US11325351B2 (en) | 2019-05-16 | 2022-05-10 | Wshan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for fabricating display panel |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101629034A (zh) * | 2009-08-03 | 2010-01-20 | 重庆大学 | 一种紫外吸收剂及其制备方法 |
CN103370653A (zh) * | 2011-02-08 | 2013-10-23 | Az电子材料美国公司 | 底层涂料组合物及制造微电子器件的方法 |
CN105118837A (zh) * | 2015-09-16 | 2015-12-02 | 京东方科技集团股份有限公司 | 一种柔性基底及其制备方法、显示装置 |
CN107556966A (zh) * | 2017-07-19 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | 紫外光吸收胶与柔性oled显示面板及其制作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3387035A (en) * | 1963-11-04 | 1968-06-04 | Air Force Usa | Fluorine substituted benzophenone ultraveiolet absorbers |
KR101773652B1 (ko) * | 2013-04-09 | 2017-09-12 | 주식회사 엘지화학 | 적층체의 제조방법 및 이를 이용하여 제조된 적층체 |
JP6197042B2 (ja) * | 2013-10-04 | 2017-09-13 | アクロン ポリマー システムズ,インク. | ポリアミド溶液、ポリアミドフィルム、積層複合材、ならびにディスプレイ用素子、光学用素子、照明用素子又はセンサ素子、およびその製造方法 |
CN104793384B (zh) * | 2015-04-03 | 2017-07-28 | 京东方科技集团股份有限公司 | 一种超薄液晶显示器及其制作方法 |
KR102394341B1 (ko) * | 2016-08-10 | 2022-05-03 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 폴리이미드 전구체 및 폴리이미드, 투명 폴리이미드 필름의 제조방법 |
CN106252269A (zh) * | 2016-09-07 | 2016-12-21 | 达迈科技股份有限公司 | 可离型的柔性基板及其制造方法 |
WO2018143588A1 (ko) * | 2017-01-31 | 2018-08-09 | 주식회사 엘지화학 | 가요성 기판 제조용 적층체 및 이를 이용한 가요성 기판의 제조방법 |
KR102008766B1 (ko) * | 2017-01-31 | 2019-08-09 | 주식회사 엘지화학 | 가요성 기판 제조용 적층체 및 이를 이용한 가요성 기판의 제조방법 |
CN106893125A (zh) * | 2017-03-23 | 2017-06-27 | 武汉华星光电技术有限公司 | 一种改性聚酰亚胺薄膜及其制备方法 |
CN107644891A (zh) * | 2017-09-13 | 2018-01-30 | 武汉华星光电半导体显示技术有限公司 | 柔性oled面板的制作方法 |
KR101971402B1 (ko) * | 2018-06-25 | 2019-04-22 | 최재규 | 투명 캐리어를 이용한 인쇄회로기판의 제조방법 |
-
2018
- 2018-12-10 CN CN201811506853.7A patent/CN109638156B/zh active Active
- 2018-12-19 WO PCT/CN2018/122192 patent/WO2020118747A1/zh active Application Filing
- 2018-12-19 US US16/349,262 patent/US11069865B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101629034A (zh) * | 2009-08-03 | 2010-01-20 | 重庆大学 | 一种紫外吸收剂及其制备方法 |
CN103370653A (zh) * | 2011-02-08 | 2013-10-23 | Az电子材料美国公司 | 底层涂料组合物及制造微电子器件的方法 |
CN105118837A (zh) * | 2015-09-16 | 2015-12-02 | 京东方科技集团股份有限公司 | 一种柔性基底及其制备方法、显示装置 |
CN107556966A (zh) * | 2017-07-19 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | 紫外光吸收胶与柔性oled显示面板及其制作方法 |
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